CN112928620B - High-efficient dehumidification switch board - Google Patents
High-efficient dehumidification switch board Download PDFInfo
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- CN112928620B CN112928620B CN202110170540.4A CN202110170540A CN112928620B CN 112928620 B CN112928620 B CN 112928620B CN 202110170540 A CN202110170540 A CN 202110170540A CN 112928620 B CN112928620 B CN 112928620B
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/261—Drying gases or vapours by adsorption
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/265—Drying gases or vapours by refrigeration (condensation)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/268—Drying gases or vapours by diffusion
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D22/00—Control of humidity
- G05D22/02—Control of humidity characterised by the use of electric means
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/24—Circuit arrangements for boards or switchyards
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/30—Cabinet-type casings; Parts thereof or accessories therefor
- H02B1/32—Mounting of devices therein
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
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- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
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- General Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Drying Of Gases (AREA)
Abstract
The invention discloses a high-efficiency dehumidification power distribution cabinet, wherein a temperature sensor and a humidity sensor are arranged in a cabinet body, a lead screw assembly is vertically arranged, a control mechanism which vertically moves along the lead screw assembly is arranged on the lead screw assembly, a controller is arranged in the control mechanism, a dehumidification box is fixedly arranged at the front end of the control mechanism, an intermediate partition plate is transversely arranged in the middle of the dehumidification box, a first air hole and a second air hole are formed in the front end of the dehumidification box, the first air hole and the second air hole are respectively formed in the upper side and the lower side of the intermediate partition plate, a semiconductor refrigeration piece is embedded in the middle of the intermediate partition plate, moisture absorption mechanisms are arranged in spaces on the upper side and the lower side of the semiconductor refrigeration piece, the moisture absorption mechanisms are in transmission connection with a conversion mechanism, a liquid discharge mechanism is further arranged on the dehumidification box, a gas circulation mechanism is arranged between the dehumidification box and the control mechanism, and the gas circulation mechanism is connected with the moisture absorption mechanism. The dehumidification structure is reasonable in design, can efficiently convert condensation into steam, and discharges the steam after cooling, so that the operation stability of the power distribution cabinet is ensured.
Description
Technical Field
The embodiment of the invention relates to the technical field of power equipment, in particular to a high-efficiency dehumidification power distribution cabinet.
Background
Condensation is simply condensed dew, which is a special phenomenon occurring when the humidity of air is high, and when water vapor in the air reaches a saturation level, the condensation is condensed on an object with relatively low temperature to form small water drops, which is the condensation phenomenon. In southern areas of China, water resources are abundant, so the condensation phenomenon is easy to occur in rainy days in autumn and winter, the damage of the condensation to power transformation equipment is mainly formed small water drops, corrosion or short circuit is easy to form, and the main damage is as follows:
1. dew formed on the secondary wiring terminal row in the terminal box mechanism case causes the corruption to the metal conductive part on the terminal row, it is heavy to corrode or easily cause alternating current-direct current short circuit ground connection after mixing other impurity such as dust, direct current ground connection has caused very big harm to transformer substation's secondary system's steady operation, the actual operation experience shows that direct current ground connection is to having water to eye and is attached to the electrified position and cause, and more serious dew even causes the short circuit of two secondary line paper spares on the terminal row, if just switch tripping circuit then can cause the switch maloperation immediately, cause the power failure accident.
2. Dew that forms on switch or switch operating device can corrode the metal parts in the mechanism, influences the life of mechanism, causes the mechanism card puckery because of the corrosion even, leads to switch or switch to construct and can not move in place when deciliter, if consequently make switch sound contact divide slowly and close slowly, then can cause very big electric power accident, especially the switch corrosion phenomenon can be more serious when not operating for a long time.
3. Generally, the high-voltage chamber is more concerned with ventilation, so that outdoor environment influence is more serious when indoor temperature and humidity are collected, condensation is easily generated in an indoor high-voltage switch cabinet, waterproof performance is not considered for most of insulating porcelain bottles in the cabinet, insulating performance of the insulating porcelain bottles can be reduced when dew exists on the insulating porcelain bottles, creepage or flashover phenomena can be caused even, normal operation of equipment is seriously influenced, especially, some equipment is in a shutdown state, the internal temperature of the equipment is lower, condensation is more easily formed on the surface of the equipment, and at the moment, accidents are very easily caused once power is transmitted.
Although in the prior art, a fan can be arranged in a switch cabinet or a power distribution cabinet, the fan is greatly influenced by the external environment, and when the moisture content in the external environment is high, the air supplemented into the power distribution cabinet also has high humidity, so that condensation can be generated again; and once the condensation is produced on the inner wall of the power distribution cabinet, the condensation is difficult to be directly removed or discharged through external force.
Therefore, how to provide a power distribution cabinet capable of realizing efficient dehumidification and condensation removal by itself is a technical problem to be solved urgently by technical personnel in the field.
Disclosure of Invention
Therefore, the embodiment of the invention provides a high-efficiency dehumidification power distribution cabinet to solve the related technical problems in the prior art.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
a high-efficiency dehumidification power distribution cabinet comprises a cabinet body, a controller, a temperature sensor and a humidity sensor, wherein the temperature sensor and the humidity sensor are arranged in the cabinet body, the temperature sensor and the humidity sensor are electrically connected with the controller, the high-efficiency dehumidification power distribution cabinet also comprises a lead screw assembly, a control mechanism, a dehumidification box, an intermediate partition plate, a first air hole, a second air hole, a semiconductor refrigeration piece, a conversion mechanism, a moisture absorption mechanism, a gas circulation mechanism and a liquid drainage mechanism which are arranged in the cabinet body, the lead screw assembly is vertically arranged, the control mechanism which vertically moves along the lead screw assembly is arranged on the lead screw assembly, the controller is arranged in the control mechanism, the front end of the control mechanism is fixedly provided with the dehumidification box, the intermediate partition plate is transversely arranged in the dehumidification box, the front end of the dehumidification box is provided with the first air hole and the second air hole, and the first air hole and the second air hole are respectively arranged at the upper side and the lower side of the intermediate partition plate, intermediate bottom middle part is inlayed and is had the semiconductor refrigeration piece, all be equipped with moisture absorption mechanism in the space of both sides about the semiconductor refrigeration piece, moisture absorption mechanism transmission connects the shifter, still be equipped with drainage mechanism on the dehumidification case, be equipped with gas circulation mechanism between dehumidification case and the control mechanism, just gas circulation mechanism connects moisture absorption mechanism.
Furthermore, the moisture absorption mechanism comprises a first moisture absorption assembly, a second moisture absorption assembly and a third moisture absorption assembly, the first moisture absorption assembly is arranged in the upper layer space of the middle partition plate, the second moisture absorption assembly is arranged in the lower layer space of the middle partition plate, and the third moisture absorption assembly is arranged in the control mechanism.
The semiconductor refrigeration device further comprises a first partition plate, a second partition plate, a first elastic switch door, a second elastic switch door, a first cavity, a second cavity, a third cavity and a fourth cavity, wherein the first partition plate is transversely arranged in the upper space of the middle partition plate, the first cavity is formed between the first partition plate and the top in the dehumidification box, the second cavity is formed between the first partition plate and the middle partition plate, the first moisture absorption assembly is arranged in the first cavity, the first elastic switch door is arranged on the first partition plate, the first elastic switch door is opposite to the semiconductor refrigeration piece, and after the first moisture absorption assembly penetrates out of the first elastic switch door, the first moisture absorption assembly is attached to the end face of the semiconductor refrigeration piece; intermediate bottom layer space still is equipped with the second baffle of horizontal setting, form the third chamber between second baffle and the intermediate bottom, form the fourth chamber between second baffle and the dehumidification incasement bottom, the second subassembly that absorbs moisture is located in the fourth chamber, be equipped with second elastic switch door on the second baffle, second elastic switch door is just right semiconductor refrigeration piece works as the subassembly that absorbs moisture is worn out to the second behind the second elastic switch door, the second subassembly that absorbs moisture pastes tightly semiconductor refrigeration piece terminal surface.
Further, the switching mechanism comprises a telescopic motor, a telescopic rod and support frames, the telescopic motor is arranged at the upper end of the dehumidifying box, the lower end of the telescopic motor is provided with the telescopic rod, the telescopic rod is downwards inserted into the dehumidifying box, the telescopic rod is provided with two support frames, one of the two support frames is arranged in the first cavity and connected with the first moisture absorption assembly, the other support frame is arranged in the fourth cavity and connected with the second moisture absorption assembly, and when the support frames drive the first moisture absorption assembly to be attached to the semiconductor refrigerating sheet, the support frames drive the second moisture absorption assembly to be located in the fourth cavity.
Further, the gas circulation mechanism comprises a first gas suction pipe, a second gas suction pipe, a gas suction control valve, an axial flow fan, a first gas discharge pipe, a second gas discharge pipe, a gas discharge control valve and a gas discharge nozzle, one end of the first gas suction pipe is connected with the first moisture absorption assembly, the other end of the first gas suction pipe is connected with the gas inlet end of the axial flow fan, one end of the second gas suction pipe is connected with the second moisture absorption assembly, the other end of the second gas suction pipe is connected with the gas inlet end of the axial flow fan, the first gas suction pipe and the second gas suction pipe are both provided with the gas suction control valve, the third moisture absorption assembly is arranged on the first gas suction pipe and the second gas suction pipe, the gas outlet end of the axial flow fan is respectively connected with one end of the first gas discharge pipe and one end of the second gas discharge pipe, the other end of the first gas discharge pipe and the other end of the second gas discharge pipe are both connected with the gas discharge nozzle, and the gas discharge nozzle extends into the second chamber and the third chamber, and the air suction control valve, the axial flow fan and the exhaust control valve are all connected with the controller.
Further, the control mechanism is a control box, and the axial flow fan and the controller are both arranged in the control box.
Furthermore, the door further comprises small air holes, and the first elastic switch door and the second elastic switch door are both provided with a plurality of small air holes.
Further, the liquid discharge mechanism is a liquid discharge pipe, one end of the liquid discharge pipe is communicated with the second cavity and the fourth cavity, and the other end of the liquid discharge pipe extends out of the cabinet body.
Furthermore, the exhaust nozzle is opposite to the end face of the semiconductor refrigeration piece.
Further, the first absorbent assembly, the second absorbent assembly and the third absorbent assembly are absorbent sponges.
The embodiment of the invention has the following advantages:
through set up first gas pocket and second gas pocket on the dehumidification case, under the control of controller, cooperate with the semiconductor refrigeration piece, realize that first gas pocket and second gas pocket admit air or carminative switching, the damp and hot air that will enter into the dehumidification incasement is converted into liquid water after meetting first subassembly or the second subassembly that absorbs moisture, and outwards discharge through water drainage pipeline, blow in the cabinet body again with the air after the drying simultaneously in, can effectively restrain the production of condensation. The dehumidification structure is reasonable in design, can efficiently convert condensation into steam and discharge the steam after cooling, and ensures the stability of operation of the power distribution cabinet.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
Fig. 1 is a schematic perspective view of a high-efficiency dehumidification power distribution cabinet according to an embodiment of the present invention;
FIG. 2 is a view illustrating an installation structure of a dehumidifying box and a screw assembly according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of a moisture removal tank provided in accordance with an embodiment of the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3A according to an embodiment of the present invention;
FIG. 5 is a diagram illustrating the connection structure between the controller and various components provided by the embodiment of the present invention;
FIG. 6 is a view showing a connection structure of a gas circulation mechanism according to an embodiment of the present invention;
in the figure:
1, a cabinet body; 2, a controller; 3 a temperature sensor; 4 a humidity sensor; 5, a lead screw component; 6 a control mechanism; 7, a dehumidification box; 8, a middle clapboard; 9 a first air vent; 10 a second air hole; 11 semiconductor refrigerating sheets; 12 a switching mechanism; 121 telescopic motors; 122, telescoping a rod; 123, a support frame; 13 a moisture absorbing mechanism; 131 a first absorbent assembly; 132 a second absorbent assembly; 133 a third absorbent assembly; 14 a gas circulation mechanism; 141 a first suction pipe; 142 a second suction duct; 143 a suction control valve; 144 axial flow fan; 145 a first exhaust pipe; 146 a second exhaust pipe; 147 exhaust control valves; 148 an exhaust nozzle; 15 a liquid discharge mechanism; 16 a first separator; 17 a second partition plate; 18 a first resilient switch door; 19 a second resilient switch door; 20 a first chamber; 21 a second chamber; 22 a third chamber; 23 a fourth chamber; 24 air permeable pores.
Detailed Description
The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the relevant technical problem that exists among the prior art, this application embodiment provides a high-efficient dehumidification switch board, aim at forming vapor through heating the condensation on the switch board inner wall after, the cold junction of using semiconductor refrigeration piece 11 forms liquid water with vapor cooling to discharge liquid water, guarantee the steady operation of switch board, and reduce the speed that the condensation formed to a certain extent again. The embodiment of this application is mainly to carry out dehumidification and condensation removal around the circuit component in the cabinet body 1 of switch board and on the inner wall. As shown in fig. 1-6, concretely, including the cabinet body 1, the controller 2, temperature sensor 3 and humidity transducer 4 all set up in the cabinet body 1, temperature sensor 3 and humidity transducer 4 can real-time supervision the internal temperature of the cabinet body 1 and humidity, temperature sensor 3 and humidity transducer 4 electricity connection director 2, thereby convey monitoring information to controller 2, controller 2 compares and analyzes received temperature signal and humidity signal, and when exceeding the settlement threshold value, open the dehumidification function.
In order to realize the dehumidification function, the multifunctional dehumidifying cabinet further comprises a screw assembly 5, a control mechanism 6, a dehumidifying box 7, an intermediate partition plate 8, a first air hole 9, a second air hole 10, a semiconductor refrigerating sheet 11, a conversion mechanism 12, a moisture absorption mechanism 13, an air circulation mechanism 14 and a liquid drainage mechanism 15 which are arranged in the cabinet body 1. In this embodiment 5 lead screw assembly has included driving motor at least, the drive lead screw, screw nut and feed screw, it is concrete, 5 vertical settings of lead screw assembly, driving motor fixes at the interior top of the cabinet body 1, the vertical setting of drive lead screw and rotate with the bearing that sets up bottom in the cabinet body 1 and be connected, be equipped with on 5 lead screw assembly along its vertical movement's control mechanism 6, thereby locate control mechanism 6 with screw nut in, feed screw and drive lead screw parallel arrangement, the in-process plays the guide effect of reciprocating at control mechanism 6, consequently 6 reciprocating of lead screw assembly 5 can drive control mechanism 6 and reciprocate. The controller 2 is arranged in the control mechanism 6, so that the safe and stable operation of the controller 2 is ensured. In this embodiment, the control mechanism 6 is a control box, which is fixed to the dehumidifying box 7 disposed at the front end thereof by screwing or welding, and the control box is a rectangular box. The middle of the dehumidification box 7 is transversely provided with a middle partition plate 8, so that the dehumidification box 7 is divided into a cavity structure which is not communicated with each other up and down, the front end of the dehumidification box 7 is provided with a first air hole 9 and a second air hole 10, as shown in fig. 3, the first air hole 9 and the second air hole 10 are the same in structure and are strip-shaped openings, the first air hole 9 and the second air hole 10 are respectively arranged on the upper side and the lower side of the middle partition plate 8, so that the first air hole 9 is communicated with the upper cavity structure, and the second air hole 10 is communicated with the lower cavity structure. The middle of the middle partition plate 8 is embedded with a semiconductor refrigerating sheet 11, as shown in fig. 3, the upper end face and the lower end face of the semiconductor refrigerating sheet 11 respectively enter the upper chamber structure and the lower chamber structure, and the environment in the upper chamber structure and the environment in the lower chamber structure can be switched between cold and hot through the use of the semiconductor refrigerating sheet 11, and the switching is controlled through the controller 2. Moisture absorption mechanisms 13 are arranged in spaces on the upper side and the lower side of the semiconductor refrigeration sheet 11, when air in the cabinet body 1 enters the upper cavity structure and the lower cavity structure through the first air holes 9 or the second air holes 10, water vapor is cooled and liquefied under the matching of the semiconductor refrigeration sheet 11 and the moisture absorption mechanisms 13, and a liquid drainage mechanism 15 is further arranged on the dehumidification box 7, so that the liquefied water vapor is discharged outwards through the liquid drainage mechanism 15. In the actual use process, in order to realize the switching of the cold and heat of the upper chamber structure and the lower chamber structure in the dehumidification box 7, the moisture absorption mechanism 13 is in transmission connection with the switching mechanism 12 in cooperation with the semiconductor refrigeration sheet 11, and the switching mechanism 12 can drive the moisture absorption mechanism 13 to be close to or far away from the semiconductor refrigeration sheet 11. A gas circulation mechanism 14 is arranged between the dehumidification box 7 and the control mechanism 6, the gas circulation mechanism 14 is connected with the moisture absorption mechanism 13, and air entering the dehumidification box 7 returns to the cabinet body 1 through the gas circulation mechanism 14, so that after vapor in the air is cooled and liquefied, the dried air can be returned to the cabinet body 1 again, the moisture content of the air in the cabinet body 1 is reduced to a certain extent, and the generation of condensation is inhibited.
In this embodiment, the moisture absorbing mechanism 13 includes a first moisture absorbing component 131, a second moisture absorbing component 132 and a third moisture absorbing component 133, the first moisture absorbing component 131 is disposed in the upper space of the middle partition 8, the second moisture absorbing component 132 is disposed in the lower space of the middle partition 8, the first moisture absorbing component 131 and the second moisture absorbing component 132 can cool and absorb moisture of the air entering the dehumidifying box 7, the third moisture absorbing component 133 is disposed in the control mechanism 6, and the third moisture absorbing component 133 can absorb moisture of the air in the air circulation mechanism 14, so as to improve the dryness of the return air. In this embodiment, the first absorbent assembly 131, the second absorbent assembly 132, and the third absorbent assembly 133 are absorbent sponges.
In order to maintain the cooling and liquefying effects of the first absorbent assembly 131 and the second absorbent assembly 132 on the water vapor in the air and to restore the first absorbent assembly 131 and the second absorbent assembly 132 to the original state, the structure of the dehumidifying box 7 is further modified, and the dehumidifying box further comprises a first partition 16, a second partition 17, a first elastic opening and closing door 18, a second elastic opening and closing door 19, a first chamber 20, a second chamber 21, a third chamber 22 and a fourth chamber 23. The upper space of the middle partition plate 8 is also provided with a first partition plate 16 which is transversely arranged, the first partition plate 16 is parallel to the middle partition plate 8, a first cavity 20 is formed between the top of the first partition plate 16 and the top of the dehumidification box 7, a second cavity 21 is formed between the first partition plate 16 and the middle partition plate 8, the first moisture absorption assembly 131 is arranged in the first cavity 20, the first partition plate 16 is provided with a first elastic switch door 18, as shown in fig. 3, the first elastic switch door 18 is composed of two door leaves, and the end parts of the first elastic switch door 18 are elastically hinged to realize automatic rebounding and closing. The first elastic switch door 18 is opposite to the semiconductor refrigerating sheet 11, and after the first moisture absorption assembly 131 penetrates out of the first elastic switch door 18, the first moisture absorption assembly 131 is attached to the end face of the semiconductor refrigerating sheet 11; the lower layer space of the middle partition plate 8 is also provided with a second partition plate 17 which is transversely arranged, the second partition plate 17 is parallel to the middle partition plate 8, a third chamber 22 is formed between the second partition plate 17 and the middle partition plate 8, a fourth chamber 23 is formed between the second partition plate 17 and the bottom in the dehumidification box 7, the second moisture absorption assembly 132 is arranged in the fourth chamber 23, the second partition plate 17 is provided with a second elastic switch door 19, and the structure of the second elastic switch door 19 is the same as that of the first elastic switch door 18, which is not described again. The second elastic switch door 19 is opposite to the semiconductor refrigeration piece 11, and after the second moisture absorption assembly 132 penetrates out of the second elastic switch door 19, the second moisture absorption assembly 132 is attached to the end face of the semiconductor refrigeration piece 11.
Based on the above structure, it should be noted that the vertical distance between the first absorbent assembly 131 and the second absorbent assembly 132 is constant, and when the conversion mechanism 12 drives the first absorbent assembly 131 and the second absorbent assembly 132 to move vertically, the following specific relationships exist:
when the switching mechanism 12 drives the first moisture absorption assembly 131 to pass through the first elastic switch door 18 and enter the second chamber 21 downwards, at this time, the side portion of the first moisture absorption assembly 131 abuts against the first elastic switch door 18, the lower portion of the first moisture absorption assembly 131 abuts against the end surface of the semiconductor refrigeration sheet 11, the first chamber 20 is communicated with the second chamber 21, at this time, the second moisture absorption assembly 132 is located in the fourth chamber 23, and the second elastic switch door 19 is in a closed state; on the contrary, when the switching mechanism 12 drives the first moisture absorption assembly 131 to enter the first chamber 20 upwards, the first elastic switch door 18 rebounds and closes, so that the first chamber 20 is isolated from the second chamber 21, at this time, the second moisture absorption assembly 132 passes through the second elastic switch door 19 upwards and enters the third chamber 22, the side of the second moisture absorption assembly 132 abuts against the second elastic switch door 19, the upper end of the second moisture absorption assembly 132 abuts against the lower end face of the semiconductor refrigeration sheet 11, and the third chamber 22 is communicated with the fourth chamber 23. Therefore, through the above action process, the switching mechanism 12 can drive the first moisture absorbing assembly 131 and the second moisture absorbing assembly 132 to switch contact with two end surfaces of the semiconductor chilling plate 11, and simultaneously, in cooperation with the switching of the first moisture absorbing assembly 131 and the second moisture absorbing assembly 132, the cold end and the hot end of the semiconductor chilling plate 11 are further switched through the controller 2, and the specific use mode is as follows: when the first absorbent member 131 or the second absorbent member 132 contacts with the end face of the semiconductor refrigeration sheet 11, the end face is a cold end, and the other opposite end face is a hot end.
In order to cooperate with the switching operation of the first absorbent assembly 131 and the second absorbent assembly 132, specifically, the switching mechanism 12 includes a telescopic motor 121, a telescopic rod 122 and a support frame 123. The telescopic motor 121 is arranged at the upper end of the dehumidifying box 7, the telescopic rod 122 is arranged at the lower end of the telescopic motor 121, the telescopic rod 122 is inserted into the dehumidifying box 7 downwards, and meanwhile, the telescopic rod 122 can penetrate through the middle partition plate 8 downwards to enter the third chamber 22 and the fourth chamber 23. Two support frames 123 are disposed on the telescopic rod 122, as shown in fig. 3, the support frames 123 are L-shaped, one of the support frames 123 is disposed in the first chamber 20 and connected to the first moisture absorption component 131, the other support frame 123 is disposed in the fourth chamber 23 and connected to the second moisture absorption component 132, and when the support frame 123 drives the first moisture absorption component 131 to cling to the semiconductor refrigeration sheet 11, the support frame 123 drives the second moisture absorption component 132 to be located in the fourth chamber 23.
In the above structure, the main purpose is to heat and gasify the condensation in the cabinet 1, and then absorb the gasified hot and humid air into the dehumidification box 7, and through the cooperation of the semiconductor refrigeration sheet 11 with the first moisture absorption assembly 131 and the second moisture absorption assembly 132, the hot and humid air is liquefied again and discharged, so that the air in the cabinet 1 is kept in a relatively dry state, and the generation of condensation is reduced. In order to achieve circulation and liquefaction of hot air in the cabinet 1, specifically, the gas circulation mechanism 14 includes a first suction pipe 141, a second suction pipe 142, a suction control valve 143, an axial flow fan 144, a first exhaust pipe 145, a second exhaust pipe 146, an exhaust control valve 147, and an exhaust nozzle 148. One end of the first air suction pipe 141 is connected with the first moisture absorption component 131, and the other end of the first air suction pipe 141 is connected with the air inlet end of the axial flow fan 144, so that after the liquefaction of the damp and hot air is realized by the cooperation of the cold ends of the first moisture absorption component 131 and the semiconductor refrigeration sheet 11, relatively dry air enters the axial flow fan 144 along the first air suction pipe 141; one end of the second air suction pipe 142 is connected to the second moisture absorbing assembly 132, and the other end of the second air suction pipe 142 is connected to the air inlet end of the axial flow fan 144, so that after the second moisture absorbing assembly 132 and the cold end of the semiconductor chilling plate 11 are matched to liquefy moist and hot air, relatively dry air enters the axial flow fan 144 along the second air suction pipe 142. The first suction pipe 141 and the second suction pipe 142 are respectively provided with the suction control valve 143, the controller 2 controls the opening and closing of the suction control valve 143, and the third suction unit 133 is provided on the first suction pipe 141 and the second suction pipe 142, so that the relatively dry air which flows back is dried by the third suction unit 133, and the dryness of the air which flows back is improved. The air outlet end of the axial flow fan 144 is connected to one end of the first exhaust pipe 145 and one end of the second exhaust pipe 146, and the other end of the first exhaust pipe 145 and the other end of the second exhaust pipe 146 are both connected to the exhaust nozzle 148, so that the dried air flows back into the dehumidification box 7 through the first exhaust pipe 145 and the second exhaust pipe 146, and flows back into the cabinet 1 from the dehumidification box 7. The exhaust nozzle 148 is extended into the second chamber 21 and the third chamber 22, the opening and closing of the exhaust nozzle 148 is controlled by an exhaust control valve 147 provided in the first exhaust pipe 145 and the second exhaust pipe 146, and the suction control valve 143, the axial flow fan 144, and the exhaust control valve 147 are connected to the controller 2. The exhaust nozzle 148 faces the end face of the semiconductor chilling plate 11. Therefore, when one end face of the semiconductor chilling plate 11 is switched to the hot end in use, the corresponding exhaust nozzle 148 opens the hot end of the direct blowing semiconductor chilling plate 11, and the backflow and heating of the dry air are realized.
In the above-described structure, the first absorbent member 131 and the second absorbent member 132 contain a large amount of moisture after use, and need to be dried in order to return to the original dry state in the next use. Furthermore, the door further comprises a small air hole 24, and a plurality of small air holes 24 are formed in the first elastic switch door 18 and the second elastic switch door 19. Thus, in use, the dry air exiting the air discharge nozzle 148 passes back through the air permeable apertures 24 into the first or fourth chamber 20, 23, such that the dry, heated air will carry moisture from the first or second absorbent assembly 131, 132 into circulation, where it is absorbed by the third absorbent assembly 133.
In this embodiment, the drainage mechanism 15 is specifically a drainage pipe, one end of the drainage pipe is communicated with the second chamber 21 and the fourth chamber 23, and the other end of the drainage pipe extends out of the cabinet 1. In actual installation, the drain pipe is a flexible pipe and can move along with the vertical movement of the dehumidification tank 7. When the first moisture absorption assembly 131 contacts with the upper end (in this state, the cold end) of the semiconductor refrigeration sheet 11, the damp and hot air entering the second chamber 21 contacts with the first moisture absorption assembly 131 and the cold end of the semiconductor refrigeration sheet 11, and is further liquefied into water and drips into the second chamber 21, and is further discharged from the liquid discharge pipe; similarly, when the second absorbent member 132 contacts the lower end (the cold end in this state) of the semiconductor chilling plate 11, the moist hot air entering the third chamber 22 contacts the second absorbent member 132 and the cold end of the semiconductor chilling plate 11, and further liquefies into water drops, which fall into the fourth chamber 23 and are further discharged from the drain pipe. Of course, during use, the discharge conduit may be provided with a solenoid valve, which is controlled by the controller 2 to cooperate with the first absorbent assembly 131 and the second absorbent assembly 132. Specifically, when liquid needs to be drained, the controller 2 controls the electromagnetic valve to be in an open state, and is in a closed state in other states.
In this embodiment, the control mechanism 6 is specifically a control box, and the axial flow fan 144 and the controller 2 are both disposed in the control box.
Based on the above structure, one usage of the embodiment of the present invention is as follows:
temperature and humidity information in the temperature sensor 3 and the humidity transducer 4 real-time supervision cabinet of setting in the cabinet body 1 to convey above-mentioned temperature and humidity information to controller 2, whether condensation has appeared on the internal wall of cabinet after the relevant data of controller 2 analysis, and when the condensation produced, controller 2 control lead screw assembly 5, dehumidification case 7, semiconductor refrigeration piece 11, shifter 12, moisture absorption mechanism 13, gas circulation mechanism 14 and drainage mechanism 15 carry out corresponding action, the process through gasification and liquefaction with the condensation is discharged outside the cabinet body 1.
the controller 2 controls the axial flow fan 144 to be started, and controls the switching mechanism 12 at the same time, so that the switching mechanism 12 drives the first moisture absorption assembly 131 to enter the second chamber 21, the second moisture absorption assembly 132 is sealed in the fourth chamber 23, the exhaust control valve 147 on the second exhaust pipe 146 is opened, the exhaust control valve 147 on the first exhaust pipe 145 is closed, and the controller 2 controls the upper end of the semiconductor refrigeration sheet 11 to be a cold end and the lower end thereof to be a hot end; the air is discharged to the hot end of the semiconductor refrigeration piece 11 from the air discharge nozzle 148 in the third chamber 22, the hot air is further discharged to the outside from the second air holes 10 of the third chamber 22, and is blown to the condensation on the inner wall of the cabinet body 1, the condensation is gasified and then enters the second chamber 21 under the suction action of the first air holes 9, the wet hot air is liquefied and flows into the second chamber 21 after meeting the first moisture absorption assembly 131 and the cold end of the semiconductor refrigeration piece 11, the air forms relatively dry air and enters the axial flow fan 144 through the first air suction pipe 141, in the process, the air is further dried by the third moisture absorption assembly 133, the dryness degree of the return air is improved, and the air further enters the third chamber 22 through the air discharge nozzle 148 on the third chamber 22. At the same time, the dried and heated air in the third chamber 22 can pass through the small air holes 24 into the fourth chamber 23, and the dried and heated air enters the second absorbent assembly 132 and dries it because the second suction duct 142 is open. After the moisture absorption process is performed for a period of time, the controller 2 can control the switching mechanism 12, the semiconductor cooling plate 11, etc. to switch, and the second moisture absorption assembly 132 is changed to absorb moisture from the hot and humid air, and the detailed operation process is not described herein again.
When the above process is completed, the controller 2 may control the liquid discharge mechanism 15 to be opened to discharge the liquid to the outside.
Through set up first gas pocket 9 and second gas pocket 10 on dehumidification case 7, under the control of controller 2, cooperate with semiconductor refrigeration piece 11, realize that first gas pocket 9 and second gas pocket 10 admit air or carminative switching, the damp and hot air that will enter into in dehumidification case 7 meets first subassembly 131 or the second subassembly 132 that absorbs moisture and later converts into liquid water that absorbs moisture, and outwards discharge through the drainage pipe way, blow in the cabinet body 1 again with the air after the drying simultaneously, can effectively restrain the production of condensation. The dehumidification structure is reasonable in design, can efficiently convert condensation into steam and discharge the steam after cooling, and ensures the stability of operation of the power distribution cabinet.
Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.
Claims (2)
1. A high-efficiency dehumidification power distribution cabinet comprises a cabinet body, a controller, a temperature sensor and a humidity sensor, wherein the temperature sensor and the humidity sensor are arranged in the cabinet body, the temperature sensor and the humidity sensor are electrically connected with the controller, and the high-efficiency dehumidification power distribution cabinet is characterized by further comprising a lead screw assembly, a control mechanism, a dehumidification box, an intermediate partition plate, a first air hole, a second air hole, a semiconductor refrigeration piece, a conversion mechanism, a moisture absorption mechanism, a gas circulation mechanism and a liquid drainage mechanism which are arranged in the cabinet body, the lead screw assembly is vertically arranged, the control mechanism which vertically moves along the lead screw assembly is arranged on the lead screw assembly, the controller is arranged in the control mechanism, the dehumidification box is fixedly arranged at the front end of the control mechanism, the intermediate partition plate is transversely arranged in the dehumidification box, the first air hole and the second air hole are arranged at the front end of the dehumidification box, the first air hole and the second air hole are respectively arranged at the upper side and the lower side of the intermediate partition plate, a semiconductor refrigerating sheet is embedded in the middle of the middle partition plate, moisture absorption mechanisms are arranged in spaces on the upper side and the lower side of the semiconductor refrigerating sheet, the moisture absorption mechanisms are in transmission connection with a conversion mechanism, a liquid drainage mechanism is further arranged on the dehumidifying box, a gas circulation mechanism is arranged between the dehumidifying box and the control mechanism, and the gas circulation mechanism is connected with the moisture absorption mechanisms;
the moisture absorption mechanism comprises a first moisture absorption component, a second moisture absorption component and a third moisture absorption component, the first moisture absorption component is arranged in the upper layer space of the middle partition plate, the second moisture absorption component is arranged in the lower layer space of the middle partition plate, and the third moisture absorption component is arranged in the control mechanism;
the semiconductor refrigeration piece is characterized by further comprising a first partition plate, a second partition plate, a first elastic switch door, a second elastic switch door, a first cavity, a second cavity, a third cavity and a fourth cavity, wherein the first partition plate is transversely arranged in the upper space of the middle partition plate, the first cavity is formed between the first partition plate and the inner top of the dehumidification box, the second cavity is formed between the first partition plate and the middle partition plate, the first elastic switch door is arranged on the first partition plate, the first elastic switch door is over against the semiconductor refrigeration piece, and when the first moisture absorption assembly penetrates out of the first elastic switch door, the first moisture absorption assembly is tightly attached to the end face of the semiconductor refrigeration piece; a second partition board is transversely arranged in the lower layer space of the middle partition board, a third chamber is formed between the second partition board and the middle partition board, a fourth chamber is formed between the second partition board and the bottom in the dehumidification box, a second elastic switch door is arranged on the second partition board, the second elastic switch door is right opposite to the semiconductor refrigeration piece, and after the second moisture absorption assembly penetrates out of the second elastic switch door, the second moisture absorption assembly is tightly attached to the end face of the semiconductor refrigeration piece;
the switching mechanism comprises a telescopic motor, a telescopic rod and support frames, the telescopic motor is arranged at the upper end of the dehumidifying box, the lower end of the telescopic motor is provided with the telescopic rod, the telescopic rod is downwards inserted into the dehumidifying box, the telescopic rod is provided with two support frames, one support frame is arranged in the first cavity and connected with the first moisture absorption assembly, the other support frame is arranged in the fourth cavity and connected with the second moisture absorption assembly, and when the support frames drive the first moisture absorption assembly to be tightly attached to the semiconductor refrigerating sheet, the support frames drive the second moisture absorption assembly to be positioned in the fourth cavity;
the gas circulation mechanism comprises a first gas suction pipe, a second gas suction pipe, a gas suction control valve, an axial flow fan, a first gas discharge pipe, a second gas discharge pipe, a gas discharge control valve and a gas discharge nozzle, one end of the first gas suction pipe is connected with the first moisture absorption component, the other end of the first gas suction pipe is connected with the gas inlet end of the axial flow fan, one end of the second gas suction pipe is connected with the second moisture absorption component, the other end of the second gas suction pipe is connected with the gas inlet end of the axial flow fan, the first gas suction pipe and the second gas suction pipe are both provided with the gas suction control valve, the third moisture absorption component is arranged on the first gas suction pipe and the second gas suction pipe, the gas outlet end of the axial flow fan is respectively connected with one end of the first gas discharge pipe and one end of the second gas discharge pipe, the other end of the first gas discharge pipe and the other end of the second gas discharge pipe are both connected with the gas discharge nozzle, and the gas discharge nozzle extends into the second chamber and the third chamber, the air suction control valve, the axial flow fan and the air exhaust control valve are all connected with the controller;
the control mechanism is a control box, and the axial flow fan and the controller are both arranged in the control box;
the first elastic switch door and the second elastic switch door are respectively provided with a plurality of small ventilation holes;
the liquid discharge mechanism is a liquid discharge pipe, one end of the liquid discharge pipe is communicated with the second cavity and the fourth cavity, and the other end of the liquid discharge pipe extends out of the cabinet body;
the exhaust nozzle is opposite to the end face of the semiconductor refrigerating sheet.
2. The high efficiency dehumidification power distribution cabinet of claim 1, wherein the first, second and third moisture absorbing assemblies are moisture absorbing sponges.
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| CN113314965B (en) * | 2021-06-17 | 2022-11-29 | 山东驰戈电气设备有限公司 | Moisture-proof device for electrical equipment |
| CN115459073A (en) * | 2022-08-19 | 2022-12-09 | 惠州万江电力安装有限公司 | Dehumidification control method for power distribution cabinet |
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| CN204103251U (en) * | 2014-07-17 | 2015-01-14 | 国家电网公司 | A kind of for the dehydrating unit in electric distribution box |
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Effective date of registration: 20220901 Address after: 311300 Room 269, Wanma Road, Jincheng Street, Lin'an District, Hangzhou City, Zhejiang Province (1-8 floors of buildings 1-5, whole buildings of 6, 1-5 floors of buildings 7) Applicant after: State Grid Zhejiang Electric Power Co., Ltd. Hangzhou Lin'an district power supply Co. Address before: 048100 No.6 Xinjian South Road, nuanqu village, Jialing Township, Yangcheng County, Jincheng City, Shanxi Province Applicant before: Liu Daihong |
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