CN109412051B - A condensation and dehumidification device for the HSBC cabinet that dissipates heat through water cooling - Google Patents

A condensation and dehumidification device for the HSBC cabinet that dissipates heat through water cooling Download PDF

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Publication number
CN109412051B
CN109412051B CN201811385290.0A CN201811385290A CN109412051B CN 109412051 B CN109412051 B CN 109412051B CN 201811385290 A CN201811385290 A CN 201811385290A CN 109412051 B CN109412051 B CN 109412051B
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water
cooling
plate
condensation
control cabinet
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CN109412051A (en
Inventor
孙庆峰
汤义勤
王炯耿
张�杰
周正强
梅简
罗宏建
魏燕定
邹宏亮
吴坚
花国祥
陈胤桢
徐胜
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Electric Power Research Institute of State Grid Zhejiang Electric Power Co Ltd
Taizhou Power Supply Co of State Grid Zhejiang Electric Power Co Ltd
Hangzhou E Energy Electric Power Technology Co Ltd
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Electric Power Research Institute of State Grid Zhejiang Electric Power Co Ltd
Taizhou Power Supply Co of State Grid Zhejiang Electric Power Co Ltd
Hangzhou E Energy Electric Power Technology Co Ltd
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H02B1/565—Cooling; Ventilation for cabinets
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Drying Of Gases (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明公开了一种通过水冷散热的汇控柜冷凝除湿装置。本发明采用的技术方案为:水冷固定板上装有水冷头,该水冷头的内侧设有半导体制冷片,半导体制冷片的内侧设有散热片;所述半导体制冷片的冷端与散热片贴合,热端与水冷头贴合;分别位于两块水冷固定板上的两个水冷头串联,水冷头的进出水口采用卡箍连接水管,水管与一水泵和一水箱组成一条封闭的回路;顶部连接板上装有一风扇,位于风扇下方的顶部连接板上开有通风道,用于将汇控柜内的空气吹入箱体中;集水板上开有管接头固定孔,该管接头固定孔中安装一管接头。本发明可以实现汇控柜内空气的冷凝除湿,并可以将半导体制冷片热端产生的热量排出汇控柜,避免因热端散热不畅而降低冷凝效果。

The invention discloses a condensation and dehumidification device for a centralized control cabinet that dissipates heat through water cooling. The technical solution adopted by the present invention is: a water-cooling head is installed on a water-cooling fixed plate, a semiconductor refrigeration fin is provided on the inside of the water-cooling head, and a heat sink is provided on the inside of the semiconductor refrigeration fin; the cold end of the semiconductor refrigeration fin is bonded to the heat sink. , the hot end and the water-cooling head fit together; the two water-cooling heads located on the two water-cooling fixed plates are connected in series. The water inlet and outlet of the water-cooling head are connected to the water pipes using clamps. The water pipes, a water pump and a water tank form a closed circuit; the top connection There is a fan installed on the board, and there is a ventilation channel on the top connecting plate below the fan, which is used to blow the air in the control cabinet into the box; there is a pipe joint fixing hole on the water collecting plate, and the pipe joint fixing hole is in Install a pipe fitting. The invention can realize condensation and dehumidification of the air in the condensation control cabinet, and can discharge the heat generated by the hot end of the semiconductor refrigeration chip out of the condensation control cabinet to avoid reducing the condensation effect due to poor heat dissipation at the hot end.

Description

Condensing and dehumidifying device of control cabinet through water cooling heat dissipation
Technical Field
The invention relates to a condensation dehumidifying device in a control cabinet, in particular to a condensation dehumidifying device of a control cabinet through water cooling.
Background
At present, the outdoor sealed box body of some power grid substations is influenced by geographical environment factors such as sea, raininess, humidity and the like, and the inside of the box body has the problem of being damp, so that power grid equipment accidents are very easy to occur. If the isolation and grounding switch box is wet, knife blocking and movement rejection or knife misoperation can occur; if the breaker mechanism box is wet, the problems of misoperation, abnormal signaling and the like of the breaker switch can occur; if the GIS equipment or the transformer control cabinet is wetted, the intelligent terminal may be halted to stop working, the device is abnormal, and the like.
The outdoor sealed box body of the power grid is wetted mainly because water vapor exists in the box body, condensation can be generated under the temperature change, and the box body sealing element (sealing ring aging or connecting part sealing gum failure) is wetted when in service.
The existing dehumidification modes mainly comprise three modes of heating dehumidification, condensation dehumidification and drying air dehumidification, and the three dehumidification modes have the advantages and disadvantages respectively:
the traditional heating and dehumidifying mode improves the temperature in the switch cabinet through the heater, improves the capability of air to dissolve moisture, achieves the purpose of reducing relative humidity, and ensures that condensation is not easy to occur. However, the moisture cannot be discharged out of the box body by heating and dehumidifying, and when the external environment is greatly cooled, the metal box body is used as a good heat conductor, and the temperature is also rapidly reduced, so that the moisture close to the box body is condensed.
The semiconductor condensation dehumidification utilizes the principle of temperature difference condensation, and reduces the temperature of a condensation surface metal plate through a semiconductor element arranged in the dehumidifier, so that water vapor is condensed on the metal plate, water drops can automatically flow to a drain pipe and are discharged to the outside of the switch cabinet through the drain pipe, and the water vapor content in the switch cabinet is reduced. But semiconductor dehumidification efficiency is low, and the box is not totally sealed, and outside humidity changes have a great influence on the inside dehumidification of box, and cold junction condensation efficiency can be reduced because the semiconductor hot junction can't discharge the steam, long ago heat siltation.
The dehumidification of the dry air mainly takes a rotary dehumidifier as a dehumidification device, and the dry air is continuously conveyed into the switch cabinet through the dehumidifier so as to replace the moist air in the cabinet, and the process is essentially equivalent to a ventilation process. This means that a drying device is required to be externally installed to ventilate the inside of the cabinet, and the dehumidification effect depends on the power of the dehumidifier, and is large in investment and unsuitable for an outdoor control cubicle.
In the prior art, when the sealed box body is wetted, the box body can be opened to naturally emit moisture only at the clear time of the weather, or a heating device or a semiconductor dehumidifying device is additionally arranged in the sealed box body with larger space such as a control cabinet and the like so as to solve the problem of the box body wetted, and the use of dry air for dehumidification is rare. An intelligent outdoor terminal box dehumidifying device (application number 201610488968.2) is a device for dehumidifying dry air, and can dehumidify the interior of a box body, but a purging pipe is required to be paved in the interior of the box body, and the existing box body is required to be modified to a certain extent. "electronic dehumidifier in terminal box" (application number: 201410121414. X) is a condensing and dehumidifying device, but does not solve the problem how heat is discharged from the inside of the box, and the discharged heat still stagnates in the inside of the box. The dehumidifying circulating dryer (application number: 201010245724.4) for the boxes and cabinets also has the heat dissipation problem, heat in the boxes cannot be timely discharged, the dehumidifying effect is affected, and the dehumidifying effect is continuously reduced under the condition that the environment is wet for a long time.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a condensing and dehumidifying device for a control cabinet through water cooling heat dissipation, which can realize condensation and dehumidification of air in the control cabinet, and can discharge heat generated by a hot end of a semiconductor refrigerating sheet out of the control cabinet, so that the condensation effect is prevented from being reduced due to unsmooth heat dissipation of the hot end.
Therefore, the invention adopts the following technical scheme: the condensing and dehumidifying device of the control cabinet through water cooling comprises two water cooling fixed plates, two side baffles arranged between the two water cooling fixed plates and a top connecting plate, wherein a water collecting plate positioned below the top connecting plate is arranged between the two water cooling fixed plates, and a box body is assembled by the water collecting plate, the two water cooling fixed plates, the two side baffles and the top connecting plate;
the water cooling fixing plate is provided with a water cooling head, the inner side of the water cooling head is provided with a semiconductor refrigerating sheet, and the inner side of the semiconductor refrigerating sheet is provided with a radiating fin; the cold end of the semiconductor refrigerating sheet is attached to the radiating fin, and the hot end of the semiconductor refrigerating sheet is attached to the water cooling head;
two water cooling heads respectively positioned on the two water cooling fixing plates are connected in series, water inlets and water outlets of the water cooling heads are connected with water pipes by adopting hoops, and the water pipes, a water pump and a water tank form a closed loop;
a fan is arranged on the top connecting plate, and an air duct is arranged on the top connecting plate below the fan and used for blowing air in the control cabinet into the box body;
the water collecting plate is provided with a pipe joint fixing hole, a pipe joint is arranged in the pipe joint fixing hole, and the pipe joint is connected with a drain pipe.
The invention uses the water pump to drive the water flow in the waterway to take away the heat of the hot end of the semiconductor refrigerating sheet, and the water tank is used for radiating the heat of the waterway, so that the heat of the hot end of the semiconductor refrigerating sheet is well radiated.
In addition to the above technical scheme, the fan, the semiconductor refrigerating sheet and the water pump are connected with a controller through wires, and the operation of the fan, the semiconductor refrigerating sheet and the water pump is controlled by the controller.
In addition to the technical scheme, the water collecting plate is provided with a wire harness wire outlet hole for leading out wires of the semiconductor refrigerating sheet and the fan.
As the supplement of the technical scheme, the water cooling head is provided with a plurality of fixing sheets, and the fixing sheets and the cooling fins clamp and fix the water cooling head on the water cooling fixing plate through bolts.
As the supplement of the technical proposal, the bottoms of the two water-cooling fixing plates are arranged on the bottom feet.
As the supplement of the technical proposal, the footing is milled with a fixing groove for fixing the water-cooling fixing plate, and the water-cooling fixing plate and the footing are joggled.
As the supplement of the technical scheme, the fan is fixed on the top connecting plate through self-tapping screws, the top connecting plate and the water collecting plate are connected with the two water-cooling fixing plates through joggles, and the side baffle plates are clamped in grooves of the top connecting plate, the water-cooling fixing plates and the water collecting plate.
As the supplement of the technical proposal, the water-cooling fixed plate is provided with a wire outlet groove for the outgoing wire of the semiconductor refrigerating piece.
In addition to the technical scheme, the water collecting plate is provided with a water collecting tank, and the pipe joint fixing hole is positioned in the water collecting tank.
In addition to the above technical scheme, a plurality of strip-shaped exhaust holes are formed in the lower portion of the side baffle plate.
The invention has the following beneficial effects:
1. simple structure, easy to assemble.
2. The condensation dehumidification effect is far higher than that of the traditional air cooling dehumidification, and heat cannot be accumulated in the control cabinet.
3. Can be quickly condensed and dehumidified in a high-temperature and high-humidity environment, and the traditional air-cooled condensation dehumidification is difficult to play a role under the conditions of high temperature and high humidity.
Drawings
FIG. 1 is a schematic view of a dehumidifying apparatus according to the present invention;
FIG. 2 is a front view of the dehumidification device of the present invention;
FIG. 3 is a side view of the dehumidification device of the present invention;
FIG. 4 is a cross-sectional view of the dehumidifying apparatus of the present invention taken along the A-A direction;
FIG. 5 is a schematic view of a dehumidifying device according to the present invention with a side of the cooling fin removed;
fig. 6 is a schematic view of a water collection sheet of the present invention;
FIG. 7 is a schematic view of the foot of the present invention;
fig. 8 is a schematic view showing the arrangement of the entire dehumidifying apparatus of the present invention.
In the figure, the fan is 1-, the top connecting plate is 2-, the side baffle is 3-, the water collecting plate is 4-, the pipe joint fixing hole is 41-, the water collecting tank is 42-, the wire harness outlet hole is 43-, the foot is 5-, the water pipe is 6-, the foot fixing groove is 51-, the water pipe is 6-, the water cooling head is 7-, the fixing piece is 8-, the water cooling fixing plate is 9-, the wire outlet groove is 91-, the semiconductor refrigerating piece is 10-, the radiating fin is 11-and the pipe joint is 12-.
Detailed Description
As shown in fig. 1 to 7, the dehumidifying device of the present invention is composed of a fan 1, a top connection plate 2, side baffles 3, a water collecting plate 4, feet 5, water pipes 6, a water cooling head 7, a fixing plate 8, a water cooling fixing plate 9, a semiconductor refrigerating plate 10, a radiating plate 11 and a pipe joint 12. The fan 1 is fixed on the top connecting plate 2 through self-tapping screws, the top connecting plate 2 and the water collecting plate 4 are connected with the two water-cooling fixing plates 9 through joggles, and the side baffles 3 are clamped in grooves of the top connecting plate 2, the water-cooling fixing plates 9 and the water collecting plate 4. The footing 5 is connected with the water-cooling fixing plate 9 through joggles. The fixing piece 8 and the radiating fin 11 clamp and fix the water cooling head 7 on the water cooling fixing plate 9 through bolts. The water pipe 6 is fixed on the water inlet and outlet of the water cooling head through the clamp, and the water pipe 6 is also connected with a water pump and a water tank to form a closed waterway. Outlet slots 91 for the outlet of the semiconductor cooling fin 10 are also milled into the water-cooled mounting plate 9.
As shown in fig. 6, a water collecting tank 42 for collecting condensed water is milled out of the water collecting plate 4. The pipe joint fixing hole 41 may be screw-coupled with the pipe joint 12 by screw-coupling. The water collecting plate 4 is also processed with a wire harness outlet hole 43 capable of leading out wires, and the wire harness outlet hole 43 is used for leading out wires of the semiconductor refrigeration sheet 10 and the fan 1 so as to be connected to a controller.
As shown in fig. 7, the foot 5 is milled with a foot fixing groove 51 for fixing the water-cooled fixing plate 9, and the water-cooled fixing plate 9 and the foot 5 are joggled.
As shown in FIG. 8, the outlet of the dehumidifier and the outlet of the water pump are connected to the controller, and the water path of the dehumidifier is connected to the water pump and the water tank to form a closed loop.
When the dehumidifying device works, the controller controls the water pump, the semiconductor refrigerating sheet 10 and the fan 1 to be started, the waterway starts to circulate, the water brings heat generated by the hot end of the semiconductor refrigerating sheet 10 to the water tank to dissipate heat, the water tank is arranged outside the control cabinet, and the heat-dissipated water flows into the hot end again to circulate. Under the condition that the heat dissipation of the hot end of the semiconductor refrigerating sheet 10 is good, the temperature of the cold end is rapidly reduced, the fan 1 blows the wet air in the control cabinet into the dehumidifying device, moisture in the air condenses on the radiating fins 11 and falls into the water collecting tank 42 of the water collecting plate 4 under the action of the fan 1 and gravity, the condensed water in the water collecting tank 42 is converged to a certain degree, flows into a drain pipe connected with the pipe joint 12 through the pipe joint fixing hole 41, and is discharged out of the control cabinet.
The wind direction of the fan 1 is the inside of the dehumidifier, so that the air in the control cabinet can be continuously blown into the dehumidifier, the dehumidification efficiency is improved, and the dehumidification effect is enhanced.
The controller can control the semiconductor refrigerating plate 10 to stop refrigerating after a period of operation, so as to prevent long-time refrigerating from frosting on the radiating plate 11 and affecting the refrigerating effect.
A plurality of strip-shaped exhaust holes are milled on the side baffle plate 3 so that the dry air dehumidified in the condensation dehumidifying device can be discharged to the control cabinet.
The cold end of the semiconductor refrigerating sheet 10 is attached to the radiating fin 11, the hot end is attached to the water cooling head 7, the water pump drives water in the waterway to take away heat of the hot end, and the water tank is used for radiating heat of the waterway, so that the heat of the hot end of the semiconductor refrigerating sheet 10 is well radiated.
The specific embodiments described herein are offered by way of illustration only. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions, without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims (6)

1.一种通过水冷散热的汇控柜冷凝除湿装置,包括两块水冷固定板(9)、安装在两块水冷固定板之间的两块侧边挡板(3)和一块顶部连接板(2),其特征在于,所述的两块水冷固定板(9)之间装有一位于顶部连接板(2)下方的集水板(4),通过一块集水板(4)、两块水冷固定板(9)、两块侧边挡板(3)和一块顶部连接板(2)组装成一箱体;1. A condensation and dehumidification device for a HSBC cabinet that dissipates heat through water cooling, including two water-cooling fixed plates (9), two side baffles (3) installed between the two water-cooled fixed plates, and a top connecting plate ( 2), which is characterized in that a water collecting plate (4) located below the top connecting plate (2) is installed between the two water-cooled fixed plates (9). Through a water collecting plate (4) and two water-cooled The fixed plate (9), two side baffles (3) and a top connecting plate (2) are assembled into a box; 所述的水冷固定板(9)上装有水冷头(7),该水冷头(7)的内侧设有半导体制冷片(10),半导体制冷片(10)的内侧设有散热片(11);所述半导体制冷片(10)的冷端与散热片(11)贴合,热端与水冷头(7)贴合;The water-cooling fixed plate (9) is equipped with a water-cooling head (7). The water-cooling head (7) is provided with a semiconductor refrigeration piece (10) inside, and the inside of the semiconductor refrigeration piece (10) is provided with a heat sink (11); The cold end of the semiconductor refrigeration piece (10) is attached to the heat sink (11), and the hot end is attached to the water cooling head (7); 分别位于两块水冷固定板上的两个水冷头串联,水冷头(7)的进出水口采用卡箍连接水管(6),水管(6)与一水泵和一水箱组成一条封闭的回路;Two water-cooling heads located on two water-cooling fixed plates are connected in series. The water inlet and outlet of the water-cooling head (7) are connected to the water pipe (6) using a clamp. The water pipe (6) forms a closed circuit with a water pump and a water tank; 所述的顶部连接板(2)上装有一风扇(1),位于风扇下方的顶部连接板上开有通风道,用于将汇控柜内的空气吹入箱体中;A fan (1) is installed on the top connecting plate (2), and a ventilation channel is opened on the top connecting plate below the fan for blowing the air in the control cabinet into the box; 所述的集水板(4)上开有管接头固定孔(41),该管接头固定孔(41)中安装一管接头(12),管接头上连接排水管;The water collecting plate (4) is provided with a pipe joint fixing hole (41), a pipe joint (12) is installed in the pipe joint fixing hole (41), and a drainage pipe is connected to the pipe joint; 所述的水冷头(7)上设有多个固定片(8),固定片(8)和散热片(11)通过螺栓将水冷头(7)夹紧并固定在水冷固定板(9)上;The water-cooling head (7) is provided with a plurality of fixing pieces (8), and the fixing pieces (8) and the heat sink (11) clamp and fix the water-cooling head (7) on the water-cooling fixing plate (9) through bolts. ; 所述的风扇(1)通过自攻螺丝固定在顶部连接板(2)上,顶部连接板(2)和集水板(4)与两块水冷固定板(9)通过榫接连接,侧边挡板(3)卡在顶部连接板(2)、水冷固定板(9)和集水板(4)的槽中;The fan (1) is fixed on the top connecting plate (2) through self-tapping screws. The top connecting plate (2) and the water collecting plate (4) are connected to the two water-cooling fixed plates (9) through tenon joints. The baffle (3) is stuck in the grooves of the top connecting plate (2), water-cooling fixed plate (9) and water collecting plate (4); 所述的水冷固定板(9)上开有用于半导体制冷片(10)出线的出线槽(91);The water-cooling fixed plate (9) is provided with an outlet slot (91) for the outlet of the semiconductor refrigeration chip (10); 所述的集水板(4)上设有集水槽(42),所述的管接头固定孔(41)位于集水槽(42)中。The water collecting plate (4) is provided with a water collecting tank (42), and the pipe joint fixing hole (41) is located in the water collecting tank (42). 2.根据权利要求1所述的汇控柜冷凝除湿装置,其特征在于,所述的风扇(1)、半导体制冷片(10)和水泵通过导线与一控制器连接,通过控制器控制风扇、半导体制冷片和水泵的工作。2. The condensation dehumidification device of the bus control cabinet according to claim 1, characterized in that the fan (1), semiconductor refrigeration chip (10) and water pump are connected to a controller through wires, and the fan, The work of semiconductor refrigeration elements and water pumps. 3.根据权利要求2所述的汇控柜冷凝除湿装置,其特征在于,所述的集水板(4)上设有线束出线孔(43),用于将半导体制冷片和风扇的导线引出。3. The condensation and dehumidification device of the bus control cabinet according to claim 2, characterized in that the water collecting plate (4) is provided with a wiring harness outlet hole (43) for leading out the wires of the semiconductor refrigeration fin and the fan. . 4.根据权利要求1或2所述的汇控柜冷凝除湿装置,其特征在于,所述的两块水冷固定板(9)的底部安装在底脚(5)上。4. The condensation and dehumidification device of the control cabinet according to claim 1 or 2, characterized in that the bottoms of the two water-cooled fixed plates (9) are installed on the feet (5). 5.根据权利要求4所述的汇控柜冷凝除湿装置,其特征在于,所述的底脚(5)上铣有用于固定水冷固定板(9)的固定槽,水冷固定板(9)和底脚(5)进行榫接。5. The condensation dehumidification device of the bus control cabinet according to claim 4, characterized in that the foot (5) is milled with a fixing groove for fixing the water-cooling fixing plate (9), and the water-cooling fixing plate (9) and The foot (5) is mortise-and-tenoned. 6.根据权利要求1或2所述的汇控柜冷凝除湿装置,其特征在于,所述侧边挡板(3)的下部开有多个条形排气孔。6. The condensation and dehumidification device of the control cabinet according to claim 1 or 2, characterized in that the lower part of the side baffle (3) is provided with a plurality of strip-shaped exhaust holes.
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