CN106091472A - A kind of quasiconductor degree of depth dehumidifier - Google Patents
A kind of quasiconductor degree of depth dehumidifier Download PDFInfo
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- CN106091472A CN106091472A CN201610675560.6A CN201610675560A CN106091472A CN 106091472 A CN106091472 A CN 106091472A CN 201610675560 A CN201610675560 A CN 201610675560A CN 106091472 A CN106091472 A CN 106091472A
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- air
- air inlet
- radiating fin
- heat absorbing
- hole
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
- A47B61/00—Wardrobes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
Abstract
The invention provides a kind of quasiconductor degree of depth dehumidifier, including housing, be provided with semiconductor chilling plate in housing, the side of semiconductor chilling plate is provided with heat absorbing fins group, and opposite side is provided with radiating fin group；Housing is provided with the first air inlet, the second air inlet and air outlet, the outer humid air of machine enters in housing from the first air inlet and the second air inlet, the humid air entered by the first air inlet flows to radiating fin group after first flowing through heat absorbing fins group again, the second air inlet the outer humid air of the machine entered flows directly into radiating fin group；Flow through the air after radiating fin group and discharged housing by air outlet；The intake of the first air inlet is less than the intake of the second air inlet.The present invention makes the sensible heat passing through the air of heat absorbing fins group accounting in cooling piece refrigerating capacity significantly, accurately reduce, the latent heat of phase change of water vapor in air accounting in semiconductor chilling plate refrigerating capacity effectively improves, accurately improves, it is ensured that heat absorbing fins group filters moisture under the conditions of low relative humidity from air.
Description
Technical field
The present invention relates to dehydrating unit design field, particularly relate to a kind of quasiconductor degree of depth dehumidifier.
Background technology
Semiconductor refrigerating technology, also known as freezing by thermoelectric action technology, from the 1950's, fast development is got up.Quasiconductor system
Cold, it utilizes the P-N junction that semi-conducting material forms, and logical upper unidirectional current can produce refrigeration, within several seconds, just can make cold end
Frosting；It does not has the complicated frame for movements such as compressor, more need not cold-producing medium.
Although the Energy Efficiency Ratio of semiconductor refrigerating, i.e. refrigerating capacity and the ratio inputting electric work, relatively low, only use fluorine profit
About the 1/10 of the vapour compression refrigeration system of high cold-producing medium, but semiconductor refrigerating technology have unrivaled feature and
Advantage: 1. mechanical is moved, without cold-producing medium, refrigeration rapidly；2. can with modularity combination in any, refrigerating capacity can from milliwatt level to
Multikilowatt, the refrigeration temperature difference is up to 30---150 DEG C, easy to use, uses extensively；3. can continuously adjust, change the confession of cooling piece
Piezoelectric voltage, refrigerating capacity can be with consecutive variations；The most lightweight, volume is little, can make miniature, submicron, small semiconductor refrigeration
Device.
Semiconductor refrigerating technology at short space, such as industrial electro gas holder, family's wardrobe cabinet etc., do not have big wet negative
Under conditions of lotus humid air continuously generates, the mildew-resistant that dehumidifies in solving cabinet, raising electric insulation grade prevent from puncturing aspect, have
Unique advantage.
Use semiconductor refrigerating, dehumidify, success and putting it over.Improve the dehumidifying degree of depth the most further,
Relative humidity is reduced to less than 50%, improves the drying property of air, prevent mycete from producing and development, become the urgent of market and be essential
Ask.
Mouldy is a kind of common natural phenomena, may alternatively appear in food and wood furniture.Wood furniture, medicated clothing etc. make moist
After time length, it is easily caused mouldy.If moisture activity value is low, mycete can not absorb moisture and be difficult to develop；Water after being moistened
Dividing activity value to raise, mycete is absorbed by the saccharide in moisture and then decomposition and edible food, fiber, carbons nutrient, fast fast-growing
Length even overgrows.
Mycete occurs and the temperature and humidity conditions of suppression:
| Temperature | Relative humidity | Vapour pressure | Go mouldy occurrence degree | |
| 1 | Less than 23 DEG C | Less than 50% | Less than 17hpa | It is not susceptible to go mouldy |
| 2 | 23 DEG C～26 DEG C | 50%～60% | 17hpa～22hpa | It is difficult to go mouldy |
| 3 | 26 DEG C～29 DEG C | 60%～70% | 22hpa～27.5hpa | Can go mouldy |
| 4 | 29 DEG C～32 DEG C | 70%～85% | 27.5hpa～31hpa | It is easier to go mouldy |
| 5 | Higher than 32 DEG C | More than 85% | Higher than 31hpa | Easily go mouldy |
As can be seen from the above table, relative humidity to be reduced to less than 50%, go mouldy and be just not susceptible to；And will be by whole sky
Between relative humidity be reduced to 50%, dehumidifier must have to be filtered in less than the following relative humidities of 50% (such as 40%)
Ability except moisture in air.
Semiconductor demoistener in the market, as shown in fig. 1, during operation, semiconductor chilling plate 17 is passed through unidirectional current, system
Cold right side heat absorption, left side heat release, blower fan 11 air is pressed to cooling piece on the left of be in close contact radiating fin 12 band become popular
It is external that amount discharges dehumidifier from air outlet 18；Meanwhile, blower fan 11 causes negative pressure at intracavity, and the air being drawn into air port 15 flows into；
From air inlet 15 leaked-in air, sub-fraction flow through with cooling piece on the right side of be in close contact heat absorbing fins 16, this sub-fraction
Air is converged by the bulk air not flowing through heat absorbing fins after cool-down dehumidification with major part, then flows to radiating fin.This partly lead
The ventilation of the heat absorbing fins of body dehumidifier, has uncertainty, and the disturbance in any one external world can cause the change of ventilation
Change, it is impossible to precisely air distribution, can only dehumidify under the conditions of high humility such as 80%RH, and can not in relatively low humidity such as
Dehumidify under the conditions of 40%RH, cause the degree of depth of semiconductor refrigerating technology to dehumidify the irrealizable problem of " mildew-resistant " function.
Summary of the invention
In order to solve the problems referred to above, the invention provides a kind of quasiconductor degree of depth dehumidifier, including housing, in described housing
Being provided with semiconductor chilling plate, the side of described semiconductor chilling plate is provided with heat absorbing fins group, and opposite side is provided with radiating fin group；
Be provided with the first air inlet, the second air inlet and air outlet on described housing, the outer humid air of dehumidifier from described respectively from first
Air inlet and the second air inlet enter in described housing, and the humid air entered by the first air inlet first flows through described heat absorption fins
Flow to described radiating fin group after sheet group again, the second air inlet the humid air entered flows directly into described radiating fin group；Stream
Air after radiating fin group discharges described housing via described air outlet；Wherein, the intake of described first air inlet
Intake less than the second air inlet.
It is preferred that be provided with the first air distribution plate on described first air inlet, described first air distribution plate is evenly equipped with multiple
One through hole；
It is provided with the second air distribution plate on described second air inlet, described second air distribution plate is evenly equipped with multiple second through hole.
It is preferred that the diameter of the first through hole or the diameter of equivalent diameter≤the second through hole or equivalent diameter, described first leads to
The quantity of the quantity in hole≤described second through hole
It is preferred that described first through hole and/or described second through hole are, described first through hole, described second through hole are circle
Shape, ellipse, rectangle, rhombus, triangle or other polygon.
It is preferred that be provided with drip tray below described heat absorbing fins group.
It is preferred that described drip tray connects a water tank.
It is preferred that be provided with blower fan between the outlet air end of described radiating fin group and described air outlet, it is used for promoting housing
The flowing of interior air.
Due to the fact that the above technical scheme of employing, be allowed to compared with prior art, have the following advantages that and actively imitate
Really:
A kind of quasiconductor degree of depth dehumidifier that the present invention provides, by air inlet is divided into two air inlets, and enters two
The air quantity in air port distributes accurately, controls so that pass through the air quantity of heat absorbing fins group less than the wind passing through radiating fin group
Amount, is greatly reduced, accurately so that passing through the sensible heat of the air of the heat absorbing fins group accounting in semiconductor chilling plate refrigerating capacity
Reducing, the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity effectively improves, accurately improves, it is ensured that half
The heat absorbing fins of conductor cooling piece filters moisture under the conditions of low relative humidity (such as 40%) from air, thus by quasiconductor
Relative humidity in space residing for dehumidifier is reduced to less than 50%, effectively to press down mycostatic generation.
Accompanying drawing explanation
In conjunction with accompanying drawing, by hereafter state detailed description, can be more clearly understood that the present invention above-mentioned and other feature and
Advantage, wherein:
Fig. 1 is the structural representation of semiconductor demoistener in prior art；
The structural representation of the quasiconductor degree of depth dehumidifier that Fig. 2 provides for the present invention；
Fig. 3 is heat absorbing fins group in the present invention, the structural representation of radiating fin group；
Fig. 4 is that in the present invention, through hole is the structural representation of the first partition plate of circular hole；
Fig. 5 is that in the present invention, through hole is the structural representation of the second partition plate of circular hole；
Fig. 6 is that in the present invention, through hole is the structural representation of the first partition plate of rectangular opening；
Fig. 7 is that in the present invention, through hole is the structural representation of the second partition plate of rectangular opening.
Detailed description of the invention
See the accompanying drawing illustrating the embodiment of the present invention, the present invention is described in more detail.But, the present invention can be with
Many multi-forms realize, and should not be construed as the embodiment by herein proposing and limited.On the contrary, proposing these embodiments is
In order to reach fully and complete disclosure, and those skilled in the art are made to understand the scope of the present invention completely.These are attached
In figure, for clarity sake, may be exaggerated layer and the size in region and relative size.
Using semiconductor refrigerating to carry out dehumidification operation, it is crucial, is radiating fin group and the heat absorption of semiconductor chilling plate
The Boiler pressure control of fins set, is how to solve " radiating fin group needs Wind Volume to need little air quantity with heat absorbing fins group " so
Conflict.
Current semiconductor demoistener cooling piece, due to the physical characteristic of quasiconductor P-N junction self, its refrigerating efficiency is relatively
Low, general only about 0.3；The generally refrigerating capacity of cooling piece is smaller, when being unit with " w ", and refrigerating capacity generally only 10
The 1 power order of magnitude or the 2 power orders of magnitude.When semiconductor demoistener runs, if heat absorbing fins assembles wind not precisely, pass through
The air mass flow of heat absorbing fins group is bigger than normal, and semiconductor chilling plate does not just carry out degree of depth dehumidifying (by relative air humidity to air
Be reduced to less than 50%) ability；This is because, air is only reduced under its dew point temperature in temperature could filtrate
Point；And when passing through the air mass flow of heat absorbing fins group of semiconductor chilling plate and being bigger than normal, the refrigerating capacity of semiconductor chilling plate is first
The absorption of more than dew point temperature sensible heat during air cooling-down, and absorbing the air sensible being positioned at more than dew point temperature
Time semiconductor chilling plate refrigerating capacity generally the most depleted, hence without refrigerating capacity more than needed be used further to now to reach saturated or
Person, close to the absorption of saturated water vapor in air condensation heat, no longer exists ability just water vapor in air and is condensed into water.
The invention provides a kind of quasiconductor degree of depth dehumidifier, by air inlet being divided into two air inlets so that pass through
The air quantity of heat absorbing fins group is less than the air quantity passing through radiating fin group, makes the small air quantity passing through heat absorbing fins group accurately be controlled
System, is greatly reduced so that passing through the sensible heat of the air of the heat absorbing fins group accounting in cooling piece refrigerating capacity, accurately reduces, empty
In gas, the latent heat of phase change of water vapour accounting in cooling piece refrigerating capacity effectively improves, accurately improves, it is ensured that quasiconductor system
The heat absorbing fins group of cold filters moisture under the conditions of low relative humidity (such as 40%) from air, thus by semi-conductor dehumidifying
Relative humidity in space residing for machine is reduced to less than 50%, effectively to press down mycostatic generation.
Concrete, with reference to Fig. 2, the quasiconductor degree of depth dehumidifier that the present invention provides includes a housing 10, sets in housing 10
Being equipped with semiconductor chilling plate 3, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 7, and opposite side is provided with radiating fin group
2；Be provided with the first air inlet, the second air inlet and air outlet 9 on housing 10, extraneous humid air from the most respectively from the first air inlet and
Second air inlet enters in housing 10, and by first air inlet enter humid air first flow through heat absorbing fins group 7 after flow to again
Radiating fin group 2, the second air inlet the humid air entered flows directly into radiating fin group 2；From the first air inlet and second
After the air of air inlet flows through radiating fin group 2 together, warp is discharged housing 10 by air outlet 9；Wherein, the air intake of the first air inlet
Amount is less than the intake of the second air inlet.
As shown in Figure 3, heat absorbing fins group 7 and radiating fin group 2 are specifically arranged base by a substrate and multiple parallel interval
Fin composition on plate, heat absorbing fins group 7, the substrate side of radiating fin group 2 are compressed on semiconductor chilling plate 3；When partly leading
Body cooling piece 3 is energized after work, and heat absorbing fins group 7 is absorbed heat, radiating fin group 2 heat release, and humid air stream is dropped through heat absorbing fins group 7
Temperature dehumidifying, becomes low temperature saturated air, then flows through radiating fin group 2 and take away the heat in radiating fin group 2.
First air inlet is communicated with the first air intake passage, and heat absorbing fins group 7 is positioned at the first air intake passage；Second air inlet
It is communicated with the second air intake passage, the first air intake passage and the second air intake passage separate, and at the air intake of radiating fin group 2
Converge；The outlet air end of radiating fin group 2 is connected with air outlet 9 by an air-out passage；From being dropped that the first air intake passage is come in
Temperature dehumidifying after air and from second air intake passage enter air converge after stream flow to radiating fin group 2, take away radiating fin
Through being discharged housing by air-out passage from air outlet 9 after heat in group 2.
It is provided with the first air distribution plate 8 on first air inlet, the second air inlet is provided with the second air distribution plate 4, the first air distribution
Plate 8 and the second air distribution plate 4 are for realizing the first air inlet, the accurate distribution of the intake of the second air inlet, at the present embodiment
In the first air distribution plate 8 accurately control low discharge air enter, the second air distribution plate 4 accurately controls relatively large air mass flow and enters
Enter.The present invention is the ventilation less than radiating fin group by flowing through the Boiler pressure control of heat absorbing fins group, so that passing through heat absorption fins
The sensible heat of the air of sheet group accounting in semiconductor chilling plate refrigerating capacity is greatly reduced, accurately reduces, water vapor in air
Latent heat of phase change accounting in cooling piece refrigerating capacity effectively improves, accurately improves.
Further, the first air distribution plate 8 is provided with multiple first through hole, the second air distribution plate 4 is provided with multiple second
Through hole, wherein the first through hole, the second through hole can be circular hole as shown in figs. 4-5, it is possible to for rectangle as shown in figs. 6-7
Hole；In other embodiments, the first through hole, the second through hole are alternatively ellipse, rhombus, triangle or other polygon, herein
It is not restricted.The present invention can by controlling the first through hole, arrange quantity, the size of the second through hole accurately control first and join
Aerofoil 8 and the intake of the second air distribution plate 4, thus accurately control heat absorbing fins group 7, the ventilation of radiating fin group 2；Such as
In the present embodiment, the first through hole and the second through hole is equivalently-sized, by controlling the setting of the first through hole on the first air distribution plate 8
Number less than on the second air distribution plate 4 second through hole number is set, thus accurately control the ventilation of the first air inlet less than the
The intake of two air inlets, accurately controls the ventilation ventilation less than radiating fin group 2 of heat absorbing fins group 7.The most such as,
The diameter of one through hole or the diameter of equivalent diameter≤the second through hole or equivalent diameter, the quantity of the first through hole≤described second through hole
Quantity so that the ventilation of heat absorbing fins group 7 is less than the ventilation of radiating fin group 2.
When the first air distribution plate 8 and the second air distribution plate 4 are orifice plate when, the i.e. first through hole and the second through hole are circular hole
When, by the diameter of circular hole on orifice plate and the setting of quantity, regulation air flows through the resistance of orifice plate, it is possible to accurately adjust
Joint heat absorbing fins group, the ventilation of radiating fin group, can accurately adjust heat absorbing fins group ventilation and ventilate with radiating fin group
The ratio of amount；I.e. can realize " increasing radiating fin group ventilation to reduce the operating temperature of radiating fin group, to improve quasiconductor
The refrigerating efficiency of cooling piece ", can realize again " reduce heat absorbing fins group ventilation make the sensible heat of air in cooling piece refrigerating capacity
Accounting be greatly reduced, accurately reduce, the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity obtains effectively
Improve, reliably improve, thus the relative humidity of the industry at semiconductor demoistener place Yu domestic space is reduced to less than 50%.
When the first air distribution plate 8 and the second air distribution plate 4 are seam plate when, the i.e. first through hole and the second through hole are rectangle
Seam eye, when, by stitching the Length x Width of eye and the setting of quantity on opposite joint plate, regulation air flows through the resistance of seam plate, just
Heat absorbing fins group, the ventilation of radiating fin group can be accurately regulated, heat absorbing fins group ventilation and heat radiation can be accurately adjusted
The ratio of fins set ventilation；I.e. can realize " increase radiating fin group ventilation with reduce radiating fin group operating temperature,
Improve the refrigerating efficiency of semiconductor chilling plate ", can realize again that " reducing heat absorbing fins group ventilation makes the sensible heat of air in refrigeration
Accounting in sheet refrigerating capacity is greatly reduced, accurately reduces, the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity
Than effectively improving, reliably improving, thus the relative humidity of the industry at semiconductor demoistener place with domestic space is reduced
To less than 50%.
The lower section of heat absorbing fins group 7 is provided with drip tray 6, for collecting the condensed water formed in heat absorbing fins group 7；Water receiving
Dish 6 is also associated with a water tank 5, and the water in drip tray 6 is exhausted directly in water tank.
It is provided with blower fan 1 between outlet air end and the air outlet 9 of radiating fin group 2, is i.e. arranged in air-out passage, blower fan 1
The flowing of air in promoting housing.After blower fan 1 starts so that enclosure interior forms negative pressure, so that outside air is suitable
Enter in housing from the first air inlet, the second air inlet.
The operation principle of the quasiconductor degree of depth dehumidifier provided with regard to the present invention below is described further:
First, after semiconductor chilling plate 3 energising starts, the heat absorbing fins group 7 on right side absorbs heat, the radiating fin on right side
Group 2 distributes heat；Blower fan 1 starts so that extraneous humid air enters in housing from the first air inlet, the second air inlet respectively；
The humid air entered from the first air inlet flows uniformly through heat absorbing fins group 7 after the first air distribution plate 8, by cool-down dehumidification, becomes
Radiating fin group 2 is flowed to after low temperature saturated air；The humid air equal uniform flow after the second air distribution plate 8 entered from the second air inlet
To radiating fin group 2；From the low temperature saturated air in the first air intake passage and from the humid air one in the second air intake passage
Rising and flow to radiating fin group 2, and lower the temperature radiating fin group 2, discharge from air outlet 9, so circulation reaches dehumidifying
Effect.
With regard to specific embodiment, the present invention is described further below:
Embodiment 1
In the present embodiment, semiconductor chilling plate power is 50W, and refrigerating capacity is 15W, and heating capacity is 65W；By controlling the
The quantity of through hole, size on one air distribution plate, the second air distribution plate so that heat absorbing fins group air quantity is 2m3/ h, radiating fin air quantity is
50m3/h；Therefore, heat absorbing end ventilation only has the 1/25 of radiating end, and the temperature difference of turnover radiating fin group is 3.9 DEG C；Take this
Bright the first air distribution plate, the air distribution technology of the second air distribution plate, can accurately control heat absorbing fins group and the ventilation of radiating fin group,
Ensure the effect on moisture extraction under low-moisture conditions.
Under (1) 30 DEG C of 60%RH operating mode
The air intake dew point of heat absorbing fins group 21.392 DEG C, enthalpy 71.302kJ/kg, water capacity 16.039g/kg, process enthalpy difference
Being 15/ (2*1.2/3.6)=22.5kJ/kg, the air condition point after process is 17.304 DEG C, enthalpy 48.802kJ/kg, water capacity
Doing for 12.367g/kg, moisture removal is 2*1.2 (16.039-12.367)=8.8g/h
(2) under 30 DEG C of 40%RH operating modes
The air intake dew point of heat absorbing fins group 15 DEG C, enthalpy 57.402kJ/kg, water capacity 10.601g/kg, processing enthalpy difference is 15/
(2*1.2/3.6)=22.5kJ/kg, the air condition point after process is 12.3 DEG C, enthalpy 34.902kJ/kg, and water capacity is
8.907g/kg does, and moisture removal is 2*1.2 (10.601-8.907)=4.06g/h
If not using the dehumidifier that the present invention provides, the ventilation of heat absorbing fins group will readily exceed 1g/s, i.e. be more than
3m3/ h, then the 15W refrigerating capacity of semiconductor chilling plate is by depleted for the sensible heat of the air being flow through heat absorbing fins group, quasiconductor
The condensation heat that cooling piece does not has refrigerating capacity to be used further to water vapor in air absorbs, and does not has condensed water to leach.
In the present embodiment, using the quasiconductor degree of depth dehumidifier that the present invention provides, it uses air distribution plate accurately to carry out
Air distribution, accurately realizes the little air quantity 2m of heat absorbing fins group3/ h, leaches moisture 4.06g/ under 30 DEG C of 40%RH operating modes from air
H, it is ensured that the relative humidity in space, semiconductor demoistener place is less than 50% such that it is able to effectively dehumidifies and presses down mycostatic
Life and development.
Embodiment 2
In the present embodiment, the power of semiconductor chilling plate is 50W, and refrigerating capacity is 15W, and heating capacity is 65W；By controlling
The quantity of through hole, size on first air distribution plate, the second air distribution plate so that heat absorbing fins group air quantity is 1m3/ h, radiating fin air quantity
For 50m3/h；Therefore, heat absorbing fins group ventilation only has the 1/50 of radiating fin group ventilation, and the temperature difference passing in and out radiating fin is
3.9℃.Take the first air distribution plate of the present invention, the air distribution technology of the second air distribution plate, can accurately control heat absorbing fins group and heat radiation
The ventilation of fins set, it is ensured that the effect on moisture extraction under low-moisture conditions.
(1) under 30 DEG C of 80%RH operating modes
The air intake dew point of heat absorbing fins group 26.14 DEG C, enthalpy 85.44kJ/kg, water capacity 21.57g/kg, processing enthalpy difference is
15/ (1*1.2/3.6)=45kJ/kg, the air condition point after process is 14.408 DEG C, enthalpy 40.44kJ/kg, and water capacity is
10.242g/kg does, and moisture removal is 1*1.2 (21.57-10.242)=13.6g/h；
(2) under 30 DEG C of 60%RH operating modes
The air intake dew point of heat absorbing fins group 21.392 DEG C, enthalpy 71.302kJ/kg water capacity 16.039g/kg, processing enthalpy difference is
15/ (1*1.2/3.6)=45kJ/kg, the air condition point after process is 8.672 DEG C, enthalpy 26.302kJ/kg, and water capacity is
6.97g/kg does, and moisture removal is 1*1.2 (16.039-6.97)=10.9g/h
(3) under 30 DEG C of 40%RH operating modes
The air intake dew point of heat absorbing fins group 15 DEG C, enthalpy 57.402kJ/kg, water capacity 10.601g/kg, processing enthalpy difference is 15/
(1*1.2/3.6)=45kJ/kg, the air condition point after process is 1.695 DEG C, enthalpy 12.402kJ/kg, and water capacity is
4.269g/kg does, and moisture removal is 1*1.2 (10.601-4.269)=7.6g/h
In the present embodiment, using the quasiconductor degree of depth dehumidifier that the present invention provides, it uses air distribution plate accurately to carry out
Air distribution, accurately realizes the little air quantity 1m of heat absorbing fins group3/ h, leaches 7.6g/h water under 30 DEG C of 40%RH operating modes from air
Point, it is ensured that the relative humidity in space, semiconductor demoistener place is less than 50% such that it is able to effectively dehumidifies and presses down mycostatic
Occur and development.
Those skilled in the art should be understood that the present invention can be implemented without departing from this with other concrete forms many
The spirit or scope of invention.Although having been described for embodiments of the invention, it should be understood that the present invention should not be limited to these embodiments,
Those skilled in the art as made change within spirit and scope of the invention that appended claims defines and can repair
Change.
Claims (7)
1. a quasiconductor degree of depth dehumidifier, it is characterised in that include housing, be provided with semiconductor chilling plate in described housing,
The side of described semiconductor chilling plate is provided with heat absorbing fins group, and opposite side is provided with radiating fin group；It is provided with on described housing
One air inlet, the second air inlet and air outlet, the outer humid air of dehumidifier from described respectively from the first air inlet and the second air inlet
Enter in described housing, and by first air inlet enter humid air first flow through described heat absorbing fins group after flow to again described dissipate
Hot fins set, the second air inlet the humid air entered flows directly into described radiating fin group；Stream is after radiating fin group
Air discharges described housing via described air outlet；Wherein, the intake of described first air inlet entering less than the second air inlet
Air quantity.
2. according to the quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that be provided with first on described first air inlet
Air distribution plate, described first air distribution plate is evenly equipped with multiple first through hole；
It is provided with the second air distribution plate on described second air inlet, described second air distribution plate is evenly equipped with multiple second through hole.
3. according to the quasiconductor degree of depth dehumidifier described in claim 2, it is characterised in that the diameter of the first through hole or equivalent diameter≤
The diameter of the second through hole or equivalent diameter, the quantity of the quantity of described first through hole≤described second through hole.
4. according to the quasiconductor degree of depth dehumidifier described in Claims 2 or 3, it is characterised in that described first through hole, described second lead to
Hole is circle, ellipse, rectangle, rhombus, triangle or other polygon.
5. according to the quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that be provided with below described heat absorbing fins group and connect
Water pond.
6. according to the quasiconductor degree of depth dehumidifier described in claim 5, it is characterised in that described drip tray connects a water tank.
7. according to the quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that the outlet air end of described radiating fin group and institute
State and between air outlet, be provided with blower fan, the flowing of air in promoting housing.
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| CN108963785A (en) * | 2018-09-28 | 2018-12-07 | 国网河南省电力公司南阳供电公司 | A kind of anti-condensation intelligent detection and control system of switchgear |
| CN109938495A (en) * | 2018-11-07 | 2019-06-28 | 杨皓 | A kind of wardrobe with energy-saving micro dehumidifier |
| CN110094809A (en) * | 2019-04-26 | 2019-08-06 | 北京智米科技有限公司 | A kind of dehumidifier |
| CN112928620A (en) * | 2021-02-08 | 2021-06-08 | 刘呆红 | High-efficient dehumidification switch board |
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| CN1837452A (en) * | 2005-08-12 | 2006-09-27 | 俞宝良 | Semi-conductor dehumidifying clothes-drier and clothes-drying method |
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| CN112928620A (en) * | 2021-02-08 | 2021-06-08 | 刘呆红 | High-efficient dehumidification switch board |
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|---|---|
| CN106091472B (en) | 2019-03-01 |
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Inventor after: Xue Shishan Inventor after: Ye Hailin Inventor after: ZhuGe Shuiming Inventor after: Su Xiaosheng Inventor after: Zeng Jinhui Inventor after: Langrunze Inventor before: Xue Shishan Inventor before: Ye Hailin Inventor before: ZhuGe Shuiming Inventor before: Geng Shibin Inventor before: Han Xu Inventor before: Su Xiaosheng Inventor before: Zeng Jinhui Inventor before: Yuan Li Inventor before: Langrunze |
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Denomination of invention: A semiconductor deep dehumidifier Effective date of registration: 20220628 Granted publication date: 20190301 Pledgee: Zhejiang Tailong Commercial Bank Co.,Ltd. Hangzhou Jiande sub branch Pledgor: HANGZHOU PREAIR ELECTRICAL APPLIANCE INDUSTRY CO.,LTD. Registration number: Y2022330001123 |