CN107990696A - Semiconductor thermoelectric drying system and dehumidification equipment - Google Patents
Semiconductor thermoelectric drying system and dehumidification equipment Download PDFInfo
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- CN107990696A CN107990696A CN201711414478.9A CN201711414478A CN107990696A CN 107990696 A CN107990696 A CN 107990696A CN 201711414478 A CN201711414478 A CN 201711414478A CN 107990696 A CN107990696 A CN 107990696A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 114
- 238000001035 drying Methods 0.000 title claims abstract description 68
- 238000007791 dehumidification Methods 0.000 title claims abstract description 9
- 238000005057 refrigeration Methods 0.000 claims abstract description 51
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 6
- 235000011194 food seasoning agent Nutrition 0.000 claims description 5
- 230000005619 thermoelectricity Effects 0.000 claims 3
- 230000010354 integration Effects 0.000 abstract description 4
- 239000003570 air Substances 0.000 description 70
- 230000000694 effects Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 238000004851 dishwashing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000006200 vaporizer Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
- B01D53/265—Drying gases or vapours by refrigeration (condensation)
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H3/00—Air heaters
- F24H3/02—Air heaters with forced circulation
- F24H3/06—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators
- F24H3/08—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators by tubes
- F24H3/081—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators by tubes using electric energy supply
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/005—Arrangement or mounting of control or safety devices of safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H2250/00—Electrical heat generating means
- F24H2250/06—Peltier
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Combustion & Propulsion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The present invention relates to a kind of semiconductor thermoelectric drying system and dehumidification equipment.Wherein, semiconductor thermoelectric drying system includes housing, semiconductor refrigeration chip, cool end heat exchanger, heat transfer device, heat pipe and hot end heat exchanger；Housing is equipped with air inlet, installation port and gas outlet；Cool end heat exchanger is embedded in housing and is hermetically arranged on the installation passage；Semiconductor refrigeration chip, heat transfer device, part heat pipe are arranged on outside housing, and the cold end of semiconductor refrigeration chip is engaged with cool end heat exchanger, and the hot junction of semiconductor refrigeration chip is engaged with the heat transfer device；One end of heat pipe is engaged with the heat transfer device, and the other end of heat pipe is engaged with hot end heat exchanger, and hot end heat exchanger is embedded in the housing；Air inlet, cool end heat exchanger, hot end heat exchanger, gas outlet are set gradually along airflow direction.Semiconductor thermoelectric drying system of the present invention effectively can complete air integration dehumidifying, heat drying, improve efficiency of energy utilization.
Description
Technical field
The present invention relates to technology is air-dried, more particularly to a kind of semiconductor thermoelectric drying system.
Background technology
Semiconductor refrigerating technology realizes that small cold freezes using the peltier effect of material.According to law of conservation of energy, half
The hot junction quantity of heat production Q of conductor refrigerating chip (TEC, Thermoelectric Cooler)h=cold end refrigeratory capacity Qc+ electricity input power
Pi, therefore, the heating efficiency (Q in the hot junction of TECh/Pi)>1, therefore can realize high-efficiency heating function using the hot junction of TEC as heat source.
Different from resistance (PTC) heating, TEC equally has cold while the heat production of hot junction, in its cold end and produces, and cold produces
More, the heat production efficiency in TEC hot junctions is higher.
At present, being air-dried mode usually has two kinds：First way is to utilize heating element, and environment is heated,
Make steam high temperature evaporation, reduce ambient air humidity, this kind of mode energy consumption is larger；The second way is using refrigeration, need to be done
The cryogenic vaporizer of dry air by refrigeration, makes it in cryogenic vaporizer surface condensation, and reaching reduces air humidity, dry empty
The effect of gas, although effect on moisture extraction is higher than first way under the same electrical power of which, its technical solution is merely with refrigeration
Function reduces humidity, causes energy utilization rate not high.Accordingly, it is capable to the refrigeration and the dual work(of heating of no comprehensive utilization TEC complete sky
Gas is dry, humidity regulation effect, thus lift simple heating or simple removal moisture drying effect and reduce energy consumption be this patent
Eyespot.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of semiconductor thermoelectric drying system, can be effectively complete to air
Wet, heat drying is integrally eliminated, improves efficiency of energy utilization.
Above-mentioned technical problem is solved by the following technical programs：
A kind of semiconductor thermoelectric drying system, including housing, semiconductor refrigeration chip, cool end heat exchanger, heat transfer device, heat pipe
And hot end heat exchanger；The housing is equipped with air inlet, installation port and gas outlet；The cool end heat exchanger is embedded in the housing
And hermetically it is arranged on the installation port；The semiconductor refrigeration chip, heat transfer device, the semiconductor refrigeration chip cold end with
The cool end heat exchanger engagement, the hot junction of the semiconductor refrigeration chip is engaged with the heat transfer device；One end of the heat pipe with
The heat transfer device engagement, the other end of the heat pipe are engaged with the hot end heat exchanger, and the hot end heat exchanger is embedded in described
Housing；The air inlet, cool end heat exchanger, hot end heat exchanger, gas outlet are set gradually along airflow direction.
The present invention compared with the prior art, has the advantages that：
Using semiconductor thermoelectric refrigeration technology, the heat produced by heat pipe to semiconductor refrigeration chip divides with cold
From, and be carried in housing, cold, the concentration of heat are formed in housing, it is dry to input air completion integration dehumidifying, heating
It is dry, improve energy utilization rate；And by semiconductor refrigeration chip, heat transfer device, the heat production, cold of semiconductor refrigeration chip can be improved
Amount, promotes dehumidifying, heat drying effect more preferable.
In one of the embodiments, the semiconductor thermoelectric drying system is further included arranged on the housing and positioned at described
The first wind turbine at air inlet or/and the second wind turbine arranged on the housing and at the gas outlet.
In one of the embodiments, when the semiconductor thermoelectric drying system includes first wind turbine and described second
During wind turbine, first wind turbine is centrifugal blower, and second wind turbine is axial flow blower.
In one of the embodiments, inner wall opposite with second wind turbine on the housing and second wind turbine it
Between distance be more than or equal to 3mm.
In one of the embodiments, the air inlet, cool end heat exchanger, hot end heat exchanger, gas outlet are set from bottom to up
Put, the shape of the heat pipe is inverted U-shaped for side.
In one of the embodiments, when the semiconductor thermoelectric drying system is equipped with first wind turbine in air inlet,
The housing is additionally provided with the section of catchmenting between the cool end heat exchanger and first wind turbine, it is described catchment section with it is described cold
It is obtuse angle to hold the angle between heat exchanger, and the bottom surface of the section of catchmenting is equipped with drainage trough, and the drainage trough exchanges heat with the cold end
Device is just opposite along the vertical direction.
In one of the embodiments, the semiconductor thermoelectric drying system further includes heat insulating mattress；The heat insulating mattress is arranged
On the semiconductor refrigeration chip and between the heat transfer device and the housing.
In one of the embodiments, the semiconductor thermoelectric drying system further includes heat-barrier material part；The heat-insulated material
Materials and parts are arranged on the outside of the heat pipe.
In one of the embodiments, the semiconductor thermoelectric drying system further includes temperature hot protective relay；It is described
Temperature hot protective relay is arranged on the heat transfer device, and series connection is between power supply and the semiconductor refrigeration chip.
The present invention also provides a kind of dehumidification equipment, it includes babinet, further includes semiconductor thermoelectric of the present invention
Drying system；First air port and the second air port are set on the side wall of the babinet；The semiconductor thermoelectric drying system is arranged on institute
State the outside of babinet, the air inlet, gas outlet are located at the same side of the housing, the air inlet/gas outlet respectively with institute
The air port of the first air port/second is stated to be sealingly engaged.
Above-mentioned dehumidification equipment is more effectively realized by setting semiconductor thermoelectric drying system of the present invention
Air dehumidifies, is dry.
Brief description of the drawings
Fig. 1 is a kind of angled arrangement schematic diagram of semiconductor thermoelectric drying system；
Fig. 2 is the sectional view along the B1-B1 lines of Fig. 1；
Fig. 3 is another angled arrangement schematic diagram of semiconductor thermoelectric drying system；
Fig. 4 is the sectional view along the B2-B2 lines of Fig. 3；
Fig. 5 is the explosive view of semiconductor thermoelectric drying system；
Fig. 6 is the schematic diagram of dehumidification equipment.
Embodiment
In order to which technical problem, technical solution and beneficial effect solved by the invention is more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
With reference to Fig. 1 to Fig. 5, a kind of semiconductor thermoelectric drying system 100, including housing 1, semiconductor refrigeration chip 2, cold end
Heat exchanger 3, heat transfer device 4, heat pipe 5 and hot end heat exchanger 6；Housing 1 is equipped with air inlet 101, installation port 102 and gas outlet 103；
Cool end heat exchanger 3 is embedded in housing 1 and is hermetically arranged on installation port 102；Semiconductor refrigeration chip 2, heat transfer device 4, heat pipe 5
One section is arranged on outside housing 1, and another section is located in passage, and the cold end of semiconductor refrigeration chip 2 is engaged with cool end heat exchanger 3, is partly led
The hot junction of body refrigerating chip 2 is engaged with heat transfer device 4；One end of heat pipe 5 is engaged with heat transfer device 4, and the other end and the hot junction of heat pipe 5 are changed
Hot device 6 engages, and hot end heat exchanger 6 is embedded in housing 1；Air inlet 101, cool end heat exchanger 3, hot end heat exchanger 6, gas outlet 103
Set gradually along airflow direction.
Above-mentioned semiconductor thermoelectric drying system 100, the hot junction of semiconductor refrigeration chip 2 is realized using heat transfer device 4, heat pipe 5
With the separation of hot end heat exchanger 6, the heat that semiconductor refrigeration chip 2 produces is carried to the hot junction for setting and being embedded in housing 1 and is changed
Hot device 6, that is, realize in 2 process of refrigerastion of semiconductor refrigeration chip, produces the separation of heat, transports, exchanges, makes semiconductor refrigerating
Cold that chip 2 produces, heat have been integrated in the housing 1 of air circulation, when need dry air (be usually high temperature,
High humidity state) entered by the air inlet 101 of semiconductor thermoelectric drying system 100 in housing 1, cool end heat exchanger 3 is first passed around, because
The cold that semiconductor refrigeration chip 2 produces causes cool end heat exchanger 3 to be in low-temperature condition (less than the air themperature passed through), to warp
The air for crossing cool end heat exchanger 3 is dehumidified, is condensed, is dry, reduces air humidity；Air again by hot end heat exchanger 6, by
Hot end heat exchanger 6 is concentrated on through superheater tube 5 in the heat that semiconductor refrigeration chip 2 produces, therefore, by hot end heat exchanger 6
The temperature of air rises, that is, air heat temperature raising is completed, since the heating efficiency of semiconductor refrigeration chip 2 (is higher than more than 1
Ptc heater), i.e., the air themperature discharged from hot end heat exchanger 6 is higher than the air themperature into cool end heat exchanger 3.Therefore, from
The air that the air inlet 101 of semiconductor thermoelectric drying system 100 enters, while humidity reduces, temperature is improved, both
Air is dried and heated air again, i.e., integration dehumidifying, heat drying are completed to air, is changed based on TEC electricity input power
Refrigeration, heating dual-use function obtained fully, efficiently use, improve energy utilization rate.
Above-mentioned semiconductor thermoelectric drying system 100, semiconductor refrigeration chip 2, heat transfer device 4, heat pipe 5 are arranged on outside housing 1,
On the one hand the influence that hot and humid air in housing 1 exchanges heat the hot junction of semiconductor refrigeration chip 2 can be reduced, make heat transfer device 4,
Heat pipe 5 concentrates the heat produced to semiconductor refrigeration chip 2 to exchange heat, and improves heat transfer device 4, heat pipe 5 to semiconductor refrigerating
The heat exchange efficiency of chip 2, so as to improve the heat production of semiconductor refrigeration chip 2, refrigeratory capacity, promotes dehumidifying, heat drying effect more
It is good；On the other hand " semiconductor refrigeration chip 2 long-term work under highly humid air environment, moisture in high temperature housing be effectively prevent
Semiconductor refrigerating hydraulic performance decline caused by producing galvanic effect to semiconductor material particles inside into semiconductor refrigeration chip 2
The problem of refrigerating capacity brought is reduced, effect on moisture extraction is deteriorated, heat drying hydraulic performance decline ", improves semiconductor refrigeration chip 2
Stablize, reliably working, so as to improve the heat production of semiconductor refrigeration chip 2, cold, promote dehumidifying, heat drying effect more
It is good.Therefore, above-mentioned semiconductor thermoelectric drying system 100 more effectively completes air integration dehumidifying, heat drying.
In one embodiment, above-mentioned housing 1 includes the first side body 111 and second mutually fastened along its length
Side body 112；Air inlet 101, installation port 102, gas outlet 103 are arranged on the second side body 112.Certainly, air inlet 101,
Installation port 102, gas outlet 103 can also be respectively arranged on the first side body 111 or the second side body 112.The housing 1 of the program
Easy to the assembling of device.
According to different application scenarios, above-mentioned air inlet 101, gas outlet 103 can be arranged on the same side or the difference of housing 1
Side.
In one embodiment, above-mentioned hot end heat exchanger 6 includes heat pipe 61 and the fins set 62 engaged with heat pipe, heat pipe
61 engage with heat pipe 5.This embodiment gives a kind of concrete structure of hot end heat exchanger 6.In the present embodiment, heat transfer device 4,
Heat pipe 5, hot end heat exchanger 6 form more well known heat exchange of heat pipe.
In one embodiment, maintain an equal level from preferably design angle, end face and the installation port 102 of cool end heat exchanger 3.
Certainly, the end face of cool end heat exchanger 3 can also be below or above installation port 102.
In one embodiment, above-mentioned semiconductor thermoelectric drying system 100 further includes arranged on housing 1 and is located at air inlet
The first wind turbine 7 at 101 or/and the second wind turbine 8 arranged on housing 1 and at gas outlet 103.Above-mentioned semiconductor heat electric seasoning
System 100 promotes air flow by setting the first wind turbine 7 or/and the second wind turbine 8.First wind turbine 7, the second wind turbine 8 can divide
Not She Yu housing 1 is outer or/and housing 1 in.Preferably, the first wind turbine 7, the second wind turbine 8 are arranged in housing 1, are easy to reduce dress
The overall volume put, to reduce the occupancy using space.
Since the integral thickness of above-mentioned semiconductor thermoelectric drying system 100 is relatively thin, in order to ensure the wind in housing 1
Pressure, air quantity, it is preferable that above-mentioned semiconductor thermoelectric drying system 100 sets the first wind turbine respectively in air inlet 101, gas outlet 103
7 and second wind turbine 8.
Wherein, when above-mentioned semiconductor thermoelectric drying system 100 includes the first wind turbine 7 and the second wind turbine 8, the first wind turbine 7
For centrifugal blower, the second wind turbine 8 is axial flow blower.From the description of background technology, the hot junction heat yield of refrigerating chip
It is greater than cold end yield, common design, the overall volume of hot end heat exchanger 6 can be more than the overall volume of cool end heat exchanger 3,
For this reason, the program is coordinated using centrifugal blower and axial flow blower, centrifugal blower is set in air inlet 101, is easy to improve wind
Pressure, concentrate air quantity to increase the flowing velocity of air-flow；When air-flow is flowed to by cool end heat exchanger 3 process of hot end heat exchanger 6, air-flow
Diffusion space it is opposite increase, air velocity is naturally relatively slack-off, therefore, axial flow blower is set in gas outlet 103, is meeting speed
It under the matching requirement of degree, can guarantee that air-flow is relatively smooth, Uniform Flow, while the diffusion area of air-flow can be increased again to accelerate heat
The diffusion velocity of air-flow, improves heat dissipation drying effect.
When the second wind turbine 8 is axial flow blower, on housing 1 between the inner wall and the second wind turbine 8 opposite with the second wind turbine 8
Distance is more than or equal to 3mm.Due to axial flow blower be from back side inlet air, must leave one between the second wind turbine 8 and housing 1
Fixed space, can just meet the design requirement of air-flow velocity, flow.
In one embodiment, air inlet 101, cool end heat exchanger 3, hot end heat exchanger 6, gas outlet 103 be from bottom to up
Set, the shape of heat pipe 5 is composite U-shaped.Hot end heat exchanger 6 is arranged on by this programme in housing 1, cool end heat exchanger 3 is set
Put under, and the shape of heat pipe 5 is designed as composite U-shaped so that housing 1 and heat pipe 5 can utilize heat forward high upwards
Conduction feature is imitated, further lifts the refrigerating capacity and transfer efficiency of semiconductor refrigeration chip 2.
When mounted, due to the through-thickness median plane of hot end heat exchanger 6 and the through-thickness median plane of heat transfer device 4
Same plane can be not at, in the case, in order to realize the engagement between hot end heat exchanger 6 and heat transfer device 4, the shape of heat pipe 5
It is inverted U-shaped that shape is designed as irregular side.
Wherein, when above-mentioned semiconductor thermoelectric drying system 100 is equipped with the first wind turbine 7 in air inlet 101, above-mentioned housing 1
The section 104 of catchmenting being additionally provided between 3 and first wind turbine 7 of cool end heat exchanger, for collecting the condensed water on cool end heat exchanger,
Angle between section of catchmenting 104 and cool end heat exchanger 3 is obtuse angle, and the bottom surface of section of catchmenting 104 is equipped with drainage trough 105, drainage trough 105
It is just opposite along the vertical direction with cool end heat exchanger 3.The program by setting relative to the inclined section 104 of catchmenting of cool end heat exchanger 3,
By 3 and first wind turbine of cool end heat exchanger, 7 stagger setting, in actual use, cool end heat exchanger 3 can shape in heat transfer process
Into condensed water, the active force for the first wind turbine 7 backwards that condensed water is fallen towards section 104 of catchmenting and is subject to air-flow to produce is cold
Condensate eventually flows to drainage trough 105, it is ensured that condensed water will not flow to the first wind turbine 7.
In one embodiment, above-mentioned semiconductor thermoelectric drying system 100 further includes heat insulating mattress 9；Heat insulating mattress 9 is set in
On semiconductor refrigeration chip 2 and between heat transfer device 4 and housing 1.The scheme of the embodiment sets heat insulating mattress 9, plays heat-insulated
With the effect of damp proof insulation, it can prevent the heat between cool end heat exchanger and heat transfer device 4 from disturbing, so as to further lift semiconductor system
Stability, the reliability of the work of cold core piece 2.
Wherein, heat insulating mattress 9 is preferably high density elastic sponge.
In one embodiment, to reduce the hot junction thermal loss of semiconductor refrigeration chip 2, lifting conduction efficiency, on
State semiconductor thermoelectric drying system 100 and further include heat-barrier material part 10, heat-barrier material part 10 is arranged on the outside of heat pipe 5, to reduce
Loss of the heat that semiconductor refrigeration chip 2 produces in 5 conductive process of heat pipe.Heat-barrier material part 10 is preferably insulating sponge.
In one embodiment, in actual use, if the heat being made of heat transfer device 4, heat pipe 5 and hot end heat exchanger 6
Pipe heat-exchanging component fails, and can cause the hot junction heat build-up of semiconductor refrigeration chip 2, and temperature is significantly raised so that catching fire, and is
Avoid such a phenomenon, above-mentioned semiconductor thermoelectric drying system 100 further includes temperature hot protective relay 11, temperature Thermal protection after
Electric appliance 11 is arranged on heat transfer device 4 and series connection is in the power supply for powering to semiconductor refrigeration chip 2 and semiconductor refrigeration chip 2
Between.When the hot junction temperature rise of semiconductor refrigeration chip 2 exceedes temperature threshold, temperature hot protective relay 11, which is automatically cut off, partly leads
The connection of body refrigerating chip 2 and power supply, semiconductor refrigeration chip 2 are stopped, so that it is guaranteed that the security of whole system work.
With reference to Fig. 1 to Fig. 6, present embodiment also provides a kind of dehumidification equipment, including states semiconductor thermoelectric and do
Drying system 100 and babinet 200：First air port and the second air port be set on the side wall of babinet 200, the first air port and the second air port
Under position relation is preferably under the first air port is located at, the second air port is located at；Semiconductor thermoelectric drying system 100 is arranged on babinet 200
Outside, the air inlet 101 of semiconductor thermoelectric drying system 100, gas outlet 103 be located at the same side of housing 1, air inlet 101,
Gas outlet 103 is sealingly engaged with the first air port, the second air port respectively.200 inner air of babinet is from the first air port by the first wind turbine 7
Semiconductor thermoelectric drying system is sucked, by whole drying system, by the second wind turbine inside the discharge of the second air port with babinet 200
Space connects to form an obturator.
When above-mentioned dehumidification equipment is dish-washing machine, in design, by semiconductor chilling plate, the first wind turbine 7, the second wind
Machine 8 is connected with dish washing machine controller, realizes the overall control of dish-washing machine.When dish-washing machine is washing the dishes program, external partly leads
Body heat electric seasoning system 100 does not work.When dish-washing machine complete wash the dishes program enter drying program when, startup semiconductor heat electric seasoning
System 100, the hot and humid air in babinet 200 suck semiconductor thermoelectric drying system 100 from lower air port by the first wind turbine 7,
The cold of the absorption generation of semiconductor refrigeration chip 2 of cool end heat exchanger 3 is first passed through to complete the condensation process of hot and humid air, is borrowed
The natural rising and the airflow direction consistent with ascent direction design of hot-air are helped, heat temperature raising is carried out by hot end heat exchanger 6,
It is discharged into again by the second wind turbine 8 mouth of being in the wind in babinet 200, completes a complete cyclic process.It is hot and humid in babinet 200
Gas enter semiconductor thermoelectric drying system 100 to the whole process discharged from uptake from lower air port, complete humidity drop
Low and atmosphere temperature rising, air temperature rise contribute to the evaporation of air moisture in babinet 200, and humidity reduces and directly accelerates babinet 200
Interior is air-dried.As it can be seen that semiconductor thermoelectric drying system 100 is bound to dish-washing machine, the drying time of dish-washing machine is shortened, is dropped
Low energy consumption, positive effect is played to energy utilization rate lifting.
In the present invention, unless otherwise clearly defined and limited, the term such as term " connection ", " being arranged on " should do broad sense reason
Solution, for example, it may be being fixedly connected or being detachably connected, or is integrally connected；It can be directly connected, can also
It is indirectly connected by intermediary.For the ordinary skill in the art, above-mentioned art can be understood as the case may be
The concrete meaning of language in the present invention.
In the description of the present invention, it is to be understood that the orientation or position relationship of the instruction such as term " on ", " under " are base
In orientation shown in the drawings or position relationship, description description of the invention and simplified, rather than instruction or hint are for only for ease of
Signified device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The limitation of invention.
Technical solution between above-mentioned each embodiment can be combined with each other, but must be with ordinary skill people
Member can be implemented as basis, and this technical solution is will be understood that when the combination appearance of technical solution is conflicting or can not realize
Combination be not present, the also no longer protection domain of application claims.
It should be pointed out that being based on the embodiment of the present invention, those of ordinary skill in the art are not making creative labor
All other embodiments obtained under the premise of dynamic, belong to the scope of protection of the invention.
Claims (10)
1. a kind of semiconductor thermoelectric drying system, it is characterised in that including housing, semiconductor refrigeration chip, cool end heat exchanger, lead
Hot device, heat pipe and hot end heat exchanger；The housing is equipped with air inlet, installation port and gas outlet；The cool end heat exchanger embeds
It is arranged in the housing and hermetically the installation passage；The semiconductor refrigeration chip, heat transfer device, the semiconductor refrigerating core
The cold end of piece is engaged with the cool end heat exchanger, and the hot junction of the semiconductor refrigeration chip is engaged with the heat transfer device；The heat
One end of pipe is engaged with the heat transfer device, and the other end of the heat pipe is engaged with the hot end heat exchanger, the hot end heat exchanger
It is embedded in the housing；The air inlet, cool end heat exchanger, hot end heat exchanger, gas outlet are set gradually along airflow direction.
2. semiconductor thermoelectric drying system according to claim 1, it is characterised in that the semiconductor thermoelectric drying system
Further include the first wind turbine arranged on the housing and at the air inlet or/and arranged on the housing and be located at the outlet
The second wind turbine at mouthful.
3. semiconductor thermoelectric drying system according to claim 2, it is characterised in that when the semiconductor heat electric seasoning system
When system includes first wind turbine and second wind turbine, first wind turbine is centrifugal blower, and second wind turbine is axis stream
Wind turbine.
4. semiconductor thermoelectric drying system according to claim 3, it is characterised in that on the housing with second wind
The distance between the opposite inner wall of machine and second wind turbine are more than or equal to 3mm.
5. semiconductor thermoelectric drying system according to claim 2, it is characterised in that the air inlet, cool end heat exchanger,
Hot end heat exchanger, gas outlet are set from bottom to up, and the shape of the heat pipe is inverted U-shaped for side.
6. semiconductor thermoelectric drying system according to claim 5, it is characterised in that when the semiconductor heat electric seasoning system
When air inlet is equipped with first wind turbine, the housing is additionally provided between the cool end heat exchanger and first wind turbine system
Section of catchmenting, the angle to catchment between section and the cool end heat exchanger is obtuse angle, and the bottom surface of the section of catchmenting is equipped with drainage
Groove, the drainage trough are just opposite along the vertical direction with the cool end heat exchanger.
7. the semiconductor thermoelectric drying system according to claim 1 to 6 any one, it is characterised in that the semiconductor
Thermoelectricity drying system further includes heat insulating mattress；The heat insulating mattress is set on the semiconductor refrigeration chip and is located at the heat transfer device
Between the housing.
8. the semiconductor thermoelectric drying system according to claim 1 to 6 any one, it is characterised in that the semiconductor
Thermoelectricity drying system further includes heat-barrier material part；The heat-barrier material part is arranged on the outside of the heat pipe.
9. the semiconductor thermoelectric drying system according to claim 1 to 6 any one, it is characterised in that the semiconductor
Thermoelectricity drying system further includes temperature hot protective relay；The temperature hot protective relay is arranged on the heat transfer device, and is gone here and there
It is connected between power supply and the semiconductor refrigeration chip.
10. a kind of dehumidification equipment, it includes babinet, it is characterised in that further includes described in claim 1 to 9 any one
Semiconductor thermoelectric drying system；First air port and the second air port are set on the side wall of the babinet；The semiconductor thermoelectric is done
Drying system is arranged on the outside of the babinet, and the air inlet, gas outlet are located at the same side of the housing, the air inlet/go out
Gas port is sealingly engaged with the air port of first air port/second respectively.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711414478.9A CN107990696A (en) | 2017-12-25 | 2017-12-25 | Semiconductor thermoelectric drying system and dehumidification equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711414478.9A CN107990696A (en) | 2017-12-25 | 2017-12-25 | Semiconductor thermoelectric drying system and dehumidification equipment |
Publications (1)
| Publication Number | Publication Date |
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| CN107990696A true CN107990696A (en) | 2018-05-04 |
Family
ID=62041674
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711414478.9A Pending CN107990696A (en) | 2017-12-25 | 2017-12-25 | Semiconductor thermoelectric drying system and dehumidification equipment |
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| CN108592391A (en) * | 2018-07-02 | 2018-09-28 | 广东万家乐燃气具有限公司 | A kind of water heater |
| CN109882923A (en) * | 2019-01-15 | 2019-06-14 | 浙江琦远科技有限公司 | A kind of integrated air supply device of warm-air drier |
| CN113064045A (en) * | 2021-04-06 | 2021-07-02 | 青岛科技大学 | Cold-hot compensation semiconductor coupling structure and vacuum temperature control test platform and method thereof |
| CN113251690A (en) * | 2021-06-08 | 2021-08-13 | 福建三能节能科技有限责任公司 | Semiconductor refrigerating device |
| WO2021196460A1 (en) * | 2020-03-31 | 2021-10-07 | 苏州浪潮智能科技有限公司 | Fire monitoring system and container-type data center system |
| CN114440596A (en) * | 2022-01-27 | 2022-05-06 | 华南农业大学 | Drying method and equipment suitable for citrus grandis |
| CN115445403A (en) * | 2022-09-19 | 2022-12-09 | 光大环境科技（中国）有限公司 | Photovoltaic coupling flue gas whitening system and process |
| CN117883936A (en) * | 2024-03-12 | 2024-04-16 | 山东联友石化工程有限公司 | Volatile organic compound centralized processing equipment for coating |
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| CN115445403A (en) * | 2022-09-19 | 2022-12-09 | 光大环境科技（中国）有限公司 | Photovoltaic coupling flue gas whitening system and process |
| CN117883936A (en) * | 2024-03-12 | 2024-04-16 | 山东联友石化工程有限公司 | Volatile organic compound centralized processing equipment for coating |
| CN117883936B (en) * | 2024-03-12 | 2024-05-31 | 山东联友石化工程有限公司 | Volatile organic compound centralized processing equipment for coating |
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Application publication date: 20180504 |