CN113251690A - Semiconductor refrigerating device - Google Patents
Semiconductor refrigerating device Download PDFInfo
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- CN113251690A CN113251690A CN202110634728.XA CN202110634728A CN113251690A CN 113251690 A CN113251690 A CN 113251690A CN 202110634728 A CN202110634728 A CN 202110634728A CN 113251690 A CN113251690 A CN 113251690A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 98
- 238000005057 refrigeration Methods 0.000 claims abstract description 57
- 230000005855 radiation Effects 0.000 claims abstract description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000007788 liquid Substances 0.000 claims description 62
- 238000010438 heat treatment Methods 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 9
- 238000007667 floating Methods 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 12
- 238000009413 insulation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000001580 bacterial effect Effects 0.000 description 3
- 238000007791 dehumidification Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000009395 breeding Methods 0.000 description 2
- 230000001488 breeding effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007605 air drying Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
Abstract
The invention discloses a semiconductor refrigerating device, which belongs to the technical field of semiconductor refrigeration and comprises a box body and a refrigerating assembly, wherein the refrigerating assembly is used for refrigerating towards an inner container of the box body; the refrigerating assembly is provided with at least one semiconductor refrigerating piece, and a metal heat radiation body is attached to the refrigerating end of the semiconductor refrigerating piece; an air flow channel is formed on the surface of each metal radiator, two ends of each metal radiator are communicated through a main pipeline, a circulating pump and a dehumidifying mechanism are distributed on the main pipeline, and condensed water on the surface of each metal radiator is dried and sucked through air circulation in the air flow channels and the main pipeline. The invention has the advantages of preventing condensed water from collecting on the outer wall of the metal radiator, reducing the risk of corrosion, having high reliability, being beneficial to prolonging the service life of the metal radiator and having low maintenance cost.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration device.
Background
At present, with the development of semiconductor refrigeration technology, refrigeration equipment which adopts a semiconductor refrigeration sheet for refrigeration is also widely applied, after a semiconductor is electrified, heat at a cold end is transferred to a hot end, so that the temperature at the cold end is reduced, the temperature at the hot end is increased, the refrigeration effect is realized, no refrigerant is needed in the refrigeration process, the refrigeration equipment can work continuously, no pollution source is generated, and the refrigeration equipment is energy-saving and environment-friendly;
in a Chinese invention patent disclosed in the prior art, the application date is 03/12/2014, the application number is 201410721995.0, and the publication number is CN105650936B, namely a multistage semiconductor refrigeration assembly and semiconductor refrigeration equipment, wherein the multistage semiconductor refrigeration assembly comprises a plurality of semiconductor refrigeration sheets and a plurality of metal heat radiation bodies, a cavity is formed in each metal heat radiation body, and volatile liquid is filled in each cavity; and a semiconductor refrigerating piece is arranged between every two adjacent metal radiating bodies and is attached to the surfaces of the metal radiating bodies.
Although the multistage semiconductor refrigeration assembly adopts the metal heat radiation body to radiate the cold end and the hot end of the semiconductor refrigeration piece, the volatile liquid is filled in the cavity of the metal heat radiation body, and the volatile liquid is changed into a gaseous state after being heated and is changed into a liquid state after being cooled, so that the volatile liquid in the metal heat radiation body realizes self-circulation flow, the refrigeration performance is good, and the heat radiation efficiency and the heat radiation capacity are effectively improved;
however, the outer wall of the metal radiator is easy to be wet in the refrigeration process, so that the risk of bacterial breeding is increased, the use reliability of the metal radiator is reduced, and the subsequent maintenance cost is increased.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a semiconductor refrigerating device.
In order to achieve the above purpose, the invention provides the following technical scheme:
the invention discloses a semiconductor refrigerating device, comprising:
the refrigerator comprises a box body and a refrigerating assembly which refrigerates towards an inner container of the box body;
the refrigerating assembly is provided with at least one semiconductor refrigerating piece, and a metal heat radiation body is attached to the refrigerating end of the semiconductor refrigerating piece;
an air flow channel is formed on the surface of each metal radiator, two ends of each metal radiator are communicated through a main pipeline, a circulating pump and a dehumidifying mechanism are distributed on the main pipeline, and condensed water on the surface of each metal radiator is dried and sucked through air circulation in the air flow channels and the main pipeline.
Further, airflow channel includes air inlet and gas vent, the air inlet set up in the gas-liquid mixture of volatile liquid sinks the end in the metal radiator, the gas vent set up in the gas-liquid mixture floating end of volatile liquid in the metal radiator.
Furthermore, a flow amplifier is arranged on the side, located on the airflow channel, of the air inlet, and airflow is guided to the position of the side wall of the metal radiator through the flow amplifier.
Further, the flow amplifier is an inclined surface extending from the air inlet end toward the side wall of the metal heat sink.
Further, the main pipeline is provided with a branch pipeline and a gas-liquid separator arranged at the air inlet end of the main pipeline;
one end of the branch pipeline is communicated with the gas-liquid separator, the other end of the branch pipeline is communicated with the inner container of the box body, and cold air is provided towards the gas-liquid separator through the branch pipeline.
Further, still include the auxiliary line, the trunk line is located install on the pipeline of vapour and liquid separator gas inlet section the auxiliary line, auxiliary line one end with the trunk line intercommunication, the other end and atmosphere intercommunication, install the third valve body on the auxiliary line for selectively open or close the auxiliary line.
Furthermore, a metal heat radiation body is also attached to the heating end of the semiconductor refrigerating sheet, the metal heat radiation body of the heating end is arranged on the outer wall of the box body, and a liquid discharge port of the gas-liquid separator is positioned right above the metal heat radiation body of the heating end.
Furthermore, a flat bearing groove is formed in the metal heat radiation body of the heating end, and liquid of the gas-liquid separator is discharged to the bearing groove.
Further, a temperature sensor is installed at the exhaust end of the main pipeline and used for detecting the exhaust temperature of the main pipeline.
Furthermore, the semiconductor refrigeration piece is located at one end of the metal radiator, and air in the air flow channel circulates towards the end of the semiconductor refrigeration piece.
In the technical scheme, the semiconductor refrigerating device provided by the invention has the beneficial effects that:
compared with the prior art, the semiconductor refrigerating device designed by the invention can prevent condensed water from being accumulated on the outer wall of the metal heat radiation body, reduce the probability of bacterial breeding, has high reliability, is beneficial to prolonging the service life of the metal heat radiation body, and has low maintenance cost.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
FIG. 1 is a schematic diagram of the overall structure of a semiconductor refrigeration device disclosed by the invention;
FIG. 2 is an enlarged view of a portion of a semiconductor refrigeration unit according to the present disclosure;
FIG. 3 is a schematic structural diagram of a semiconductor cooling plate of a semiconductor cooling device according to the present disclosure;
fig. 4 is a cross-sectional view of a metal heat sink of a semiconductor refrigeration device disclosed by the invention.
Description of reference numerals:
a case 10; an inner container 11; a heat insulating layer 13;
a refrigeration assembly 20; a semiconductor refrigerating sheet 21; a refrigerating end 211; a heating end 212; a metal heat sink 22; a bearing groove 221; an air inlet duct 222; an air outlet duct 223; a fan 224; the airflow passage 23, the air inlet 231; an exhaust port 232;
a main conduit 30; a circulation pump 31; a flow amplifier 32; a branch line 33; the first valve body 331; a gas-liquid separator 34; a liquid discharge port 341; a temperature sensor 35;
a secondary duct 40; a third valve body 41;
an insulating panel 50.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
Referring to fig. 1, embodiment one;
the invention provides a semiconductor refrigerating device, comprising:
the refrigerator comprises a refrigerator body 10 and a refrigerating assembly 20 for refrigerating towards an inner container 11 of the refrigerator body 10;
the refrigeration assembly 20 is provided with at least one semiconductor refrigeration piece 21, and a metal heat radiation body 22 is attached to the refrigeration end 211 of the semiconductor refrigeration piece 21; an air flow channel 23 is formed on the surface of each metal radiating body 22, two ends of the air flow channel 23 are communicated through a main pipe 30, a circulating pump 31 and a dehumidifying mechanism are arranged on the main pipe 30, and condensed water on the surface of the metal radiating body 22 is dried and sucked through air circulation in the air flow channel 23 and the main pipe 30.
Specifically, in the structure, a refrigeration assembly 20 is embedded in one side of the box body 10, the refrigeration assembly 20 comprises a plurality of semiconductor refrigeration pieces 21, and a metal radiator 22 is attached to each semiconductor refrigeration piece 21, so that refrigeration of the inner container 11 of the box body 10 is realized through the metal radiator 22. In this embodiment, an air flow channel 23 is formed on the surface of each metal heat sink 22, two ends of the air flow channel 23 are communicated with the main pipe 30, one end is an air inlet of the main pipe 30, the other end is an air outlet of the main pipe 30, a circulating pump 31 and a dehumidifying mechanism are disposed on the main pipe 30, the air flow channel 23 is open, it is not limited inside a specific pipe, but covers the outer surface of the metal heat sink 22, that is, the air in the whole box 10 can participate in circulation, the function of the metal heat sink 22 is that the moisture in the air in the box can be continuously condensed onto the metal heat sink 22 due to refrigeration, the moisture is sucked by the air flow, so that the moisture is evaporated and sucked into the main pipe 30, that the moisture content of the gas sucked into the main pipe 30 is obviously higher than that of other air in the box 10, and the dehumidifying mechanism is disposed on the main pipe 30, the moisture of the sucked air is removed, so that the main pipeline 30 sucks air with high moisture content from the box body 10, removes the moisture and then sends the air into dry air to realize dehumidification and drying of the box body, and thus, the cooling and drying of the box body 10 are synchronously realized through the mechanism.
In this embodiment, the airflow channel 23 actually refers to a virtual space, which covers the surface of the metal heat sink 22, theoretically, the internal refrigeration spaces of the overall box 10 all form the airflow channel 23, but the core part is on the surface of the metal heat sink 22, and one end of the airflow channel 23 is provided with an air inlet 231 (i.e., an air outlet of the main pipe 30), and the other end is provided with an air outlet 232 (i.e., an air inlet of the main pipe 30); the air inlet 231 and the air outlet 232 are communicated through the main pipeline 30, the circulating pump 31 is installed on the main pipeline 30, and when the cooling device works, the circulating pump 31 is started to enable air in the air flow channel 23 to circulate rapidly, so that condensed water on the side wall of the metal heat radiating body 22 is evaporated rapidly, and the purpose of keeping the outer wall of the metal heat radiating body 22 dry is achieved; then the wet-out drying is carried out by the wet-out mechanism.
In each embodiment of the present invention, the semiconductor chilling plate 21 further has a heating end 212, which may be located outside the box body 10 (the semiconductor chilling plate 21 itself is embedded on the shell of the box body 10), the heating end 212 dissipates heat through a heat dissipating device outside the box body 10, and the arrangement and heat dissipation of the heating end 212 of the semiconductor chilling plate 21 are the prior art and are not described in detail.
Referring to fig. 3, the metal heat sink 22 includes a cone, the cone has a structure that the radial dimension gradually increases from the top to the bottom, and it may have a side plane for connecting the semiconductor refrigeration end, the outer periphery of the bottom forms an annular groove, the annular groove is used for the condensed water on the outer wall of the cone flowing into the annular groove along the outer wall without dropping, and at the same time, the inner part of the cone forms a through hole from the bottom to the top, the through hole is a part of the air flow channel 23, preferably, the through hole is also a structure that the radial dimension gradually increases from the top to the bottom, the arrangement is such that, for the central part, the condensed water flows down along the hole wall of the through hole, the direction of the circulating air is opposite to that of the circulating air, the condensed water is directly dried by the circulating air, and is received by the annular groove on the outer side, further, set up a branch road passageway that communicates the conical body top from the top of annular groove again inside the conical body, the air current gets into from the marginal part of conical body bottom this moment, enters into the branch road passageway through the recess, finally converges air current passageway 23, also weathers the comdenstion water that assembles the outer wall through this passageway, so to such metal radiator 22, no matter be outer wall or inner wall, the comdenstion water can all realize directly air-drying, thereby can not form the water droplet and drip and form the bacterial growing environment at the box.
As shown in fig. 1;
preferably, airflow channel 23 includes air inlet 231 and gas vent 232, and air inlet 231 sets up the end that sinks of the gas-liquid mixture of volatile liquid in metal radiator 22, and gas vent 232 sets up the end that floats of the gas-liquid mixture of volatile liquid in metal radiator 22, holds the chamber through setting up in the metal radiator 22, holds the intracavity and sets up gas-liquid mixture, turns the realization quick temperature express delivery about the temperature difference through gas-liquid mixture under.
Specifically, in the structure, the airflow channel 23 circulates through the air inlet 231 and the air outlet 232, and the airflow in the airflow channel 23 flows from the cold end to the hot end of the metal heat sink 22, so that excessive cold energy is prevented from being taken away in the airflow circulation process in the airflow channel 23, and energy consumption is saved;
as shown in fig. 3;
preferably, the air inlet 231 is provided with a flow amplifier 32 on the side of the air flow channel 23, and the air flow is guided to the position of the side wall of the metal heat radiator 22 by the flow amplifier 32.
Specifically, in this structure, the intake port 231 is provided with the flow rate amplifier 32, and the flow rate amplifier 32 is configured as an inclined surface extending from the end of the intake port 231 toward the side wall of the metal heat radiator 22. Guiding the air flow from the air inlet 231 to the side wall of the metal heat sink 22, and ascending from the cold end to the hot end along the side wall of the metal heat sink 22 to promote the air circulation on the side wall of the metal heat sink 22;
as shown in fig. 1;
preferably, the main pipe 30 has a branch pipe 33 and a gas-liquid separator 34 installed at the gas inlet end of the main pipe 30; the branch pipe 33 has one end communicating with the gas-liquid separator 34 and the other end communicating with the inner container 11 of the casing 10, and supplies cold air to the gas-liquid separator 34 through the branch pipe 33.
Specifically, the main pipe 30 further includes a branch pipe 33 and a gas-liquid separator 34, as shown in fig. 1, the pipe of the main pipe 30 located at the gas inlet end of the front section of the circulating pump 31 is connected in series with the gas-liquid separator 34, and after the gas-liquid separator circulates the gas flow from the main pipe 30 through the gas-liquid separator 34, the gas circulates to the gas outlet end of the main pipe 30 through the circulating pump 31, and is conveyed back to the gas flow channel 23 through the gas inlet 231;
one end of the branch pipeline 33 is communicated with the gas-liquid separator 34, the other end is communicated with the inner container 11 of the box body 10, the branch pipeline 33 is provided with a first valve body 331, the first valve body 331 controls the branch pipeline 33 to be opened or closed, preferably, the exhaust end of the main pipeline 30 is provided with a temperature sensor 35 for detecting the exhaust temperature of the main pipeline 30, in the structure, cold air is provided to the gas-liquid separator 34 through the branch pipeline 33, the branch pipeline 33 is used for providing cold air, the air flow in the main pipeline 30 and the air flow in the branch pipeline 33 are cooled in the gas-liquid separator 34 in a combined mode, the temperature of the air flow circulated out from the main pipeline 30 is controllable, and the phenomenon that the excessive air flow flows back to the air flow channel 23 to take away cold energy is avoided;
as shown in fig. 1;
preferably, the gas-liquid separator further comprises a secondary pipeline 40, the secondary pipeline 40 is installed on a pipeline of the main pipeline 30 located at the gas inlet section of the gas-liquid separator 34, one end of the secondary pipeline 40 is communicated with the main pipeline 30, the other end of the secondary pipeline is communicated with the atmosphere, and a third valve body is installed on the secondary pipeline 40 and used for selectively opening or closing the secondary pipeline 40. The main pipeline 30 can be supplemented with airflow through the auxiliary pipeline 40 to accelerate airflow circulation;
preferably, the metal heat radiator 22 is also attached to the heating end 212 of the semiconductor refrigeration sheet 21, the metal heat radiator 22 of the heating end 212 is disposed on the outer wall of the box body, and the liquid outlet 341 of the gas-liquid separator 34 is located right above the metal heat radiator 22 of the heating end 212.
Specifically, in the structure, the metal heat radiation body 22 is attached to both the refrigerating end 211 and the heating end 212 of the semiconductor refrigerating sheet 21, as shown in fig. 1, the metal heat radiation body 22 attached to the heating end 212 of the semiconductor refrigerating sheet 21 only participates in heat radiation work, radiates heat to the heating end 212 of the semiconductor refrigerating sheet 21, avoids burning loss of the heating end 212 of the semiconductor refrigerating sheet 21, in order to utilize heat energy of the outermost metal heat radiation body 22, the liquid discharge port 341 of the gas-liquid separator 34 is positioned right above the metal heat radiation body 22 of the heating end 212, liquid discharged by the gas-liquid separator 34 drops on the metal heat radiation body 22 and can be rapidly evaporated, the work of cleaning the gas-liquid separator 34 regularly is saved, energy is reasonably utilized, heat on the metal heat radiation body 22 can be taken away in the evaporation process, and the purpose of promoting heat radiation of the metal heat radiation body 22 is also achieved;
preferably, the metal heat radiator 22 of the heating end 212 is provided with a flat supporting groove 221, and the liquid of the gas-liquid separator 34 is discharged to the supporting groove 221. The liquid which is not evaporated in time is collected through the bearing groove 221, so that the liquid is prevented from polluting the box body 10 or other equipment;
as shown in fig. 1;
preferably, the semiconductor cooling plate 21 is located at one end of the metal heat radiator 22, and the air in the air flow channel 23 circulates towards the end of the semiconductor cooling plate 21.
Specifically, in the structure, the semiconductor refrigeration sheet 21 is arranged at one end of the metal heat radiation body 22 in a biased manner, more specifically, at the floating end of the metal heat radiation body 22 close to the gas-liquid mixture of the internal volatile liquid, and the air in the air flow channel 23 circulates towards the end of the semiconductor refrigeration sheet 21. Referring to fig. 1, the air outlet 232 of the air flow channel 23 is at the upper end, the air inlet 231 is at the bottom end of the air flow channel 23, and when the main pipe 30 circulates, the air enters from the air inlet 231 and is discharged from the air outlet 232, so that the air flow at the hot end of the metal heat sink 22 is prevented from flowing through the cold end to generate more condensed water;
referring to fig. 1, preferably, the metal heat sink 22 further includes a heat insulation plate 50, and the heat insulation plate 50 is attached to the side of the heat producing end 212 of the metal heat sink 22.
Specifically, in the structure, the metal heat radiation body 22 attached to the heating end 212 of the outermost semiconductor chilling plate 21 only participates in heat radiation work and radiates heat to the heating end 212 of the semiconductor chilling plate 21, the heat insulation plate 50 is attached to the metal heat radiation body 22 at the side of the heating end 212, heat insulation is performed through the heat insulation plate 50, cold energy consumption of the cooling end 211 is avoided, and energy consumption is saved;
in the preferred embodiment, the metal heat sink of the heating end 212 is located in the open space and is cooled by a fan, similar to the outdoor unit of the prior art air conditioner, in an alternative embodiment, a heat dissipation space may be separately arranged, the metal heat dissipation body 22 to which the cooling end 211 and the heating end 212 of the semiconductor cooling plate 21 are attached has the same structure of the air flow channel 23, wherein, the metal heat radiator 22 attached to the heating end 212 of the semiconductor cooling plate 21 is located in the heat radiation space, at this time, an air inlet 231 of the metal heat radiator 22 is connected with an air inlet pipeline 222, an air outlet 232 of the metal heat radiator 22 is connected with an air outlet pipeline 223 communicated with the atmosphere, a fan 224 is arranged on the air inlet pipeline 222, the fan 224 makes the air of the metal heat radiating body 22 circulate quickly, so as to achieve the purpose of quickly radiating the heat of the metal heat radiating body 22 and further effectively make the heating end 212 of the semiconductor cooling plate 21 cool down quickly.
In the embodiment in which the heat dissipating space is provided for the heating end 212, further, the heat dissipating space communicates with the space in the cabinet 10 through a communication passage, and this is provided to have a control manner in which the cooling end 211 and the heating end 212 operate simultaneously and the heat dissipating space delivers hot air to the space in the cabinet through the communication passage to maintain the temperature of the space in the cabinet constant, and at the same time, the main pipe 30, the circulation pump 31, and the dehumidifying mechanism operate. The effect that so sets up lies in, and this moment refrigerating end 211 has provided sufficient low temperature for cold courage, but humidity is not enough, so through refrigerating end and heating end simultaneous working and be linked together like 5 degrees centigrade in order to maintain invariable temperature, owing to opened refrigerating end simultaneously, the temperature of its corresponding metal radiator is lower, still can carry out the dehumidification operation, realizes the dehumidification through the circulation.
In the technical scheme, the semiconductor refrigerating device provided by the invention has the beneficial effects that:
compared with the prior art, the semiconductor refrigerating device designed by the invention can avoid condensed water from gathering on the outer wall of the metal radiator, reduce the risk of corrosion, has high reliability, is beneficial to prolonging the service life of the metal radiator and has low maintenance cost.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (10)
1. A semiconductor refrigeration device, comprising:
the refrigerator comprises a box body (10) and a refrigerating assembly (20) which refrigerates towards an inner container (11) of the box body (10);
the refrigeration assembly (20) is provided with at least one semiconductor refrigeration piece (21), and a metal heat radiation body (22) is attached to a refrigeration end (211) of the semiconductor refrigeration piece (21), and the refrigeration assembly is characterized in that;
an air flow channel (23) is formed on the surface of each metal radiator (22), two ends of each metal radiator (22) are communicated through a main pipeline (30), a circulating pump (31) and a dehumidifying mechanism are arranged on each main pipeline (30), and condensed water on the surface of each metal radiator (22) is dried and sucked through air circulation in the air flow channels (23) and the main pipelines.
2. A semiconductor refrigeration unit according to claim 1, wherein;
the air flow channel (23) comprises an air inlet (231) and an air outlet (232), the air inlet (231) is arranged at the sinking end of the gas-liquid mixture of the volatile liquid in the metal heat radiation body (22), and the air outlet (232) is arranged at the floating end of the gas-liquid mixture of the volatile liquid in the metal heat radiation body (22).
3. A semiconductor refrigeration unit according to claim 2, wherein;
the air inlet (231) is provided with a flow amplifier (32) at the side of the air flow channel (23), and the air flow is guided to the side wall of the metal heat radiation body (22) through the flow amplifier (32).
4. A semiconductor refrigeration unit according to claim 3, wherein;
the flow amplifier (32) is an inclined surface extending from the end of the air inlet (231) towards the side wall of the metal radiator (22).
5. A semiconductor refrigeration unit according to claim 2, wherein;
the main pipeline (30) is provided with a branch pipeline (33) and a gas-liquid separator (34) arranged at the gas inlet end of the main pipeline (30);
one end of the branch pipeline (33) is communicated with the gas-liquid separator (34), the other end of the branch pipeline is communicated with the inner container (11) of the box body (10), and cold air is provided towards the gas-liquid separator (34) through the branch pipeline (33).
6. A semiconductor refrigeration unit according to claim 5, wherein;
still include auxiliary conduit (40), trunk line (30) are located install on the pipeline of vapour and liquid separator (34) section of admitting air auxiliary conduit (40), auxiliary conduit (40) one end with trunk line (30) intercommunication, the other end and atmosphere intercommunication, install third valve body (41) on auxiliary conduit (40) for selectively open or close auxiliary conduit (40).
7. A semiconductor refrigeration unit according to claim 5, wherein;
the heating end (212) of the semiconductor refrigerating sheet (21) is also attached with a metal radiating body (22), the metal radiating body (22) of the heating end (212) is arranged on the outer wall of the box body (10), and a liquid outlet (341) of the gas-liquid separator (34) is positioned right above the metal radiating body (22) of the heating end (212).
8. A semiconductor refrigeration unit according to claim 7, wherein;
the metal heat radiation body (22) of the heating end (212) is provided with a flat bearing groove (221), and liquid of the gas-liquid separator (34) is discharged to the bearing groove (221) externally.
9. A semiconductor refrigeration unit according to claim 5, wherein;
and a temperature sensor (35) is installed at the exhaust end of the main pipeline (30) and used for detecting the exhaust temperature of the main pipeline (30).
10. A semiconductor refrigeration unit according to claim 1, wherein;
the semiconductor refrigeration piece (21) is located at one end of the metal heat radiation body (22), and air in the air flow channel (23) circulates towards the end of the semiconductor refrigeration piece (21).
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| CN202110634728.XA CN113251690B (en) | 2021-06-08 | 2021-06-08 | Semiconductor refrigerating device |
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| CN202110634728.XA CN113251690B (en) | 2021-06-08 | 2021-06-08 | Semiconductor refrigerating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115164493A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Air-cooled semiconductor freezer and control method thereof |
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| CN213066623U (en) * | 2020-09-13 | 2021-04-27 | 上海唐人神肉制品有限公司 | Heat radiator |
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2021
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115164493A (en) * | 2022-07-15 | 2022-10-11 | 青岛海容商用冷链股份有限公司 | Air-cooled semiconductor freezer and control method thereof |
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| CN113251690B (en) | 2022-05-20 |
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