CN106168389A - A kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier - Google Patents
A kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier Download PDFInfo
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- CN106168389A CN106168389A CN201610669275.3A CN201610669275A CN106168389A CN 106168389 A CN106168389 A CN 106168389A CN 201610669275 A CN201610669275 A CN 201610669275A CN 106168389 A CN106168389 A CN 106168389A
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- air
- heat exchanger
- fluid passage
- intermediate heat
- high temperature
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
- F24F2003/1446—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only by condensing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Drying Of Gases (AREA)
Abstract
The invention provides a kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, by arranging Intermediate Heat Exchanger, the low temperature air-out of cooling piece heat absorbing fins group is introduced the cry-fluid passage of Intermediate Heat Exchanger, high temperature air intake is introduced the zone of heat liberation of Intermediate Heat Exchanger, the low temperature air-out utilizing heat absorbing fins group carries out pre-cooling to the high temperature air intake of heat absorbing fins group, thus high temperature inlet temperature is reduced, relative humidity improves, make close to saturated humid air or saturated air, enter back into heat absorbing fins group, thus increase substantially the humidity load of cooling piece, increase substantially dehumidifying efficiency.
Description
Technical field
The present invention relates to dehydrating unit design field, particularly relate to a kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifying
Machine.
Background technology
Semiconductor refrigerating technology, also known as freezing by thermoelectric action technology, from the 1950's, fast development is got up.Quasiconductor system
Cold, it utilizes the P-N junction that semi-conducting material forms, and logical upper unidirectional current can produce refrigeration, within several seconds, just can make cold end
Frosting；It does not has the frame for movement that compressor etc. is complicated, more need not cold-producing medium.
Although the Energy Efficiency Ratio of semiconductor refrigerating, i.e. refrigerating capacity and the ratio inputting electric work, relatively low, only use fluorine profit
About the 1/10 of the vapour compression refrigeration system of high cold-producing medium；But semiconductor refrigerating technology have unrivaled feature and
Advantage: 1. mechanical is moved, without cold-producing medium, refrigeration rapidly；2. can with modularity combination in any, refrigerating capacity can from milliwatt level to
Multikilowatt, the refrigeration temperature difference is up to 30---150 DEG C, easy to use, uses extensively；3. can continuously adjust, change the confession of cooling piece
Piezoelectric voltage, refrigerating capacity can be with consecutive variations；The most lightweight, volume is little, can make miniature, submicron, small semiconductor refrigeration
Device.
Semiconductor refrigerating technology is at short space, and such as industrial electro gas holder, family's wardrobe cabinet etc., solution cabinet is interior to dehumidify
Mildew-resistant, raising electric insulation grade prevent air breakdown aspect, have the advantage of uniqueness.
As it is shown in figure 1, semiconductor demoistener in the market, during operation, semiconductor chilling plate 3 is passed through unidirectional current, cooling piece
Right side heat absorption, left side heat release, blower fan 14 air is pressed to cooling piece on the left of be in close contact radiating fin group 2 take away heat from
It is external that air outlet 13 discharges dehumidifier；Meanwhile, blower fan 14 causes negative pressure at intracavity, and the air being drawn into air port 12 flows into；From entering
Air port 13 leaked-in air, sub-fraction flow through with cooling piece on the right side of be in close contact heat absorbing fins group 9, this sub-fraction air
Converged by the bulk air not flowing through heat absorbing fins group after cool-down dehumidification with major part, then flow to radiating fin group.
As can be seen here, the ventilation of the heat absorbing fins group of existing semiconductor demoistener, there is uncertainty, any one
Extraneous disturbance can cause the change of ventilation.Semiconductor demoistener, owing to refrigerating efficiency is relatively low, usual refrigerating capacity all compares
Little, when being unit with " w ", the 1 power order of magnitude of refrigerating capacity generally only 10 or the 2 power orders of magnitude, if the quasiconductor system of passing through
The air mass flow of the heat absorbing fins group of cold is relatively big, and semiconductor chilling plate does not just carry out degree of depth dehumidifying (by air phase to air
Humidity is reduced to less than 50%) ability；Because air is only reduced under dew point temperature just can leach moisture in temperature,
And when passing through the air mass flow of heat absorbing fins group of semiconductor chilling plate and being bigger, the refrigerating capacity of cooling piece is initially used for air dew
The absorption of sensible heat more than some temperature, and the refrigerating capacity of cooling piece is usual when absorbing the air sensible being positioned at more than dew point temperature
The most depleted, hence without unnecessary refrigerating capacity for the absorption of water vapor in air condensation heat, no longer exist ability just
Water vapor in air is condensed into water, and now dehumidifying effect is zero.
Summary of the invention
In order to solve the problems referred to above, the invention provides a kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, including:
Housing, is provided with the first air inlet, the second air inlet and air outlet；
Semiconductor chilling plate, is arranged in described housing, and the side of described semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in described housing, and described Intermediate Heat Exchanger is provided with cry-fluid passage and high temperature fluid leads to
Road；
The outer humid air of dehumidifier enters in described housing from the first air inlet and the second air inlet respectively from described；By described
The humid air that one air inlet enters first flows through the high temperature fluid passage of described Intermediate Heat Exchanger and tentatively lowers the temperature pre-cooling, passes through institute
State heat absorbing fins group and carry out cool-down dehumidification, pass through the cry-fluid passage of described Intermediate Heat Exchanger for high temperature fluid passage
Air carry out cooling and realize pre-cooling, finally flow to described radiating fin group；The humid air entered by described second air inlet is straight
Connect and flow to described radiating fin group, flow through the heat absorption of radiating fin group together with the air from Intermediate Heat Exchanger cry-fluid passage
Discharged by described air outlet after intensification.
It is preferred that described Intermediate Heat Exchanger uses crossflow regenerator, counter-flow heat exchanger or fork contra-flow heat exchanger, described
Intermediate Heat Exchanger includes some described cry-fluid passage and high temperature fluid passage, and described cry-fluid passage and described height
Temperature fluid passage interlaced arrangement, cryogen flows in the described cry-fluid passage passage with high temperature fluid with high temperature fluid
And realize heat exchange by wallboard.
It is preferred that the air flow in described cry-fluid passage hangs down mutually with the air flow in described high temperature fluid passage
Directly, or, the air flow in described cry-fluid passage intersects with the air flow in described high temperature fluid passage and adverse current,
Or, the air flow in described cry-fluid passage parallel with the air flow in described high temperature fluid passage and adverse current.
It is preferred that be provided with the first air distribution plate on described first air inlet, described first air distribution plate is evenly equipped with multiple
One through hole；It is provided with the second air distribution plate on described second air inlet, described second air distribution plate is evenly equipped with multiple second through hole.
It is preferred that described first through hole, described second through hole are circular or rectangle.
It is preferred that be provided with drip tray below described heat absorbing fins group, described drip tray connects a water tank.
It is preferred that be provided with blower fan between the outlet air end of described radiating fin group and described air outlet, it is used for promoting housing
The flowing of interior air.
Present invention also offers a kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, including:
Housing, is provided with the first air inlet, the second air inlet, the first air outlet and the second air outlet；
Semiconductor chilling plate, is arranged in described housing, and the side of described semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in described housing, and described Intermediate Heat Exchanger is provided with cry-fluid passage and high temperature fluid leads to
Road；
The outer humid air of dehumidifier enters in described housing from the first air inlet and the second air inlet respectively from described；
The humid air entered by described first air inlet first flows through the high temperature fluid passage of described Intermediate Heat Exchanger and tentatively lowers the temperature,
Pass through described heat absorbing fins group and carry out cool-down dehumidification, pass through the cry-fluid passage of described Intermediate Heat Exchanger for high temperature
The air of fluid passage carries out pre-cooling, is finally discharged by the first air outlet；
Described radiating fin group, directly through described radiating fin group, is dropped by the humid air entered by described second air inlet
Temperature, then discharge from described second air outlet.
It is preferred that described first air outlet is provided with the first blower fan, described second air inlet is provided with the second blower fan.
It is preferred that described Intermediate Heat Exchanger uses crossflow regenerator, fork contra-flow heat exchanger or counter-flow heat exchanger, described
Intermediate Heat Exchanger includes some described cry-fluid passage and high temperature fluid passage, and described cry-fluid passage and described height
Temperature fluid passage interlaced arrangement, cryogen flows in the described cry-fluid passage passage with high temperature fluid with high temperature fluid
And realize heat exchange by wallboard.
It is preferred that the air flow in described cry-fluid passage hangs down mutually with the air flow in described high temperature fluid passage
Directly；Or, the air flow in described cry-fluid passage intersects with the air flow in described high temperature fluid passage and adverse current；
Or, the air flow in described cry-fluid passage parallel with the air flow in described high temperature fluid passage and adverse current.
It is preferred that be provided with the first air distribution plate on described first air inlet, described first air distribution plate is evenly equipped with multiple
One through hole；It is provided with the second air distribution plate on described second air inlet, described second air distribution plate is evenly equipped with multiple second through hole.
Due to the fact that the above technical scheme of employing, be allowed to compared with prior art, have the following advantages that and actively imitate
Really:
1) the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier that the present invention provides, by the setting of Intermediate Heat Exchanger, by quasiconductor
The low temperature air-out of the heat absorbing fins group of refrigeration fin introduces in the cry-fluid passage of Intermediate Heat Exchanger, will be entered by the first air inlet
The high temperature air intake entered introduces in the high temperature fluid passage of Intermediate Heat Exchanger, utilizes the low temperature air-out of heat absorbing fins group to heat absorbing fins
The high temperature air intake of group carries out pre-cooling, thus the reduction of high temperature inlet temperature, relative humidity is improved, and makes close to saturated
Humid air or saturated air, enter back into heat absorbing fins group, thus increase substantially the humidity load of cooling piece, increase substantially dehumidifying
Efficiency；
2) the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier that the present invention provides, achieves by arranging air distribution plate on air inlet
Heat absorbing fins group, the accurate air distribution of radiating fin group, so that passing through the sensible heat of the air of heat absorbing fins group at semiconductor refrigerating
Accounting in sheet refrigerating capacity is greatly reduced, accurately reduces, the latent heat of phase change of water vapor in air accounting in cooling piece refrigerating capacity
Than effectively improving, accurately improving, it is ensured that the heat absorbing fins group of semiconductor chilling plate is in low relative humidity (such as 40%) condition
Under from air, filter moisture, thus the relative humidity in space residing for semiconductor demoistener is reduced to less than 50%, with effectively
Press down mycostatic generation.
Accompanying drawing explanation
In conjunction with accompanying drawing, by hereafter state detailed description, can be more clearly understood that the present invention above-mentioned and other feature and
Advantage, wherein:
Fig. 1 is the structural representation of semiconductor demoistener in prior art；
Fig. 2 is the principle schematic of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier in embodiment 1；
Fig. 3 is heat absorbing fins group in the present invention, the structural representation of radiating fin group；
Fig. 4 is the structural representation of Intermediate Heat Exchanger in embodiment 1；
Fig. 5 is the fractionation schematic diagram of Intermediate Heat Exchanger in embodiment 1；
Fig. 6 is the schematic diagram of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier in embodiment 2；
Fig. 7 is that the A of Fig. 6 is to schematic diagram；
Fig. 8 is the schematic diagram of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier in embodiment 3.
Detailed description of the invention
See the accompanying drawing illustrating the embodiment of the present invention, the present invention is described in more detail.But, the present invention can be with
Many multi-forms realize, and should not be construed as the embodiment by herein proposing and limited.On the contrary, proposing these embodiments is
In order to reach fully and complete disclosure, and those skilled in the art are made to understand the scope of the present invention completely.These are attached
In figure, for clarity sake, may be exaggerated layer and the size in region and relative size.
Current semiconductor demoistener cooling piece, due to the physical characteristic of quasiconductor P-N junction self, its refrigerating efficiency is relatively
Low, general only about 0.3.
When semiconductor demoistener runs, if heat absorbing fins assembles wind not precisely, pass through the air stream of heat absorbing fins group
Measuring bigger than normal, semiconductor chilling plate does not just carry out the energy of degree of depth dehumidifying (relative air humidity is reduced to less than 50%) to air
Power；This is because, air is only reduced under its dew point temperature just can leach moisture in temperature；And when passing through semiconductor refrigerating
When the air mass flow of the heat absorbing fins group of sheet is bigger than normal, the refrigerating capacity of semiconductor chilling plate is initially used for dew point during air cooling-down
The absorption of sensible heat more than temperature, and the refrigerating capacity of semiconductor chilling plate when absorbing the air sensible being positioned at more than dew point temperature
The most depleted, it is used further to now reach saturated or steam close to water in saturated air hence without refrigerating capacity more than needed
The absorption of vapour condensation heat, no longer exists ability just water vapor in air and is condensed into water.
Even if being capable of semiconductor demoistener heat absorbing fins group little air quantity accurate air distribution, leach the water in a small amount of air
Point, for cooling piece, flowing through the sensible heat of heat absorbing fins group air, to account for the ratio of refrigerating capacity the most too high, causes dehumidification rate low
Under.Such as, cooling piece refrigerating capacity 15w, under 30 DEG C of 40%RH operating modes, realize moisture removal 7.6g/h by precision air distribution；For
The refrigeration work consumption that water vapor in air condensation heat absorbs also only has 5.3w, only accounts for the 35% of overall refrigerating effect 15w；And the refrigerating capacity of 65%
It is used for absorbing the sensible heat flowing through heat absorbing fins group air, direct meaning is not had for dehumidifying and mildew-resistant.
For the problems referred to above, the invention provides a kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, on the one hand pass through
Air inlet arranges air distribution plate and achieves heat absorbing fins group, the accurate air distribution of radiating fin group, it is ensured that semiconductor chilling plate
Heat absorbing fins group filters moisture under the conditions of low relative humidity from air；On the other hand by heat absorbing fins group and air intake it
Between heat exchanger is set, by high temperature inlet temperature reduce, relative humidity improve, make close to saturated humid air or saturated
Air, enters back into heat absorbing fins group, thus increases substantially the humidity load of cooling piece, increase substantially dehumidifying efficiency.
Below specific embodiment is further described.
Embodiment 1
With reference to Fig. 2, the invention provides a kind of band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, include a housing 11, housing
Being provided with semiconductor chilling plate 3 in 11, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 9, and opposite side is provided with heat radiation
Fins set 2；Being provided with the first air inlet a, the second air inlet b and air outlet 10 on housing 11, extraneous humid air is from the most respectively from the
One air inlet and the second air inlet enter in housing 11.Being additionally provided with Intermediate Heat Exchanger 8 in housing 11, Intermediate Heat Exchanger 8 sets
Putting between the first air inlet a and heat absorbing fins group 9, Intermediate Heat Exchanger 8 is provided with cry-fluid passage and high temperature fluid passage,
The air flowing through cry-fluid passage and high temperature fluid passage mutually carries out heat exchange
Wherein, the first air inlet a the humid air entered first flows through the high temperature fluid passage of Intermediate Heat Exchanger 8 and tentatively lowers the temperature,
Pass through heat absorbing fins group 9 and carry out cool-down dehumidification, pass through the cry-fluid passage of Intermediate Heat Exchanger 8 for high temperature fluid is led to
The air in road carries out pre-cooling, finally flows to radiating fin group 2；The humid air entered by the second air inlet b flows directly into radiating fin
Sheet group 2, is discharged by air outlet 10 after flowing through radiating fin group together with the air of Intermediate Heat Exchanger and heating up.
The low temperature air-out of the heat absorbing fins group 9 of semiconductor refrigerating fin, by arranging Intermediate Heat Exchanger 8, is introduced by the present invention
In the cry-fluid passage of Intermediate Heat Exchanger 8, the first air inlet a the high temperature air intake entered is introduced the height of Intermediate Heat Exchanger 8
In temperature fluid passage, utilize the low temperature air-out of heat absorbing fins group 9 that the high temperature air intake of heat absorbing fins group 9 carries out pre-cooling, thus will
High temperature inlet temperature reduces, relative humidity improves, and makes close to saturated humid air or saturated air, enters back into heat absorption
Fins set 9, thus increase substantially the humidity load of cooling piece, increase substantially dehumidifying efficiency.
In the present embodiment, as shown in Figure 3, heat absorbing fins group 9, radiating fin group 2 are specifically be arranged in parallel by multiple
Fin forms, and heat absorbing fins group 9, radiating fin group 2 are compressed on semiconductor chilling plate 3；When semiconductor chilling plate 3 is energized
After work, heat absorbing fins group 9 is absorbed heat, radiating fin group 2 heat release, and humid air stream by cool-down dehumidification, becomes low through heat absorbing fins group 9
Temperature saturated air, then flows through radiating fin group 2 and takes away the heat in radiating fin group 2.
First air inlet a is communicated with the first air intake passage, and heat absorbing fins group 9, Intermediate Heat Exchanger 8 are positioned at the first air intake passage
In；It is separate that second air inlet b is communicated with the second air intake passage, the first air intake passage and the second air intake passage, and in heat radiation
The air intake of fins set 2 converges；The outlet air end of radiating fin group 2 is connected with air outlet 10 by an air-out passage；Enter from first
The air by the air after cool-down dehumidification with from the second air intake passage entrance that wind passage is come in flows through radiating fin group after converging
2, through being discharged housing 11 by air-out passage from air outlet 10 after taking away the heat in radiating fin group 2.
In the present invention, Intermediate Heat Exchanger 8 uses cross-current type or counter-flow heat exchanger or fork contra-flow heat exchanger, compared to following current
Formula heat exchanger, has the advantages that heat transfer efficiency is high, unit volume heat exchange area is big, thermic load is big, is suitable to gas-gas heat exchange.
In the present embodiment, using crossflow regenerator with reference to Fig. 4-5 Intermediate Heat Exchanger 8, it includes some low temperature stream
Body passage (i.e. A channel) and high temperature fluid passage (i.e. channel B), and cry-fluid passage and the crisscross cloth of high temperature fluid passage
Putting, the air flow in cry-fluid passage is perpendicular with the air flow in high temperature fluid passage；From the first air inlet a's
High temperature air flows through high temperature fluid passage, and the Cryogenic air from heat absorbing fins group 9 flows through cry-fluid passage, so that low
Heat exchange is realized between temperature fluid passage and high temperature fluid passage.
Certainly, in other embodiments, Intermediate Heat Exchanger 8 may be used without counter-flow heat exchanger, now cry-fluid passage
In air flow parallel with the air flow in high temperature fluid passage and countercurrently.
Certainly, in other embodiments, Intermediate Heat Exchanger 8 may be used without pitching contra-flow heat exchanger, now cry-fluid passage
Interior air flow intersects with the air flow in high temperature fluid passage and adverse current.
In the present embodiment, the first air inlet a is provided with the first air distribution plate 7, the second air inlet b is provided with second and joins
Aerofoil 4, the first air distribution plate 7 and the second air distribution plate 4 are for realizing the first air inlet a, intake accurate of the second air inlet b
Distribution.
Further, the first air distribution plate 7 is provided with multiple first through hole, the second air distribution plate 4 is provided with multiple second
Through hole, wherein the first through hole, the second through hole can be circular hole or rectangular opening etc., do not limit.The present invention can be by adjusting
Save the first through hole, the second through hole quantity, size are set, regulate air and flow through the first air distribution plate 7 and resistance of the second air distribution plate 4
Power, thus accurately control the first air distribution plate 7 and intake of the second air distribution plate 4, thus accurately control heat absorbing fins group 9,
The ventilation of radiating fin group 2；I.e. can realize " increasing radiating fin group ventilation to reduce the work temperature of radiating fin group
Degree, improve semiconductor chilling plate refrigerating efficiency ", can realize again " reduce heat absorbing fins group ventilation make the sensible heat of air exist
Accounting in cooling piece refrigerating capacity is greatly reduced, accurately reduces, and the latent heat of phase change of water vapor in air is in cooling piece refrigerating capacity
Accounting effectively improve, reliably improve, thus by the relative humidity of the industry at semiconductor demoistener place Yu domestic space
It is reduced to less than 50%.
In the present embodiment, the lower section of heat absorbing fins group 9 is provided with drip tray 6, is used for collecting in heat absorbing fins group 9 formation
Condensed water；Drip tray 6 is also associated with a water tank 5, and the water in drip tray 6 is exhausted directly in water tank.
It is provided with blower fan 1 between outlet air end and the air outlet 9 of radiating fin group 2, is i.e. arranged in air-out passage, blower fan 1
The flowing of air in promoting housing.After blower fan 1 starts so that enclosure interior forms negative pressure, so that outside air is suitable
Enter in housing from the first air inlet, the second air inlet.
The operation principle of the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier provided with regard to the present invention below is done further
Bright:
After startup, blower fan 1 runs, and produces negative pressuren zone at blower fan 1 suction inlet, attracts the external air of semiconductor demoistener to flow into housing
In 11；
Under the suction of blower fan 1, the air intake of the first air inlet is in the micro-air of the accurate air distribution of the first air distribution plate 7 flows through
Between the zone of heat liberation heat release pre-cooling of heat exchanger 8, temperature reduce, relative humidity improve, enter back into heat absorbing fins group 9 and drop further
Temperature dehumidifying leaches moisture, becomes low temperature saturated air and again passes through the cold fluid pass heat absorption intensification of Intermediate Heat Exchanger 8, is then out
Intermediate Heat Exchanger 8；
Meanwhile, under the suction of blower fan 1, the air intake of the second air inlet is after the second air distribution plate 4 Even air distribution and from centre
The air mixing of heat exchanger 8 cold fluid pass, then flow into radiating fin group 2, absorb radiating fin group 2 heat and heat up, through blower fan 1
Discharge machine from air outlet 10 after boosting.
Embodiment 2
With reference to Fig. 6-7, the present embodiment is the improvement carried out on the basis of embodiment 1, exists relative to embodiment 1 the present embodiment
Following distinguishing feature:
In the present embodiment, the air intake direction of the first air inlet a be perpendicular to the A shown in Fig. 6 to direction, the second air inlet b's
Air intake direction be then parallel to the A shown in Fig. 6 to direction, and, flow through plane (the i.e. Fig. 6 at radiating fin group air-flow place
Shown in plane), mutual with flowing through heat absorbing fins group 9, Intermediate Heat Exchanger 8 air-flow place plane (i.e. plane shown in Fig. 7)
Perpendicular.
The airflow direction of housing is configured by the present invention by above-mentioned design, is conducive to arranging conveniently in actual product
The arrangement in internal each air channel.
Embodiment 3
With reference to Fig. 8, the present embodiment is the improvement carried out on the basis of embodiment 1.
Concrete, in the present embodiment, band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier includes a housing 11, housing 11
Inside being provided with semiconductor chilling plate 3, the side of semiconductor chilling plate 3 is provided with heat absorbing fins group 9, and opposite side is provided with radiating fin
Sheet group 2；The first air inlet the 15, second air inlet the 16, first air outlet 17 and the second air outlet 18 it is provided with on housing 11.Housing
Being additionally provided with Intermediate Heat Exchanger 8 in 11, Intermediate Heat Exchanger 8 is arranged between the first air inlet 15 and heat absorbing fins group 9, and centre is changed
Hot device 8 is provided with cry-fluid passage and high temperature fluid passage, flows through the air phase of cry-fluid passage and high temperature fluid passage
Carry out heat exchange mutually.
In the present embodiment, it is provided with the first blower fan 19 at the first air outlet 17, at the second air inlet 16, is provided with second
Blower fan 20.
Heat absorbing fins group 9 and radiating fin group 2 lay respectively in two independent air ducts；
Under the effect of the first blower fan 19, extraneous humid air enters from the first air inlet 15, first flows through the height of Intermediate Heat Exchanger 8
Temperature fluid passage tentatively lowers the temperature, and passes through heat absorbing fins group 9 and carries out cool-down dehumidification, passes through the cryogen of Intermediate Heat Exchanger 8
Passage, for the air of high temperature fluid passage is carried out pre-cooling, is finally discharged by the first air outlet 17；
Under the effect of the second blower fan 20, the external world enters from the second air inlet 16, directly through radiating fin group 2, for dissipating
Hot fins set 2 is lowered the temperature, then discharges from the second air outlet 18.
Those skilled in the art should be understood that the present invention can be implemented without departing from this with other concrete forms many
The spirit or scope of invention.Although having been described for embodiments of the invention, it should be understood that the present invention should not be limited to these embodiments,
Those skilled in the art as made change within spirit and scope of the invention that appended claims defines and can repair
Change.
Claims (12)
1. a band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, it is characterised in that including:
Housing, is provided with the first air inlet, the second air inlet and air outlet；
Semiconductor chilling plate, is arranged in described housing, and the side of described semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in described housing, and described Intermediate Heat Exchanger is provided with cry-fluid passage and high temperature fluid leads to
Road；
The outer humid air of dehumidifier enters in described housing from the first air inlet and the second air inlet respectively from described；By described
The humid air that one air inlet enters first flows through the high temperature fluid passage of described Intermediate Heat Exchanger and tentatively lowers the temperature pre-cooling, passes through institute
State heat absorbing fins group and carry out cool-down dehumidification, pass through the cry-fluid passage of described Intermediate Heat Exchanger for high temperature fluid passage
Air carry out cooling and realize pre-cooling, finally flow to described radiating fin group；The humid air entered by described second air inlet is straight
Connect and flow to described radiating fin group, flow through the heat absorption of radiating fin group together with the air from Intermediate Heat Exchanger cry-fluid passage
Discharged by described air outlet after intensification.
2. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that described Intermediate Heat Exchanger
Using crossflow regenerator, counter-flow heat exchanger or fork contra-flow heat exchanger, described Intermediate Heat Exchanger includes some described low temperature
Fluid passage and high temperature fluid passage, and described cry-fluid passage and described high temperature fluid passage interlaced arrangement, cryogen
Flow in the described cry-fluid passage passage with high temperature fluid with high temperature fluid and realize heat exchange by wallboard.
3. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that described cryogen is led to
Air flow in road is perpendicular with the air flow in described high temperature fluid passage, or, in described cry-fluid passage
Air flow intersects with the air flow in described high temperature fluid passage and adverse current, or, the sky in described cry-fluid passage
Air-flow is to and adverse current parallel with the air flow in described high temperature fluid passage.
4. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that described first air inlet
On be provided with the first air distribution plate, described first air distribution plate is evenly equipped with multiple first through hole；It is provided with on described second air inlet
Second air distribution plate, described second air distribution plate is evenly equipped with multiple second through hole.
5. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 4, it is characterised in that described first through hole,
Described second through hole is circular or rectangle.
6. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that described heat absorbing fins group
Lower section is provided with drip tray, and described drip tray connects a water tank.
7. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 1, it is characterised in that described radiating fin group
Outlet air end and described air outlet between be provided with blower fan, for promoting the flowing of air in housing.
8. a band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier, it is characterised in that including:
Housing, is provided with the first air inlet, the second air inlet, the first air outlet and the second air outlet；
Semiconductor chilling plate, is arranged in described housing, and the side of described semiconductor chilling plate is provided with heat absorbing fins group, opposite side
It is provided with radiating fin group；
Intermediate Heat Exchanger, is arranged in described housing, and described Intermediate Heat Exchanger is provided with cry-fluid passage and high temperature fluid leads to
Road；
The outer humid air of dehumidifier enters in described housing from the first air inlet and the second air inlet respectively from described；
The humid air entered by described first air inlet first flows through the high temperature fluid passage of described Intermediate Heat Exchanger and tentatively lowers the temperature,
Pass through described heat absorbing fins group and carry out cool-down dehumidification, pass through the cry-fluid passage of described Intermediate Heat Exchanger for high temperature
The air of fluid passage carries out pre-cooling, is finally discharged by the first air outlet；
Described radiating fin group, directly through described radiating fin group, is dropped by the humid air entered by described second air inlet
Temperature, then discharge from described second air outlet.
9. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 8, it is characterised in that described first air outlet
Being provided with the first blower fan, described second air inlet is provided with the second blower fan.
10. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 8, it is characterised in that described intermediate heat transfer
Device uses crossflow regenerator, fork contra-flow heat exchanger or counter-flow heat exchanger, and described Intermediate Heat Exchanger includes some described low
Temperature fluid passage and high temperature fluid passage, and described cry-fluid passage and described high temperature fluid passage interlaced arrangement, low temperature stream
Body and high temperature fluid flow in the described cry-fluid passage passage with high temperature fluid and realize heat exchange by wallboard.
11. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 8, it is characterised in that described cryogen
Air flow in passage is perpendicular with the air flow in described high temperature fluid passage；Or, in described cry-fluid passage
Air flow intersect with the air flow in described high temperature fluid passage and adverse current；Or, in described cry-fluid passage
Air flow parallel with the air flow in described high temperature fluid passage and adverse current.
12. according to the band Intermediate Heat Exchanger quasiconductor degree of depth dehumidifier described in claim 8, it is characterised in that described first air intake
It is provided with the first air distribution plate on Kou, described first air distribution plate is evenly equipped with multiple first through hole；Arrange on described second air inlet
There is the second air distribution plate, described second air distribution plate is evenly equipped with multiple second through hole.
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| CN201610669275.3A CN106168389B (en) | 2016-08-15 | 2016-08-15 | Semiconductor deep dehumidifier with intermediate heat exchanger |
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| CN201610669275.3A CN106168389B (en) | 2016-08-15 | 2016-08-15 | Semiconductor deep dehumidifier with intermediate heat exchanger |
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| CN106617250A (en) * | 2016-12-15 | 2017-05-10 | 中国烟草总公司广东省公司 | Efficient tobacco curing barn |
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| CN107504558A (en) * | 2017-07-18 | 2017-12-22 | 西安交通大学 | A kind of twin-stage semiconductor dehumidifying device of heat pipe synergy |
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| CN109798649A (en) * | 2018-11-30 | 2019-05-24 | 陈柏年 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
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| CN111389185A (en) * | 2020-03-27 | 2020-07-10 | 宁夏企程科技有限公司 | Dehumidification mechanism, cabinet structure and intelligent cabinet system based on Internet of things |
| CN111928359A (en) * | 2020-08-18 | 2020-11-13 | 北京无线电测量研究所 | Semiconductor dehumidifier and dehydrating unit |
| CN112097442A (en) * | 2019-06-18 | 2020-12-18 | 青岛海尔智能技术研发有限公司 | Airflow dehumidification module for refrigeration and freezing device and refrigeration and freezing device |
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| CN110486983B (en) * | 2019-07-25 | 2021-11-09 | 中国科学院广州能源研究所 | Temperature-controllable semiconductor moisture-proof and dehumidifying device |
| CN110486983A (en) * | 2019-07-25 | 2019-11-22 | 中国科学院广州能源研究所 | A kind of controllable temperature semiconductor damp-proof moisture removing apparatus |
| CN111389185A (en) * | 2020-03-27 | 2020-07-10 | 宁夏企程科技有限公司 | Dehumidification mechanism, cabinet structure and intelligent cabinet system based on Internet of things |
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| CN112153876A (en) * | 2020-10-21 | 2020-12-29 | 江苏勒图智能科技有限公司 | Soaking plate heat exchanger |
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