CN111397010A - Semiconductor refrigerating and dehumidifying device - Google Patents

Semiconductor refrigerating and dehumidifying device Download PDF

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Publication number
CN111397010A
CN111397010A CN202010284210.3A CN202010284210A CN111397010A CN 111397010 A CN111397010 A CN 111397010A CN 202010284210 A CN202010284210 A CN 202010284210A CN 111397010 A CN111397010 A CN 111397010A
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CN
China
Prior art keywords
cold
cavity
hot
semiconductor refrigeration
chamber
Prior art date
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Pending
Application number
CN202010284210.3A
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Chinese (zh)
Inventor
邵济舟
伍超
龚文忠
张娟娟
方劼
李丽娟
白晓宇
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China Railway Construction Heavy Industry Group Co Ltd
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China Railway Construction Heavy Industry Group Co Ltd
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Filing date
Publication date
Application filed by China Railway Construction Heavy Industry Group Co Ltd filed Critical China Railway Construction Heavy Industry Group Co Ltd
Priority to CN202010284210.3A priority Critical patent/CN111397010A/en
Publication of CN111397010A publication Critical patent/CN111397010A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/89—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/20—Casings or covers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/22—Means for preventing condensation or evacuating condensate
    • F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H3/00—Air heaters
    • F24H3/02—Air heaters with forced circulation
    • F24H3/04—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element
    • F24H3/0405—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element using electric energy supply, e.g. the heating medium being a resistive element; Heating by direct contact, i.e. with resistive elements, electrodes and fins being bonded together without additional element in-between
    • F24H3/0411—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element using electric energy supply, e.g. the heating medium being a resistive element; Heating by direct contact, i.e. with resistive elements, electrodes and fins being bonded together without additional element in-between for domestic or space-heating systems
    • F24H3/0417—Air heaters with forced circulation the air being in direct contact with the heating medium, e.g. electric heating element using electric energy supply, e.g. the heating medium being a resistive element; Heating by direct contact, i.e. with resistive elements, electrodes and fins being bonded together without additional element in-between for domestic or space-heating systems portable or mobile
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/0052—Details for air heaters
    • F24H9/0073—Arrangement or mounting of means for forcing the circulation of air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B29/00—Combined heating and refrigeration systems, e.g. operating alternately or simultaneously
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
    • F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
    • F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
    • F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
    • F24F2003/1446—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only by condensing

Abstract

The invention discloses a semiconductor refrigeration and dehumidification device, which comprises a shell, wherein a cold cavity and a hot cavity which are separated by a semiconductor refrigeration sheet are arranged in the shell, a hot cavity air inlet communicated with the hot cavity, an air outlet communicated with the hot cavity and a cold cavity air inlet communicated with the cold cavity are arranged on the shell in a penetrating manner, a cold end heat absorption fin fixed on the semiconductor refrigeration sheet is arranged in the cold cavity, a hot end heat release fin fixed on the semiconductor refrigeration sheet is arranged in the hot cavity, an air blowing fan is arranged in the hot cavity, a cold and hot cavity communication hole communicated with the cold cavity and the hot cavity is arranged on the semiconductor refrigeration sheet, a control valve used for opening or sealing the cold and hot cavity communication hole is arranged on the cold and hot cavity communication hole, and the control valve. Through the setting of control flap and cold and hot chamber intercommunicating pore, cold chamber and hot chamber intercommunication can realize the dehumidification, and usable gaseous circulation is only in order effectively to heat in the hot chamber after cold chamber cuts off with hot chamber, makes semiconductor refrigeration dehydrating unit can switch between dehumidification and heating two kinds of functions.

Description

Semiconductor refrigerating and dehumidifying device
Technical Field
The invention relates to the technical field of refrigeration equipment, in particular to a semiconductor refrigeration and dehumidification device.
Background
The semiconductor refrigeration technology, also called thermoelectric refrigeration technology, utilizes P-N junction made of semiconductor material to produce refrigeration effect by applying direct current, and can make cold end frosted for several seconds. The semiconductor refrigeration technology does not have complex mechanical structures such as a compressor and the like, and does not need a refrigerant.
At present, in the semiconductor dehumidifier on the market, the water vapor in the air is condensed when the semiconductor refrigeration sheet generates local low temperature so as to reduce the humidity of the air flowing through. However, it has only a dehumidifying function and cannot have both dehumidifying and heating functions.
Therefore, how to provide a semiconductor refrigeration and dehumidification device capable of switching between dehumidification and heating functions is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present invention provides a semiconductor refrigeration and dehumidification device, which can switch between dehumidification and heating functions.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a semiconductor refrigeration dehydrating unit, includes the casing, include in the casing cold chamber and the hot chamber of being separated by the semiconductor refrigeration piece, run through on the casing be equipped with the hot chamber air intake of hot chamber intercommunication, with the air outlet of hot chamber intercommunication and with the cold chamber air intake of cold chamber intercommunication, be equipped with in the cold chamber be fixed in the cold junction heat absorption fin of semiconductor refrigeration piece, be equipped with in the hot chamber and be fixed in the hot junction heat release fin of semiconductor refrigeration piece, be equipped with the fan of blowing in the hot chamber, be equipped with the intercommunication on the semiconductor refrigeration piece cold chamber with the cold and hot chamber intercommunicating pore in hot chamber, be equipped with on the cold and hot chamber intercommunicating pore and be used for opening or sealing the control flap of cold and hot chamber intercommunicating pore, the control flap electricity is connected the external placement in.
Preferably, a heat insulation layer is arranged on the inner wall of the shell forming the cold cavity.
Preferably, a hydrophobic coating is arranged on the cold-end heat absorption fin.
Preferably, the cold chamber air inlet and the hot chamber air inlet are formed in opposite wall surfaces of the shell, and the cold chamber communicating hole and the cold chamber air inlet are formed in two sides of the cold end heat absorbing fin respectively.
Preferably, the air outlet is opposite to the blowing fan.
Preferably, a cold cavity water outlet communicated with the cold cavity is arranged on the shell in a penetrating mode, the cold cavity water outlet and the cold cavity air inlet are respectively formed in two adjacent wall surfaces of the shell, and the cold end heat absorption fins are arranged on the shell in an inclined mode from the cold cavity air inlet to the cold cavity water outlet.
Preferably, the cold chamber outlet is provided with a funnel-shaped outlet groove in butt joint with the outer side of the shell, the tip of the funnel-shaped outlet groove penetrates through the cold chamber outlet, and the tip is in butt joint with a cylindrical water pipe interface.
The invention provides a semiconductor refrigeration and dehumidification device, which comprises a shell, wherein a cold cavity and a hot cavity which are separated by a semiconductor refrigeration sheet are arranged in the shell, a hot cavity air inlet communicated with the hot cavity, an air outlet communicated with the hot cavity and a cold cavity air inlet communicated with the cold cavity are arranged on the shell in a penetrating manner, a cold end heat absorption fin fixed on the semiconductor refrigeration sheet is arranged in the cold cavity, a hot end heat release fin fixed on the semiconductor refrigeration sheet is arranged in the hot cavity, an air blowing fan is arranged in the hot cavity, a cold and hot cavity communication hole communicated with the cold cavity and the hot cavity is arranged on the semiconductor refrigeration sheet, a control valve used for opening or sealing the cold and hot cavity communication hole is arranged on the cold and hot cavity communication hole, and the.
Through the setting of control flap and cold and hot chamber intercommunicating pore, can conveniently realize the on-off control to cold chamber and hot chamber, cold chamber and hot chamber intercommunication in order to realize the dehumidification, cold chamber and hot chamber separate the back, can utilize gas only circulate in the hot chamber with effective heating for semiconductor refrigeration dehydrating unit can switch between dehumidification and heating two kinds of functions. Simultaneously, adopt the single air outlet structure setting of two air intakes of cold chamber air intake, hot chamber air intake and air outlet, at the dehumidification in-process, not only utilized semiconductor refrigeration piece dehumidification, the air after the secondary use dehumidification cooling dispels the heat to the hot junction of semiconductor refrigeration piece in addition, can reduce the secondary evaporation effect to the comdenstion water, full play semiconductor refrigeration piece's efficiency, reduce cold end airflow, when reducing the comdenstion water evaporation, guarantee the hot junction heat dissipation, the problem that the low amount of wind that leads to cold and hot both ends needs of semiconductor refrigeration efficiency is different has been solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a horizontal sectional view of a semiconductor refrigeration dehumidifier according to the present invention;
fig. 2 is a longitudinal sectional view of the semiconductor refrigeration and dehumidification device provided by the invention at the cold chamber side.
Reference numerals:
1-cold cavity air inlet, 2-cold end heat absorption fin, 3-cold and hot cavity communication hole, 4-hot cavity air inlet, 5-hot end heat release fin, 6-blowing fan, 7-air outlet, 8-water pipe interface, 9-semiconductor refrigerating sheet, 10-change-over switch, 11-shell, 12-heat insulation layer, 13-funnel-shaped water outlet groove, 14-cold cavity water outlet, 15-cold cavity and 16-hot cavity.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the invention is to provide a semiconductor refrigeration and dehumidification device which can switch between dehumidification and heating functions.
It will be understood that when an element is referred to as being "secured" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The semiconductor refrigeration and dehumidification device comprises a shell 11, wherein a cold cavity 15 and a hot cavity 16 which are separated by a semiconductor refrigeration sheet 9 are arranged in the shell 11, and a hot cavity air inlet 4 communicated with the hot cavity 16, an air outlet 7 communicated with the hot cavity 16 and a cold cavity air inlet 1 communicated with the cold cavity 15 are arranged on the shell 11 in a penetrating manner. A cold end heat absorption fin 2 fixed on the semiconductor refrigeration sheet 9 is arranged in the cold cavity 15, and a hot end heat release fin 5 fixed on the semiconductor refrigeration sheet 9 is arranged in the hot cavity 16. The semiconductor refrigeration piece 9 is a refrigeration element, the cold-end heat absorption fin 2 is a heat absorption end of the semiconductor refrigeration piece 9, and the hot-end heat release fin 5 is a heat release end of the semiconductor refrigeration piece 9. The hot cavity 16 is internally provided with the blowing fan 6, wherein only one blowing fan 6 can be arranged, the whole structure is simple, and materials can be saved. The semiconductor refrigeration piece 9 is provided with a cold and hot cavity communication hole 3 for communicating the cold cavity 15 and the hot cavity 16, the cold and hot cavity communication hole 3 is provided with a control valve for opening or sealing the cold and hot cavity communication hole 3, the control valve is electrically connected with a change-over switch 10 externally arranged on the shell 11, and the change-over switch 10 can be manually controlled.
A dehumidification mode: the change-over switch 10 is triggered, and the control valve opens the cold and hot cavity communication hole 3, so that the cold cavity 15 is communicated with the hot cavity 16. When the blowing fan 6 at the air outlet 7 works, air flow flows from the hot cavity air inlet 4 to the hot end heat-releasing fin 5 below the blowing fan 6, heat of the hot end is taken away, low pressure is formed on an air channel of the hot end heat-releasing fin 5 flowing through the hot end air inlet 4, so that external air at the cold cavity air inlet 1 flows into the cold cavity 15, after the temperature and the humidity of the air are reduced by the cold end heat-absorbing fin 2, the air flows are converged into the air flow at the hot cavity air inlet 4 through the cold and hot cavity communication holes 3 and flow to the hot end heat-releasing fin 5 to dissipate heat of the hot end heat-releasing fin 5, and then the air flows. The air entering from cold chamber air intake 1 is cooled down when passing through cold end heat absorbing fin 2, and vapor in the air can condense on cold end heat absorbing fin 2, and the condensate water droplet that produces can fall when reaching certain size. The air flow rate that flows in through cold chamber air intake 1 is slower, can effectively prevent the vapor secondary evaporation after the condensation, promotes the dehumidification effect.
Heating mode: the change-over switch 10 is triggered, the control valve closes the cold and hot cavity communication hole 3, so that the cold cavity 15 and the hot cavity 16 are separated, and only the hot cavity 16 circulates in the shell 11. The blowing fan 6 works to enable air flow to enter the hot cavity 16 from the hot cavity air inlet 4, flow through the hot end heat release fin 5 for heating and then be discharged from the air outlet 7, and the function of the heater is achieved.
In this embodiment, through the setting of control flap and cold and hot chamber intercommunicating pore 3, can conveniently realize the on-off control to cold chamber 15 and hot chamber 16, cold chamber 15 and hot chamber 16 intercommunication are in order to realize the dehumidification, and cold chamber 15 separates the back with hot chamber 16, can utilize gaseous circulation in hot chamber 16 only with effective heating for semiconductor refrigeration dehydrating unit can switch between dehumidification and heating two kinds of functions. Simultaneously, adopt the single air outlet 7 structure setting of two air intakes of cold chamber air intake 1, hot chamber air intake 4 and air outlet 7, in dehumidification process, not only utilized semiconductor refrigeration piece 9 to dehumidify, and the air after the secondary uses dehumidification cooling dispels the heat to the hot junction of semiconductor refrigeration piece 9, can reduce the secondary evaporation effect to the comdenstion water, full play semiconductor refrigeration piece 9's efficiency, reduce cold end airflow, when reducing the comdenstion water evaporation, guarantee the hot junction heat dissipation, the problem that the low amount of wind that leads to cold and hot both ends needs of semiconductor refrigeration efficiency is different has been solved.
Furthermore, the inner wall of the shell 11 forming the cold chamber 15 is provided with the heat insulation layer 12, so that heat exchange between the cold chamber 15 and the outside through the shell 11 can be reduced, the shell of the cold chamber is prevented from generating low temperature, water vapor is prevented from being condensed on the shell, and the working efficiency under the dehumidification and heating modes is enhanced.
Further, be equipped with the hydrophobic coating on cold junction heat absorption fin 2, through set up the material of hydrophobic nature on cold junction heat absorption fin 2, can avoid the comdenstion water to amass on cold junction heat absorption fin 2, prevent that the comdenstion water from infiltrating cold junction heat absorption fin 2 amass and increase the thermal resistance, the reinforcing air passes through the ability of hot junction heat release fin 5, the drainage of being convenient for improves dehumidification ability and dehumidification efficiency.
Further, cold chamber air intake 1 and hot chamber air intake 4 set up on the relative wall on casing 11, and cold and hot chamber intercommunicating pore 3 sets up the both sides at cold junction heat absorption fin 2 respectively with cold chamber air intake 1 to can guarantee that the air inlet of cold chamber air intake 1 can flow through cold junction heat absorption fin 2 after reentrant cold and hot chamber intercommunicating pore 3, and can merge rapidly with the air inlet of hot chamber air intake 4. Specifically, as shown in fig. 1, the cold chamber air inlet 1 and the hot chamber air inlet 4 are respectively disposed on two opposite wall surfaces of the housing 11 perpendicular to the horizontal direction, and the external air horizontally enters the cold chamber air inlet 1 and the hot chamber air inlet 4.
Furthermore, the air outlet 7 is arranged opposite to the blowing fan 6, so that the gas in the thermal cavity 16 can be discharged quickly and efficiently.
Furthermore, a cold cavity water outlet 14 communicated with a cold cavity 15 penetrates through the shell 11, the cold cavity water outlet 14 and the cold cavity air inlet 1 are respectively arranged on two adjacent wall surfaces of the shell 11, and the cold end heat absorption fins 2 are obliquely arranged from the cold cavity air inlet 1 to the cold cavity water outlet 14. As shown in fig. 2, the cold chamber air inlet 1 is disposed on a wall surface perpendicular to the horizontal direction of the casing 11, the hot chamber air inlet 4 is disposed on a bottom wall surface parallel to the horizontal direction of the casing 11, the cold end heat absorbing fins 2 are sequentially disposed from top to bottom, the cold end heat absorbing fins 2 are disposed in an inclined manner relative to the horizontal direction, and the whole structure formed by the cold end heat absorbing fins 2 is a rectangular structure. After external air enters the cold cavity 15 through the cold cavity air inlet 1, the cold end heat absorption fins 2 have a guiding function to guide air to flow, the cold end heat absorption fins 2 are prevented from blocking air flow and passing through, the cold end heat absorption fins 2 also have a guiding function on condensed water, the condensed water can flow towards the wall surface where the cold cavity water outlet 14 is located, the condensed water can slide down conveniently, and the condensed water discharge efficiency is improved. Wherein, the base material of the cold-end heat-absorbing fin 2 is aluminum alloy.
Furthermore, a funnel-shaped water outlet groove 13 is butted on the outer side of the shell 11 on the cold cavity water outlet 14 to further improve the water discharging efficiency, the tip of the funnel-shaped water outlet groove 13 is arranged in a penetrating way, the tip is butted with a cylindrical water pipe interface 8, and the water pipe interface 8 can be butted with a standard water outlet pipe.
The semiconductor refrigeration and dehumidification device in the embodiment is provided with the single shell 11, the inner surface of the cold cavity 15 of the shell 11 is added with a layer of heat insulation material to serve as the heat insulation layer 12, in addition, the double air inlets, the single air outlet, the single fan and the water outlet are arranged, air in the cold cavity 15 flows into the hot cavity 16 after being cooled and condensed, heat of the hot end can be dissipated, the flow of air in the cold cavity 15 can be reduced, and evaporation of condensed water is reduced. Through setting up two air intakes, can increase the heat dissipation to hot junction exothermic fin 5, and can make the sensible heat of the air that passes through hot junction exothermic fin 5 in the semiconductor refrigeration piece 9 refrigerating capacity account for than reducing, the accuracy reduces by a wide margin, the latent heat of phase change of vapor in the air accounts for in the refrigeration piece refrigerating capacity and is effectively improved, the accuracy improves, and the cold chamber has insulating layer 12 to cover, can reduce the loss of refrigeration piece cold volume. Meanwhile, the switching between dehumidification and heating can be conveniently realized through the arrangement of the switchable cold and hot cavity communication hole 3. Meanwhile, the hydrophobic cold-end heat absorption fins 2 are used, so that condensed water can slide down quickly to the cold-end heat absorption fins 2 and cannot be accumulated.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The semiconductor refrigeration and dehumidification device provided by the invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims (7)

1. The semiconductor refrigeration and dehumidification device is characterized by comprising a shell (11), wherein a cold cavity and a hot cavity which are separated by a semiconductor refrigeration sheet (9) are arranged in the shell (11), a hot cavity air inlet (4) communicated with the hot cavity, an air outlet (7) communicated with the hot cavity and a cold cavity air inlet (1) communicated with the cold cavity are arranged on the shell (11) in a penetrating manner, cold end heat absorption fins (2) fixed on the semiconductor refrigeration sheet (9) are arranged in the cold cavity, hot end heat release fins (5) fixed on the semiconductor refrigeration sheet (9) are arranged in the hot cavity, a blowing fan (6) is arranged in the hot cavity, cold and hot cavity communication holes (3) communicated with the cold cavity and the hot cavity are formed in the semiconductor refrigeration sheet (9), and a control valve used for opening or sealing the cold and hot cavity (3) is arranged on the cold and hot cavity communication holes (3), the control valve is electrically connected with a switch (10) which is externally arranged on the shell (11).
2. A semiconductor refrigeration and dehumidification device according to claim 1, wherein a thermal insulation layer (12) is provided on the inner wall of the housing (11) forming the cold chamber.
3. A semiconductor refrigeration dehumidifier as claimed in claim 1 wherein said cold side heat absorption fins (2) are provided with a hydrophobic coating.
4. The semiconductor refrigerating and dehumidifying device of claim 1, wherein the cold chamber air inlet (1) and the hot chamber air inlet (4) are formed in opposite wall surfaces of the housing (11), and the cold chamber communication hole (3) and the cold chamber air inlet (1) are formed in two sides of the cold side heat absorbing fin (2) respectively.
5. The semiconductor refrigeration and dehumidification device according to claim 1, wherein the air outlet (7) is disposed opposite to the blowing fan (6).
6. The semiconductor refrigeration and dehumidification device according to any one of claims 1 to 5, wherein a cold chamber water outlet (14) communicated with the cold chamber is formed in the housing (11) in a penetrating manner, the cold chamber water outlet (14) and the cold chamber air inlet (1) are respectively formed in two adjacent wall surfaces of the housing (11), and the cold end heat absorption fin (2) is obliquely arranged from the cold chamber air inlet (1) to the cold chamber water outlet (14).
7. A semiconductor refrigeration and dehumidification device according to claim 6, wherein a funnel-shaped water outlet groove (13) is butted on the cold chamber water outlet (14) at the outer side of the shell (11), the tip of the funnel-shaped water outlet groove (13) is arranged in a penetrating way, and the tip is butted with a cylindrical water pipe interface (8).
CN202010284210.3A 2020-04-14 2020-04-14 Semiconductor refrigerating and dehumidifying device Pending CN111397010A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010284210.3A CN111397010A (en) 2020-04-14 2020-04-14 Semiconductor refrigerating and dehumidifying device

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Application Number Priority Date Filing Date Title
CN202010284210.3A CN111397010A (en) 2020-04-14 2020-04-14 Semiconductor refrigerating and dehumidifying device

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Publication Number Publication Date
CN111397010A true CN111397010A (en) 2020-07-10

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114562769A (en) * 2021-11-17 2022-05-31 浙江先导热电科技股份有限公司 Semiconductor dehumidifying device
CN114698298A (en) * 2022-03-29 2022-07-01 清华大学 Temperature control box
CN115400555A (en) * 2022-08-22 2022-11-29 中煤科工集团重庆研究院有限公司 Gas dehumidification system and method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114562769A (en) * 2021-11-17 2022-05-31 浙江先导热电科技股份有限公司 Semiconductor dehumidifying device
CN114562769B (en) * 2021-11-17 2024-02-27 浙江先导热电科技股份有限公司 Semiconductor dehumidification device
CN114698298A (en) * 2022-03-29 2022-07-01 清华大学 Temperature control box
CN114698298B (en) * 2022-03-29 2023-04-07 清华大学 Temperature control box
CN115400555A (en) * 2022-08-22 2022-11-29 中煤科工集团重庆研究院有限公司 Gas dehumidification system and method

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