CN109798649A - Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier - Google Patents
Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier Download PDFInfo
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- CN109798649A CN109798649A CN201811456919.6A CN201811456919A CN109798649A CN 109798649 A CN109798649 A CN 109798649A CN 201811456919 A CN201811456919 A CN 201811456919A CN 109798649 A CN109798649 A CN 109798649A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 127
- 238000011084 recovery Methods 0.000 title claims abstract description 58
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- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 230000008929 regeneration Effects 0.000 claims abstract description 15
- 238000011069 regeneration method Methods 0.000 claims abstract description 15
- 239000002274 desiccant Substances 0.000 claims description 29
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- 238000001035 drying Methods 0.000 claims description 5
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- 238000009434 installation Methods 0.000 description 7
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- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000007791 dehumidification Methods 0.000 description 2
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Abstract
The invention discloses semiconductor full heat recovery devices, including several semiconductor chilling plates, several poles N radiating piece, several poles P radiating piece, each semiconductor chilling plate is equipped with N pole-face and P pole-face, two neighboring semiconductor chilling plate is oppositely arranged, and is connected between two opposite semiconductor chilling plates of N pole-face by the pole N radiating piece；It is connected between two opposite semiconductor chilling plates of P pole-face by the pole P radiating piece.The exchange of cold and hot operating condition can be realized in the power connection that semiconductor full heat recovery device need to only exchange semiconductor chilling plate N pole-face and P pole-face, and the thermal efficiency is higher.The present invention also provides fresh air ventilators and rotary dehumidifier including semiconductor full heat recovery device.Fresh air ventilator has cooling hydrofuge and heating function, and summer reduces calorific value；High heat exchanger effectiveness, which maximizes, when use in winter reduces energy dissipation.Semiconductor full heat recovery device in rotary dehumidifier improves efficiency regeneration wind pre-add heat treatment, can fresh air pretreatment cooling down reduction electric energy consumption.
Description
Technical field
The present invention relates to air recuperation of heat processing equipment technical field more particularly to semiconductor full heat recovery devices, fresh air
Ventilator and rotary dehumidifier.
Background technique
In equipment for being recycled to air fresh air, recuperation of heat component is mainly used: board-like recuperation of heat, heat pipe
Recuperation of heat, heat pump recuperation of heat, runner recuperation of heat.Four kinds of common air heat recovery devices have corresponding insufficient and disadvantage.
The shortcomings that plate-type heat recovery device, has: heat recovery efficiency lower only 45%；There is air cross pollution of opening and shaft, the service life is short,
Efficiency decaying is fast；Way of recycling is more passive, and structure is complicated；It is easily stained with polluter, such as dust, greasy dirt etc..
The shortcomings that heat pipe thermal recovery unit, has: the thermal efficiency lower only 70%；Need to fill heating exchange matchmaker Jie, using by item
Part limitation, bearing pressure to installation and pipeline has strict demand；Belong to pressure vessel product；Installation space is big, expense of maintenance and management
Greatly, it is also easy to reveal, is not environmentally type product；Safety in utilization is lower, has strict demand to fire-fighting.
The shortcomings that heat pump recuperation of heat recyclable device, has: the thermal efficiency lower only 70%；It needs to fill heating exchange matchmaker Jie, uses
Subject to conditions, bearing pressure to installation and pipeline has strict demand；Belong to pressure vessel control；Installation space is big, pipeline dimension
Administration fee is protected, is also easy to reveal, is not environmentally type product；Safety in utilization is lower, has strict demand to fire-fighting；It needs additional
Heat pump compressor provides circulation power, and energy consumption is high, and the variation of outdoor fresh air operating condition be easy to cause system conditions unstable；It is automatically controlled
System, heat pump coolant system is complicated, and maintenance expense is high；Initial investment is costly.
The shortcomings that runner heat recovery apparatus；Initial investment is costly；There is air cross pollution of opening and shaft, the service life is short, and efficiency decaying is fast；
Way of recycling is more passive, and structure is complicated；Installation space is big, and expense of maintenance and management is high；It is easily stained with polluter, such as dust, oil
Dirt etc..
To sum up, existing air heat recovery equipment generally all exist heat recovery efficiency is lower, power consumption can be high, not environmentally etc.
Disadvantage.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide semiconductor full heat recovery devices, new
Wind ventilator and rotary dehumidifier, can solve existing heat recovery efficiency is lower, power consumption can it is high, not environmentally the problem of.
An object of the present invention adopts the following technical scheme that realization:
Semiconductor full heat recovery device, including several semiconductor chilling plates further include that several poles N radiating piece, several P extremely dissipate
Warmware, each semiconductor chilling plate are equipped with N pole-face and P pole-face, and the pole N radiating piece is fixedly mounted on the semiconductor system
Cold N pole-face, the pole P radiating piece are fixedly mounted on the P pole-face of the semiconductor chilling plate；One semiconductor chilling plate
N pole-face it is opposite with the N pole-face of the adjacent semiconductor chilling plate, between two opposite semiconductor chilling plates of N pole-face
It is connected by the pole a N radiating piece；The P pole-face of one semiconductor chilling plate and another adjacent semiconductor chilling plate
P pole-face is opposite, is connected between two opposite semiconductor chilling plates of P pole-face by the pole a P radiating piece.
Further, each pole N radiating piece includes several poles N cooling fin, the fixed peace in the both ends of each pole N cooling fin
The N pole-face for the semiconductor chilling plate being oppositely arranged mounted in two forms several N polar winds road between several pole N cooling fins；
The each pole P radiating piece includes several poles P cooling fin, and the both ends of each pole P cooling fin are fixedly mounted on two and are oppositely arranged
The P pole-face of the semiconductor chilling plate forms several P polar winds road between several pole P cooling fins.
Further, each pole N radiating piece further includes the pole N baffle, and several pole N cooling fins are installed in parallel, institute
State the N pole-face both ends that the pole N baffle is fixedly mounted on the semiconductor chilling plate；The each pole P radiating piece further includes the pole P gear
Plate, the pole P cooling fin are installed in parallel, and the pole P baffle is fixedly mounted on the P pole-face both ends of the semiconductor chilling plate.
Further, the N pole-face of the semiconductor chilling plate and P pole-face are evenly coated with heat-conducting silicone grease respectively, make the pole N
Face, P pole-face and the pole N cooling fin, the pole P cooling fin are in close contact.
Further, several pole N cooling fins are laterally arranged, and several pole P cooling fins are vertically arranged, make the N
Polar wind road is independent and vertical with P polar wind road.
Further, the semiconductor full heat recovery device further includes DC power supply, the N of several semiconductor chilling plates
Pole-face is connected in parallel to the cathode of the DC power supply, and the P pole-face of several semiconductor chilling plates is connected in parallel to DC power supply
Anode.
Further, the semiconductor full heat recovery device further includes DC power supply, the N of several semiconductor chilling plates
Pole-face is connected in parallel to the anode of the DC power supply, and the P pole-face of several semiconductor chilling plates is connected in parallel to DC power supply
Cathode.
Fresh air ventilator, including cabinet, exhaust blower, pressure fan, cabinet is interior to be equipped with supply air duct and wind output channel, the row
Blower is located at the exit of the wind output channel, and the pressure fan is located at the exit of the supply air duct, the fresh-air ventilation
Machine includes described in any item semiconductor full heat recovery devices as above, and fresh air enters in the supply air duct, through the semiconductor
After full heat recovery device cooling or heating, it is sent into through the pressure fan indoor；Indoor exhaust air is filled through the semiconductor total heat recovery
After setting heating or cooling, outdoor is discharged to through the exhaust blower.
Rotary dehumidifier, including body, desiccant wheel, wet-emitting blower, circulation pressure fan, the desiccant wheel include regeneration
Area and treatment region, the desiccant wheel are mounted on the inside of the body, and the inside of the body is equipped with hydrofuge air duct, dry wind
Road, the wet-emitting blower are mounted on the outlet air end in the hydrofuge air duct, and the circulation pressure fan is mounted on the dry air duct
Outlet air end, the rotary dehumidifier further include that as above any semiconductor full heat recovery device, the full heat of the semiconductor are returned
Receiving apparatus installs the front end in the hydrofuge air duct, is heat-treated to the regeneration wind pre-add for entering the desiccant wheel, locates in advance to fresh air
Reason is sent into dry air duct removal moisture drying after cooling.
Further, the rotary dehumidifier further includes assisted heating device, and the assisted heating device is mounted on described
Between desiccant wheel and the semiconductor full heat recovery device, hydrofuge drying and processing is carried out to the desiccant wheel.
Compared with prior art, the beneficial effects of the present invention are:
(1) semiconductor full heat recovery device provided by the invention need to only exchange the electricity of semiconductor chilling plate N pole-face and P pole-face
The exchange of cold and hot operating condition can be realized in source connector, can be realized without other devices while to the function of the dual coupling of air-treatment
Can, the thermal efficiency is higher.
(2) fresh air ventilator provided by the invention has cooling hydrofuge and heating function simultaneously, passes through increase and decrease half appropriate
Conductor refrigeration unit controls the size of heating amount and refrigerating capacity；Summer using when exhaust gas heat taken out of, calorific value can be reduced,
Increase service life；Use in winter introduces high heat exchanger effectiveness maximizing reduction energy dissipation when sucking outside air.
(3) rotary dehumidifier provided by the invention, improving efficiency to the regeneration wind pre-add heat treatment for entering desiccant wheel can
The power consumption energy consumption of refrigeration host computer is reduced to part fresh air pretreatment cooling down, and there is great energy-saving effect.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects, features and advantages of the invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and cooperate attached drawing, detailed description are as follows.
Detailed description of the invention
Fig. 1 is the perspective view of one preferred embodiment of semiconductor full heat recovery device in the present invention；
Fig. 2 is the operation schematic diagram of semiconductor full heat recovery device in the present invention；
Fig. 3 is the power supply wiring schematic diagram of semiconductor full heat recovery device in the present invention；
Fig. 4 is the main view of fresh air ventilator in the present invention；
Fig. 5 is the top view of fresh air ventilator in the present invention；
Fig. 6 is the structural schematic diagram of rotary dehumidifier in the present invention.
In figure: 100, semiconductor full heat recovery device；110, semiconductor chilling plate；111, N pole-face；112, P pole-face；120,
The pole N radiating piece；121, the pole N cooling fin；122, the pole N baffle；130, the pole P radiating piece；131, the pole P cooling fin；132, the pole P baffle；
140, N polar wind road；150, P polar wind road；160, DC power supply；161, heat-insulated filler；200, fresh air ventilator；210, indoor
Pressure fan；220, exhaust blower；230, cabinet；231, fresh air inlet；232, indoor air outlet；233, indoor exhaust air import；234,
Wind exhausting outlet；240, drip tray is condensed；300, rotary dehumidifier；310, body；311, air inlet valve is regenerated；312, heat recovery fresh air
Valve；313, indoor return air valve；314, main new air-valve；320, desiccant wheel；330, wet-emitting blower；340, pressure fan is recycled；350,
Surface air cooler；360, air filter；370, assisted heating device.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
It should be noted that it can be directly on another component when component is referred to as " being fixed on " another component
Or there may also be components placed in the middle.When a component is considered as " connection " another component, it, which can be, is directly connected to
To another component or it may be simultaneously present component placed in the middle.When a component is considered as " being set to " another component, it
It can be and be set up directly on another component or may be simultaneously present component placed in the middle.Term as used herein is " vertical
", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Please refer to Fig. 1-6, a kind of semiconductor full heat recovery device 100 includes several semiconductor chilling plates 110, several poles N
Radiating piece 120, several poles P radiating piece 130, DC power supply 160.
Each semiconductor chilling plate 110 is equipped with N pole-face 111 and P pole-face 112.Several semiconductor chilling plates 110 simultaneously discharge
It sets, putting in order is the N pole-face 111 of two neighboring semiconductor chilling plate 110 and N pole-face 111 is opposite or P pole-face 112 and P
Pole-face 112 is opposite.The N pole-face 111 of each semiconductor chilling plate 110 is fixedly installed with the pole N radiating piece 120, each semiconductor system
Cold 110 P pole-face 112 is fixedly installed with the pole P radiating piece 130.
When the N pole-face 111 of the N pole-face 111 of one semiconductor chilling plate 110 and adjacent semiconductor chilling plate 110 is opposite,
It is connected between two opposite semiconductor chilling plates 110 of N pole-face 111 by the pole N radiating piece 120；One semiconductor chilling plate 110
P pole-face 112 and another adjacent semiconductor cooling piece 110 P pole-face 112 it is opposite, two opposite semiconductors of P pole-face 112
It is connected between cooling piece 110 by the pole P radiating piece 130.
Each pole N radiating piece 120 include 121, two pole N baffles 122 of several poles N cooling fin, the two of the pole N cooling fin 121
End is fixedly installed in the N pole-face 111 for two semiconductor chilling plates 110 being oppositely arranged by fastening screw.Positioned at the pole N of end
Cooling fin 121 only has one end to be fixedly mounted on the N pole-face 111 of semiconductor chilling plate 110.Preferably, several poles N cooling fin
121 parallel installations, two pole N baffles 122 are parallel with the pole N cooling fin 121, and the both ends of the pole N baffle 122 are fixedly installed in relatively
The end of the N pole-face 111 for two semiconductor chilling plates 110 being arranged.Several N polar winds road is formed between several poles N cooling fin 121
140.Preferably, the pole N baffle 122 and the pole P baffle 132 are the non-conductive thermal baffle of insulation.
Each pole P radiating piece 130 include 131, two pole P baffles 132 of several poles P cooling fin, the two of the pole P cooling fin 131
End is fixedly installed in the P pole-face 112 for two semiconductor chilling plates 110 being oppositely arranged by fastening screw.Positioned at the pole P of end
Cooling fin 131 only has one end to be fixedly mounted on the P pole-face 112 of semiconductor chilling plate 110.Preferably, several poles P cooling fin
131 parallel installations, two pole N baffles 122 are parallel with the pole N cooling fin 121, and the both ends of the pole P baffle 132 are fixedly installed in relatively
The end of the P pole-face 112 for two semiconductor chilling plates 110 being arranged.Several P polar winds road is formed between several poles P cooling fin 131
150。
Preferably, the N pole-face 111 of semiconductor chilling plate 110 and P pole-face 112 are evenly coated with heat-conducting silicone grease respectively, apply thermally conductive
The planar thickness of silicone grease is not more than 0.03mm.Semiconductor chilling plate 110 is fixedly mounted on heat dissipation with fastening bolt again after coating
Among piece, it is in close contact two surfaces of semiconductor chilling plate 110 and cooling fin, guarantee is cold and hot to be efficiently transmitted to cooling fin
On.In addition, in addition to interlayer has a semiconductor chilling plate 110 between the pole N radiating piece 120 and the pole P radiating piece 130, complementary space with every
Hot filler 161 is filled, and thickness is in 25~30mm.
The orientation of several poles N cooling fin 121 is vertical with the orientation of several poles P cooling fin 131, makes N polar wind road
140 is vertical with P polar wind road 150 and independent.In the present embodiment, the transversely arranged setting of several poles N cooling fin 121, several P extremely dissipate
The setting of 131 vertical array of backing.In other embodiments, cooling fin 121 vertical array in several poles N is arranged, several poles P cooling fin
131 transversely arranged settings form two mutually indepedent non-interference closed air ducts.
The N pole-face 111 of several semiconductor chilling plates 110 is connected in parallel to the cathode of DC power supply 160, several semiconductor refrigeratings
The P pole-face 112 of piece 110 is connected in parallel to the anode of DC power supply 160.At this point, P pole-face 112 heats, N pole-face 111 freezes.
When the N pole-face 111 of several semiconductor chilling plates 110 is connected in parallel to the anode of DC power supply 160, if dry semiconductor system
When cold 110 P pole-face 112 is connected in parallel to the cathode of DC power supply 160, P pole-face 112 freezes, and N pole-face 111 heats.Semiconductor
Cooling piece 110 must not be passed through backward voltage at work moment, and backward voltage must can be passed through after five to ten minutes.
In addition, in order to improve the service life of semiconductor chilling plate 110, it should be to the surrounding of semiconductor chilling plate 110 before use
Exposed parts carry out curing process.Curing method is equably coated in cooling assembly surrounding P/N element with 706 single group curing rubbers
On, the rubber twenty four hours spontaneous curing applied, be creamy white flexible solid after solidification.Cured purpose is to make to freeze
Component galvanic couple is completely isolated with outside air, serves moisture-proof, and the cooling assembly service life can be improved.
Semiconductor full heat recovery device 100 provided by the invention need to exchange the N pole-face 111 and P of semiconductor chilling plate 110
The exchange of cold and hot operating condition can be realized in the power connection of pole-face 112, can be realized without other devices while double to air-treatment
The function of coupling again, the thermal efficiency are higher.Furthermore, it is possible to which the quantity of the work by increase and decrease semiconductor chilling plate 110, change are partly led
The working efficiency of the heating refrigeration of body full heat recovery device 100.
The invention also discloses a kind of fresh air ventilators 200, including cabinet 230, semiconductor full heat recovery device 100, row
Blower 220, indoor blower 210.Supply air duct and wind output channel are equipped in cabinet 230, cabinet 230 is equipped with fresh air inlet
231, indoor air outlet 232, indoor exhaust air import 233, wind exhausting outlet 234, fresh air inlet 231, indoor air outlet 232, which are located at, to be sent
The both ends in wind air duct, indoor exhaust air import 233, wind exhausting outlet 234 are located at the both ends of wind output channel, and exhaust blower 220 is located at air draft
It exports at 234, indoor blower 210 is located at indoor air outlet 232, the N polar wind road 140 of semiconductor full heat recovery device 100
It is connected to supply air duct, P polar wind road 150 is connected to wind output channel.
In addition, 200 built-in temperature of fresh air ventilator perception probe, can pass through increase and decrease half appropriate according to indoor and outdoor temperature
The working quantity of conductor cooling piece 110 adjusts the size of heating amount and refrigerating capacity in real time.In addition, also equipped with humidity perceptron,
When indoor humidity is more than preset value, will automatic increase and decrease semiconductor chilling plate 110 appropriate working quantity, control refrigeration remove
Wet power.Multistorey strainer mesh built in indoor air outlet 232, the air pollutants such as filtering formaldehyde, dust, PM2.5.Fresh air ventilator
200 also condense drip tray 240, and condensation drip tray 240 installs the lower section of semiconductor full heat recovery device 100, plays storage and row
The effect of condensed water.The driving device of fresh air ventilator 200 use completely new DC steromotor, energy consumption reduce by 50%, and
And calorific value can be reduced, increase service life.Use in winter sucks high heat exchanger effectiveness maximizing when outside air and reduces energy
Amount consume.
For fresh air ventilator 200 in summer operation, the P pole-face 112 of semiconductor chilling plate 110 connects DC power supply 160
Anode, N pole-face 111 connect the cathode of DC power supply 160, and fresh air enters in supply air duct through fresh air inlet 231, through N polar wind road
After 140 cool-down dehumidifications, interior is sent into through indoor blower 210；Indoor exhaust air enters wind output channel through indoor exhaust air import 233,
After the heating of P polar wind road 150, indoor exhaust air takes away heat and is discharged to outdoor through exhaust blower 220.
When fresh air ventilator 200 works in winter, the P pole-face 112 of semiconductor chilling plate 110 connects DC power supply 160
Cathode, N pole-face 111 connect the anode of DC power supply 160, and fresh air enters in supply air duct through fresh air inlet 231, through N polar wind road
After 140 heating, interior is sent into through indoor blower 210；Indoor exhaust air enters wind output channel through indoor exhaust air import 233, through the pole P
After air duct 150 cools down, indoor exhaust air is discharged to outdoor through exhaust blower 220.
Fresh air ventilator 200 provided by the invention has cooling hydrofuge and heating function simultaneously, passes through increase and decrease half appropriate
110 working quantity of conductor cooling piece controls the size of heating amount and refrigerating capacity；Summer using when exhaust gas heat taken out of, can drop
Lower calorific value increases service life；Use in winter introduces high heat exchanger effectiveness maximizing reduction energy when sucking outside air
Consume.
The invention also discloses a kind of rotary dehumidifier 300, including body 310, desiccant wheel 320, wet-emitting blower 330,
Recycle pressure fan 340, semiconductor full heat recovery device 100, surface air cooler 350, air filter 360, assisted heating device 370.
Desiccant wheel 320 is mounted in body 310, and desiccant wheel 320 includes renewing zone and treatment region, is set in body 310
There are hydrofuge air duct, dry air duct, 320 part of desiccant wheel in hydrofuge air duct is renewing zone, in dry air duct
320 part of desiccant wheel is treatment region.The dehumidification process of desiccant wheel 320 is substantially the process of water transport, will be moist empty
Moisture in gas is transferred to regeneration wind by runner, and so then requiring regeneration wind is the air of high temperature.
Wet-emitting blower 330 is mounted on the outlet air end in hydrofuge air duct, and surface air cooler 350, air filter 360 are mounted on dry wind
In road, circulation pressure fan 340 is mounted on the outlet air end in dry air duct, and it is new that body 310 is equipped with regeneration air inlet valve 311, recuperation of heat
Air-valve 312, indoor return air valve 313, main new air-valve 314.Preferably, main new air-valve 314 is mounted on the front end of surface air cooler 350.
Semiconductor full heat recovery device 100 is installed in hydrofuge air duct, and is located at the front of desiccant wheel 320, regeneration air inlet
Valve 311 is mounted on the front end in P polar wind road 150, and heat recovery fresh air valve 312, indoor return air valve 313 are mounted on N polar wind road 140 side by side
Front end.N polar wind road 140 is connect by thermal insulation wind pipe with surface air cooler 350.The connection of P pole-face 112 of semiconductor chilling plate 110 is just
Pole, N pole-face 111 connect cathode.It regenerates wind and enters desiccant wheel 320 by the heating of P polar wind road 150 through regeneration air inlet valve 311
Then renewing zone is discharged through wet-emitting blower 330.Fresh air or indoor return air are sent into dry after the pretreatment of N polar wind road 140 cools
Dry air duct removal moisture drying.
Preferably, assisted heating device 370 is installed between semiconductor full heat recovery device 100 and desiccant wheel 320,
When desiccant wheel 320 needs excessively high high temperature air, further auxiliary heating regenerates wind to assisted heating device 370, meets again
Raw wind high temperature demands.Assisted heating device 370 can be electric heater, hot-water heater or steam coil heater.
The workflow of rotary dehumidifier 300 is: regeneration wind enters semiconductor full heat recovery device through regeneration air inlet valve 311
100, it is heated by P polar wind road 150, then assist heating through assisted heating device 370, provides high temperature regeneration for desiccant wheel 320
The renewing zone of wind, desiccant wheel 320 is regenerated through high temperature air；When summer, indoor return air valve 313 is closed, part fresh air is returned through heat
It receives new air-valve 312 and enters after the pretreatment of N polar wind road 140 cools and through thermal insulation wind pipe enter surface air cooler 350, and through main new air-valve
The 314 main fresh air mixing entered further cool through surface air cooler 350, then filter out pollutant through air filter 360, pass through
Pressure fan 340 is recycled after the dehumidifying of 320 treatment region of desiccant wheel and is sent into interior, and desiccant wheel 320 goes to regeneration after absorbing moisture
Area's regeneration.When winter, heat recovery fresh air valve 312 is closed, indoor return air enters N polar wind road 140 through indoor return air valve 313 and pre-processes
Enter surface air cooler 350 through thermal insulation wind pipe after cooling, mixes with the main fresh air entered through main new air-valve 314 through surface air cooler 350
It further cools, then filters out pollutant through air filter 360, through recycling after the dehumidifying of 320 treatment region of desiccant wheel
Pressure fan 340 is sent into interior.
In addition, the also mountable post heating device of rotary dehumidifier 300, post heating device is mounted on circulation pressure fan 340
Front, when rotary dehumidifier 300 works in winter, the air after dehumidifying after post heating device heats, then through recycle pressure fan
340 are sent into interior.
Rotary dehumidifier 300 provided by the invention, using semiconductor full heat recovery device 100 to desiccant wheel 320 again
Raw area's heating hydrofuge processing improves work efficiency, and reduces electric heating amount, saves the consumption of system energy；Semiconductor is entirely warm
100 pairs of part fresh air pretreatment cooling downs of recyclable device reduce the power consumption energy consumption of refrigeration host computer, have great energy-saving effect.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. semiconductor full heat recovery device, including several semiconductor chilling plates, it is characterised in that: further include several poles N radiating piece,
Several poles P radiating piece, each semiconductor chilling plate are equipped with N pole-face and P pole-face, and the pole N radiating piece is fixedly mounted on institute
The N pole-face of semiconductor chilling plate is stated, the pole P radiating piece is fixedly mounted on the P pole-face of the semiconductor chilling plate；
The N pole-face of one semiconductor chilling plate is opposite with the N pole-face of the adjacent semiconductor chilling plate, N pole-face it is opposite two
It is connected between a semiconductor chilling plate by the pole a N radiating piece；The P pole-face of one semiconductor chilling plate with it is another
The P pole-face of the adjacent semiconductor chilling plate is opposite, by described in one between two opposite semiconductor chilling plates of P pole-face
The connection of the pole P radiating piece.
2. semiconductor full heat recovery device as described in claim 1, it is characterised in that: if each pole N radiating piece includes
The dry pole N cooling fin, the both ends of each pole N cooling fin are fixedly mounted on the N pole-face for the semiconductor chilling plate that two are oppositely arranged,
Several N polar winds road is formed between several pole N cooling fins；The each pole P radiating piece includes several poles P cooling fin, each P
The both ends of pole cooling fin are fixedly mounted on the P pole-face for the semiconductor chilling plate that two are oppositely arranged, several pole P cooling fins
Between form several P polar winds road.
3. semiconductor full heat recovery device as claimed in claim 2, it is characterised in that: each pole N radiating piece further includes N
Pole baffle, several pole N cooling fins are installed in parallel, and the pole N baffle is fixedly mounted on the N pole-face of the semiconductor chilling plate
Both ends；The each pole P radiating piece further includes the pole P baffle, and the pole P cooling fin is installed in parallel, and the pole P baffle is fixedly mounted
At the P pole-face both ends of the semiconductor chilling plate.
4. semiconductor full heat recovery device as claimed in claim 3, it is characterised in that: the N pole-face of the semiconductor chilling plate
It is evenly coated with heat-conducting silicone grease respectively with P pole-face, is in close contact the N pole-face, P pole-face and the pole N cooling fin, the pole P cooling fin.
5. semiconductor full heat recovery device as claimed in claim 4, it is characterised in that: several pole N cooling fins are laterally set
It sets, several pole P cooling fins are vertically arranged, keep N polar wind road independent and vertical with P polar wind road.
6. semiconductor full heat recovery device as described in claim 1, it is characterised in that: the semiconductor full heat recovery device is also
Including DC power supply, the N pole-face of several semiconductor chilling plates is connected in parallel to the cathode of the DC power supply, and several described half
The P pole-face of conductor cooling piece is connected in parallel to the anode of DC power supply.
7. semiconductor full heat recovery device as described in claim 1, it is characterised in that: the semiconductor full heat recovery device is also
Including DC power supply, the N pole-face of several semiconductor chilling plates is connected in parallel to the anode of the DC power supply, and several described half
The P pole-face of conductor cooling piece is connected in parallel to the cathode of DC power supply.
8. fresh air ventilator, including cabinet, exhaust blower, pressure fan, cabinet is interior to be equipped with supply air duct and wind output channel, the air draft
Machine is located at the exit of the wind output channel, and the pressure fan is located at the exit of the supply air duct,
It is characterized by: the fresh air ventilator includes semiconductor total heat recovery dress as described in any one of claim 1 to 7
It sets, fresh air enters in the supply air duct, after the semiconductor full heat recovery device cools down or heats up, send through the pressure fan
Enter interior；Indoor exhaust air is discharged to outdoor after the semiconductor full heat recovery device heats up or cools down, through the exhaust blower.
9. rotary dehumidifier, including body, desiccant wheel, wet-emitting blower, circulation pressure fan, the desiccant wheel includes renewing zone
And treatment region, the desiccant wheel are mounted on the inside of the body, the inside of the body is equipped with hydrofuge air duct, dry wind
Road, the wet-emitting blower are mounted on the outlet air end in the hydrofuge air duct, and the circulation pressure fan is mounted on the dry air duct
Outlet air end,
It is characterized by: the rotary dehumidifier further includes the semiconductor total heat recovery dress as described in claim 1 to 7 is any
It sets, the semiconductor full heat recovery device installs the front end in the hydrofuge air duct, pre- to the regeneration wind for entering the desiccant wheel
Dry air duct removal moisture drying is sent into heat treatment after cooling to fresh air pretreatment.
10. rotary dehumidifier as claimed in claim 9, it is characterised in that: the rotary dehumidifier further includes auxiliary heating dress
It sets, the assisted heating device is mounted between the desiccant wheel and the semiconductor full heat recovery device, to the dehumidifying
Runner carries out hydrofuge drying and processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811456919.6A CN109798649A (en) | 2018-11-30 | 2018-11-30 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811456919.6A CN109798649A (en) | 2018-11-30 | 2018-11-30 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109798649A true CN109798649A (en) | 2019-05-24 |
Family
ID=66556390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811456919.6A Pending CN109798649A (en) | 2018-11-30 | 2018-11-30 | Semiconductor full heat recovery device, fresh air ventilator and rotary dehumidifier |
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| Country | Link |
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| CN (1) | CN109798649A (en) |
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| CN112169554A (en) * | 2020-11-04 | 2021-01-05 | 珠海科域生物工程股份有限公司 | Rotating wheel dehumidification device for medical test paper and storage system |
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| CN113038804A (en) * | 2021-03-25 | 2021-06-25 | 江苏中科新源半导体科技有限公司 | Fresh air cooling and heat exchanging system based on semiconductor refrigerating sheet |
| CN114521795A (en) * | 2022-02-08 | 2022-05-24 | 普沃思环保科技无锡有限公司 | Storage chamber with dehumidification drying function |
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