CN217307058U

CN217307058U - Low-voltage switch cabinet

Info

Publication number: CN217307058U
Application number: CN202221185206.2U
Authority: CN
Inventors: 朱秀磊
Original assignee: Zhejiang Qipeng Electric Co Ltd
Current assignee: Zhejiang Qipeng Electric Co Ltd
Priority date: 2022-05-17
Filing date: 2022-05-17
Publication date: 2022-08-26
Anticipated expiration: 2032-05-17

Abstract

The utility model discloses a low-voltage switch cabinet, which adopts the technical proposal that the cabinet body is provided with a dehumidifying box at the top, a clapboard is arranged in the dehumidifying box, the clapboard divides the interior of the dehumidifying box into a drying cavity and a gas storage cavity, and the gas storage cavity is positioned above the drying cavity; a pair of condensation plates with through holes are arranged in the drying cavity, the pair of condensation plates are obliquely arranged, and a semiconductor refrigeration sheet assembly is arranged on the condensation plates; air inlets are also formed in the two sides of the drying cavity, air inlet fans are arranged on the air inlets, and the air inlet fans are used for blowing airflow to the condensing plate; an air pipe is arranged between the air storage cavity and the cabinet body, and a cooling fan used for sending air in the air storage cavity into the cabinet body is arranged in the air pipe; the bottom of the cabinet body is also provided with an air outlet for exhausting air; the dehumidifying box can dry air entering the cabinet body, so that the humidity in the cabinet body is reduced, and the damage caused by the contact of water vapor and electrical elements is avoided; meanwhile, the efficiency is higher, and the workload of workers is reduced.

Description

Low-voltage switch cabinet

Technical Field

The utility model relates to a cubical switchboard technical field, concretely relates to low-voltage switchgear.

Background

The low-voltage switch cabinet is suitable for industries such as power plants, petroleum, chemical industry, metallurgy, textile, high-rise buildings and the like, is used for power transmission, distribution and electric energy conversion, and meets the standard regulation of GB7251.1-2013 low-voltage complete switch equipment (IDT IEC60439-11999), and belongs to products listed in 3C certification mandatory certification products catalog.

The traditional low-voltage switch cabinet has a simple internal structure and does not have a dehumidification mechanism; when the humidity of the external environment is too high, moisture easily enters the cabinet body to cause the electrical elements to be damp and short-circuited, so that the safety is affected and the service life of the switch cabinet is prolonged; meanwhile, in the conventional dehumidification method in the prior art, moisture is usually absorbed through absorbent cotton or activated carbon and the like, so that the moisture absorption efficiency is low, workers need to be frequently replaced, and the workload of the workers is increased.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem, the utility model provides a low-voltage switch cabinet can carry out drying and dehumidification to the air in the entering switch cabinet through the condensing plate to avoid external moisture to get into the internal messenger electric element of cabinet and wet the short circuit, influence the use of cubical switchboard.

In order to realize the purpose, the utility model adopts the technical scheme that: a low-voltage switch cabinet comprises a cabinet body and is characterized in that a dehumidifying box is arranged at the top of the cabinet body, a partition plate is arranged in the dehumidifying box, the partition plate divides the interior of the dehumidifying box into a drying cavity and a gas storage cavity, and the gas storage cavity is positioned above the drying cavity; a pair of condensation plates with through holes are arranged in the drying cavity, the pair of condensation plates are obliquely arranged, a transfer cavity communicated with the gas storage cavity is formed between the pair of condensation plates, and a semiconductor refrigerating sheet assembly is arranged on the condensation plates; air inlets are further formed in the two sides of the drying cavity, air inlet fans are arranged on the air inlets, and the air inlet fans are used for blowing airflow to the condensing plate; an air pipe is arranged between the air storage cavity and the cabinet body, and a cooling fan used for sending air in the air storage cavity into the cabinet body is arranged in the air pipe; the bottom of the cabinet body is also provided with an air outlet for exhausting air.

The utility model is further provided with a heat dissipation plate with a through hole is arranged in the cabinet body, and a heat dissipation cavity is formed between the heat dissipation plate and the inner wall of the cabinet body; the bottom surface of the drying cavity is provided with a water drainage groove, the water drainage groove is obliquely arranged and the high end of the water drainage groove is positioned below the condensing plate, the low end of the water drainage groove is provided with a water drainage pipe, the water drainage pipe is communicated with the heat dissipation cavity, the end, positioned on the heat dissipation cavity, of the water drainage pipe is connected with a cooling pipe which is attached to the heat dissipation cavity, and the cooling pipe is connected with a water storage box.

The utility model discloses still further set up as, semiconductor refrigeration piece subassembly includes semiconductor refrigeration piece and heat dissipation case, the cold junction and the condensing plate surface laminating of semiconductor refrigeration piece, the hot junction sets up in the heat dissipation case, be provided with a plurality of thermovents on the heat dissipation case, the thermovent is used for dispelling the heat to semiconductor refrigeration piece hot junction; an air duct communicated with the cabinet body is further arranged in the heat dissipation box, one end, located at the heat dissipation box, of the air duct is rotatably connected with a temperature control fan, and the temperature control fan is connected with a rotating motor; and a temperature sensor for controlling the positive and negative rotation of the rotating motor is also arranged in the cabinet body.

The utility model discloses still further set up to, the gas storage intracavity is provided with the dust removal net of vertical setting.

The utility model discloses still further set up to, be provided with the moisture absorption board in the gas storage chamber.

To sum up, the utility model has the advantages that:

1. compared with the prior art, the utility model has the advantages that the dehumidification box is arranged at the top, so that the air passing through the cabinet body is dried, and the problem that the humidity in the cabinet body is too high, so that the internal electric elements are affected by damp and short circuit to affect the service life of the switch cabinet is avoided; the air through getting into the cabinet is internal dehumidifies through the condensation plate of connecting the semiconductor refrigeration piece subassembly, when the air current contacted with the condensation plate, can make the steam condensation in the air become water attached to the condensation plate to carry out the drying to the air, compare with this kind of adsorption method of current adoption moisture absorption cotton or active carbon, utility model's dehumidification efficiency of itself is higher, has reduced staff's work load simultaneously.

2. The hot end of the semiconductor refrigeration piece is positioned in the heat dissipation box, the heat dissipation box is internally provided with an air duct communicated with the interior of the cabinet body, the air duct is internally provided with a temperature control fan for controlling the wind direction through a rotating motor, and the wind direction of the temperature control fan blows the wind in the cabinet body to the heat dissipation box in a daily state, so that the heat dissipation of the cabinet body is accelerated, and the hot end of the semiconductor refrigeration piece can be cooled; when the temperature in winter or the ambient temperature is low, the internal temperature of the cabinet is too low, the sensitivity of part of electrical equipment can be influenced, and at the moment, the temperature sensor controls the wind direction of the temperature control fan to change, so that the airflow blows the cabinet from the heat dissipation box, and the heat generated by the hot end of the semiconductor refrigeration sheet is sent to the cabinet body, so that the internal temperature of the cabinet is improved, and the normal use of the equipment is ensured.

Drawings

Fig. 1 is an external view schematically showing the present embodiment.

Fig. 2 is a front sectional view of the present embodiment.

Fig. 3 is a side sectional view of the present embodiment.

Reference numerals: 1-a cabinet body; 2-a dehumidification box; 201-a separator; 202-a drying chamber; 203-gas storage cavity; 204-condensation plates; 205-a transit chamber; 206-air intake fan; 207-air duct; 208-a heat dissipation fan; 3-a semiconductor cooling fin assembly; 301-semiconductor chilling plates; 302-a heat dissipation box; 303-heat dissipation port; 304-an airway; 305-a temperature controlled fan; 306-a temperature sensor; 4, air outlet; 5-a heat sink; 6-heat dissipation cavity; 7-a drainage tank; 8-a drain pipe; 9-a cooling pipe; 10-a water storage tank; 11-a dust removal net; 12-moisture absorption board.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1-3, the embodiment discloses a low-voltage switch cabinet, which includes a cabinet body 1, a dehumidification box 2 is arranged at the top of the cabinet body 1, a partition plate 201 is arranged in the dehumidification box 2, the partition plate 201 divides the interior of the dehumidification box 2 into a drying cavity 202 and an air storage cavity 203, and the air storage cavity 203 is located above the drying cavity 202; a pair of condensation plates 204 with through holes are arranged in the drying cavity 202, the pair of condensation plates 204 are obliquely arranged, a transfer cavity 205 communicated with the gas storage cavity 203 is formed between the pair of condensation plates 204, and a semiconductor chilling plate assembly 3 is arranged on the condensation plates 204; air inlets are further formed in two sides of the drying cavity 202, air inlet fans 206 are arranged on the air inlets, and the air inlet fans 206 are used for blowing air flow to the condensing plate 204; an air pipe 207 is arranged between the air storage cavity 203 and the cabinet body 1, and a heat radiation fan 208 for sending air in the air storage cavity 203 to the cabinet body 1 is arranged in the air pipe 207; the bottom of the cabinet body 1 is also provided with an air outlet 4 for exhausting air.

In the cabinet body, the air inlet fan 206 and the semiconductor refrigeration sheet 301 adopt the same power supply, and when the cabinet body is in a working state, the semiconductor refrigeration sheet 301 and the air inlet fan 206 are always in the working state; the air inlet fan 206 sends outside air into the drying cavity 202 in the dehumidifying box 2, the air in the drying cavity 202 can contact with the condensing plate 204 in the process of entering the air storage cavity 203, the condensing plate 204 is connected with the cold end of the semiconductor refrigerating sheet 301, and therefore the air can be always in a low-temperature state, and when the air enters the air storage cavity 203 through the through hole in the condensing plate 204, moisture in the air can be condensed and attached to one side, facing the drying cavity 202, of the condensing plate 204 and can enter the water storage box 10 through the water drainage groove 7; thereby reducing the damage of the water vapor entering the cabinet body 1 to the electric elements in the cabinet body 1; meanwhile, the moist condensation plate 204 can adhere to dust in the air, so that the dust entering the cabinet body 1 is reduced; and the air that gets into in the air storage chamber 203 can get into through tuber pipe 207 and radiator fan 208 and be sent to in the cabinet body 1 to cool down the air in the cabinet body 1, hot-air is then sent to the external world through air outlet 4, finally realizes the heat dissipation to in the cabinet body 1.

As shown in fig. 2, a heat dissipation plate 5 with a through hole is arranged in the cabinet body 1, and a heat dissipation cavity 6 is formed between the heat dissipation plate 5 and the inner wall of the cabinet body 1; the bottom surface of the drying cavity 202 is provided with a drainage groove 7, the drainage groove 7 is obliquely arranged, the higher end of the drainage groove 7 is positioned below the condensation plate 204, the lower end of the drainage groove is provided with a drainage pipe 8, the drainage pipe 8 is communicated with the heat dissipation cavity 6 and the drying cavity 202, one end of the drainage pipe positioned in the heat dissipation cavity 6 is connected with a cooling pipe 9 attached to the heat dissipation cavity 6, and the cooling pipe 9 is connected with a water storage tank 10; the heat dissipation in the cabinet body can be accelerated through the heat dissipation plate, the heat accumulation in the cabinet body is avoided, and meanwhile, the heat dissipation efficiency of the heat dissipation plate can be accelerated through water entering the cooling pipe through the drainage groove; and the storage water tank can collect the water that condenses, avoids polluting the surrounding environment.

In this embodiment, the semiconductor chilling plate assembly 3 includes a semiconductor chilling plate 301 and a heat dissipation box 302, the cold end of the semiconductor chilling plate 301 is attached to the surface of the condensation plate 204, the hot end of the semiconductor chilling plate is arranged in the heat dissipation box 302, the heat dissipation box 302 is provided with a plurality of heat dissipation ports 303, and the heat dissipation ports 303 are used for dissipating heat of the hot end of the semiconductor chilling plate 301; an air duct 304 communicated with the inside of the cabinet body 1 is further arranged in the heat dissipation box 302, one end of the air duct 304, which is positioned in the heat dissipation box 302, is rotatably connected with a temperature control fan 305, and the temperature control fan 305 is connected with a rotating motor; a temperature sensor 306 for controlling the positive and negative rotation of the rotating motor is also arranged in the cabinet body 1;

the rotating motor is a servo motor, when the rotating motor is used in daily life, the servo motor does not rotate, and the temperature control fan 305 discharges the air in the cabinet body 1 to the outside, so that the air circulation in the cabinet body 1 is accelerated, the heat dissipation efficiency is improved, and meanwhile, the heat dissipation can be performed on the hot end of the semiconductor refrigeration sheet 301; when the external temperature is too low, the temperature sensor 306 sends a signal to the servo motor, the servo motor controls the temperature control fan 305 to rotate, so that the wind direction of the temperature control fan 305 is changed, air heated by the hot end of the semiconductor refrigeration sheet 301 is guided into the cabinet body 1, the temperature of the cabinet body 1 is increased, and the electric elements in the cabinet body 1 are ensured to be in normal environmental temperature; when the internal temperature is within the normal range, the servo motor is automatically reset so that the temperature control fan 305 is used for discharging air.

In this embodiment, a dust removal net 11 vertically arranged is arranged in the air storage cavity 203.

In this embodiment, a moisture absorption plate 12 is disposed in the air storage cavity 203.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, any modification, equivalent replacement, or improvement made within the design concept of the present invention should be included within the protection scope of the present invention.

Claims

1. A low-voltage switch cabinet comprises a cabinet body (1) and is characterized in that a dehumidifying box (2) is arranged at the top of the cabinet body (1), a partition plate (201) is arranged in the dehumidifying box (2), the dehumidifying box (2) is divided into a drying cavity (202) and an air storage cavity (203) by the partition plate (201), and the air storage cavity (203) is located above the drying cavity (202); a pair of condensation plates (204) with through holes are arranged in the drying cavity (202), the pair of condensation plates (204) are obliquely arranged, a transfer cavity (205) communicated with the gas storage cavity (203) is formed between the pair of condensation plates, and a semiconductor refrigerating sheet assembly (3) is arranged on each condensation plate (204); air inlets are further formed in two sides of the drying cavity (202), air inlet fans (206) are arranged on the air inlets, and the air inlet fans (206) are used for blowing air flow to the condensing plate (204); an air pipe (207) is arranged between the air storage cavity (203) and the cabinet body (1), and a heat radiation fan (208) used for sending air in the air storage cavity (203) into the cabinet body (1) is arranged in the air pipe (207); the bottom of the cabinet body (1) is also provided with an air outlet (4) for exhausting air.

2. The low-voltage switch cabinet according to claim 1, characterized in that a heat dissipation plate (5) with through holes is arranged in the cabinet body (1), and a heat dissipation cavity (6) is formed between the heat dissipation plate (5) and the inner wall of the cabinet body (1); drying chamber (202) bottom surface is provided with water drainage tank (7), water drainage tank (7) slant sets up and high one end is located condenser plate (204) below, and the one end of low is provided with drain pipe (8), drain pipe (8) intercommunication heat dissipation chamber (6) and drying chamber (202) and its one end that is located heat dissipation chamber (6) are connected with cooling tube (9) of laminating mutually with heating panel (5), cooling tube (9) are connected with water storage box (10).

3. The low-voltage switch cabinet according to claim 1, wherein the semiconductor refrigerating sheet assembly (3) comprises a semiconductor refrigerating sheet (301) and a heat dissipation box (302), the cold end of the semiconductor refrigerating sheet (301) is attached to the surface of the condensing plate (204), the hot end of the semiconductor refrigerating sheet is arranged in the heat dissipation box (302), a plurality of heat dissipation ports (303) are arranged on the heat dissipation box (302), and the heat dissipation ports (303) are used for dissipating heat of the hot end of the semiconductor refrigerating sheet (301); an air duct (304) communicated with the inside of the cabinet body (1) is further arranged in the heat dissipation box (302), one end, located at the heat dissipation box (302), of the air duct (304) is rotatably connected with a temperature control fan (305), and the temperature control fan (305) is connected with a rotating motor; and a temperature sensor (306) for controlling the positive and negative rotation of the rotating motor is also arranged in the cabinet body (1).

4. The low-voltage switchgear cabinet according to claim 1, wherein a dust removing net (11) is vertically arranged in the gas storage chamber (203).

5. Low-voltage switchgear cabinet according to claim 1, characterized in that a moisture absorption plate (12) is arranged in the gas storage chamber (203).