CN209863491U - Novel intelligent oven - Google Patents

Novel intelligent oven Download PDF

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Publication number
CN209863491U
CN209863491U CN201920154325.3U CN201920154325U CN209863491U CN 209863491 U CN209863491 U CN 209863491U CN 201920154325 U CN201920154325 U CN 201920154325U CN 209863491 U CN209863491 U CN 209863491U
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CN
China
Prior art keywords
cold
oven
heat insulation
oven body
air channel
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Active
Application number
CN201920154325.3U
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Chinese (zh)
Inventor
刘买花
杨小萍
郭新
易焕银
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Zhongshan Josoo Electric Appliance Co ltd
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Guangdong Communications Polytechnic
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Priority to CN201920154325.3U priority Critical patent/CN209863491U/en
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Publication of CN209863491U publication Critical patent/CN209863491U/en
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  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The application discloses a novel intelligent oven, which is provided with a cold air channel and a hot air channel, a semiconductor refrigeration piece is arranged between the cold air channel and the hot air channel, when food in the oven body needs to be refrigerated, the heat insulation valve is opened, the fan blows air to the semiconductor refrigeration sheet, generated cold air enters the cavity of the oven body from the refrigeration air inlet to refrigerate and keep fresh the food, the cold air enters the cold air channel from the refrigeration air outlet and is discharged from the cold end air outlet communicated with the cold air channel, when the food in the oven body is heated, the heat insulation valve is closed, the cold storage air inlet is sealed by the heat insulation valve, the fan blows air to the semiconductor refrigeration sheet, the generated cold air is blown through the cold air channel, the camera in the cold wind passageway cools off, then discharges from the cold junction air outlet, can reach the food of treating the heating in compromise cold storage oven and reduce the purpose of camera temperature when heating.

Description

Novel intelligent oven
Technical Field
The application relates to the technical field of intelligent household appliances, in particular to a novel intelligent oven.
Background
An oven is an electric heating appliance that toasts food using radiant heat emitted by electric heating elements. The existing oven has a reserved heating function, a user can place food in the oven in advance, reserved timing heating processing is carried out on the food needing to be heated, and the intelligent degree is improved. However, when the user uses the oven to reserve the heating function, the environment inside the oven is closed, so that the food may deteriorate in the process of putting the food into the oven to wait for heating, and the health of the user may be affected. In order to solve the defect, the current scheme is to arrange a refrigeration system in an oven to refrigerate and preserve food which is put into the oven to be heated, and the food is placed to deteriorate.
In order to improve the intelligent degree of the oven, a camera is further arranged in the existing oven to monitor the environment in the oven and recognize images, but when the oven is heated, the service life of the camera and an electronic element is easily shortened due to the high temperature (even up to 300 ℃) in the oven.
Therefore, in order to compromise the food of waiting to heat in the cold-storage oven and reduce the camera temperature when the heating, provide a novel intelligence oven in this application and be used for solving above technical defect.
SUMMERY OF THE UTILITY MODEL
The application provides a novel intelligence oven can reach and compromise the food of treating the heating in the cold-stored oven and reduce the purpose of camera temperature when the heating.
The application provides a novel intelligence oven, include oven body and install be used for the control on the oven body the camera of oven body internal environment still includes:
the device comprises heat insulation cotton, heat insulation transparent glass, a cold end air outlet, a hot end air outlet, a cold air channel, a hot air channel, a semiconductor refrigerating sheet, a fan, a heat insulation valve, a refrigerating air inlet and a refrigerating air outlet;
the heat insulation cotton is fixed on the inner wall of the oven body;
the heat insulation transparent glass is fixed on the inner wall of the oven body, and the position of the heat insulation transparent glass corresponds to the shooting lens of the camera;
the cold air channel is arranged in the oven body, and the camera is arranged in the cold air channel;
the fan and the semiconductor refrigeration piece are both arranged in the oven body, and the fan is used for providing an air source for the semiconductor refrigeration piece;
the cold end air outlet is arranged on the oven body and is communicated with the cold air channel and the refrigeration air outlet;
the oven body is also internally provided with the hot air channel which is communicated with the hot end outlet on the oven body;
the semiconductor cooling effect end of the semiconductor cooling piece is positioned in the cold air channel, and the semiconductor heating effect end of the semiconductor cooling piece is positioned in the hot air channel;
the cold-stored air intake with cold-stored air outlet all sets up on the inner wall of oven body, just cold-stored air intake with cold wind passageway intercommunication, cold-stored air intake with be provided with between the cold wind passageway thermal-insulated valve.
Preferably, the method further comprises the following steps: a heat sink;
the radiator is arranged at the semiconductor heat effect end of the semiconductor refrigeration sheet.
Preferably, the heat insulation cotton is double-layer heat insulation cotton.
Preferably, the heat-insulating transparent glass is double-layer heat-insulating transparent glass.
Preferably, the method further comprises the following steps: a temperature sensor;
the temperature sensor is installed on the semiconductor refrigerating sheet.
Preferably, the method further comprises the following steps: an alarm;
the alarm is electrically connected with the temperature sensor.
Preferably, the heat insulation valve is provided with heat insulation cotton.
According to the technical scheme, the method has the following advantages:
the utility model provides a novel intelligence oven that provides in this application, include oven body and install be used for the control on the oven body the camera of oven body internal environment still includes: the device comprises heat insulation cotton, heat insulation transparent glass, a cold end air outlet, a hot end air outlet, a cold air channel, a hot air channel, a semiconductor refrigerating sheet, a fan, a heat insulation valve, a refrigerating air inlet and a refrigerating air outlet; the heat insulation cotton is fixed on the inner wall of the oven body; the heat-insulating transparent glass is fixed on the inner wall of the oven body, and the position of the heat-insulating transparent glass corresponds to the shooting lens of the camera; the cold air channel is arranged in the oven body, and a camera is arranged in the cold air channel; the fan and the semiconductor refrigeration piece are both arranged in the oven body, and the fan is used for providing an air source for the semiconductor refrigeration piece; the cold end air outlet is arranged on the oven body and is communicated with the cold air channel and the refrigeration air outlet; a hot air channel is also arranged in the oven body and is communicated with a hot end outlet on the oven body; the semiconductor cooling effect end of the semiconductor cooling plate is positioned in the cold air channel, and the semiconductor heating effect end of the semiconductor cooling plate is positioned in the hot air channel; the cold storage air inlet and the cold storage air outlet are both arranged on the inner wall of the oven body and communicated with the cold air channel, and a heat insulation valve is arranged between the cold storage air inlet and the cold air channel. The novel intelligent oven is provided with a cold air channel and a hot air channel, a semiconductor refrigerating sheet is arranged between the cold air channel and the hot air channel, when food in the oven body needs to be refrigerated, the heat insulation valve is opened, the fan blows air to the semiconductor refrigeration sheet, generated cold air enters the cavity of the oven body from the refrigeration air inlet to refrigerate and keep fresh the food, the cold air enters the cold air channel from the refrigeration air outlet and is discharged from the cold end air outlet communicated with the cold air channel, when the food in the oven body is heated, the heat insulation valve is closed, the cold storage air inlet is sealed by the heat insulation valve, the fan blows air to the semiconductor refrigeration sheet, the generated cold air is blown through the cold air channel, the camera in the cold wind passageway cools off, then discharges from the cold junction air outlet, can reach the food of treating the heating in compromise cold storage oven and reduce the purpose of camera temperature when heating.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a novel intelligent oven provided in an embodiment of the present application;
wherein the reference numerals are:
1. an oven body; 2. a food; 3. a cold end air outlet; 4. refrigerating the air outlet; 5. a cold air passage; 6. heat insulation cotton; 7. heat-insulating transparent glass; 8. a camera; 9. a hot end air outlet; 10. a hot air passage; 11. a heat insulation valve; 12. refrigerating the air inlet; 13. a semiconductor cold effect terminal; 14. a semiconductor thermal effect end; 15. a heat sink; 16. a fan; 17. an air inlet.
Detailed Description
The embodiment of the application discloses novel intelligence oven can reach the purpose of considering the food of treating the heating in the cold-stored oven and reducing the camera temperature when the heating.
Referring to fig. 1, the present application provides an embodiment of a novel intelligent oven, which includes an oven body 1 and a camera 8 installed on the oven body 1 for monitoring an internal environment of the oven body 1, and further includes:
the refrigerator comprises heat insulation cotton 6, heat insulation transparent glass 7, a cold end air outlet 3, a hot end air outlet 9, a cold air channel 5, a hot air channel 10, a semiconductor refrigeration sheet, a fan 16, a heat insulation valve 11, a refrigeration air inlet 12 and a refrigeration air outlet 4;
the heat insulation cotton 6 is fixed on the inner wall of the oven body 1;
the heat insulation transparent glass 7 is fixed on the inner wall of the oven body 1, and the position of the heat insulation transparent glass 7 is arranged corresponding to a shooting lens of the camera 8;
the cold air channel 5 is arranged in the oven body 1, and a camera 8 is arranged in the cold air channel 5;
the fan 16 and the semiconductor refrigeration piece are both arranged in the oven body 1, and the fan 16 is used for providing an air source for the semiconductor refrigeration piece;
the cold end air outlet 3 is arranged on the oven body 1 and is communicated with the cold air channel 5 and the refrigeration air outlet 4;
a hot air channel 10 is also arranged in the oven body 1, and the hot air channel 10 is communicated with a hot end outlet on the oven body 1;
the semiconductor cold effect end 13 of the semiconductor refrigeration piece is positioned in the cold air channel 5, and the semiconductor heat effect end 14 of the semiconductor refrigeration piece is positioned in the hot air channel 10;
the cold storage air inlet 12 and the cold storage air outlet 4 are both arranged on the inner wall of the oven body 1, the cold storage air inlet 12 is communicated with the cold air channel 5, and a heat insulation valve 11 is arranged between the cold storage air inlet 12 and the cold air channel 5.
It should be noted that, in the novel intelligent oven provided in the embodiment of the present application, a cold storage cooling system is formed by heat insulation cotton 6, heat insulation transparent glass 7, a cold end air outlet 3, a hot end air outlet 9, a cold air passage 5, a hot air passage 10, a semiconductor refrigeration sheet, a fan 16, a heat insulation valve 11, a cold storage air inlet 12 and a cold storage air outlet 4, the cold air passage 5 and the hot air passage 10 are arranged in the oven body 1, the semiconductor refrigeration sheet is arranged between the cold air passage 5 and the hot air passage 10, an air inlet 17 for providing an air source to the fan 16 is arranged on the oven body 1, when the food 2 in the oven body 1 needs to be refrigerated, the heat insulation valve 11 is opened, the fan 16 blows air to the semiconductor refrigeration sheet, the air provided by the fan 16 forms cold air after encountering the semiconductor cold effect end 13 of the semiconductor refrigeration sheet, and the generated cold air enters the cavity of the oven body 1 from, the effect of thermal-insulated valve 11 is similar with the single-pole double throw switch, cold-stored air outlet 4 is opened when opening, cold wind gets into cold wind passageway 5 from cold-stored air outlet 4, discharge from cold junction air outlet 3 with cold wind passageway 5 intercommunication, when heating the food in the oven body 1, thermal-insulated valve 11 closes, thermal-insulated valve 11 seals cold-stored air intake 12, fan 16 blows to the semiconductor refrigeration piece, the cold wind that produces blows from cold wind passageway 5, cool off camera 8 in the cold wind passageway 5, then discharge from cold junction air outlet 3, the heat that the semiconductor heating effect end 14 of semiconductor refrigeration piece produced passes through hot air channel 10 and is discharged by hot junction air outlet 9, can reach the food that treats heating in the cold-stored oven and reduce the purpose of camera 8 temperature when the heating, thereby camera 8 and inside electronic component's life have been prolonged.
The novel intelligent oven that provides in this application embodiment, after finishing at reservation functional state and heating food 2, the cold-stored air outlet 4 and the cold-stored air intake 12 of oven body 1 are opened, and thermal-insulated valve 11 is closed and is opened, and the cold volume that semiconductor refrigeration piece produced is sent into the oven cavity along with the wind in, carries out cold-stored fresh-keeping to food 2 in the oven. When the oven is in heating food 2 state, cold-stored air intake 12 and cold-stored air outlet 4 are closed, and thermal-insulated valve 11 is closed, and the cold volume that the semiconductor refrigeration piece produced conveys camera 8 under the drive of 16 air supplies of fan, carries out cooling treatment to camera 8, has solved current intelligent oven and can not compromise the food 2 of waiting to heat in the cold-stored oven and has reduced the technical problem of camera 8 temperature when the heating.
Further, the novel intelligent oven that provides in this application embodiment still includes: a heat sink 15;
the radiator 15 is arranged at the semiconductor heating effect end 14 of the semiconductor refrigerating sheet.
It should be noted that the semiconductor cooling plate is a heat transfer tool. The working principle is that when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through the thermocouple, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. In the embodiment of the application, set up radiator 15 and carry out the heat dissipation to semiconductor heating effect end 14 of semiconductor refrigeration piece, the difference in temperature in semiconductor refrigeration piece cold and hot end can reach 40 ~ 65 degrees usually, reduces the hot junction temperature through the radiating mode of initiative, so the cold junction temperature also can corresponding decline to reach lower temperature.
Further, the heat insulation cotton 6 is a double-layer heat insulation cotton 6.
Further, the heat-insulating transparent glass 7 is a double-layer heat-insulating transparent glass 7.
Further, still include: a temperature sensor;
the temperature sensor is installed on the semiconductor refrigerating sheet.
Further, still include: an alarm;
the alarm is electrically connected with the temperature sensor.
It should be noted that, for better protection semiconductor refrigeration piece, be provided with temperature sensor on the semiconductor refrigeration piece in this application embodiment, temperature sensor is connected with the alarm, and when the body temperature of semiconductor refrigeration piece exceeded 100 ℃, the alarm reported to the police and reminds user oven high temperature, has danger, need close oven power and stop using, avoids appearing the incident.
Further, the heat insulation valve 11 is provided with heat insulation cotton 6.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims (7)

1. The utility model provides a novel intelligent oven, includes oven body and installs be used for the control on the oven body the camera of oven body internal environment, its characterized in that still includes:
the device comprises heat insulation cotton, heat insulation transparent glass, a cold end air outlet, a hot end air outlet, a cold air channel, a hot air channel, a semiconductor refrigerating sheet, a fan, a heat insulation valve, a refrigerating air inlet and a refrigerating air outlet;
the heat insulation cotton is fixed on the inner wall of the oven body;
the heat insulation transparent glass is fixed on the inner wall of the oven body, and the position of the heat insulation transparent glass corresponds to the shooting lens of the camera;
the cold air channel is arranged in the oven body, and the camera is arranged in the cold air channel;
the fan and the semiconductor refrigeration piece are both arranged in the oven body, and the fan is used for providing an air source for the semiconductor refrigeration piece;
the cold end air outlet is arranged on the oven body and is communicated with the cold air channel and the refrigeration air outlet;
the oven body is also internally provided with the hot air channel which is communicated with the hot end outlet on the oven body;
the semiconductor cooling effect end of the semiconductor cooling piece is positioned in the cold air channel, and the semiconductor heating effect end of the semiconductor cooling piece is positioned in the hot air channel;
the cold-stored air intake with cold-stored air outlet all sets up on the inner wall of oven body, just cold-stored air intake with cold wind passageway intercommunication, cold-stored air intake with be provided with between the cold wind passageway thermal-insulated valve.
2. The new smart oven as claimed in claim 1, further comprising: a heat sink;
the radiator is arranged at the semiconductor heat effect end of the semiconductor refrigeration sheet.
3. The novel intelligent oven of claim 1, wherein the insulation wool is double-layer insulation wool.
4. The novel smart oven of claim 1 wherein said insulated clear glass is a double layer insulated clear glass.
5. The new smart oven as claimed in claim 1, further comprising: a temperature sensor;
the temperature sensor is installed on the semiconductor refrigerating sheet.
6. The novel smart oven of claim 5, further comprising: an alarm;
the alarm is electrically connected with the temperature sensor.
7. The novel intelligent oven of claim 1, wherein the heat insulation valve is provided with heat insulation cotton.
CN201920154325.3U 2019-01-29 2019-01-29 Novel intelligent oven Active CN209863491U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920154325.3U CN209863491U (en) 2019-01-29 2019-01-29 Novel intelligent oven

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920154325.3U CN209863491U (en) 2019-01-29 2019-01-29 Novel intelligent oven

Publications (1)

Publication Number Publication Date
CN209863491U true CN209863491U (en) 2019-12-31

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ID=68951948

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920154325.3U Active CN209863491U (en) 2019-01-29 2019-01-29 Novel intelligent oven

Country Status (1)

Country Link
CN (1) CN209863491U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112902233A (en) * 2021-01-25 2021-06-04 宁波方太厨具有限公司 Cooking equipment and integrated kitchen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112902233A (en) * 2021-01-25 2021-06-04 宁波方太厨具有限公司 Cooking equipment and integrated kitchen

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20221214

Address after: No. 9, Qiye North Road, Maxin Industrial Zone, Huangpu Town, Zhongshan, Guangdong 528434

Patentee after: ZHONGSHAN JOSOO ELECTRIC APPLIANCE Co.,Ltd.

Address before: No. 789, Tianyuan Road, Guangzhou, Guangdong 510650

Patentee before: GUANGDONG COMMUNICATION POLYTECHNIC

TR01 Transfer of patent right