CN216956836U

CN216956836U - Computer host with array type radiating fins

Info

Publication number: CN216956836U
Application number: CN202122912454.4U
Authority: CN
Inventors: 盛飞羽
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-11-25
Filing date: 2021-11-25
Publication date: 2022-07-12
Anticipated expiration: 2031-11-25

Abstract

The utility model relates to the technical field of computer hosts, in particular to a computer host with array type heat dissipation fins, which comprises a shell, wherein one side of the shell is connected with a side plate in a sliding way, a partition plate is arranged inside the shell, an exhaust hole is formed in the bottom of the partition plate, a rectangular frame is embedded in the top of the shell, a semiconductor refrigeration sheet is arranged at the bottom of the rectangular frame, a heat dissipation aluminum plate is arranged inside the rectangular frame, heat dissipation fins are arranged at the top of the heat dissipation aluminum plate, a drying bin is arranged between the inner wall and the outer wall of the shell, and air inlet holes and air outlet holes which are symmetrically distributed are respectively formed in the inner wall of the front side and the rear side of the shell and are positioned at the upper side and the lower side of the partition plate, the damage to the internal elements of the main machine caused by the liquid leakage in the water cooling process is avoided.

Description

Computer host with array type radiating fins

Technical Field

The utility model relates to the technical field of computer hosts, in particular to a computer host with array type radiating fins.

Background

The host refers to the main body part of the computer except the input and output equipment. The control box is also used for placing a mainboard and other main components, generally comprises a CPU, an internal memory, a mainboard, a hard disk, an optical drive, a power supply, a case, a heat dissipation system and other input/output controllers and interfaces, and relates to terminal equipment for sending and receiving information in the network technology;

after the host computer is used for a long time, a large amount of heat is generated in the working process of components such as an internal mainboard, the components such as the mainboard are cooled mostly in two modes of air cooling and water cooling in the prior art, the cooling liquid is leaked when being used and easily damages internal elements of the host computer, in addition, the continuous work of the cooling fan easily consumes a large amount of power resources, and therefore, the host computer with the array type cooling fins is provided.

Disclosure of Invention

In order to make up for the above deficiencies, the utility model provides a computer host with array type heat dissipation fins.

The technical scheme of the utility model is as follows:

a computer host with array radiating fins comprises a shell, a side plate is connected with one side of the shell in a sliding way, a clapboard is arranged in the shell, the clapboard is of a hollow structure, the bottom of the clapboard is provided with an exhaust hole, a rectangular frame is embedded at the top of the shell, a semiconductor refrigerating sheet is arranged at the bottom of the rectangular frame, a heat-radiating aluminum plate is arranged in the rectangular frame and close to the bottom, a plurality of heat-radiating fins distributed at equal intervals are arranged at the top of the heat-radiating aluminum plate, a drying bin is arranged between the inner wall and the outer wall of the shell, symmetrically distributed air inlets are arranged on the inner walls at the front side and the rear side of the shell and above the clapboard, the inner walls of the front side and the rear side of the shell are located below the partition plates, symmetrically distributed air outlet holes are formed in the lower position of the partition plates, temperature sensors are arranged at the bottoms of the partition plates, and a single chip microcomputer is arranged on the outer wall of the shell.

As a preferable technical scheme, one side of the partition plate penetrates through the shell to the outside, and a plurality of wind deflectors which are distributed at equal intervals are rotatably connected inside the partition plate.

Preferably, the drying chamber is filled with a drying agent.

As a preferred technical scheme, heat-conducting silicone grease is arranged between the heat-radiating aluminum plate and the heat-radiating surface of the semiconductor refrigerating sheet, and the upper ends of the heat-radiating fins penetrate through the top of the rectangular frame to the outside.

As a preferred technical scheme, a fan is arranged on the inner wall of the bottom of the shell.

As the preferred technical scheme, the front side of the shell is internally and rotatably connected with a limiting block, and a placing groove capable of containing the limiting block is formed in the shell.

As preferred technical scheme, the inner wall of shell and with inlet port position corresponds the department and is equipped with the filter screen, the inner wall of shell and with the corresponding department in outlet port position also is equipped with the filter screen.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the semiconductor refrigeration sheet is used for refrigerating the interior of the shell, then cold air enters the interior of the drying bin through the air inlet hole, so that moisture in the air is treated, and then the air is discharged through the air outlet hole, so that the space below the partition plate is refrigerated, and the damage to internal elements of the main machine due to the leakage of liquid in the water cooling process is avoided.

2. According to the utility model, the singlechip and the temperature sensor are used in a matched manner, so that the temperature inside the shell can be conveniently monitored, and meanwhile, the power supply of the semiconductor and the fan can be turned on according to the temperature requirement, so that the semiconductor refrigerating sheet and the fan can work intermittently, and the power resource can be conveniently saved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a second schematic view of the overall structure of the present invention;

FIG. 3 is a schematic view of a cut-away portion of the housing of the present invention;

FIG. 4 is a second schematic view of a cutaway portion of the outer casing of the present invention;

FIG. 5 is a schematic structural view of a cut rectangular frame according to the present invention;

FIG. 6 is a schematic view of a cut-away part of the partition board according to the present invention.

The meaning of the individual reference symbols in the figures is:

a housing 1; a stopper 11; a chute 12; an air intake hole 13; an air outlet 14; a drying bin 15;

a side plate 2;

a singlechip 3;

a rectangular frame 4; a semiconductor refrigerating sheet 41; a heat dissipating aluminum plate 42; heat dissipating fins 421;

a filter screen 5;

a partition 6; an exhaust hole 61; a wind deflector 62;

a fan 7;

a temperature sensor 8.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Referring to fig. 1-6, the present invention provides a technical solution:

a computer host with array type heat dissipation fins comprises a shell 1, a side plate 2 is connected to one side of the shell 1 in a sliding mode, a sliding groove 12 connected with the side plate 2 in a sliding mode is formed in the shell 1, one end of the sliding groove 12 is communicated with the outside, a partition plate 6 is arranged in the shell 1, the partition plate 6 is of a hollow structure, an exhaust hole 61 is formed in the bottom of the partition plate 6, a rectangular frame 4 is embedded in the top of the shell 1, a semiconductor refrigeration sheet 41 is arranged at the bottom of the rectangular frame 4, the refrigeration surface of the semiconductor refrigeration sheet 41 faces downwards, a heat dissipation aluminum plate 42 is arranged in the rectangular frame 4 and close to the bottom of the rectangular frame 4, the bottom of the heat dissipation aluminum plate 42 is tightly attached to the heat dissipation surface of the semiconductor refrigeration sheet 41, a plurality of heat dissipation fins 421 distributed at equal intervals are arranged at the top of the heat dissipation aluminum plate 42, a drying bin 15 is formed between the inner wall and the outer wall of the shell 1, and air inlets 13 which are symmetrically distributed are formed in positions, which are located above the partition plate 6, on the inner walls on the front side and the back side of the shell 1, the air outlet 14 that the symmetric distribution was seted up to the both sides inner wall just is located the below position of baffle 6 around shell 1, and the bottom of baffle 6 is equipped with temperature sensor 8, and the outer wall of shell 1 is equipped with singlechip 3.

It is supplementary to need, semiconductor refrigeration piece 41, fan 7 and temperature sensor 8 are respectively through wire and singlechip 3 electric connection to temperature sensor 8 carries the data that detect to singlechip 3 inside, and then carries out on-off control to semiconductor refrigeration piece 41 and the power of fan 7 through singlechip 3.

Preferably, one side of the partition plate 6 penetrates through the outer casing 1 to the outside, a plurality of wind deflectors 62 distributed at equal intervals are rotatably connected to the inside of the partition plate 6, and the direction of the gas flowing inside the partition plate 6 is guided by rotating the connected wind deflectors 62, so that the direction of the gas flowing out is adjusted.

Preferably, the drying agent is filled in the drying chamber 15, a filter screen 5 is arranged on the inner wall of the housing 1 corresponding to the air inlet 13, and a filter screen 5 is also arranged on the inner wall of the housing 1 corresponding to the air outlet 14, further, the particle diameter of the drying agent is larger than the diameter of the filter hole on the filter screen 5, so that the drying agent is blocked by the filter screen 5, and the drying agent is prevented from entering the housing 1 through the air inlet 13 and the air outlet 14.

As a preferred embodiment of the present invention, a heat conductive silicone grease is disposed between the heat dissipating aluminum plate 42 and the heat dissipating surface of the semiconductor chilling plate 41, so as to improve the heat conductive efficiency between the heat dissipating surface of the semiconductor chilling plate 41 and the heat dissipating aluminum plate 42 by adding the heat conductive silicone grease, and the upper end of the heat dissipating fin 421 passes through the top of the rectangular frame 4 to the outside, so that the heat dissipating fin 421 is cooled by air in the process of flowing the outside air, thereby dissipating heat from the heat dissipating fin 421.

Preferably, the inner wall of the bottom of the casing 1 is provided with a fan 7, and the flow speed of the air inside the casing 1 can be increased by adding the fan 7, so as to improve the cooling efficiency.

As the preferred of this embodiment, the inside rotation of front side of shell 1 is connected with stopper 11, restrict the position of curb plate 2 through stopper 11, avoid curb plate 2 and spout 12 to separate, the standing groove that can hold stopper 11 is seted up to the inside of shell 1, so that accomodate stopper 11, thereby the realization is adjusted the angle of stopper 11, so that curb plate 2 removes and separates with spout 12 in spout 12 is inside, and then be convenient for overhaul each inside component of shell 1 after dismantling curb plate 2.

When the computer host with the array type heat dissipation fins is used, the refrigerating surface of the semiconductor refrigerating sheet 41 refrigerates towards the interior of the shell 1, then cold air enters the interior of the drying bin 15 through the air inlet 13, so that moisture and humidity in the air are fully contacted with a drying agent filled in the interior of the drying bin 15 and then enter the interior of the shell 1 and a space below the partition plate 6 through the air outlet 14, then the air flow speed in the space below the partition plate 6 is accelerated through the fan 7, then the heat dissipation efficiency is improved, in the air flow process, the cold air sinks to be contacted with each element, so that the temperature is reduced, hot air rises and is discharged from the interior of the shell 1 through the air outlet 61, the temperature sensor 8 monitors the temperature of the partition plate 6, then the detection data is fed back to the singlechip 3, and then the singlechip 3 analyzes and compares the data detected by the temperature sensor 8, then, the power supply of the semiconductor refrigeration sheet 41 and the fan 7 is switched on and off, and the refrigeration surface of the semiconductor refrigeration sheet 41 performs heat dissipation treatment on the heat dissipation surface of the semiconductor refrigeration sheet 41 through the matching use of the heat dissipation aluminum plate 42 and the heat dissipation fins 421 while refrigerating, so that the working efficiency of the refrigeration surface of the semiconductor refrigeration sheet 41 is improved.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a host computer with array heat radiation fins, includes shell (1), one side sliding connection of shell (1) has curb plate (2), its characterized in that: the heat dissipation device is characterized in that a partition plate (6) is arranged inside the shell (1), the partition plate (6) is of a hollow structure, an exhaust hole (61) is formed in the bottom of the partition plate (6), a rectangular frame (4) is embedded at the top of the shell (1), semiconductor refrigerating sheets (41) are arranged at the bottom of the rectangular frame (4), a heat dissipation aluminum plate (42) is arranged inside the rectangular frame (4) and close to the bottom of the rectangular frame (4), a plurality of heat dissipation fins (421) distributed at equal intervals are arranged at the top of the heat dissipation aluminum plate (42), a drying bin (15) is formed between the inner wall and the outer wall of the shell (1), symmetrically distributed air inlets (13) are formed in the positions above the partition plate (6) on the inner walls of the front side and the rear side of the shell (1), symmetrically distributed air outlets (14) are formed in the positions below the partition plate (6) on the inner walls of the front side and the rear side of the shell (1), the bottom of baffle (6) is equipped with temperature sensor (8), the outer wall of shell (1) is equipped with singlechip (3).

2. The host computer with arrayed heat dissipation fins of claim 1, wherein: one side of the partition plate (6) penetrates through the shell (1) to the outside, and a plurality of wind shields (62) distributed at equal intervals are rotatably connected to the inside of the partition plate (6).

3. The host computer with arrayed heat dissipation fins of claim 1, wherein: the drying cabin (15) is filled with a drying agent.

4. The host computer with arrayed heat dissipation fins of claim 1, wherein: and heat-conducting silicone grease is arranged between the heat-radiating aluminum plate (42) and the heat-radiating surface of the semiconductor refrigerating sheet (41), and the upper ends of the heat-radiating fins (421) penetrate through the top of the rectangular frame (4) to the outside.

5. The host computer with arrayed heat dissipation fins of claim 1, wherein: the inner wall of the bottom of the shell (1) is provided with a fan (7).

6. The host computer with arrayed heat dissipation fins of claim 1, wherein: the inside stopper (11) that is connected with of front side rotation of shell (1), the inside of shell (1) is seted up can hold the standing groove of stopper (11).

7. The host computer with arrayed heat dissipation fins of claim 1, wherein: the inner wall of shell (1) and with inlet port (13) position department of corresponding is equipped with filter screen (5), the inner wall of shell (1) and with venthole (14) position department of corresponding also is equipped with filter screen (5).