CN217718593U - Intelligent box and server - Google Patents

Abstract

The utility model relates to an intelligent box and a server, wherein the intelligent box comprises a main board component, a fan component and a radiator, wherein the main board component comprises a board body and a chip, the board body is provided with an installation surface, and the chip is arranged on the installation surface; the fan assembly comprises a shell arranged on the mounting surface and a fan body arranged in the shell, the shell is provided with a first air inlet and a first air outlet, the fan body is electrically connected with the chip, and the rotating speed of the fan body can be adjusted through heat generated by the chip during working; the radiator is arranged on the mounting surface and is provided with a second air inlet and a second air outlet, and the second air inlet is communicated with the first air outlet. When the fan body works, cold air sequentially passes through the shell and the radiator, so that the plate body and a chip mounted on the plate body can be radiated; simultaneously, the rotational speed of fan body can be adjusted according to the heat that the chip during operation produced to avoid producing the waste of energy when guaranteeing the radiating effect.

Description

Intelligent box and server

Technical Field

The utility model relates to a data processing technology field, especially an intelligence box and server.

Background

Most of the existing intelligent boxes are cooled by fans inside server cases, but because each intelligent box works differently on a server and the types and powers of chips inside the intelligent boxes are different, the heat accumulation on each intelligent box is unequal.

If the rotating speed of a fan in the case is low, the intelligent box can radiate heat unevenly, and the radiating effect is poor; the fan inside the chassis with a high rotation speed generates a lot of noise and also causes energy waste.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a smart box and a server, which can reduce power consumption while ensuring a heat dissipation effect.

The utility model discloses at first, provide an intelligent box, include: the mainboard assembly comprises a board body and a chip, wherein the board body is provided with a mounting surface, and the chip is arranged on the mounting surface; the fan assembly comprises a shell arranged on the mounting surface and a fan body arranged in the shell, the shell is provided with a first air inlet and a first air outlet, the fan body is electrically connected with the chip, and the rotating speed of the fan body can be adjusted through heat generated by the chip during working; and the radiator is arranged on the mounting surface and is provided with a second air inlet and a second air outlet, and the second air inlet and the first air outlet are communicated.

When the fan body in the intelligent box works, cold air outside the intelligent box enters the shell through the first air inlet, air entering the shell enters the radiator through the first air outlet and the second air inlet, the air entering the radiator is finally discharged out of the intelligent box through the second air outlet, and the cold air can radiate the plate body and the chip mounted on the plate body when passing through the shell and the radiator; simultaneously, the rotational speed of fan body can be adjusted according to the heat that the chip during operation produced, and when the heat that the chip work produced was more, the rotational speed increase of control fan body, when the heat that the chip work produced was less, the rotational speed of control fan body reduced to avoid producing the waste of energy when guaranteeing the radiating effect.

In one embodiment, the intelligent box further comprises a box body, the box body comprises a bottom wall, and one side face, deviating from the mounting face, of the plate body is arranged on the bottom wall.

So set up, the diapire is used for fixed mainboard subassembly, and the box body is used for fixing the intelligent box to other exterior structure on.

In one embodiment, the box further includes a first side wall fixed to the bottom wall, the first side wall is provided with a heat dissipation opening, and the second air outlet and the heat dissipation opening are communicated with each other.

So set up, can follow the thermovent discharge intelligence box from second air outlet exhaust air.

In one embodiment, the fan assembly is disposed on a side of the heat sink opposite to the first side wall.

So set up, fan unit can drive the air and pass whole intelligent box, and the radiating effect is good.

In one embodiment, a side surface of the housing provided with the first air outlet is attached to a side surface of the heat sink provided with the second air inlet; and/or the radiator is provided with one side surface of the second air outlet and is attached to the first side wall.

So set up, can improve the leakproofness between casing and the radiator and/or between radiator and the first side wall, avoid hot-air to remain and influence the radiating effect in the intelligence box.

In one embodiment, the heat dissipation ports are provided as honeycomb heat dissipation holes.

So set up, honeycomb hole has radiating effect to can dispel the heat to the air of discharging intelligent box.

In one embodiment, the first air inlet faces the bottom wall, the plate body is provided with a first ventilation opening communicated with the first air inlet, and the bottom wall is provided with a second ventilation opening communicated with the first ventilation opening.

So set up, fan assembly can loop through the cold air in the intelligence box outside second vent, first vent and first air intake suction casing in, guarantees that inspiratory cold air temperature is lower, and heat exchange efficiency is high, and the radiating effect is good.

In one embodiment, the heat sink is provided as a heat sink.

So set up, the fin can increase the area of contact between radiator and the air, increase heat radiating area promptly to improve heat exchange efficiency.

The utility model also provides a server, including frame and foretell intelligent box, the frame has installation space, the quantity of intelligent box is a plurality of, and is a plurality of the intelligent box set up side by side in the installation space.

So set up, this server is with the temperature control fragmentation, and every intelligence box can both be based on the rotational speed of the heat control fan body that inside chip produced at the during operation, accomplishes self heat dissipation strategy, when guaranteeing the radiating effect, makes server energy consumption greatly reduced when the operation.

In one embodiment, the rack has an air outlet side, and the second air outlets of the heat sink face the air outlet side.

So set up, in fan unit can take out the inside air of installation space in the intelligence box to the hot-air after will dispelling the heat all discharges from the air-out side of frame, thereby takes away the heat in the frame.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic perspective view of an intelligent box according to an embodiment of the present invention;

fig. 2 is a schematic diagram of the explosion structure of fig. 1 provided by the present invention;

fig. 3 is a schematic structural view of the main board assembly and the fan assembly in fig. 1 at a bottom view according to the present invention;

fig. 4 is a schematic structural view of fig. 1 from a top view according to the present invention;

fig. 5 is a schematic structural diagram of fig. 1 at a right view angle provided by the present invention;

fig. 6 is a schematic structural diagram of a server according to an embodiment of the present invention.

Reference numerals are as follows: 100. an intelligent box; 1. a motherboard assembly; 11. a plate body; 111. a mounting surface; 112. a first air vent; 2. a fan assembly; 21. a housing; 211. a first air inlet; 212. a first air outlet; 3. a heat sink; 31. a second air inlet; 32. a second air outlet; 4. a case body; 41. a bottom wall; 411. a second vent; 42. a first side wall; 421. a heat dissipation port; 43. a second side wall; 44. a third side wall; 5. a fastener; 200. a frame; 201. and (5) installing space.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiment in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and therefore the application is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The use of the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like in the description of the present application is for purposes of illustration only and is not intended to represent the only embodiment.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or may simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the description of this application, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Most of heat in the server comes from power consumption of the intelligent boxes, generally, 2 or 4 chips are arranged in each intelligent box, and the power of a single chip is different from 5W to 15W according to different types of chips in the intelligent boxes. In the existing server heat dissipation method, part of the heat dissipation is directly performed on the whole intelligent box through a fan inside a server case, and part of the heat dissipation is performed on a chip through arranging an independent fan in each intelligent box. In addition, the rotating speed of a fan in the existing intelligent box cannot be adjusted generally, or the whole intelligent box can only be adjusted according to the whole temperature in the server. However, since each smart box operates differently on the server, the type and power of the chip inside the smart box also differ, and therefore, the heat buildup on each smart box is unequal. If the rotating speed of the fan is low, the intelligent box can dissipate heat unevenly, and the heat dissipation effect is poor; the higher the rotation speed of the fan, the higher the noise is generated, and the waste of energy is caused.

In order to solve the above problem, as shown in fig. 1 to 6, the present invention firstly provides an intelligent box 100, and the intelligent box 100 can reduce the energy consumption while ensuring the heat dissipation effect.

As shown in fig. 2 to 3, specifically, the smart box 100 includes a motherboard assembly 1, a fan assembly 2 and a heat sink 3, wherein the motherboard assembly 1 includes a board body 11 and a chip, the board body 11 has a mounting surface 111, and the chip is disposed on the mounting surface 111; the fan assembly 2 comprises a housing 21 arranged on the mounting surface 111 and a fan body arranged in the housing 21, the housing 21 is provided with a first air inlet 211 and a first air outlet 212, and the fan body is electrically connected with the chip and can adjust the rotating speed of the fan body through heat generated by the chip during operation; the radiator 3 is provided on the mounting surface 111, the radiator 3 has a second intake port 31 and a second outlet port 32, and the second intake port 31 and the first outlet port 212 are provided in communication with each other.

As described above, in the existing server heat dissipation method, no matter the whole intelligent boxes are directly cooled by the fans inside the server chassis, or the chips are cooled by arranging separate fans inside each intelligent box, the rotation speed of the fans in the intelligent boxes cannot be adjusted, or the whole server can only adjust according to the temperature of the whole server; however, the phenomenon that the intelligent box has uneven heat dissipation and poor heat dissipation effect occurs when the rotating speed of the fan is low; the fan with a higher rotation speed generates a larger noise and also causes a waste of energy. And the utility model provides an in the intelligent box, the chip, fan unit 2 and radiator 3 all set up on plate body 11's installation face 111, fan body during operation, the outer cold air of intelligent box can get into in the casing 21 through first air intake 211, the air that gets into in the casing 21 gets into in the radiator 3 through first air outlet 212 and second air intake 31, the air that gets into in the radiator 3 is last through second air outlet 32 intelligent box of discharging, the cold air can dispel the heat to plate body 11 and the chip of installing on plate body 11 when casing 21 and radiator 3.

Meanwhile, the rotating speed of the fan body can be adjusted according to the heat generated by the chip during working, when the power of the chip in the intelligent box is higher, the heat generated by the chip during working is more, and the rotating speed of the fan body is controlled to be increased through the chip so as to ensure the heat dissipation effect; when the chip power in this intelligence box is less, the heat that chip work produced is less, and the rotational speed through chip control fan body reduces this moment to avoid the waste of production energy when guaranteeing the radiating effect, can also prevent to produce great noise because the fan speed is great simultaneously. The size of the fan body can also be selected as needed.

In one embodiment, the heat sink 3 is provided as a heat dissipating fin. The fins are arranged in parallel at intervals, and a second air inlet 31 and a second air outlet 32 are formed at two ends of the radiating fins in the length direction. The fin can increase the area of contact between radiator and the air, increases heat radiating area promptly to improve heat exchange efficiency. Of course, in other embodiments, the radiator 3 may also be provided as another type of radiator such as a column radiator, a convection radiator, and the like, and is not limited in particular herein.

As shown in fig. 1 to 2, the smart box 100 further includes a box body 4, the box body 4 includes a bottom wall 41, a first sidewall 42, a second sidewall 43 and a third sidewall 44, the bottom wall 41 and the first sidewall 42 are fixed to each other to form an L shape, and the second sidewall 43 and the third sidewall 44 are disposed on two sides of the bottom wall 41 and adjacent to two sides of the first sidewall 42 respectively. Wherein, a side of the plate body 11 departing from the mounting surface 111 is disposed on the bottom wall 41, the bottom wall 41 is used for fixing the motherboard assembly 1, and the box body 4 is used for fixing the smart box 100 to other external structures such as a server. The first sidewall 42 is provided with a heat dissipation opening 421, the second air outlet 32 and the heat dissipation opening 421 are communicated, and the air exhausted from the second air outlet 32 can be exhausted from the heat dissipation opening 421 out of the smart box 100. The second side wall 43 and the third side wall 44 serve to limit the position of the plate body 11, so as to facilitate the installation of the plate body 11 on the bottom wall 41. Further, the box body 4 may further include a top wall and a fourth side wall, and the top wall 41, the first side wall 42, the second side wall 43 and the third side wall 44 form a cube. Of course, in other embodiments, the box 4 may have other regular or irregular shapes.

As shown in fig. 4, in the illustrated embodiment, the fan assembly 2 is disposed on a side of the heat sink 3 relatively far from the first side wall 42, that is, a side of the heat sink 3 close to the fourth side wall. Fan assembly 2 can drive the air and enter into in the intelligent box 100 from the one end of intelligent box 100 to discharge from the other end after passing whole intelligent box 100, the radiating effect is good. In other embodiments, the fan assembly 2 may also be disposed on a side of the heat sink 3 close to the second side wall 43 or the third side wall 44.

As shown in fig. 2 and fig. 4, a side of the housing 21 having the first air outlet 212 is attached to a side of the heat sink 3 having the second air inlet 31; one side of the heat sink 3 having the second air outlet 32 is attached to the first sidewall 42. Like this, can improve the leakproofness between casing 21 and the radiator 3 and between radiator 3 and the first lateral wall 42, guarantee that the wind that blows out from first air outlet 212 can both get into in the radiator 3 through second air intake 31, the wind that blows out from second air outlet 32 can both blow out outside intelligent box 100 through thermovent 421 to avoid the hot-air to remain and influence the radiating effect in intelligent box 100. In other embodiments, a duct may be provided between the first outlet 212 and the second inlet 31 for guiding air, or a duct may be provided between the second outlet 32 and the heat sink 421 for guiding air.

As shown in fig. 5, in the illustrated embodiment, the vents 421 are provided as honeycomb louvers. The honeycomb-shaped holes have a heat dissipation effect, so that air exhausted out of the intelligent box 100 can be dissipated, and the influence on the normal work of the intelligent box 100 or other elements caused by overhigh temperature at the heat dissipation port is prevented; meanwhile, the honeycomb-shaped heat dissipation holes can also ensure the compact and firm structure of the first side wall 42. The honeycomb-shaped heat dissipation holes can be formed by splicing a plurality of polygons such as circles, triangles and quadrangles, or can be formed by splicing a plurality of other regular or irregular polygons, and are not particularly limited herein.

As shown in fig. 2 to 3, in the illustrated embodiment, the first air inlet 211 faces the bottom wall 41, the plate body 11 is provided with a first air vent 112 communicating with the first air inlet 211, and the bottom wall 41 is provided with a second air vent 411 communicating with the first air vent 112. Like this, fan assembly 2 can loop through second ventilation opening 411, first ventilation opening 112 and first air intake 211 with the cold air in the intelligent box 100 outside and inhale in casing 21, guarantees that inspiratory cold air temperature is lower, and heat exchange efficiency is high, and the radiating effect is good, avoids directly from the inside higher air of suction temperature of intelligent box 100 and influence heat exchange efficiency. In other embodiments, the first air inlet 211 may also be disposed toward one or more of the top wall, the bottom wall 41, the first side wall 42, the second side wall 43, and the fourth side wall, and is provided with a ventilation opening at a corresponding position on the box body 4 to ensure that the fan assembly 2 can suck cold air from the outside of the smart box 100.

As shown in fig. 2, in the illustrated embodiment, the fan assembly 2 and the heat sink 3 are detachably fixed to the mounting surface 111 by the fasteners 5. This can facilitate the user in replacing or servicing the fan assembly 2 and the heat sink 3, and can also facilitate the user in replacing or servicing the chip after removing the fan assembly 2 or the heat sink 3. The panel body 11 is also detachably fixed to the bottom wall 41 by the fastener 5, so that the user can replace or repair the motherboard assembly 1. The chip may be mounted on the mounting surface 111 by means of adhesive, screws, or snaps. The fastener 5 may be configured as a screw and a stud structure that can be fixed by a thread, a buckle and a slot structure that can be engaged with each other, or other fixing modes that can be detachably linked, and is not limited specifically herein. Of course, in other embodiments, only one of the fan module 2 and the heat sink 3 may be detachably fixed to the mounting surface 111, and the other may be fixedly disposed on the mounting surface 111, or both the fan module 2 and the heat sink 3 may be fixedly disposed on the mounting surface 111, so as to improve the stability of connection therebetween.

As shown in fig. 6, the present invention further provides a server, which includes a rack 200 and the smart boxes 100, wherein the rack 200 has an installation space 201, the number of the smart boxes 100 is plural, and the plurality of smart boxes 100 are arranged in the installation space 201 in parallel. In the related art, a fan with large power and large volume is usually disposed in a server to dissipate heat of the server as a whole, and a large area is usually reserved inside a rack for installing the fan. And the utility model discloses a server then sets up the fan in each intelligent box 100, with the temperature control fragmentation, every intelligent box 100 can both be based on the rotational speed of the heat control fan body that the inner chip produced at the during operation, accomplishes the heat dissipation strategy of self, can also replace high-power fan for the low-power fan simultaneously, when guaranteeing the radiating effect, make the server energy consumption greatly reduced when the operation, can also save the space of placing the fan at installation space 201 simultaneously.

In the illustrated embodiment, the rack 200 has an air outlet side, and the second air outlets 32 of the radiators 3 face the air outlet side. When the fan assembly 2 is disposed on the side of the heat sink 3 relatively far away from the first side wall 42, the fan assembly 2 is disposed in the rack 200, the fan assembly 2 can draw air inside the installation space 201 into the smart box 100, and discharge hot air after heat dissipation from the air outlet side of the rack 200, so as to take away heat inside the rack 200 and dissipate heat inside the installation space 201.

All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several implementation modes of the present application, and the description thereof is specific and detailed, but not construed as limiting the scope of the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application shall be subject to the appended claims.

Claims (10)

1. A smart box (100), comprising:

the mainboard assembly (1) comprises a plate body (11) and a chip, wherein the plate body (11) is provided with a mounting surface (111), and the chip is arranged on the mounting surface (111);

the fan assembly (2) comprises a shell (21) arranged on the mounting surface (111) and a fan body arranged in the shell (21), the shell (21) is provided with a first air inlet (211) and a first air outlet (212), the fan body is electrically connected with the chip, and the rotating speed of the fan body can be adjusted through heat generated by the chip during operation; and

the radiator (3) is arranged on the mounting surface (111), the radiator (3) is provided with a second air inlet (31) and a second air outlet (32), and the second air inlet (31) and the first air outlet (212) are communicated.

2. The smart box (100) according to claim 1, wherein the smart box (100) further comprises a box body (4), the box body (4) comprises a bottom wall (41), and a side of the plate body (11) facing away from the mounting surface (111) is disposed on the bottom wall (41).

3. The smart box (100) according to claim 2, wherein the box body (4) further comprises a first side wall (42) fixed to the bottom wall (41) in an L-shape, the first side wall (42) is provided with a heat dissipating opening (421), and the second air outlet (32) and the heat dissipating opening (421) are communicated with each other.

4. The smart box (100) according to claim 3, wherein the fan assembly (2) is arranged on a side of the heat sink (3) relatively far from the first side wall (42).

5. The smart box (100) according to claim 3, wherein a side of the housing (21) provided with the first air outlet (212) is attached to a side of the heat sink (3) provided with the second air inlet (31); and/or

One side face of the radiator (3) provided with the second air outlet (32) is attached to the first side wall (42).

6. The smart box (100) of claim 3 wherein the heat vents (421) are provided as honeycomb louvers.

7. The smart box (100) of claim 2, wherein the first air inlet (211) faces the bottom wall (41), the plate body (11) is provided with a first air vent (112) communicating with the first air inlet (211), and the bottom wall (41) is provided with a second air vent (411) communicating with the first air vent (112).

8. The smart box (100) according to claim 1, wherein the heat sink (3) is provided as a heat sink fin.

9. A server, characterized by comprising a rack (200) and the smart box (100) according to any one of claims 1-8, wherein the rack (200) has an installation space (201), the number of the smart boxes (100) is multiple, and a plurality of the smart boxes (100) are arranged in parallel in the installation space (201).

10. The server according to claim 9, characterized in that the racks (200) have an air outlet side, the second air outlets (32) of the radiators (3) each facing the air outlet side.

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