CN2937955Y - Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet - Google Patents

Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet Download PDF

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Publication number
CN2937955Y
CN2937955Y CN 200620021339 CN200620021339U CN2937955Y CN 2937955 Y CN2937955 Y CN 2937955Y CN 200620021339 CN200620021339 CN 200620021339 CN 200620021339 U CN200620021339 U CN 200620021339U CN 2937955 Y CN2937955 Y CN 2937955Y
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CN
China
Prior art keywords
cabinet
chamber
refrigerating chamber
refrigerating
hot water
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Expired - Fee Related
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CN 200620021339
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Chinese (zh)
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陈尊山
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Individual
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Individual
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Priority to CN 200620021339 priority Critical patent/CN2937955Y/en
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Publication of CN2937955Y publication Critical patent/CN2937955Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

Disclosed is a multifunctional multi-temperature zones semiconductor cooling (heating) heat preservation cabinet, which pertains to the cooling, heating and energy reuse technology field. The utility model is designed for adding heat preservation and hot water producing functions to refrigerators and ice chests with double-effect of cooling and heating. The heat preservation, cold storage and freezing parts are assembled vertically together in turn with the hot water part being arranged behind; a semiconductor double-effect temperature difference cooling component 12 is mounted between the back wall of a cold storage chamber and a frozen chamber 5, 7 and the trapezoidal hill of the inner container of a hot water chamber 9, and heats the water in the hot water chamber 9 using the heat produced during the cooling process, as well as increasing the temperature in the heat preservation chamber 2; a hot water independent heating part 13 is mounted between the inner container of the hot water chamber 9 and the back wall of the cabinet body 1; a cold storage independent cooling part and a freezing independent cooling part 14, 15 are mounted between the side wall of the cold storage chamber and the frozen chamber 5, 7 and the side wall of the cabinet body 1, heating or cooling orders can be executed separately on demand; thermal insulating materials are filled between the inner wall and the outer wall of each chamber and in gaps for preserving the heat. The utility model integrates a plurality of functions and is suited for being arranged in family kitchens.

Description

Multi-functional many warm areas semiconductor refrigerating (heating) insulation cabinet
Technical field: the utility model relates to a kind of multi-functional many warm areas semiconductor refrigerating (heating) insulation cabinet, belongs to refrigeration, heats and the reusing of energy source technical field.
Background technology: the function of general domestic refrigerator, refrigerator-freezer is all more single, can only refrigerate with freezing; Pot-type boiler also is that function singleness and energy consumption are bigger, and a kind of technology need be provided, and increases heat insulation and hot water function on refrigeration, freezing basis, simultaneously its whole energy consumption is controlled at floor level.
Summary of the invention: for make full use of the heat that refrigerator ice cabinet gives out when freezing, for it increases heat insulation and hot water function, multi-functional many warm areas semiconductor refrigerating (heating) insulation cabinet that reduces whole energy consumption simultaneously and design, it is made up of cabinet, hot insulating sections, refrigeration part, frozen portions, hot water part, independent temperature part and thermal insulation material: hot insulating sections, refrigeration part, the three-dimensional successively front portion that is assembled in cabinet 1 of frozen portions, and hot water partly is installed in the rear portion of cabinet 1; Moist closet 2, heat insulation plate washer 3 and moist closet cabinet door 4 are formed hot insulating sections; Refrigerating chamber 5 and refrigerating chamber cabinet door 6 and semiconductor economic benefits and social benefits temperature-difference refrigerating assembly 12, refrigeration independent cooling spare 14 are formed the refrigeration part; Refrigerating chamber 7 and refrigerating chamber cabinet door 8 and semiconductor economic benefits and social benefits temperature-difference refrigerating assembly 12, freezing independent cooling spare 15 are formed frozen portions; Hot hydroecium 9, water inlet pipe 10 and outlet pipe 11 and semiconductor economic benefits and social benefits temperature-difference refrigerating assembly 12, hot water independently heat part 13 and form the hot water part; Semiconductor economic benefits and social benefits temperature-difference refrigerating assembly 12 is mounted between the trapezoidal high spot of refrigeration, refrigerating chamber 5,7 rear walls and hot hydroecium's 9 inner bags; Hot water independently heats part 13 and is mounted between the trapezoidal projection and cabinet 1 rear wall at hot hydroecium 9 inner bag rear portions; Refrigeration, freezing independent cooling spare 14,15 are mounted between the trapezoidal projection and cabinet 1 sidewall of refrigeration, refrigerating chamber 5,7 sidewalls; Be filled with thermal insulation material 16 between the inwall in each chamber district and the outer wall and at interval.The utility model noiselessness, low-voltage power supply, safe in utilization, heat-collecting heat-preserving, refrigeration, freezing, hot water is in one, is applicable to that the family kitchen configuration uses.
Description of drawings:
Accompanying drawing is the utility model structure chart.
Among the figure: 1, cabinet, 2, moist closet, 3, heat insulation plate washer, 4, moist closet cabinet door, 5, refrigerating chamber, 6, refrigerating chamber cabinet door, 7, refrigerating chamber, 8, refrigerating chamber cabinet door, 9, hot hydroecium, 10, water inlet pipe, 11, outlet pipe, 12, semiconductor economic benefits and social benefits temperature-difference refrigerating assembly, 13, hot water independently heats part, 14, refrigeration independent cooling spare, 15, freezing independent cooling spare, 16, the thermal insulation material.
The specific embodiment:
Below in conjunction with description of drawings structure of the present utility model and embodiment:
Semiconductor economic benefits and social benefits temperature-difference refrigerating assembly 12 is four groups, be mounted between the trapezoidal high spot of refrigeration, refrigerating chamber 5,7 rear walls and hot hydroecium's 9 inner bags, be operated in refrigeration, heating double-effect is answered state, refrigeration, refrigerating chamber 5,7 are freezed, and the heat that produces when utilizing refrigeration, water in the hot hydroecium 9 is heated, and heated water transmits heat simultaneously by the metallic plate partition between hot hydroecium 9 and the moist closet 2 to moist closet.The temperature of each warm area is set to: moist closet and hot hydroecium are 40 ℃, and refrigerating chamber is 0 ℃, 4 ℃; Refrigerating chamber is-7 ℃ ,-18 ℃.
Be provided with removable heat insulation plate washer 3 in the moist closet, pull down plate washer when needing insulation, heated water transmits heat to moist closet in the hot hydroecium 9; Need not be incubated plate washer on the fashionable dress, the heat that isolated hot hydroecium 9 spreads out of is to reduce thermal energy consumption.
Each chamber district is provided with independent cooling, heating, and dispose independently temperature control circuit, when arbitrary temperature of refrigeration, refrigerating chamber 5,7 and hot hydroecium 9 reaches setting value, cause the respective chamber/chambers district can not separate refrigeration, when heating, hot water independently heats part 13 and refrigeration, freezing independent cooling spare 14,15 correspondences start, and the chamber district that promotes temperature for needs heats separately, freezes.
For making semiconductor economic benefits and social benefits temperature-difference refrigerating assembly 12, hot water independently heat tightly mounting of part 13 and refrigeration, freezing independent cooling spare 14,15 and refrigeration, heating chamber district inwall, inner bag, and make between each inside and outside wall in chamber district and leave enough cavitys, filling the thermal insulation material, the utility model mounts hot water with the sidewall of the inner bag of hot hydroecium 9 and refrigeration, refrigerating chamber 5,7 and independently heats part 13, refrigeration, freezing independent cooling spare 14,15 places and be processed into trapezoidal convex.The double heat radiation of doing independent cooling, heating part of the metal outer wall of cabinet 1, cold radiation plate.
The utility model low-voltage power supply, the operation principle of its control circuit is identical with conventional refrigeration plant with the device of use.

Claims (4)

1, a kind of multi-functional many warm areas semiconductor refrigerating (heating) insulation cabinet independently heats part (13), refrigeration independent cooling spare (14), freezing independent cooling spare (15) and thermal insulation material (16) by cabinet (1), moist closet (2), heat insulation plate washer (3), moist closet cabinet door (4), refrigerating chamber (5), refrigerating chamber cabinet door (6), refrigerating chamber (7), refrigerating chamber cabinet door (8), hot hydroecium (9), water inlet pipe (10), outlet pipe (11), semiconductor economic benefits and social benefits temperature-difference refrigerating assembly (12), hot water and forms.It is characterized in that: hot insulating sections, refrigeration part, frozen portions solid successively are assembled in the front portion of cabinet (1), and hot water partly is loaded on the rear portion of cabinet (1); Moist closet (2), thermal insulation plate washer (3) and moist closet cabinet door (4) are formed hot insulating sections; Refrigerating chamber (5) and refrigerating chamber cabinet door (6) and semiconductor economic benefits and social benefits temperature-difference refrigerating assembly (12), refrigeration independent cooling spare (14) are formed the refrigeration part; Refrigerating chamber (7) and refrigerating chamber cabinet door (8) and semiconductor economic benefits and social benefits temperature-difference refrigerating assembly (12), freezing independent cooling spare (15) are formed frozen portions; Water inlet pipe (10) is installed in the bottom of hot hydroecium (9), and outlet pipe (11) is installed in the top of hot hydroecium (9), independently heats part (13) with semiconductor economic benefits and social benefits temperature-difference refrigerating assembly (12), hot water and forms the hot water part; Semiconductor economic benefits and social benefits temperature-difference refrigerating assembly (12) is mounted between the trapezoidal high spot of the rear wall of refrigerating chamber (5) and refrigerating chamber (7) and hot hydroecium (9) inner bag; Hot water independently heats part (13) and is mounted between the trapezoidal high spot and cabinet (1) rear wall at hot hydroecium (9) inner bag rear portion, and refrigeration independent cooling spare (14), freezing independent cooling spare (15) are mounted between refrigerating chamber (5) and trapezoidal high spot of refrigerating chamber (7) sidewall and cabinet (1) sidewall; All be filled with thermal insulation material (16) between the inwall in each chamber district and the outer wall and at interval.
2, multi-functional many warm areas semiconductor refrigerating according to claim 1 (heating) insulation cabinet is characterized in that: the inner bag that is spaced apart hot hydroecium (9) of moist closet (2) and hot hydroecium (9), set heat insulation plate washer (3) is detachable.
3, multi-functional many warm areas semiconductor refrigerating according to claim 1 (heating) insulation cabinet, it is characterized in that: semiconductor economic benefits and social benefits temperature-difference refrigerating assembly (12) is four groups, its cold worker's face is affixed to the rear wall of refrigerating chamber (5) and refrigerating chamber (7), and thermal technology's face is affixed to the inner bag of hot hydroecium (9).
4, multi-functional many warm areas semiconductor refrigerating according to claim 1 (heating) insulation cabinet is characterized in that: the double hot water of doing of the outer wall of cabinet (1) independently heats the row's cold drawing of part (13) and the heat sink of refrigeration independent cooling spare (14), freezing independent cooling spare (15).
CN 200620021339 2006-08-01 2006-08-01 Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet Expired - Fee Related CN2937955Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200620021339 CN2937955Y (en) 2006-08-01 2006-08-01 Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200620021339 CN2937955Y (en) 2006-08-01 2006-08-01 Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet

Publications (1)

Publication Number Publication Date
CN2937955Y true CN2937955Y (en) 2007-08-22

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CN 200620021339 Expired - Fee Related CN2937955Y (en) 2006-08-01 2006-08-01 Multifunction multi-temp zone semiconductor refrigeration (heating) themal insulation cabinet

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CN (1) CN2937955Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101476809B (en) * 2009-02-11 2011-08-17 陕西师范大学 Semiconductor energy-saving environment-friendly refrigerator
WO2018196680A1 (en) * 2017-04-28 2018-11-01 青岛海尔智能技术研发有限公司 Semiconductor refrigeration device with multiple temperature areas
WO2018196679A1 (en) * 2017-04-28 2018-11-01 青岛海尔智能技术研发有限公司 Semiconductor refrigeration module and refrigeration device
CN108800657A (en) * 2017-04-28 2018-11-13 青岛海尔智能技术研发有限公司 The assemble method of semiconductor refrigerating equipment
CN110513961A (en) * 2018-05-22 2019-11-29 余建中 Refrigeration cold insulation can be provided simultaneously and heat the incubator and its temperature control method of thermal protection
CN112902538A (en) * 2021-03-26 2021-06-04 江苏芷泉能源科技有限公司 Multifunctional thermovoltaic refrigeration refrigerator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101476809B (en) * 2009-02-11 2011-08-17 陕西师范大学 Semiconductor energy-saving environment-friendly refrigerator
WO2018196680A1 (en) * 2017-04-28 2018-11-01 青岛海尔智能技术研发有限公司 Semiconductor refrigeration device with multiple temperature areas
WO2018196679A1 (en) * 2017-04-28 2018-11-01 青岛海尔智能技术研发有限公司 Semiconductor refrigeration module and refrigeration device
CN108800657A (en) * 2017-04-28 2018-11-13 青岛海尔智能技术研发有限公司 The assemble method of semiconductor refrigerating equipment
CN108800657B (en) * 2017-04-28 2020-07-24 青岛海尔智能技术研发有限公司 Assembling method of semiconductor refrigeration equipment
CN110513961A (en) * 2018-05-22 2019-11-29 余建中 Refrigeration cold insulation can be provided simultaneously and heat the incubator and its temperature control method of thermal protection
CN112902538A (en) * 2021-03-26 2021-06-04 江苏芷泉能源科技有限公司 Multifunctional thermovoltaic refrigeration refrigerator

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C14 Grant of patent or utility model
GR01 Patent grant
DD01 Delivery of document by public notice

Addressee: Chen Zunshan

Document name: Notification of Termination of Patent Right

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070822

Termination date: 20100801