CN217540928U - Semiconductor dehumidifying device and constant humidity equipment with same - Google Patents

Abstract

The utility model discloses a semiconductor dehydrating unit and have its constant humidity equipment, wherein, semiconductor dehydrating unit, include: the semiconductor dehumidification module comprises a semiconductor refrigeration piece, a first radiator, a second radiator and a heat transfer plate, wherein the first radiator and the second radiator are both positioned on the same side of the semiconductor refrigeration piece, and form an air channel; the semiconductor refrigeration piece comprises a first heat transfer end and a second heat transfer end, the first radiator is connected with the first heat transfer end, one end of the heat transfer plate is connected with the second heat transfer end, the other end of the heat transfer plate is connected with the second radiator, the first radiator is communicated with the second radiator to form an air channel, namely the first radiator and the second radiator are arranged side by side, and the improvement of the gas exchange efficiency between the first radiator and the second radiator is facilitated.

Description

Semiconductor dehumidifying device and constant humidity equipment with same

Technical Field

The utility model relates to a humidity control equipment technical field, in particular to semiconductor dehydrating unit and have its constant humidity equipment.

Background

With the development of science and technology, dehumidification devices are widely applied to the life of people, such as data centers, medical equipment rooms, laboratories and even household environments, to realize the adjustment of air humidity.

Semiconductor dehumidification equipment has been applied to a certain extent due to its small volume, simple structure, and low cost. However, because the cold end and the hot end of the semiconductor refrigeration sheet are respectively arranged on the two side surfaces, most of the cold end radiators and the hot end radiators are arranged at the cold end and the hot end of the semiconductor refrigeration sheet in an object manner, and the semiconductor refrigeration sheet causes great interference on air inlet and air outlet of the dehumidification equipment, so that the problem of low air inlet and outlet efficiency of the dehumidification equipment is caused.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least.

In a first aspect, the present invention provides a semiconductor dehumidifying apparatus, including: the semiconductor dehumidification module comprises a semiconductor refrigeration piece, a first radiator, a second radiator and a heat transfer plate, wherein the first radiator and the second radiator are both positioned on the same side of the semiconductor refrigeration piece, and an air channel is formed by the first radiator and the second radiator; the semiconductor refrigeration piece comprises a first heat transfer end and a second heat transfer end, the first radiator is connected with the first heat transfer end, one end of the heat transfer plate is connected with the second heat transfer end, and the other end of the heat transfer plate is connected with the second radiator.

According to the utility model provides a semiconductor dehydrating unit has following beneficial effect at least: the first radiator and the second radiator are both arranged on the same side of the semiconductor refrigerating sheet, and the first radiator and the second radiator are communicated to form an air channel, namely the first radiator and the second radiator are arranged side by side, so that the gas exchange efficiency between the first radiator and the second radiator is improved; the first radiator is connected with the first heat transfer end of the semiconductor refrigeration piece, the second radiator is connected with the second heat transfer end of the semiconductor refrigeration piece through the heat transfer plate in a grounding mode, heat can be transferred to the second radiator from the second heat transfer end of the semiconductor refrigeration piece, the first radiator and the second radiator can be arranged side by side, compared with the traditional first radiator and the traditional second radiator, the semiconductor dehumidification device is in object arrangement on two sides of the semiconductor refrigeration piece through the arrangement of the heat transfer plate and the arrangement mode of the first radiator and the second radiator, the improvement of the air inlet and outlet efficiency between the first radiator and the second radiator is facilitated, and the interference of the semiconductor refrigeration piece on the air inlet and outlet is reduced.

According to some embodiments of the utility model, semiconductor dehumidification module still includes thermal-insulated gasket, and thermal-insulated gasket centers on the peripheral setting of semiconductor refrigeration piece, and thermal-insulated gasket is located between heat transfer board and the first radiator, and thermal-insulated gasket's one end is connected with heat transfer board, and thermal-insulated gasket's the other end is connected with first radiator.

The thermal-insulated gasket sets up around the periphery of semiconductor refrigeration piece, and the thermal-insulated gasket is located between heat transfer board and the first radiator, and the one end and the heat transfer board of thermal-insulated gasket are connected, and the other end and the first radiator of thermal-insulated gasket are connected, and the thermal-insulated gasket plays thermal barrier effect, and the thermal-insulated gasket be provided with do benefit to and reduce the problem that the first heat transfer end and the second heat transfer end of semiconductor refrigeration piece are interfered with each other and are leaded to heat loss.

According to some embodiments of the utility model, first radiator is the cold junction radiator, and the second radiator is the hot junction radiator, and first heat transfer end is the cold junction, and the second heat transfer end is the hot junction, and cold junction radiator and hot junction radiator all are located cold junction one side of semiconductor refrigeration piece, and the cold junction radiator is connected with the cold junction of semiconductor refrigeration piece, and the one end of heat transfer board is connected with the hot junction of semiconductor refrigeration piece, and the other end and the hot junction radiator of heat transfer board are connected.

Specifically, cold junction radiator and hot junction radiator all are located the cold junction one side of semiconductor refrigeration piece to make the cold junction radiator directly meet with the cold junction of semiconductor refrigeration piece, and transmit the heat of the hot junction of semiconductor refrigeration piece to hot junction radiator department through the heat transfer board, the air gets into first radiator department condensation earlier and separates out moisture, in order to realize the function of the humidity of reduction air, then get into the second radiator with the temperature recovery to the state that is close to the room temperature, the air after the dehumidification finally gets into indoorly, thereby realize the function of air dehumidification.

According to some embodiments of the utility model, first radiator is the hot junction radiator, and the second radiator is the cold junction radiator, and first heat transfer end is the hot junction, and second heat transfer end is the cold junction, and cold junction radiator and hot junction radiator all are located hot junction one side of semiconductor refrigeration piece, and the hot junction radiator is connected with the hot junction of semiconductor refrigeration piece, and the one end of heat transfer board is connected with the cold junction of semiconductor refrigeration piece, and the other end and the cold junction radiator of heat transfer board are connected.

Optionally, the cold-end radiator and the hot-end radiator are both positioned on one side of the hot end of the semiconductor refrigeration sheet, and the hot-end radiator is directly abutted to the hot end of the semiconductor refrigeration sheet; the cold junction butt of heat transfer board and semiconductor refrigeration piece to with the heat transfer of cold junction to cold junction radiator department, the air gets into second radiator department condensation earlier and separates out moisture, with the function of the humidity of realization reduction air, then gets into the state of recovering to being close the room temperature with the temperature in the first radiator, and the air after the dehumidification finally gets into indoorly, does also realize the dehumidification of air, the function of temperature recovery.

According to the utility model discloses a some embodiments, the utility model discloses still include first water collector, first water collector setting is located semiconductor dehumidification module's cold junction department and is located semiconductor dehumidification module's below.

In order to avoid the interference of the moisture separated out at the cold end of the semiconductor dehumidifying module on the operation of the semiconductor dehumidifying module, the semiconductor dehumidifying device is also provided with a first water receiving tray which is arranged at the cold end of the semiconductor dehumidifying module, is positioned below the semiconductor dehumidifying module and is used for receiving the moisture separated out by the semiconductor dehumidifying module.

According to some embodiments of the present invention, the semiconductor dehumidifying module is provided in plurality; a plurality of semiconductor dehumidification modules are the setting of arranging around to constitute the semiconductor dehumidification module, a first water collector of a plurality of semiconductor dehumidification modules's cold junction sharing.

Considering actual demand to humidity control, semiconductor dehumidification module can set up a plurality ofly, and a plurality of semiconductor dehumidification modules are arranged around being to form semiconductor dehumidification module, and a plurality of semiconductor dehumidification modules can constitute semiconductor dehumidification module jointly, in order to increase this semiconductor dehumidification device's dehumidification efficiency, and a first water collector of a plurality of semiconductor dehumidification modules's cold junction sharing, thereby realize collecting the moisture of air at the cold junction condensation.

According to some embodiments of the utility model, the semiconductor dehumidification module is equipped with a plurality ofly, and a plurality of semiconductor dehumidification modules are arranged from top to bottom, are equipped with first water collector between two adjacent semiconductor dehumidification modules, and a plurality of first water collectors all communicate.

According to actual demand to humidity control, the semiconductor dehumidification module can set up a plurality ofly, a plurality of semiconductor dehumidification modules are and arrange from top to bottom, and all be provided with first water collector between two adjacent semiconductor dehumidification modules from top to bottom, being provided with of first water collector does benefit to the collection of the moisture of realization at the cold junction department condensation to the air, be favorable to avoiding the water droplet landing to cause the problem of interference to adjacent semiconductor dehumidification module to appear, and be provided with through first water collector and do benefit to the interval setting of two adjacent semiconductor dehumidification modules about realizing, be favorable to avoiding the hot junction and the cold junction of two semiconductor refrigeration pieces from top to bottom to interfere with each other and lead to the problem appearance that the heat scatters and disappears.

According to the utility model discloses a some embodiments, first radiator is equipped with a plurality of first fin that are interval arrangement around being, and the second radiator is equipped with a plurality of second fins that are interval arrangement around being, and first fin is parallel to each other with the second fin, and first fin and second fin all are and extend the setting about.

The first radiator is provided with a plurality of first radiating fins which are arranged at intervals from front to back, the second radiator is provided with a plurality of second radiating fins which are arranged at intervals from front to back, the intervals between the first radiators and the intervals between the second radiating fins can be used for air flowing so as to realize dehumidification and temperature return of air, the first radiating fins are parallel to the second radiating fins, namely, the flow channels of the first radiators are mutually communicated with the flow channels of the second radiators, and the improvement of the circulation efficiency of the air between the first radiators and the second radiators is facilitated.

In a second aspect, the present invention also provides a constant humidity device, including: the semiconductor dehumidification device of any one of the first to third aspects; the humidifying device and the semiconductor dehumidifying device are arranged in sequence; a fan is arranged between the partition board and the semiconductor dehumidifying device, a through hole corresponding to the fan is formed in the partition board, and the semiconductor dehumidifying device, the fan and the humidifying device are sequentially arranged to form an air channel.

According to the utility model provides a constant humidity equipment has following beneficial effect at least: the constant humidity equipment is also provided with a humidifying device, and the humidifying device is matched with the semiconductor dehumidifying device, so that the indoor humidity can be controlled within a constant range, and a constant humidity environment can be created for a user; the arrangement of the partition plate can realize the separation of the semiconductor dehumidifying device and the humidifying device, the partition plate is provided with a through hole corresponding to the fan, the semiconductor dehumidifying device, the fan and the humidifying device are sequentially arranged to form an air channel, and the arrangement of the partition plate is favorable for enabling air to flow in a single direction and reducing the problem of air turbulence, so that the air inlet and outlet efficiency of the constant humidity equipment is improved; the first radiator and the second radiator are both arranged on the same side of the semiconductor refrigerating sheet, and the first radiator and the second radiator are communicated to form an air channel, namely the first radiator and the second radiator are arranged side by side, so that the gas exchange efficiency between the first radiator and the second radiator is improved; the first radiator is connected with the first heat transfer end of the semiconductor refrigeration piece, the second radiator is connected with the second heat transfer end of the semiconductor refrigeration piece through the heat transfer plate in a grounding mode, heat can be transferred to the second radiator from the second heat transfer end of the semiconductor refrigeration piece, the first radiator and the second radiator can be arranged side by side, compared with the traditional first radiator and the traditional second radiator, the semiconductor dehumidification device is in object arrangement on two sides of the semiconductor refrigeration piece, the semiconductor dehumidification device is favorable for improving the air inlet and outlet efficiency between the first radiator and the second radiator through the arrangement of the heat transfer plate and the arrangement mode of the first radiator and the second radiator, and the interference of the semiconductor refrigeration piece on the air inlet and outlet is reduced.

According to some embodiments of the utility model, humidification device is equipped with a plurality of bleeder vents including being used for the wet curtain of air humidifying on the wet curtain, and the air-out direction of wet curtain and fan is perpendicular.

The wet curtain keeps moist, and the fan drives the air and is the vertical direction and blows to wet curtain department, is equipped with a plurality of bleeder vents on the wet curtain for the air to pass to can improve the humidity of the air of passing wet curtain, thereby realize the humidification function.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic perspective view of a constant humidity apparatus provided in an embodiment of the present invention;

fig. 2 is a schematic perspective view of a constant humidity device (without a housing) according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of a constant humidity apparatus provided by an embodiment of the present invention;

fig. 4 is a cross-sectional view of another angle of a constant humidity apparatus according to an embodiment of the present invention;

fig. 5 is a schematic perspective view of a semiconductor dehumidification module of a constant humidity apparatus according to an embodiment of the present invention;

fig. 6 is a cross-sectional view of a semiconductor dehumidification module of a constant humidity apparatus according to an embodiment of the present invention.

In the drawings: 100. a semiconductor dehumidification device; 110. a semiconductor dehumidification module; 111. a semiconductor refrigeration sheet; 112. a first heat sink; 1121. a first heat sink; 113. a second heat sink; 1131. a second heat sink; 114. a heat transfer plate; 115. a heat insulating spacer; 120. a first water pan; 130. a partition plate; 200. a humidifying device; 210. wet curtain; 220. a water inlet valve; 230. a second water pan; 300. a housing; 400. a fan.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of terms means an indefinite amount, and a plurality of terms means two or more, and the terms greater than, less than, exceeding, etc. are understood to include no essential numbers, and the terms greater than, less than, within, etc. are understood to include essential numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated. Additionally, appearing throughout and/or representing three side-by-side scenarios, e.g., A and/or B represents a scenario satisfied by A, a scenario satisfied by B, or a scenario satisfied by both A and B.

In the description of the present invention, if there is a phrase containing a plurality of features arranged side by side, the phrase is defined by the closest feature, for example: b, C disposed on A, and E connected to D, wherein B is disposed on A and E is connected to D, and C is not limited; however, terms indicating relationships between features such as "spaced apart", "arranged in a ring", etc. do not fall within this category. The phrase with the word "mean" before it is meant to be a definition of all features in the phrase, e.g., B, C, D, both disposed on a, means B, C and D both disposed on a.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

Embodiments of the present invention will be described with reference to fig. 1 to 6.

Embodiment one, referring to fig. 1-2, an embodiment of the present invention provides a constant humidity device, including: semiconductor dehydrating unit 100, humidifying unit 200, fan 400, partition 130 and casing 300.

Referring to fig. 1, wherein the semiconductor dehumidifying apparatus 100, the humidifying apparatus 200 and the partition 130 are all disposed in a housing 300, the housing 300 can be used for hoisting with an indoor ceiling, a ceiling or a wall, so as to implement installation of the constant humidity apparatus. The left end and the right end of the housing 300 are respectively provided with an air inlet and an air outlet, the partition 130 is vertically arranged in the housing 300 and divides the housing 300 into a dehumidification area and a humidification area, the dehumidification area is communicated with the air inlet, and the humidification area is communicated with the air outlet.

Referring to fig. 3 and 4, the semiconductor dehumidifying apparatus 100 includes a semiconductor dehumidifying module 110, the semiconductor dehumidifying module 110 is disposed in a dehumidifying area, and a fan 400 is disposed between a partition 130 and the semiconductor dehumidifying module 110, the partition 130 is provided with a through hole corresponding to the fan 400, and the semiconductor dehumidifying apparatus 100, the fan 400 and the humidifying apparatus 200 are sequentially disposed and form an air passage. The constant humidity device can realize the functions of dehumidifying and humidifying air by arranging one or a group of fans 400 and matching the operation of the semiconductor dehumidifying device 100 and the humidifying device 200, and is favorable for reducing the manufacturing cost of the constant humidity device. The baffle 130 is arranged to facilitate the unidirectional flow of air and avoid the problem of air turbulence. The fan 400 may be an axial fan 400, a centrifugal fan 400, or the like.

Referring to fig. 5 and 6, in particular, the semiconductor dehumidification module 110 includes a semiconductor cooling fin 111, a first heat sink 112, a second heat sink 113, and a heat transfer plate 114. The semiconductor refrigeration sheet 111 is transversely arranged, the lower end of the semiconductor refrigeration sheet 111 is a first heat transfer end, the upper end of the semiconductor refrigeration sheet is a second heat transfer end, the first heat transfer end is a cold end, and the second heat transfer end is a hot end. The first radiator 112 and the second radiator 113 are both located on one side of the cold end of the semiconductor chilling plate 111, that is, the first radiator 112 and the second radiator 113 are both located below the semiconductor chilling plate 111; the first radiator 112 is a cold-end radiator and is used for abutting against the cold end of the semiconductor refrigeration sheet 111; the second heat sink 113 is a hot-side heat sink, and is configured to abut against the hot side of the semiconductor cooling fin 111.

The upper end of the first radiator 112 is directly abutted with the cold end face of the semiconductor refrigeration sheet 111, namely, the cold end heat of the semiconductor refrigeration sheet 111 is directly transferred to the first radiator 112, the left end of the heat transfer plate 114 covers the hot end face of the semiconductor refrigeration sheet 111 and is attached to the hot end face, the right end of the heat transfer plate 114 is abutted with the second radiator 113, namely, the second radiator 113 is indirectly abutted with the hot end of the semiconductor refrigeration sheet 111 through the transfer function of the heat transfer plate 114, and the hot end heat of the semiconductor refrigeration sheet 111 is transferred to the second radiator 113, so that the first radiator 112 and the second radiator 113 are arranged side by side.

The first heat sink 112 includes first heat dissipation fins 1121 arranged in a front-rear arrangement, the first heat dissipation fins 1121 arranged at intervals therebetween to form an air flow passage, and the second heat sink 113 includes second heat dissipation fins 1131 arranged in a front-rear interval, the second heat dissipation fins 1131 arranged at intervals therebetween to form an air flow passage.

The first heat sink 1121 and the second heat sink 1131 are parallel to each other, and both the first heat sink 1121 and the second heat sink 1131 are arranged to extend left and right, that is, the air flow channel of the first heat sink 112 is communicated with the air flow channel of the second heat sink 113, the first heat sink 112 is located at the left end of the second heat sink 113, and the air outlet of the first heat sink 112 is communicated with the air inlet of the second heat sink 113.

Referring to fig. 2, 3 and 4, the air entering the semiconductor dehumidifying apparatus 100 first enters the first heat sink 112, and is condensed and separated out a part of moisture at the first heat sink 112, so as to implement the dehumidifying function for the air, and then the air enters the second heat sink 113, and under the heat transfer action of the second heat sink 113, the temperature of the air is restored to be close to the room temperature, which is beneficial to implementing the control for the air humidity.

The heat transfer plate 114 is provided with a bevel at the joint of the first radiator 112 and the second radiator 113, which is beneficial to realizing the joint of the heat transfer plate 114 with the semiconductor chilling plate 111 and the second radiator 113 and reducing the overall thickness of the heat transfer plate 114. The heat transfer plate 114, the first radiator 112 and the second radiator 113 may be made of metal material with good heat transfer performance, such as aluminum and steel.

Most of the semiconductor refrigeration sheets 111 of the existing semiconductor dehumidification equipment are vertically arranged, and a cold-end radiator and a hot-end radiator are clamped on two sides of the semiconductor refrigeration sheets 111 in an object manner, so that when air is transferred from the cold-end radiator to the hot-end radiator, if the air is guided to directly pass through in a transverse direction, the air is obstructed by the semiconductor refrigeration sheets 111, and a common solution is to arrange fans 400 at the cold-end radiator and the hot-end radiator, so that the air circulation is ensured, but the manufacturing cost of the dehumidification equipment is increased; by arranging the enclosing plates, part of the semiconductor dehumidification equipment enables air flowing through the cold-end radiator to flow into an air flow channel enclosed by the enclosing plates and finally to be guided to the hot-end radiator, so that the flow path of the air is prolonged, and the loss of wind energy and heat is increased.

Compared with the conventional semiconductor dehumidifying device, the semiconductor chilling plate 111 of the semiconductor dehumidifying device 100 is transversely arranged, and the air transversely flows, which is beneficial to reducing the interference of the semiconductor chilling plate 111 on the air flow, and the first radiator 112 and the second radiator 113 are arranged side by side, so that the dehumidifying and temperature returning functions are ensured, meanwhile, the flow path of the air is beneficial to being shortened, the loss of wind energy is reduced, and the air inlet and outlet efficiency between the first radiator 112 and the second radiator 113 is increased. Compared with the conventional dehumidification equipment which adopts a compressor to realize dehumidification, the semiconductor dehumidification device 100 adopts the semiconductor dehumidification principle, and is beneficial to reducing the noise generated during dehumidification.

The semiconductor dehumidification module 110 further comprises a heat insulation gasket 115, the heat insulation gasket 115 surrounds the periphery of the semiconductor chilling plate 111, the heat insulation gasket 115 is arranged between the heat transfer plate 114 and the first radiator 112, the upper end of the heat insulation gasket 115 is abutted to the lower end face of the heat transfer plate 114, the lower end of the heat insulation gasket 115 is abutted to the upper end face of the first radiator 112, and the arrangement of the heat insulation gasket is beneficial to reducing the problem of heat loss caused by mutual interference between the cold end and the hot end of the semiconductor chilling plate 111. The insulating pad 115 may be a material with better insulating properties, such as foam, plastic, etc.

Referring to fig. 2, in consideration of the actual requirement for humidity control, the semiconductor dehumidifying apparatus 100 is provided with a plurality of semiconductor dehumidifying modules 110, and the plurality of semiconductor dehumidifying modules 110 are all disposed within a dehumidifying area of a housing 300. The semiconductor dehumidification modules 110 are arranged in a front-back manner to form a semiconductor dehumidification module, and the cold ends of the semiconductor dehumidification modules 110 share one first water pan 120.

The semiconductor dehumidification module is equipped with a plurality ofly, and a plurality of semiconductor dehumidification modules are arranged from top to bottom, are equipped with first water collector 120 between two adjacent semiconductor dehumidification modules, and the water pipe intercommunication that extends about a plurality of first water collector 120 accessible to realize the discharge of comdenstion water from a drain outlet department.

The semiconductor dehumidification device 100 can construct a semiconductor dehumidification module through the plurality of semiconductor dehumidification modules 110, and the semiconductor dehumidification module is constructed to improve the dehumidification efficiency of the whole device, so that the semiconductor dehumidification device 100 is favorable for improving the applicability of different use environments.

The humidifying device 200 comprises a water inlet valve 220, a second water receiving tray 230, a water pump and a wet curtain 210 for humidifying air, wherein a plurality of air holes are formed in the wet curtain 210, the wet curtain 210 is perpendicular to the air outlet direction of the fan 400, the water inlet valve 220 is connected with the upper end of the wet curtain 210, the second water receiving tray 230 is arranged below the wet curtain 210, the water outlet of the second water receiving tray 230 is connected with the water pump, and the water pump is connected with the water inlet valve 220.

The water inlet valve 220 may be connected to an external water pipe, when the humidifying device 200 is activated, the water inlet valve 220 guides water flow to the wet curtain 210 from top to bottom, so that the wet curtain 210 is kept wet, and the fan 400 drives air to blow toward the wet curtain 210 in a vertical direction, thereby increasing the humidity of the air passing through the wet curtain 210, and achieving the air humidifying function.

The second water pan 230 is used for receiving water drops at the lower end of the wet curtain 210, a water outlet of the second water pan 230 is connected with a water pump, the water pump is connected with the water inlet valve 220, and water in the second water pan 230 can be repeatedly conveyed to the water inlet valve 220 under the circulation of the water pump, so that the cyclic utilization of water energy is facilitated, and the effect of saving water is achieved. The arrangement of the water inlet valve 220, the second water collecting tray 230 and the water pump is beneficial to reducing the use burden of a user, and the user does not need to pay attention to the water quantity of the wet curtain 210 or manually add and drain water.

The traditional ultrasonic humidifier belongs to a vulnerable electric part, has a short service life, and is extremely inconvenient to maintain after being damaged. Compared with the conventional ultrasonic humidifier, the embodiment of the present invention provides a humidifying device 200 that is favorable to improving the durability of the constant humidity device through the arrangement of the wet curtain 210. The wet curtain 210 may be a honeycomb paper material, such as a wood material, with better water absorption and mildew resistance.

In some other embodiments of the present invention, the constant humidity device further comprises a humidity sensor and a controller, the humidity sensor and the semiconductor dehumidification device 100 are electrically connected to the controller, and the humidity sensor and the humidification device 200 are electrically connected to the controller.

When the humidity sensor detects that the humidity in the room is higher than a set threshold, for example, when the humidity sensor detects that the humidity in the room is higher (greater than 60%), the constant humidity device starts the dehumidification function. The humidity sensor is triggered and sends a first detection signal to the controller, after the controller receives the first detection signal, the controller generates and sends a first control signal to the semiconductor dehumidifying device 100, the first control signal controls the semiconductor dehumidifying device 100 to start, and the fan 400 starts. The fan 400 sucks in indoor moist air, the moist air firstly flows into the first radiator 112 to analyze water, the temperature is raised to be close to room temperature through the second radiator 113, the semiconductor dehumidifying device 100 conveys the dehumidified air indoors, and the water separated out in the dehumidifying working state flows out from the first water pan 120 through the drain pipe. When the humidity in the humidity sensor detection chamber is maintained at 50 ± 3% for more than 15 minutes, the humidity sensor generates a second detection signal and transmits the second detection signal to the controller, and the controller generates a second control signal, and the second control signal controls the semiconductor dehumidifying apparatus 100 to stop operating.

When the humidity sensor detects that the humidity in the room is lower than a set threshold value, for example, when the humidity sensor detects that the humidity in the room is lower (less than 40%), the constant humidity device starts the humidifying function. The humidity sensor triggers and sends a third detection signal to the controller, after the controller receives the third detection signal, the controller generates and sends a third control signal to the humidifying device 200, and the third control signal controls the fan 400 and the humidifying device 200 to start. The water inlet valve 220 guides water from top to bottom to the wet curtain 210, so as to maintain the wet state of the wet curtain 210, the fan 400 sucks in dry air in the room, the dry air is vertically blown to the wet curtain 210, and the humidity of the air is increased under the humidifying action of the wet curtain 210 and finally enters the indoor environment. When the humidity in the humidity sensor detection chamber is maintained at 50 ± 3% for more than 15 minutes, the humidity sensor generates a fourth detection signal and sends the fourth detection signal to the controller, and the controller generates a fourth control signal, and the fourth control signal controls the humidifying device 200 to stop operating.

The constant humidity device can intelligently adjust the humidity of indoor air through the cooperation of the humidity sensor and the controller, does not need to be operated by a user, and is favorable for improving the comfort of the user in using the constant humidity device.

It should be noted that, the control method of the controller is a conventional technical means, and does not belong to the protection scope of the present invention. The structure and principle of the semiconductor chilling plate 111 are conventional in the art.

In some other embodiments of the present invention, the semiconductor cooling plate 111 is disposed horizontally, the upper end of the semiconductor cooling plate 111 is a first heat transferring end and the lower end is a second heat transferring end, the first heat transferring end is a cold end and the second heat transferring end is a hot end. The first heat sink 112 is a cold side heat sink and the second heat sink 113 is a hot side heat sink. The cold end radiator and the hot end radiator are both located on one side of the cold end of the semiconductor refrigeration piece 111, namely, the first radiator 112 and the second radiator 113 are both located above the semiconductor refrigeration piece 111, the lower end of the first radiator 112 is directly abutted to the cold end face of the semiconductor refrigeration piece 111, namely, the cold end heat of the semiconductor refrigeration piece 111 is directly transferred to the first radiator 112, the right end of the heat transfer plate 114 is abutted to the second radiator 113, the left end of the heat transfer plate 114 covers the hot end face of the semiconductor refrigeration piece 111 and is attached to the hot end face, namely, the heat transfer effect of the heat transfer plate 114 is achieved, the heat of the semiconductor refrigeration piece 111 can be indirectly transferred to the hot end of the second radiator 113, and therefore the first radiator 112 and the second radiator 113 are arranged side by side.

In some other embodiments of the present invention, the semiconductor cooling plate 111 is disposed transversely, the upper end of the semiconductor cooling plate 111 is a first heat transferring end and the lower end is a second heat transferring end, the first heat transferring end is a hot end and the second heat transferring end is a cold end. The first radiator 112 is a hot-end radiator, the second radiator 113 is a cold-end radiator, the first radiator 112 and the second radiator 113 are both located on one side of the hot end of the semiconductor chilling plate 111, that is, the first radiator 112 and the second radiator 113 are both located above the semiconductor chilling plate 111, the lower end of the first radiator 112 is directly abutted to the hot end face of the semiconductor chilling plate 111, that is, the hot end heat of the semiconductor chilling plate 111 is directly transferred to the first radiator 112, the left end of the heat transfer plate 114 is abutted to the second radiator 113, the right end of the heat transfer plate 114 covers the cold end face of the semiconductor chilling plate 111 and is attached to the cold end face, that is, the heat transfer effect of the heat transfer plate 114 is utilized to indirectly transfer the cold end heat of the semiconductor chilling plate 111 to the second radiator 113, so that the first radiator 112 and the second radiator 113 are arranged side by side.

In some other embodiments of the present invention, the semiconductor cooling plate 111 is disposed horizontally, the upper end of the semiconductor cooling plate 111 is the second heat transferring end and the lower end is the first heat transferring end, the first heat transferring end is the hot end and the second heat transferring end is the cold end. The first radiator 112 is a hot-end radiator and the second radiator 113 is a cold-end radiator, the first radiator 112 and the second radiator 113 are both located on one side of the hot end of the semiconductor chilling plate 111, that is, the first radiator 112 and the second radiator 113 are both located below the semiconductor chilling plate 111, the upper end of the first radiator 112 is directly abutted against the hot end face of the semiconductor chilling plate 111, that is, the hot end heat of the semiconductor chilling plate 111 is directly transferred to the first radiator 112, the left end of the heat transfer plate 114 is abutted against the second radiator 113, the right end of the heat transfer plate 114 covers the cold end face of the semiconductor chilling plate 111 and is attached to the cold end face, that is, the cold end heat of the semiconductor chilling plate 111 can be indirectly transferred to the second radiator 113 through the transfer function of the heat transfer plate 114, and therefore the parallel arrangement of the first radiator 112 and the second radiator 113 is realized.

In some other embodiments of the present invention, the fan 400 may be disposed at the left of the semiconductor dehumidifying apparatus 100, and under the blowing action of the fan 400, air may enter the semiconductor dehumidifying apparatus 100 and the humidifying apparatus 200, so as to realize the dehumidifying and humidifying functions of air.

In other embodiments of the present invention, the fan 400 is disposed on the left and right of the semiconductor dehumidifying apparatus 100, and under the blowing action of the fan 400, the air can enter the semiconductor dehumidifying apparatus 100 and the humidifying apparatus 200 to achieve the dehumidifying and humidifying functions of the air.

While the preferred embodiments of the present invention have been described in detail, it is to be understood that the invention is not limited to the precise embodiments, and that various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. A semiconductor dehumidification apparatus, comprising:

the semiconductor dehumidification module (110) comprises a semiconductor refrigeration sheet (111), a first radiator (112), a second radiator (113) and a heat transfer plate (114), wherein the first radiator (112) and the second radiator (113) are located on the same side of the semiconductor refrigeration sheet (111), and the first radiator (112) and the second radiator (113) form an air channel; the semiconductor refrigeration piece (111) comprises a first heat transfer end and a second heat transfer end, the first radiator (112) is connected with the first heat transfer end, one end of the heat transfer plate (114) is connected with the second heat transfer end, and the other end of the heat transfer plate (114) is connected with the second radiator (113).

2. The semiconductor dehumidification device according to claim 1, wherein the semiconductor dehumidification module (110) further comprises a heat insulation gasket (115), the heat insulation gasket (115) is disposed around a periphery of the semiconductor refrigeration sheet (111), the heat insulation gasket (115) is located between the heat transfer plate (114) and the first heat sink (112), one end of the heat insulation gasket (115) is connected to the heat transfer plate (114), and the other end of the heat insulation gasket (115) is connected to the first heat sink (112).

3. The semiconductor dehumidifying device of claim 1, wherein the first heat sink (112) is a cold-end heat sink, the second heat sink (113) is a hot-end heat sink, the first heat transfer end is a cold end, the second heat transfer end is a hot end, the cold-end heat sink and the hot-end heat sink are both located on one side of the cold end of the semiconductor chilling plate (111), the cold-end heat sink is connected to the cold end of the semiconductor chilling plate (111), one end of the heat transfer plate (114) is connected to the hot end of the semiconductor chilling plate (111), and the other end of the heat transfer plate (114) is connected to the hot-end heat sink.

4. The semiconductor dehumidifying device of claim 1, wherein the first heat sink (112) is a hot-end heat sink, the second heat sink (113) is a cold-end heat sink, the first heat transfer end is a hot end, the second heat transfer end is a cold end, the cold-end heat sink and the hot-end heat sink are both located on a hot-end side of the semiconductor chilling plate (111), the hot-end heat sink is connected to the hot end of the semiconductor chilling plate (111), one end of the heat transfer plate (114) is connected to the cold end of the semiconductor chilling plate (111), and the other end of the heat transfer plate (114) is connected to the cold-end heat sink.

5. The semiconductor dehumidification device according to claim 3 or 4, further comprising a first water tray (120), wherein the first water tray (120) is disposed at the cold end of the semiconductor dehumidification module (110) and below the semiconductor dehumidification module (110).

6. The semiconductor dehumidification device according to claim 5, wherein a plurality of semiconductor dehumidification modules (110) are provided; the semiconductor dehumidification modules (110) are arranged in a front-back mode to form a semiconductor dehumidification module, and cold ends of the semiconductor dehumidification modules (110) share one first water pan (120).

7. The semiconductor dehumidification device according to claim 6, wherein a plurality of semiconductor dehumidification modules are arranged in an up-down manner, the first water pan (120) is disposed between two adjacent semiconductor dehumidification modules, and the first water pans (120) are all communicated.

8. The semiconductor dehumidification device according to claim 1, wherein the first heat sink (112) is provided with a plurality of first heat dissipation fins (1121) arranged at a distance from each other in a front-to-rear direction, the second heat sink (113) is provided with a plurality of second heat dissipation fins (1131) arranged at a distance from each other in a front-to-rear direction, the first heat dissipation fins (1121) and the second heat dissipation fins (1131) are parallel to each other, and the first heat dissipation fins (1121) and the second heat dissipation fins (1131) are arranged to extend in a left-to-right direction.

9. A constant humidity apparatus, comprising:

the semiconductor dehumidification device (100) of any of claims 1 to 8;

the humidifying device (200) and the semiconductor dehumidifying device (100) are sequentially arranged;

the semiconductor dehumidifying device comprises a partition board (130), wherein the partition board (130) is located between the semiconductor dehumidifying device (100) and the humidifying device (200), a fan (400) is arranged between the partition board (130) and the semiconductor dehumidifying device (100), a through hole corresponding to the fan (400) is formed in the partition board (130), and the semiconductor dehumidifying device (100), the fan (400) and the humidifying device (200) are sequentially arranged to form an air channel.

10. The constant humidity equipment as claimed in claim 9, wherein the humidifying device (200) comprises a wet curtain (210) for humidifying air, the wet curtain (210) is provided with a plurality of air holes, and the wet curtain (210) is perpendicular to the air outlet direction of the fan (400).

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