CN108397935A - Heat-exchanger rig and semiconductor refrigerating equipment with the heat-exchanger rig - Google Patents

Abstract

The invention discloses a heat exchange device and semiconductor refrigeration equipment with the heat exchange device. The fin group of the heat exchange device includes a heat conduction substrate fin group located on a heat conduction substrate and two heat conduction body fins located on a heat conduction body. The heat conduction substrate fin group is located between the two heat conduction body fin groups. The present invention can strengthen the heat dissipation of the heat conduction substrate due to the arrangement of the heat conduction substrate fin group, and can improve the heat dissipation efficiency of the heat exchange device with the same volume. The assembly of the centrifugal fan and the fin group in the present invention can reduce the thickness of the heat exchange device. The invention adopts one air supply device to make the airflow flow through two heat conducting body fin groups and one heat conduction base plate fin group at the same time, which can improve the utilization rate of the air supply device and reduce the noise of the heat exchange device.

Description

Heat exchange device and semiconductor refrigeration equipment with the heat exchange device

technical field

The invention belongs to the technical field of refrigeration equipment, in particular to a heat exchange device and semiconductor refrigeration equipment with the heat exchange device.

Background technique

Semiconductor refrigeration equipment uses semiconductor refrigeration sheets to achieve refrigeration through heat pipe heat dissipation and conduction technology and automatic variable pressure and variable flow control technology. It does not require refrigeration fluids and mechanical moving parts, and solves the application problems of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical vibration. However, the cold end of the semiconductor refrigeration chip will generate a large amount of heat at the hot end while cooling. In order to ensure the reliable and continuous operation of the semiconductor refrigeration chip, it is necessary to dissipate heat from the hot end in time. The heat dissipation of the hot end of the fin generally adopts the scheme of forced convection heat dissipation by setting the fan to improve the heat exchange efficiency, but the heat dissipation fin itself is relatively large; in addition, an axial flow fan is installed on one side of the heat dissipation fin group, The airflow can be blown to the gap between every two adjacent fins, or the airflow can be sucked in from the gap between every two adjacent fins. This kind of heat exchanger is relatively large in size and requires a large installation space, and is not suitable for installation in a small space. In addition, the heat dissipation of the hot end is usually achieved by increasing the speed and power of the fan, which has poor heat dissipation efficiency, high noise and high energy consumption.

The existing heat dissipation device cannot effectively solve the problem of high-power heat dissipation of semiconductor refrigeration modules with high heat flux density, so that its cooling capacity cannot be guaranteed, and the volume of conventional semiconductor refrigeration equipment is generally <=68L; and when the ambient temperature is 32°C, the box The internal temperature can only be pulled down to 12°C, and a lower temperature cannot be achieved, resulting in the inability to achieve large-volume refrigeration.

Contents of the invention

The object of the present invention is to provide a heat exchange device for semiconductor refrigeration equipment, which solves the technical problems of large installation space and poor heat dissipation efficiency caused by the large volume of the existing heat exchange device.

In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions to achieve:

A heat exchange device for semiconductor refrigeration equipment, comprising:

a thermally conductive substrate for absorbing heat from at least one heat source, or, absorbing cooling from at least one heat sink;

A plurality of heat conductors, including a middle heat conductor section fixed to the heat conduction substrate and end heat conductor sections located at both ends of the middle heat conductor section;

The fin group includes a heat conduction substrate fin group and two heat conductor fin groups, the heat conduction substrate fin group is located on the heat conduction substrate, and the heat conductor fin group is located on the end heat conductor section , the heat conduction substrate fin group is located between two heat conductor fin groups;

An air duct assembly, which defines an airflow channel connecting the gap between the adjacent fins of the fin group of the heat-conducting substrate and the gap between the adjacent fins of the fin group of the heat-conducting body;

A centrifugal fan, installed in the airflow channel, the rotation axis of the centrifugal fan is perpendicular to the arrangement direction of the fin sets, and is configured to suck airflow from its axial direction and let the airflow flow out from its radial direction, and then The heat conduction substrate fin group and the two heat conduction body fin groups respectively flow through the airflow channel.

According to the above-mentioned heat exchange device for semiconductor refrigeration equipment, the fin group of the heat conduction substrate includes several fins, and the fins are curved surfaces.

According to the above-mentioned heat exchange device for semiconductor refrigeration equipment, the air duct assembly includes an air duct side plate and two air duct cover plates, the air duct side plate includes an arc portion, and the centrifugal fan is located on the In the space enclosed by the arc portion and the two air duct cover plates, an air inlet opposite to the centrifugal fan is opened on the air duct cover plate.

In the above-mentioned heat exchange device for semiconductor refrigeration equipment, the air channel side plate and the air channel cover plate form a space for accommodating the fin group, and the air channel cover plate is far from the end of the centrifugal fan An air outlet is opened, and an opening for exposing the heat-conducting substrate is opened on the air duct cover plate.

According to the above-mentioned heat exchange device for semiconductor refrigeration equipment, an arc-shaped air deflector is provided on the air inlet side of the fin set of the heat conductor opposite to the centrifugal fan.

In the above-mentioned heat exchange device for semiconductor refrigeration equipment, the first end of the arc-shaped air guide plate is in contact with the middle part of the air inlet side of the fin group of the heat conductor, and the first end of the arc-shaped air guide plate There is a certain gap between the two ends and the centrifugal fan.

According to the above-mentioned heat exchange device for semiconductor refrigeration equipment, the arc surface where the air deflector is located is tangent to the centrifugal fan.

In the above-mentioned heat exchange device for semiconductor refrigeration equipment, the heat conductor fin set has an air intake side opposite to the centrifugal fan, and the heat conduction substrate fin set has an air intake side opposite to the centrifugal fan. A windshield is provided between the air inlet side of the heat conductor fin group and the air inlet side of the heat conduction substrate fin group.

According to the above-mentioned heat exchange device for semiconductor refrigeration equipment, the windshield is arc-shaped.

A semiconductor refrigeration device, comprising a casing, an inner container, a semiconductor refrigeration sheet and an insulating layer arranged on the inner container, the casing and the insulating layer define an installation space, and the above-mentioned replacement parts are installed in the installation space The heat device, the housing is provided with an air inlet and an air outlet, the air inlet communicates with the air inlet of the heat exchange device, the air outlet communicates with the air outlet of the heat exchange device, the The heat conducting substrate is directly or indirectly connected to the hot end of the semiconductive cooling sheet.

Compared with the prior art, the advantages and positive effects of the present invention are: the fin group used in the heat exchange device of the semiconductor refrigeration equipment in the present invention includes a heat-conducting substrate fin group located on the heat-conducting substrate and two fin groups located on the heat-conducting body. There are two heat-conducting body fin groups, and the heat-conducting substrate fin group is located between two heat-conducting body fin groups. The present invention can strengthen the heat dissipation of the heat-conducting substrate due to the arrangement of the heat-conducting substrate fin group, and can improve the heat exchange device with the same volume. cooling efficiency. The assembly of the centrifugal fan and the fin group in the present invention can reduce the thickness of the heat exchange device. The invention adopts one air supply device to make the air flow flow through two heat conducting body fin groups and one heat conduction base plate fin group at the same time, which can improve the utilization rate of the air supply device and reduce the noise of the heat exchange device.

The invention can effectively solve the heat dissipation problem of high heat flux density and high thermal power of the semiconductor refrigeration module. Under the condition of ensuring a volume of 50-200L, the temperature inside the refrigeration equipment can be lower than the ambient temperature by 27-30°C, such as: ambient temperature 32°C, the internal temperature of semiconductor refrigeration equipment can be pulled down to <=5°C.

Other features and advantages of the present invention will become more apparent after reading the detailed description of the embodiments of the present invention in conjunction with the accompanying drawings.

Description of drawings

Fig. 1 is a schematic diagram of a heat exchange device according to an embodiment of the present invention.

FIG. 2 is a schematic view of the rear view of FIG. 1 .

Fig. 3 is a schematic diagram of Fig. 1 with the upper part of the air duct cover plate removed.

Fig. 4 is a longitudinal sectional view of Fig. 2 along the central axis.

Fig. 5 is an assembly diagram of a heat conducting substrate, a heat conducting body and a fin group according to an embodiment of the present invention.

Fig. 6 is a schematic side view of a peltier device according to an embodiment of the present invention.

In the figure, 1, heat conductor; 11, first end heat conductor section; 12, second end heat conductor section; 13, middle heat conductor section; 14, transition section; 21, first heat conduction substrate; 22, second end 2. Heat conduction substrate; 221, heat exchange surface; 3, fin group of heat conduction substrate; 31, air inlet side; 41, first heat conductor fin group; 411, air inlet side; 42, second heat conductor fin group; 421. Air inlet side; 5. Air flow channel; 61. Air duct side plate; 611. Arc portion; 612. Plane portion; 62. Air duct cover plate; 621. Square portion; 622. Semicircular portion; 623. Air inlet; 624, air outlet; 625, opening; 7, centrifugal fan; 81, first arc-shaped wind deflector; 82, second arc-shaped wind deflector; 91, first wind deflector; 92, second deflector 101, shell; 1011, air inlet; 1012, air outlet; 102, inner tank; 103, semiconductor refrigeration sheet; 104, insulation layer.

Detailed ways

Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

This embodiment proposes a heat exchange device for semiconductor refrigeration equipment. The heat exchange device is used for direct or indirect contact with the semiconductor refrigeration chip, and quickly releases the heat or cold generated by the semiconductor refrigeration chip.

As shown in Figures 1-4, the heat exchange device of this embodiment includes: a heat conduction substrate, a heat conductor, a fin set, an air duct assembly, and a centrifugal fan. The following describes each part of the heat exchange device in detail:

The thermally conductive substrate is used for absorbing heat from at least one heat source, or absorbing cold energy from at least one cold source. In semiconductor refrigeration equipment, the heat-conducting substrate is directly or indirectly in contact with the hot end of the semiconductor refrigeration sheet, absorbing the heat generated by the hot end of the semiconductor refrigeration sheet and releasing the heat generated by the hot end of the semiconductor refrigeration sheet. In this embodiment, the heat conduction substrate includes a first heat conduction substrate 21 and a second heat conduction substrate 22 for clamping a heat conductor, and the first heat conduction substrate 21 and the second heat conduction substrate 22 clamp the heat conductor and are fixedly installed. The second heat-conducting substrate 22 has a heat exchange surface 221 in direct or indirect contact with the peltier.

A plurality of heat conductors 1 are used to export the heat on the heat conduction substrate to the fin group of the heat conductor. The heat conductors 1 are distributed at intervals on the heat conduction substrate, and the heat conductors 1 are heat pipes. The heat conductor 1 includes a middle heat conductor section 13 fixed on the heat conduction substrate, and a first end heat conductor section 11 and a second end heat conductor section 12 located at two ends of the middle heat conductor section 13 . Wherein, the first end heat conductor segment 11 and the second end heat conductor segment 12 are located on two sides of the heat conduction substrate. The middle heat conductor section 13 is arranged parallel to the plane where the heat conduction substrate is located, and the first end heat conductor section 11 and the second end heat conductor section 12 are arranged parallel to the plane where the heat conduction substrate is located.

A plurality of middle heat conductor segments 13 are in the same plane, a plurality of end heat conductor segments 12 are in the same plane, and the distance between every two adjacent middle heat conductor segments 13 is smaller than that between every two adjacent end portions The distance between the heat conductor segments 12 , the distance between the middle heat conductor segment 13 and the heat exchange surface 221 is smaller than the distance between the end heat conductor segments 12 and the heat exchange surface 221 . A transition section 14 is provided between the middle heat conductor section 13 and the first end heat conductor section 11 , and a transition section 14 is provided between the middle heat conductor section 13 and the second end heat conductor section 12 . The first end heat conductor segment 11 and the second end heat conductor segment 12 are symmetrically distributed on both ends of the middle heat conductor segment 13 . The arrangement of the heat conductor can transfer the heat of the heat conduction substrate to the fin group of the heat conductor quickly and evenly.

The fin group includes a heat conduction substrate fin group 3 and two heat conductor fin groups, and the heat conductor fin group includes a first heat conductor fin group 41 and a second heat conductor fin group 42 .

The heat conduction substrate fin group 3 is located on the heat conduction substrate. Specifically, the heat conduction substrate fin group 3 is located on the first heat conduction substrate 21, and the heat conduction substrate fin group 3 includes several fins in the form of inserted fins or aluminum extruded fins to increase the heat dissipation area of the heat conduction substrate. Preferably, the fins are in the shape of a curved surface, and a plurality of fins are evenly distributed on the first heat-conducting substrate 21. The fins in the shape of a curved surface can increase turbulent flow and heat dissipation area, improve heat dissipation efficiency, and reduce heat dissipation while ensuring heat dissipation capacity. device thickness.

The heat conduction substrate fin group 3 is arranged on the heat conduction substrate to facilitate the design of the air supply duct, and at the same time, the heat dissipation area of the heat exchange device is increased by about 1/3 through the heat conduction substrate fin group on the heat conduction substrate. The heat conduction substrate fin group adopts The curved surface structure can increase wind resistance and turbulent flow, enhance heat dissipation at the heat conduction substrate, and enable more effective heat dissipation in the area close to the semiconductor refrigeration sheet where the heat flux density is concentrated.

The heat conductor fin group is located on the end heat conductor section, and the heat conduction substrate fin group is located between the two heat conductor fin groups. The heat conductor fin group includes a first heat conductor fin group 41 and a second heat conductor fin group 42, the first heat conductor fin group 41 is located on the first end heat conductor segment 11, and the second heat conductor fin group 42 is located on the heat conductor section 12 at the second end, and the first heat conductor fin group 41 and the second heat conductor fin group 42 are symmetrically and evenly distributed on both sides of the heat conduction substrate, so as to ensure that the heat conducted from the heat conduction substrate can be quickly and evenly transferred to The first heat conductor fin group 41 and the second heat conductor fin group 42 . The middle part of the fins of the heat conductor fin group is provided with a through hole, the first end heat conductor segment 11 passes through the through hole of the fin, and the second end heat conductor segment 12 passes through the through hole of the fin.

The heat conductor segments at the ends are arranged in parallel and connected to the fin group of the heat conductor, so that the heat on the heat conduction substrate can be quickly and evenly transferred to the fin group of the heat conductor.

In order to improve the heat exchange efficiency, in FIG. 5, the upper surfaces of the first heat conduction fin group 41, the second heat conduction fin group 42 and the heat conduction substrate fin group 3 are on the same plane, that is, the first heat conduction fin group 41 . Both the second heat conducting fin group 42 and the heat conducting substrate fin group 3 are in contact with the square portion 621 of one of the air duct cover plates 62 .

The air duct assembly defines an airflow channel 5 connecting the gaps between adjacent fins of the fin group 3 of the heat-conducting substrate and the gaps between the adjacent fins of the fin groups 41 and 42 of the heat-conducting body.

The air duct assembly includes an air duct side plate 61 and two air duct cover plates 62 . The centrifugal fan 7 is located in the space enclosed by the air channel side plate 61 and the two air channel cover plates 62 , at this time, the air channel side plate 61 is an arc-shaped part, and the two air channel cover plates are semicircular parts. The air outlet of the air duct assembly is formed between the straight segments of the semicircular part, the air outlet of the air duct assembly is opposite to the fin group, and the air outlet of the air duct assembly flows to the fin group. The semicircle part does not specifically refer to a standard semicircle, but generally refers to a shape composed of arcs and straight lines.

In this embodiment, in order to improve the heat exchange efficiency, the air duct side plate and the air duct cover plate are optimally designed so that the centrifugal fan 7, the heat conductor 1, the heat conduction substrate, and the fin group are located between the air duct side plate 61 and the two air duct cover plates. The space enclosed by the road cover plate 62.

The air duct side plate 61 includes an arc portion 611 and three successively connected and vertical plane portions 612, the three successively connected and vertical plane portions 612 form a “door” shape, and the two ends of the arc portion 611 are aligned with the plane. Two ends of the portion 612 are connected, and the arc portion 611 and the flat portion 612 can be formed separately and then assembled or integrally formed. The air duct cover plate 62 includes a square part 621 and a semicircular part 622, the square part 621 corresponds to the space surrounded by the three planar parts 612, the semicircular part 622 corresponds to the space surrounded by the arc part 611, and the square part 622 corresponds to the space surrounded by the arc part 611. The part 621 and the semicircular part 622 can be formed separately and then assembled or integrally formed. Wherein, the semicircle portion 622 does not specifically refer to a standard semicircle, but generally refers to a shape composed of arcs and straight lines.

The air flow channel 5 is a space surrounded by the arc portion 611 and the semicircular portion 622 of the two air duct cover plates 62, and the centrifugal fan 7 is located at the arc portion 611 and the semicircular portion 622 of the two air duct cover plates 62. In the formed space, an air inlet 623 opposite to the centrifugal fan is opened on the semicircular portion 622 of the air duct cover plate 62 .

The air channel side plate 61 and the air channel cover plate 62 form a space for accommodating the fin group, specifically, the square part 621 and the flat surface 612 form a space for accommodating the fin group. An air outlet 624 is defined on the square portion of the air duct cover 62 away from the centrifugal fan 7 , and an opening 625 for exposing the second heat conduction substrate 22 of the heat conduction substrate is opened on the air duct cover 62 .

The centrifugal fan 7 is installed in the airflow channel 5, the rotation axis of the centrifugal fan 7 is perpendicular to the arrangement direction of the fin groups, and is configured to suck airflow from its axial direction, and make the airflow flow out from its radial direction, and then pass through the The airflow channels flow respectively to the fin group of the heat conducting substrate and the two fin groups of the heat conducting body.

In this embodiment, the centrifugal fan 7 is a centrifugal fan with a 360-degree air outlet. The air from the air outlet can directly flow to the first heat conductor fin group 41, the second heat conductor fin group 42 and the heat conduction substrate fin group 3, or flow to the arc portion 611, under the guidance of the arc portion 611 Flow to the first heat conductor fin group 41 and the second heat conductor fin group 42 .

In order to optimize the wind speed flowing to the first heat conductor fin group 41 and the second heat conductor fin group 42, and improve the uniformity of the air volume flowing through the first heat conductor fin group 41 and the second heat conductor fin group 42, the heat conductor fin group The air inlet side of the sheet group opposite to the centrifugal fan 7 is provided with an arc-shaped wind deflector.

The air inlet side of the first heat conductor fin group 41 opposite to the centrifugal fan 7 is provided with a first arc-shaped air deflector 81 , and the second heat conductor fin group 42 is provided with a second arc on the air inlet side opposite to the centrifugal fan 7. Shaped wind deflector 82.

The first end of the first arc-shaped air deflector 81 is in contact with the middle part of the air inlet side of the first heat conductor fin group 41, and there is a certain gap between the second end of the first arc-shaped air deflector 81 and the centrifugal fan 7. . The first end of the second arc-shaped air guide plate 82 is in contact with the middle part of the air inlet side of the second heat conductor fin group 42 , and there is a certain gap between the second end of the second arc-shaped air guide plate 82 and the centrifugal fan 7 . Wherein, the middle part of the air inlet side does not refer to the center in a geometric sense, and the average position between the cooling fins at the two ends of the air inlet side in this embodiment is the middle part of the air inlet side.

Preferably, the arc surface where the wind deflector is located is tangent to the centrifugal fan 7 . The wind deflector can guide the air out of the centrifugal fan 7, increase the wind speed and distribute the air volume more evenly to each part of the fin group.

The heat conductor fin group 3 has an air inlet side 31 opposite to the centrifugal fan 7, the first heat conduction substrate fin group 41 has an air inlet side 411 opposite to the centrifugal fan 7, and the second heat conduction substrate fin group 42 has an air inlet side 411 opposite to the centrifugal fan 7. 7 On the opposite air inlet side 421, a first windshield 91 is provided between the air inlet side 411 of the first heat conductor fin group 41 and the air inlet side 31 of the heat conduction substrate fin group 3, and the second heat conductor fin A second windshield 92 is disposed between the air inlet side 421 of the group 42 and the air inlet side 31 of the thermally conductive substrate fin group 3 .

Preferably, both the first wind-shielding fins 91 and the second wind-shielding fins 92 are arc-shaped, and they are arranged symmetrically on both sides of the heat-conducting substrate. The first windshield 91 and the second windshield 92 can prevent the wind from flowing through the gap between the heat conduction substrate fin group and the heat conductor fin group, and allow all the wind to flow through between the fins, ensuring that all The wind average exchanges heat with the fins to improve the heat exchange efficiency.

A centrifugal fan is used to supply air to the fin group 3 of the heat conduction substrate and the two fin groups of the heat conductor at the same time. The design of the centrifugal fan and air duct assembly can reduce noise and enhance heat dissipation, and increase heat transfer efficiency by enhancing air flow.

Of course, the centrifugal fan 7 can also be a centrifugal fan with three air outlets, and the three air outlets face the first heat conductor fin set 41 , the second heat conductor fin set 42 and the heat conduction substrate fin set 3 respectively.

The position design of the air inlet 623 and the air outlet 624 of the heat exchange device in this embodiment can make a certain distance between the air inlet 623 and the air outlet 624, which can prevent the air from the air outlet 624 from being inhaled by the air inlet 623, and solve the problem of refrigeration equipment. The heat dissipation efficiency drops seriously when it is close to the wall.

The heat conduction substrate of this embodiment can be in direct or indirect contact with the hot end of at least one peltier cooler. Meet the heat dissipation needs of multiple semiconductor cooling chips.

Based on the design of the above-mentioned heat exchange device, as shown in Figure 6, this embodiment also proposes a semiconductor refrigeration device, including a housing 101, an inner tank 102, a semiconductor cooling chip 103 and an insulating layer 104 arranged on the inner tank 102 . The semiconductor cooling chip 103 is located in the insulation layer 104, the cold end of the semiconductor cooling chip 103 transfers cold energy to the inner tank 102, and the hot end of the semiconductor cooling chip 103 transfers heat to the heat exchange device.

An installation space is defined between the housing 101 and the insulation layer 104, and the above-mentioned heat exchange device is installed in the installation space, and the hot end of the semiconductor cooling chip 103 is in direct or indirect contact with the second heat conduction substrate 22 of the heat exchange device.

An air inlet 1011 and an air outlet 1012 are opened on the housing 101, and the air inlet 1011 communicates with the air inlet 623 of the heat exchange device, and the two are opposite. The air outlet 1012 communicates with the air outlet 624 of the heat exchange device, and the two are opposite.

As shown in Figure 6, when the refrigeration equipment is working, the cold end of the semiconductor refrigeration sheet 103 generates cold energy to cool the inner tank 102, the hot end of the semiconductor refrigeration sheet 103 generates heat, and the heat exchange device absorbs the heat generated by the hot end of the semiconductor refrigeration sheet 103. Heat is released to the outside of the refrigeration unit. The working process of the heat exchange device is as follows: the centrifugal fan 7 rotates, driving the air to enter the air inlet 623 of the air duct cover plate 62 from the air inlet 1011 of the casing 101, enter the air flow channel 5, and pass through the heat conduction channel 5 under the guidance of the air flow channel 5. The gap between the fins of the substrate fin group 3 , the first heat conductor fin group 41 , and the second heat conductor fin group 42 takes away the heat of the fins, and the heat from the air outlet 624 of the air duct cover plate 62 , The air outlet 1012 of the casing 101 flows out of the casing 101, and the fins of the heat-conducting substrate fin group 3, the first heat-conducting body fin group 41, and the second heat-conducting body fin group 42 are continuously cooled, and the semiconductor cooling fins 103 The heat at the hot end is continuously transferred to the heat-conducting substrate fin group 3 through the heat-conducting substrate, and then to the first heat-conducting body fin group 41 and the second heat-conducting body fin group 42 through the heat-conducting substrate and the heat-conducting body, so that the heat at the hot end of the semiconductor refrigeration sheet 103 It is exported by the heat exchange device to realize the cooling of the hot end of the peltier refrigerating sheet 103 .

Semiconductor refrigeration equipment can be products such as wine cabinets, ice bars, refrigerators, and medical boxes.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims (10)

1. A heat exchange device for semiconductor refrigeration equipment, characterized in that, comprising: a thermally conductive substrate for absorbing heat from at least one heat source, or, absorbing cooling from at least one heat sink; A plurality of heat conductors, including a middle heat conductor section fixed to the heat conduction substrate and end heat conductor sections located at both ends of the middle heat conductor section; The fin group includes a heat conduction substrate fin group and two heat conductor fin groups, the heat conduction substrate fin group is located on the heat conduction substrate, and the heat conductor fin group is located on the end heat conductor section , the heat conduction substrate fin group is located between two heat conductor fin groups; An air duct assembly, which defines an airflow channel connecting the gap between the adjacent fins of the fin group of the heat-conducting substrate and the gap between the adjacent fins of the fin group of the heat-conducting body; A centrifugal fan, installed in the airflow channel, the rotation axis of the centrifugal fan is perpendicular to the arrangement direction of the fin sets, and is configured to suck airflow from its axial direction and let the airflow flow out from its radial direction, and then The heat conduction substrate fin group and the two heat conduction body fin groups respectively flow through the airflow channel. 2 . The heat exchange device for semiconductor refrigeration equipment according to claim 1 , wherein the heat-conducting substrate fin group includes several fins, and the fins are curved surfaces. 3 . 3. The heat exchange device for semiconductor refrigeration equipment according to claim 1, wherein the air duct assembly includes an air duct side plate and two air duct cover plates, and the air duct side plate includes an arc part, the centrifugal fan is located in the space enclosed by the arc part and two air duct cover plates, and the air duct cover plate is provided with an air inlet opposite to the centrifugal fan. 4. The heat exchange device for semiconductor refrigeration equipment according to claim 3, characterized in that, the air duct side plate and the air duct cover plate form a space for accommodating the fin group, and the air duct An air outlet is opened on the end of the cover plate away from the centrifugal fan, and an opening for exposing the heat-conducting substrate is opened on the air duct cover plate. 5. The heat exchange device for semiconductor refrigeration equipment according to claim 3 or 4, characterized in that, an arc-shaped air guide plate is provided on the air inlet side of the heat conductor fin set opposite to the centrifugal fan. 6. The heat exchange device for semiconductor refrigeration equipment according to claim 5, characterized in that, the first end of the arc-shaped air deflector is in contact with the middle part of the air inlet side of the fin group of the heat conductor, There is a certain gap between the second end of the arc-shaped air deflector and the centrifugal fan. 7. The heat exchange device for semiconductor refrigeration equipment according to claim 6, wherein the arc surface where the air guide plate is located is tangent to the centrifugal fan. 8. The heat exchange device for semiconductor refrigeration equipment according to claim 3 or 4, wherein the heat conductor fin set has an air inlet side opposite to the centrifugal fan, and the heat conduction substrate fin set The group has an air inlet side opposite to the centrifugal fan, and a windshield is arranged between the air inlet side of the heat conductor fin group and the air inlet side of the heat conduction substrate fin group. 9. The heat exchange device for semiconductor refrigeration equipment according to claim 8, wherein the windshield is arc-shaped. 10. A semiconductor refrigeration device, comprising a housing, an inner container, a semiconductor refrigeration sheet, and an insulating layer arranged on the inner container, characterized in that, the housing and the insulating layer define an installation space, and the installation space The heat exchange device according to any one of claims 1-9 is installed inside, the housing is provided with an air inlet and an air outlet, the air inlet is connected to the air inlet of the heat exchange device, and the air outlet The air outlet communicates with the air outlet of the heat exchange device, and the heat-conducting substrate is directly or indirectly connected with the hot end of the semiconductor cooling fin.