CN104411147A - Novel liquid immersion cooling device - Google Patents
Novel liquid immersion cooling device Download PDFInfo
- Publication number
- CN104411147A CN104411147A CN201410772606.7A CN201410772606A CN104411147A CN 104411147 A CN104411147 A CN 104411147A CN 201410772606 A CN201410772606 A CN 201410772606A CN 104411147 A CN104411147 A CN 104411147A
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- liquid chamber
- containing liquid
- fin plate
- tec refrigerating
- fin
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Abstract
The invention provides a novel liquid immersion cooling device which comprises an upper liquid storage bin, a lower liquid storage bin, a fin plate, a water inlet, a water outlet, TEC refrigerating chips, partitions and fins, wherein the upper liquid storage bin is connected with the lower liquid storage bin and separated from the lower liquid storage bin through the fin plate; the TEC refrigerating chips are fixed on the upper surface of the fin plate; the cold surfaces of the TEC refrigerating chips are in contact with the fin plate; a partition is inserted between every two adjacent TEC refrigerating chips; the fins are uniformly arranged on the lower surface of the fin plate; the water inlet is formed in the side wall of the upper liquid storage bin; the water outlet is formed in the side wall of the upper liquid storage bin. The novel liquid immersion cooling device has the advantages and benefits that due to the adoption of the TEC refrigerating chips, the problems of difficult temperature adjustment, difficult maintenance and damage of flowing of cooling liquid on the chips in the conventional liquid immersion cooling system are solved; a proper amount of cooling liquid is added and a proper amount of airbags are reserved, so that the liquid overflow caused by thermal expansion and cold contraction of the liquid can be prevented; due to the design of the partitions, the cooling liquid can uniformly flow through the TEC refrigerating chips.
Description
Technical field
The invention belongs to conductive structure field, especially relate to a kind of energy-efficient, manufacture liquid immersion type radiator structure simple, with low cost.
Background technology
Along with professional domain is to the improve of the performance requirements such as high-performance computer, supercomputer, asic chip, data center, mainboard array group is increasing, but heat dissipation problem but limits the further expansion of corresponding mainboard or electronic chip array.The heat dissipation problem that tradition is air-cooled, liquid cooling can not solve professional chip, namely allows to solve, also can cause huge noise or power consumption.
Traditional heat-dissipating structure is dispelled the heat mainly for hot zone, and difficulty disposed by heat abstractor or pipeline, needs the installation of multiple step ability.The heat generating components such as mainboard are immersed in cooling fluid by liquid immersion type cooling system, greatly reduce installation difficulty, also reduce the overall volume of server cluster simultaneously.
Liquid immersion type heat radiation is mainly passive heat radiation, but this radiating mode flexibility is relatively poor, cannot control immersion temperature flexibly, limit the use of immersion system to a certain extent.
Summary of the invention
The problem that the invention will solve is to provide a kind of novel immersion cooling system of built-in TEC refrigerating chip.
For solving the problems of the technologies described above, the technical scheme that the invention adopts is: a kind of novel immersion heat abstractor, comprises top containing liquid chamber, bottom containing liquid chamber, fin plate, water inlet, delivery port, TEC refrigerating chip, dividing plate and fin;
Described top containing liquid chamber is connected with bottom containing liquid chamber and is cut off by fin plate; Described fin plate upper surface is fixed with some TEC refrigerating chips, and described TEC refrigerating chip huyashi-chuuka (cold chinese-style noodles) contacts with fin plate, is inserted with dividing plate between adjacent described TEC refrigerating chip; Described fin plate lower surface is evenly provided with some fins; Described top containing liquid chamber sidewall is provided with water inlet, and described top containing liquid chamber sidewall is provided with delivery port;
Be marked with cooling fluid respectively in described top containing liquid chamber and bottom containing liquid chamber, the cooling fluid in described top containing liquid chamber and bottom containing liquid chamber does not all fill.
Preferably: the TEC refrigerating chip arrangement mode of described fin plate upper surface is corresponding with the fin arrangement mode of described fin plate lower surface.
Preferably, described fin thickness is 1 ~ 6mm.
The advantage that the invention has and good effect are: adopt TEC refrigerating chip to solve traditional liquid immersion type cooling system temperature and not easily regulate, easy care and coolant flow be not to the destruction risk of chip; Cooling fluid is not filled, and leaves appropriate air bag, in case liquid expands with heat and contract with cold cause overflow; The design of dividing plate makes dividing plate and fin plate form liquid cooling passage, makes cooling fluid flow uniformly through every block TEC refrigerating chip.
Accompanying drawing explanation
Fig. 1 is the invention external structure schematic diagram;
Fig. 2 is the invention internal structure schematic diagram;
Fig. 3 is machine room arrangement example schematic;
In figure: the containing liquid chamber of 10-top, 11-bottom containing liquid chamber, 12-water inlet, 13-delivery port, 21-fin plate, 22-dividing plate, 23-fin, 24-TEC refrigerating chip, 31-chilled water machine, 32-pipeline.
Embodiment
Elaborate below in conjunction with the specific embodiment of accompanying drawing to the invention.
A kind of novel immersion heat abstractor, comprises top containing liquid chamber 10, bottom containing liquid chamber 11, fin plate 21, water inlet 12, delivery port 13, TEC refrigerating chip 24, dividing plate 22 and fin 23; Described top containing liquid chamber 10 is connected with bottom containing liquid chamber 11 and is cut off by fin plate 21; Described fin plate 21 upper surface is fixed with some TEC refrigerating chips 24, described TEC refrigerating chip 24 huyashi-chuuka (cold chinese-style noodles) contacts with fin plate, be inserted with dividing plate 22 between adjacent described TEC refrigerating chip 24, dividing plate 22 and fin plate 21 form liquid cooling passage, make cooling fluid flow uniformly through every block TEC refrigerating chip 24; Described fin plate 21 lower surface is evenly provided with some fins 23, and described fin thickness is 1 ~ 6mm, between adjacent fins 23 longitudinally can 1-2 placed side by side need heat-dissipating main or other electronic devices; Described top containing liquid chamber 10 sidewall is provided with water inlet 12, and described top containing liquid chamber 10 sidewall is provided with delivery port 13, and cooling water is inputted by water inlet 12, and the cooling water after heat absorption is exported by delivery port 13; Be marked with cooling fluid respectively in described top containing liquid chamber 10 and bottom containing liquid chamber 11, the cooling fluid in described top containing liquid chamber 10 and bottom containing liquid chamber 11 does not all fill.
Operation principle is as follows, after TEC refrigerating chip 24 is started working, coldface temperature is extremely low, the flowing cooling fluid of hot side in top containing liquid chamber 10 maintains operating temperature range, under the refrigeration of TEC refrigerating chip 24 huyashi-chuuka (cold chinese-style noodles), insert the fin 23 temperature step-down of bottom containing liquid chamber 11, the coolant temperature near fin 23 is corresponding reduction also.When euthermic chip between fin 23 works, release heat, coolant temperature near heat radiation chip raises, cooling fluid near heat radiation chip is different from the cooling fluid Yin Wendu near fin 23, form the concurrent heat-dissipating of convection current to exchange, heat is taken away by fin, and is finally taken away by the cooling fluid flowed in the containing liquid chamber of top.
Embodiment one:
The immersion heat abstractor that some the invention provide is connected with chilled water machine 31 by cooling water pipeline 32, enter along cooling water pipeline 32 immersion heat abstractor middle and upper part containing liquid chamber 10 Inner eycle that the invention provides under the water pump effect of cooling water in chilled water machine 31, the heat that TEC refrigerating chip 24 hot side sends is taken away, has been reached for the object of chip in bottom containing liquid chamber 11 and other electronic equipment dissipating heats.In this kind of occupation mode, in outdoor cooling unit, can be cooled further by the cooling fluid heated, constantly this process of circulation, the heat at chip place constantly can be brought to outdoor.
Above an embodiment of the invention has been described in detail, but described content being only the preferred embodiment of the invention, the practical range for limiting the invention can not being considered to.All equalization changes done according to the invention application range with improve, within the patent covering scope that still all should belong to the invention.
Claims (3)
1. a novel immersion heat abstractor, is characterized in that: comprise top containing liquid chamber, bottom containing liquid chamber, fin plate, water inlet, delivery port, TEC refrigerating chip, dividing plate and fin;
Described top containing liquid chamber is connected with bottom containing liquid chamber and is cut off by fin plate; Described fin plate upper surface is fixed with some TEC refrigerating chips, and described TEC refrigerating chip huyashi-chuuka (cold chinese-style noodles) contacts with fin plate, is inserted with dividing plate between adjacent described TEC refrigerating chip; Described fin plate lower surface is evenly provided with some fins; Described top containing liquid chamber sidewall is provided with water inlet, and described top containing liquid chamber sidewall is provided with delivery port;
Be marked with cooling fluid respectively in described top containing liquid chamber and bottom containing liquid chamber, the cooling fluid in described top containing liquid chamber and bottom containing liquid chamber does not all fill.
2. the novel immersion heat abstractor of one according to claim 1, is characterized in that: the TEC refrigerating chip arrangement mode of described fin plate upper surface is corresponding with the fin arrangement mode of described fin plate lower surface.
3. the novel immersion heat abstractor of one according to claim 1, is characterized in that: described fin thickness is 1 ~ 6mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410772606.7A CN104411147A (en) | 2014-12-14 | 2014-12-14 | Novel liquid immersion cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410772606.7A CN104411147A (en) | 2014-12-14 | 2014-12-14 | Novel liquid immersion cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104411147A true CN104411147A (en) | 2015-03-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410772606.7A Pending CN104411147A (en) | 2014-12-14 | 2014-12-14 | Novel liquid immersion cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104411147A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
| CN111240448A (en) * | 2020-01-19 | 2020-06-05 | 苏州浪潮智能科技有限公司 | Immersed liquid cooling device for liquid injection in middle of server |
-
2014
- 2014-12-14 CN CN201410772606.7A patent/CN104411147A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577319A (en) * | 2017-10-24 | 2018-01-12 | 北京中热能源科技有限公司 | A kind of liquid immersion type server |
| CN111240448A (en) * | 2020-01-19 | 2020-06-05 | 苏州浪潮智能科技有限公司 | Immersed liquid cooling device for liquid injection in middle of server |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150311 |