CN104932639A - Heat conduction part for CPU (central processing unit) of portable computer - Google Patents
Heat conduction part for CPU (central processing unit) of portable computer Download PDFInfo
- Publication number
- CN104932639A CN104932639A CN201510257493.1A CN201510257493A CN104932639A CN 104932639 A CN104932639 A CN 104932639A CN 201510257493 A CN201510257493 A CN 201510257493A CN 104932639 A CN104932639 A CN 104932639A
- Authority
- CN
- China
- Prior art keywords
- heat conduction
- heat
- conducting
- cpu
- bottom plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat conduction part for a CPU (central processing unit) of a portable computer. The heat conduction part comprises an upper-layer heat conduction bottom plate and a lower-layer heat conduction bottom plate; a plurality of flat-strip-shaped gaps are formed between the upper-layer heat conduction bottom plate and the lower-layer heat conduction bottom plate; the flat-strip-shaped gaps are filled with graphite heat conduction strips; one group of arc-shaped embedded grooves are formed in the upper-layer heat conduction bottom plate; heat radiation copper pipes are embedded into the arc-shaped embedded grooves; a square shallow groove matched with a CPU module is formed in the middle of the bottom surface of the lower-layer heat conduction bottom plate; and a convex line array is arranged at the bottom of the square shallow groove. The heat conduction part is simple and reasonable in structure and convenient to mount and use; and the design that double layers of the heat conduction bottom plates and an interlayer are filled with the graphite heat conduction strips is adopted, so that the heat dissipated by the CPU module can be efficiently and rapidly conducted to the heat radiation copper pipes from bottom to top along the heat conduction part, the heat is not easy to gather, the heat conduction efficiency is effectively improved and the heat radiation effect of the CPU module is improved.
Description
Technical field
The present invention relates to computer fittings field, be specially a kind of portable computer CPU conducting-heat elements.
Background technology
The CPU of computing machine is the main heat-generating units of computer equipment, needs to carry out effective heat radiation auxiliary, to ensure the runnability of computing machine.Existing cpu heat radiating effect is not good, and between its heat conduction original paper and CPU module, heat transfer is comparatively slow, and heat of high temperature easily accumulates in conducting-heat elements, not easily to fin conductive, and then affect heat conduction rate, make the heat of CPU not easily conduct to heat conduction original paper fast, radiating efficiency is not high.
Summary of the invention
The object of this invention is to provide a kind of portable computer CPU conducting-heat elements, not good to solve cpu heat radiating effect traditional in prior art, between its heat conduction original paper and CPU module, heat transfer is slower, heat of high temperature easily accumulates in conducting-heat elements, not easily to fin conductive, and then affect heat conduction rate, make the heat of CPU not easily conduct to heat conduction original paper fast, the problem that radiating efficiency is not high.
For achieving the above object, the technical solution used in the present invention is:
A kind of portable computer CPU conducting-heat elements, it is characterized in that: include upper strata conductive sole plate and lower floor's conductive sole plate, multiple flat bar gap is left between described upper strata conductive sole plate and lower floor's heat-conducting plate, graphite heat conducting bar is filled with in described flat bar gap, described upper strata heat-conducting plate is provided with one group of arc caulking groove, heat dissipation copper pipe is embedded with in described arc caulking groove, be provided with the square shallow slot matched with CPU module in the middle part of the bottom surface of described lower floor heat-conducting plate, the bottom land of described square shallow slot is provided with burr array.
Described a kind of portable computer CPU conducting-heat elements, is characterized in that: the corner of described lower floor conductive sole plate is provided with the mounting bracket extended laterally.
Beneficial effect of the present invention is:
The present invention is simple and reasonable, easy to install, adopt in double-deck conductive sole plate and the design of graphite heat conducting bar is set in interlayer, the heat that CPU module is sent efficiently can conduct to heat dissipation copper pipe fast from bottom to top along conducting-heat elements, heat not easily gathers, effectively improve heat transfer efficiency, improve the radiating effect of CPU module.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
As shown in Figure 1, a kind of portable computer CPU conducting-heat elements, include upper strata conductive sole plate 1 and lower floor's conductive sole plate 2, multiple flat bar gap 3 is left between upper strata conductive sole plate 1 and lower floor's heat-conducting plate 2, be filled with graphite heat conducting bar in flat bar gap 3, upper strata heat-conducting plate 1 is provided with one group of arc caulking groove 4, is embedded with heat dissipation copper pipe 5 in arc caulking groove 4, be provided with the square shallow slot 6 matched with CPU module in the middle part of the bottom surface of lower floor's heat-conducting plate 2, the bottom land of square shallow slot 6 is provided with burr array.
The corner of lower floor's conductive sole plate 2 is provided with the mounting bracket 7 extended laterally.
Claims (2)
1. a portable computer CPU conducting-heat elements, it is characterized in that: include upper strata conductive sole plate and lower floor's conductive sole plate, multiple flat bar gap is left between described upper strata conductive sole plate and lower floor's heat-conducting plate, graphite heat conducting bar is filled with in described flat bar gap, described upper strata heat-conducting plate is provided with one group of arc caulking groove, heat dissipation copper pipe is embedded with in described arc caulking groove, be provided with the square shallow slot matched with CPU module in the middle part of the bottom surface of described lower floor heat-conducting plate, the bottom land of described square shallow slot is provided with burr array.
2. a kind of portable computer CPU conducting-heat elements according to claim 1, is characterized in that: the corner of described lower floor conductive sole plate is provided with the mounting bracket extended laterally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510257493.1A CN104932639A (en) | 2015-05-20 | 2015-05-20 | Heat conduction part for CPU (central processing unit) of portable computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510257493.1A CN104932639A (en) | 2015-05-20 | 2015-05-20 | Heat conduction part for CPU (central processing unit) of portable computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104932639A true CN104932639A (en) | 2015-09-23 |
Family
ID=54119838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510257493.1A Withdrawn CN104932639A (en) | 2015-05-20 | 2015-05-20 | Heat conduction part for CPU (central processing unit) of portable computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104932639A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505789A (en) * | 2019-07-27 | 2019-11-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099878A (en) * | 2007-10-19 | 2009-05-07 | Hitachi Ltd | Heat sink and its manufacturing method |
| CN101458049A (en) * | 2008-12-02 | 2009-06-17 | 王晓山 | Composite graphite heat conducting radiation fins |
| CN103425215A (en) * | 2013-07-31 | 2013-12-04 | 昆山维金五金制品有限公司 | CUP radiator |
-
2015
- 2015-05-20 CN CN201510257493.1A patent/CN104932639A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009099878A (en) * | 2007-10-19 | 2009-05-07 | Hitachi Ltd | Heat sink and its manufacturing method |
| CN101458049A (en) * | 2008-12-02 | 2009-06-17 | 王晓山 | Composite graphite heat conducting radiation fins |
| CN103425215A (en) * | 2013-07-31 | 2013-12-04 | 昆山维金五金制品有限公司 | CUP radiator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110505789A (en) * | 2019-07-27 | 2019-11-26 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Capacity of heat transmission method for improving with PMI foamed sandwich structure electronic module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103906413B (en) | Heat radiation module | |
| CN203748105U (en) | Double-face circuit board | |
| CN201629328U (en) | Heat radiator structure | |
| CN201726633U (en) | Hollow laminar type cooling plate unit structure | |
| CN104932639A (en) | Heat conduction part for CPU (central processing unit) of portable computer | |
| CN207820432U (en) | Water-cooled circuit plate heat dissipating device | |
| CN203086910U (en) | A copper pipe heat conducting structure | |
| CN204390151U (en) | A kind of air-cooled heat-pipe radiator | |
| CN104914946A (en) | Liquid cooling and fan heat mode spiral radiating structure of computer CPU | |
| CN104932637A (en) | Heat conduction assembly for CPU (central processing unit) of desk computer | |
| CN201184991Y (en) | Efficient radiator | |
| CN209929439U (en) | Power battery water-cooling module assembly | |
| CN202634976U (en) | Heat dissipation device | |
| CN202205731U (en) | Heat radiating module for IGBT (Insulated Gate Bipolar Transistor) module superconductive heat pipe | |
| CN203773456U (en) | Mainboard radiator for sealed computer case | |
| CN104952817A (en) | Tower-type heat radiating component for computer CPU (central processing unit) | |
| CN204697452U (en) | There is the radiator structure separating double-layer overlapping heat pipe | |
| CN204857705U (en) | Silicon controlled rectifier radiator | |
| CN219269435U (en) | Bidirectional radiator | |
| CN204652857U (en) | Heat sink assembly | |
| CN210199678U (en) | Liquid cooling placing box for chip | |
| CN203930673U (en) | A kind of two-way server mainboard heat ink | |
| CN201018741Y (en) | Heat radiating module structure | |
| CN206596327U (en) | A kind of graphite heat conducting medium | |
| CN104932638A (en) | CPU (central processing unit) efficient heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20150923 |