CN203930673U - A kind of two-way server mainboard heat ink - Google Patents
A kind of two-way server mainboard heat ink Download PDFInfo
- Publication number
- CN203930673U CN203930673U CN201420379764.1U CN201420379764U CN203930673U CN 203930673 U CN203930673 U CN 203930673U CN 201420379764 U CN201420379764 U CN 201420379764U CN 203930673 U CN203930673 U CN 203930673U
- Authority
- CN
- China
- Prior art keywords
- heat
- copper billet
- radiation copper
- heat radiation
- fixed head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 230000005855 radiation Effects 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000013021 overheating Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- JEOQACOXAOEPLX-WCCKRBBISA-N (2s)-2-amino-5-(diaminomethylideneamino)pentanoic acid;1,3-thiazolidine-4-carboxylic acid Chemical compound OC(=O)C1CSCN1.OC(=O)[C@@H](N)CCCN=C(N)N JEOQACOXAOEPLX-WCCKRBBISA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a kind of two-way server mainboard heat ink, belongs to server radiating device field, and its structure comprises radiator base plate, heat pipe, heat radiation copper billet, radiating fin, fixed head.Radiator base plate adopts high thermal conductivity coefficient copper coin, is mainly according to its weight and the good capacity of heat transmission, and the position of reference server mainboard CPU and the layout of other components and parts of board design; Heat radiation copper billet lays respectively at the correspondence position of Computer card CPU inside radiator base plate, and bottom surface is connected by heat-conducting medium with chip, welds above with heat pipe and substrate; Heat pipe connects together two heat radiation copper billets, mainly plays the effect of whole radiator temperature equilibrium, prevents the phenomenon of heating radiator local overheating.
Description
Technical field
The utility model relates to server radiating device field, specifically a kind of two-way server mainboard heat ink.
Background technology
Along with the raising of Computing processing power, chip thermal value is also increasing with surprising rapidity.In the equipment ventilating in large-scale open type, the main heat radiator that adopts adds air-cooled radiating mode, but for some standard compliant cabinets, ATCA cabinet for example, its board space and air channel have restricted, for guaranteeing the works fine of mainboard, except requiring board to there is rational device layout and using suitable blower fan, the heating radiator of board is also had higher requirements.Generally to two cpu motherboard heat radiations, all can design two identical heating radiators, respectively two CPU be dispelled the heat.But actual conditions are at work, two CPU have master slave relation, be that host CPU can be than high from CPU thermal value, and be limited to the layout of board, also can cause from CPU in air channel compared with good position, host CPU is in air channel poor position, if radiator heat-dissipation effect is bad, will make mainboard work be greatly affected.
Summary of the invention
The technical problems to be solved in the utility model: the heating radiator of the two cpu server mainboards of high power consumption.
The utility model solves the technical scheme that its technical matters adopts: the utility model is mainly according to the coefficient of heat conductivity of copper, to be greater than the principle design of the coefficient of heat conductivity of aluminium alloy and the quick conductive ability of heat pipe.
A two-way server mainboard heat ink, comprises heat pipe, radiating fin and fixed head, it is characterized in that, also comprise heat-radiating substrate and heat radiation copper billet, shown in fixed head be provided with two, the respectively corresponding radiating fin of every fixed head, radiating fin is connected with fixed head by mounting screw
Described heat radiation copper billet be provided with two and lay respectively at heat-radiating substrate and fixed head between, heat radiation copper billet and heat pipe and heat-radiating substrate are connected together; Heat pipe is attached to fixed on heat-radiating substrate, and heat pipe one end is passed from one of them heat radiation copper billet bottom, and the other end passes from another heat radiation copper billet bottom, and heat pipe connects together two heat radiation copper billets.
The utility model mainly comprises radiator base plate, heat pipe, heat radiation copper billet, radiating fin, fixed head.Radiator base plate adopts high thermal conductivity coefficient copper coin, is mainly according to its weight and the good capacity of heat transmission, and the position of reference server mainboard CPU and the layout of other components and parts of board design; Heat radiation copper billet lays respectively at the correspondence position of Computer card CPU inside radiator base plate, and bottom surface is connected by heat-conducting medium with chip, welds above with heat pipe and substrate; Heat pipe connects together two heat radiation copper billets, mainly plays the effect of whole radiator temperature equilibrium, prevents the phenomenon of heating radiator local overheating.
The effect intentionally that the utility model brings:
The utility model has improved the radiating effect of two cpu motherboards, has reduced the working temperature of mainboard chip, has strengthened the job stability of mainboard.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is described in further detail:
Accompanying drawing 1 is plan structure schematic diagram of the present utility model;
Accompanying drawing 2 is polycrystalline substance schematic diagram of the present utility model;
Accompanying drawing 3 is mounting structure schematic diagram of the present utility model.
Embodiment
1) install
Fixed head 4 is installed on mainboard 6 back sides, radiating fin 2 is arranged on the front of heat-radiating substrate 3, the vis-a-vis of the back side of heat-radiating substrate 3 and mainboard 6, radiating fin 2 is connected with fixed head 4 through heat-radiating substrate 3 is rear by mounting screw 1, the copper billet 7 that wherein dispels the heat is attached to the back side of heat-radiating substrate 3, heat radiation copper billet 7 links together by heat-conducting medium respectively with mainboard CPU
2) heat radiation
Because CPU combines closely by heat-conducting medium and heat radiation copper billet 7, when mainboard 6 work, the heat of CPU passes to heat radiation copper billet 7 by heat-conducting medium, heat radiation copper billet 7 back sides are heat pipes 5, therefore heat can be transmitted by heat pipe heat 5 end guiding heat pipe 5 cold junctions rapidly, in the utility model, be heat pipe 5 by the heat balance of host CPU on whole heating radiator, the direction of radiating fin 2 is to design with reference to complete machine air channel, by cold wind, the heat on radiating fin 2 is delivered to rapidly to air outlet, thereby has completed the whole heat radiation process of two cpu server mainboards.
3) shape and position
Accompanying drawing 1,2 is only for illustrating, and the direction of the shape of concrete heating radiator, size, radiating fin 2, the heat radiation position of copper billet 7 and the position of heat pipe 5 and length are determined by the concrete condition of mainboard.
Heat-conducting medium can adopt heat-conducting cream, and heat-conducting cream (heat-conducting silicone grease) is a kind of heat radiation compound that adds the grease-like silicone material of heat filling.This will improve from electric, electronic devices and components to the heat transmission between heating radiator or chassis.
Its processing and fabricating of two-way server mainboard heat ink of the present utility model is simple and convenient, processing and fabricating shown in by specification accompanying drawing.
Except the technical characterictic described in instructions, be those skilled in the art's known technology.
Claims (5)
1. a two-way server mainboard heat ink, comprise heat pipe, radiating fin and fixed head, it is characterized in that, also comprise heat-radiating substrate and heat radiation copper billet, shown in fixed head be provided with two, the respectively corresponding radiating fin of every fixed head, radiating fin is connected with fixed head by mounting screw, described heat radiation copper billet be provided with two and lay respectively at heat-radiating substrate and fixed head between, heat radiation copper billet and heat pipe and heat-radiating substrate are connected together; Heat pipe is attached to fixed on the back side of heat-radiating substrate, and heat pipe one end is passed from one of them heat radiation copper billet bottom, and the other end passes from another heat radiation copper billet bottom, and heat pipe connects together two heat radiation copper billets.
2. two-way server mainboard heat ink according to claim 1, it is characterized in that, described radiating fin is arranged on the front of heat-radiating substrate, and the back that described copper billet is arranged on fixed head is between fixed head and heat-radiating substrate, described mounting screw through heat-radiating substrate and with its clearance fit.
3. two-way server mainboard heat ink according to claim 1 and 2, is characterized in that, the size of described radiating fin matches with the size of heat-radiating substrate.
4. two-way server mainboard heat ink according to claim 3, is characterized in that, described heat-radiating substrate is divided into two main areas and join domain, and described radiating fin is separately positioned in main areas.
5. two-way server mainboard heat ink according to claim 1, is characterized in that, heat radiation copper billet and heat pipe and heat-radiating substrate weld together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420379764.1U CN203930673U (en) | 2014-07-10 | 2014-07-10 | A kind of two-way server mainboard heat ink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420379764.1U CN203930673U (en) | 2014-07-10 | 2014-07-10 | A kind of two-way server mainboard heat ink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203930673U true CN203930673U (en) | 2014-11-05 |
Family
ID=51826453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420379764.1U Expired - Fee Related CN203930673U (en) | 2014-07-10 | 2014-07-10 | A kind of two-way server mainboard heat ink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203930673U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503557A (en) * | 2015-01-16 | 2015-04-08 | 浪潮(北京)电子信息产业有限公司 | Heat dissipation management method and system based on multipath processor |
| CN113993358A (en) * | 2021-11-15 | 2022-01-28 | 深圳市兴研科技有限公司 | High-density communication platform and heat dissipation method using non-uniform distributed heat dissipation structure |
| CN115942691A (en) * | 2022-10-20 | 2023-04-07 | 北京算能科技有限公司 | Heat Sinks, Computing Boards, Heat Dissipating Substrates and Connectors |
| CN116860093A (en) * | 2023-08-29 | 2023-10-10 | 深圳从平技术有限公司 | High-performance heat dissipation waterproof structure of vehicle-mounted flat plate |
-
2014
- 2014-07-10 CN CN201420379764.1U patent/CN203930673U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503557A (en) * | 2015-01-16 | 2015-04-08 | 浪潮(北京)电子信息产业有限公司 | Heat dissipation management method and system based on multipath processor |
| CN113993358A (en) * | 2021-11-15 | 2022-01-28 | 深圳市兴研科技有限公司 | High-density communication platform and heat dissipation method using non-uniform distributed heat dissipation structure |
| CN115942691A (en) * | 2022-10-20 | 2023-04-07 | 北京算能科技有限公司 | Heat Sinks, Computing Boards, Heat Dissipating Substrates and Connectors |
| CN116860093A (en) * | 2023-08-29 | 2023-10-10 | 深圳从平技术有限公司 | High-performance heat dissipation waterproof structure of vehicle-mounted flat plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20150710 |
|
| EXPY | Termination of patent right or utility model |