CN103425215A - CUP radiator - Google Patents
CUP radiator Download PDFInfo
- Publication number
- CN103425215A CN103425215A CN2013103279568A CN201310327956A CN103425215A CN 103425215 A CN103425215 A CN 103425215A CN 2013103279568 A CN2013103279568 A CN 2013103279568A CN 201310327956 A CN201310327956 A CN 201310327956A CN 103425215 A CN103425215 A CN 103425215A
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- China
- Prior art keywords
- cpu
- heat
- securing member
- radiator
- heat radiator
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a CPU radiator. The CPU radiator is characterized in that the CPU radiator comprises a reversed bowl-shaped radiating sheet. The top of the radiating sheet is in a circular plate shape and is connected with a bottom plate of a radiating frame through a first fastening member, the radiating frame further comprises a plurality of cooling fins perpendicularly arranged on the upper portion of the bottom plate, extending ends are arranged at the tail ends of the side portions of the radiating sheet in the horizontal direction in a stretching mode, second through holes are formed in the extending ends, second fastening members used for connecting the extending ends and a CPU main board together are arranged in the second through holes in a penetrating mode, the top wall of the radiating sheet is further connected with heat conduction silicone grease, and a CPU chip arranged on the CPU main board is further connected to the other face of the heat conduction silicone grease. The CPU radiator can effectively avoid the situation of damaging the CPU chip and is novel and simple in structure and easy to assemble.
Description
Technical field
The present invention relates to a kind of cooling device, relate in particular to the heating radiator that a kind of computer CPU is used.
Background technology
In recent years, along with the transfer capability of power circuit constantly increases, power consumption increases thereupon, therefore various electronic components have also produced very huge heat, brought heat dissipation problem, produced heat abstractor thereupon, with regard to current CPU element, the raising of its integrated level and frequency of operation, also will improve the requirement of heat radiator.
In prior art, normally cpu chip directly is fixed on heat radiator, but nowadays the CPU processing procedure enters into the 18um epoch its core fragility especially, traditional fixed form and easily damage this cpu chip.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of heating radiator of difficult infringement cpu chip.
For addressing the above problem, the invention provides a kind of cpu heat, it is characterized in that: comprise the heat radiator of falling the bowl-type, described heat radiator top is discoideus and is connected with the base plate of a heat radiation rack by the first securing member, this heat radiation rack also comprises several radiating fins that are vertically set on described base plate top, the end of described heat radiator sidepiece is extended with external part to horizontal direction, described external part is provided with the second through hole, through described the second through hole, be provided with second securing member for described external part and cpu motherboard are linked together, the roof of described heat radiator also is connected with a heat-conducting silicone grease, the another side of this heat-conducting silicone grease also is connected with a cpu chip be arranged on described cpu motherboard.
As a further improvement on the present invention, under described cpu motherboard, release and be provided with backboard, described the second securing member links together described backboard, cpu motherboard and heat radiator through the first through hole be arranged on described backboard.
As a further improvement on the present invention, described the second securing member is screw bolt and nut.
As a further improvement on the present invention, described the first securing member is bolt, and described heat radiator is provided with the internal thread hole coordinated with described the first securing member.
As a further improvement on the present invention, described heat radiator is copper.
Beneficial effect of the present invention is, cpu chip is arranged on to the top of cpu motherboard, then by the method for heat radiator pressure-bearing, fix, this heat radiator can play the role of pressure on the one hand, can also assist to a great extent heat radiation simultaneously, and be provided with heat conductive silica gel between it, this can't affect heat-conducting effect, and can also between heat radiator and cpu chip, play the effect of a buffering, adopt this result, it can effectively avoid damaging the situation mode of cpu chip, and novel structure, simple, easily assembling.
The accompanying drawing explanation
Fig. 1 is structural representation of the present invention,
Wherein: the 2-heat radiation rack; The 4-radiating fin; 8-the first securing member; The 10-base plate; The 12-heat radiator; 14-the second securing member; The 16-CPU mainboard; The 18-heat conductive silica gel; The 20-CPU chip; The 22-backboard.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further details.
As shown in Figure 1, bag of the present invention is drawn together the heat radiator of falling the bowl-type 12, described heat radiator 12 tops are discoideus and are connected with the base plate 10 of a heat radiation rack 2 by the first securing member 8, this heat radiation rack 2 also comprises several radiating fins 4 that are vertically set on described base plate 10 tops, the end of described heat radiator 12 sidepieces is extended with external part to horizontal direction, described external part is provided with the second through hole, through described the second through hole, be provided with second securing member 14 for described external part and cpu motherboard 16 are linked together, the roof of described heat radiator 12 also is connected with a heat-conducting silicone grease, the another side of this heat-conducting silicone grease also is connected with a cpu chip 18 be arranged on described cpu motherboard 16.Cpu chip 18 is arranged on to the top of cpu motherboard 16, then by the method for heat radiator 12 pressure-bearings, fix, this heat radiator 12 can play the role of pressure on the one hand, can also assist to a great extent heat radiation simultaneously, and be provided with heat conductive silica gel 18 between it, this can't affect heat-conducting effect, and can also be in heat radiator 12 and 18 effects of playing a buffering of cpu chip, adopt this result, it can effectively avoid damaging the situation mode of cpu chip 18, and novel structure, simple, easily assembling.
Described cpu motherboard is released for 16 times and is provided with backboard 22, and described the second securing member 14 links together described backboard 22, cpu motherboard 16 and heat radiator 12 through the first through hole be arranged on described backboard 22.The point of application that backboard 22, the second securing members 14 are set drops on backboard 22, prevents that pcb board from damaging because pressurized is excessive.
Described the first securing member 8 is bolt, and described heat radiator 12 is provided with the internal thread hole coordinated with described the first securing member 8.Described the second securing member 14 is also screw bolt and nut.Employing is threaded, simple in structure, easy operation, and be convenient to dismounting.
As a further improvement on the present invention, described heat radiator 12 is copper.Heat radiator 12 is bronze medal, the one, there is good radiating effect, but the toughness of copper is high, and intensity is low, is not easy to scratch the PCB chip.
Above-described embodiment is preferably embodiment of the present invention; but embodiments of the present invention are not limited by the examples; other any do not deviate from change, the modification done under Spirit Essence of the present invention and principle, substitutes, combination, simplify and all should be equivalent substitute mode, within being included in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claim was defined.
Claims (5)
1. a cpu heat, it is characterized in that: comprise the heat radiator of falling the bowl-type, described heat radiator top is discoideus and is connected with the base plate of a heat radiation rack by the first securing member, this heat radiation rack also comprises several radiating fins that are vertically set on described base plate top, the end of described heat radiator sidepiece is extended with external part to horizontal direction, described external part is provided with the second through hole, through described the second through hole, be provided with second securing member for described external part and cpu motherboard are linked together, the roof of described heat radiator also is connected with a heat-conducting silicone grease, the another side of this heat-conducting silicone grease also is connected with a cpu chip be arranged on described cpu motherboard.
2. a kind of cpu heat as claimed in claim 1, is characterized in that, under described cpu motherboard, releases and be provided with backboard, and described the second securing member links together described backboard, cpu motherboard and heat radiator through the first through hole be arranged on described backboard.
3. a kind of cpu heat as claimed in claim 2, is characterized in that, described the second securing member is screw bolt and nut.
4. a kind of cpu heat as claimed in claim 3, is characterized in that, described the first securing member is bolt, and described heat radiator is provided with the internal thread hole coordinated with described the first securing member.
5. a kind of cpu heat as claimed in claim 4, is characterized in that, described heat radiator is copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103279568A CN103425215A (en) | 2013-07-31 | 2013-07-31 | CUP radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103279568A CN103425215A (en) | 2013-07-31 | 2013-07-31 | CUP radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103425215A true CN103425215A (en) | 2013-12-04 |
Family
ID=49650094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013103279568A Pending CN103425215A (en) | 2013-07-31 | 2013-07-31 | CUP radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103425215A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932638A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | CPU (central processing unit) efficient heat radiator |
| CN104932639A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Heat conduction part for CPU (central processing unit) of portable computer |
| CN109753129A (en) * | 2018-12-24 | 2019-05-14 | 曹丽美 | A kind of server CPU radiator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7321492B2 (en) * | 2005-02-15 | 2008-01-22 | Inventec Corporation | Heat sink module for an electronic device |
| CN101266513A (en) * | 2008-05-15 | 2008-09-17 | 华硕电脑股份有限公司 | Collapsible type radiation system |
| CN201418227Y (en) * | 2009-06-05 | 2010-03-03 | 深圳市宾利达智能科技有限公司 | Novel radiator |
| CN201780542U (en) * | 2009-09-25 | 2011-03-30 | 北京立华莱康平台科技有限公司 | Fanless non-contact radiator, motherboard consisting of fanless non-contact radiator and host computer |
| CN203376681U (en) * | 2013-07-31 | 2014-01-01 | 昆山维金五金制品有限公司 | CPU radiator |
-
2013
- 2013-07-31 CN CN2013103279568A patent/CN103425215A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7321492B2 (en) * | 2005-02-15 | 2008-01-22 | Inventec Corporation | Heat sink module for an electronic device |
| CN101266513A (en) * | 2008-05-15 | 2008-09-17 | 华硕电脑股份有限公司 | Collapsible type radiation system |
| CN201418227Y (en) * | 2009-06-05 | 2010-03-03 | 深圳市宾利达智能科技有限公司 | Novel radiator |
| CN201780542U (en) * | 2009-09-25 | 2011-03-30 | 北京立华莱康平台科技有限公司 | Fanless non-contact radiator, motherboard consisting of fanless non-contact radiator and host computer |
| CN203376681U (en) * | 2013-07-31 | 2014-01-01 | 昆山维金五金制品有限公司 | CPU radiator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104932638A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | CPU (central processing unit) efficient heat radiator |
| CN104932639A (en) * | 2015-05-20 | 2015-09-23 | 铜陵宏正网络科技有限公司 | Heat conduction part for CPU (central processing unit) of portable computer |
| CN109753129A (en) * | 2018-12-24 | 2019-05-14 | 曹丽美 | A kind of server CPU radiator |
| CN109753129B (en) * | 2018-12-24 | 2020-12-29 | 佛山市顺德区酷宇五金制品有限公司 | Server CPU heat abstractor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131204 |