CN203151926U - Integrated board card heat radiation shield assembly - Google Patents
Integrated board card heat radiation shield assembly Download PDFInfo
- Publication number
- CN203151926U CN203151926U CN 201320068798 CN201320068798U CN203151926U CN 203151926 U CN203151926 U CN 203151926U CN 201320068798 CN201320068798 CN 201320068798 CN 201320068798 U CN201320068798 U CN 201320068798U CN 203151926 U CN203151926 U CN 203151926U
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- radome
- circuit board
- integrated circuit
- screening arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an integrated board card heat radiation shield assembly, which is used on a wired cable modem terminal system. The shield assembly comprises a shield cover; the shield cover is a heat radiation shield cover; and a plurality of radiating fins are integrally moulded on the top of the shield cover. The utility model has simple structure and can greatly save cabinet space, and enhance shielding property and heat radiation performance of a circuit board.
Description
Technical field
The utility model relates to the accessory of wired Cable Modem Terminal System (CMTS), relates in particular to a kind of integrated integrated circuit board heat radiation screening arrangement that is used on the wire cable modem terminal system (CMTS).
Background technology
At present, on wire cable modem terminal system (CMTS) equipment, radome and the fansink designs of separating are relatively poor to the heat dispersion of the chip on the pcb board card, and because lack the chip pyrotoxin of heat conductive silica gel contact integrated circuit board, thereby cause that chip is easy to burn out etc., influence the operate as normal of wire cable modem terminal system (CMTS) equipment.How to solve this technical barrier, become a big technical bottleneck.
The utility model content
The purpose of this utility model is to provide a kind of integrated integrated circuit board heat radiation screening arrangement of simple in structure, perfect heat-dissipating.
The technical scheme of this utility model is such:
A kind of integrated integrated circuit board heat radiation screening arrangement, this integrated circuit board heat radiation screening arrangement is used on the wire cable modem terminal system, and it comprises radome; Described radome is the heat radiation radome, and one-body molded at this heat radiation radome top have several fin.
Preferably, described heat radiation radome is aluminium alloy heat radiation radome, and described fin is the fin-shaped aluminum alloy heat sink.
Preferably, it also comprises shockproof thermal conductive silicon glue-line, and described heat radiation radome contacts chip one side of pcb board card of the microarray strip of described wire cable modem terminal system by described shockproof thermal conductive silicon glue-line.
Compared with prior art, the utility model is after adopting said structure, and its beneficial effect that has is as follows:
(1). adopt fin and the integrated design of heat radiation radome, especially adopt the integrated design of fin-shaped aluminum alloy heat sink and aluminium alloy heat radiation radome, be different from traditional detachable design, integrated design reduces the application of Heat Conduction Material and heat-conducting glue on the one hand, aluminium alloy integral body more is conducive to heat conduction on the other hand, so the utility model perfect heat-dissipating.
(2). integrated circuit board heat radiation screening arrangement of the present utility model is monolateral Design of device, namely the heat radiation radome is installed and opposite side is vacated in chip one side of pcb board card, arrange more closely thereby can satisfy the limited device space, improve the device space utilance of the mainframe box of wire cable modem terminal system.
(3). because the heat radiation radome contacts chip one side of pcb board card of the microarray strip of described wire cable modem terminal system by described shockproof thermal conductive silicon glue-line, by shockproof thermal conductive silicon glue-line the chip pyrotoxin of pcb board card is closely contacted heat radiation, further improve heat dispersion, and, also play shockproof effect.
After the detailed description of reading execution mode of the present utility model by reference to the accompanying drawings, it is clearer that characteristics of the present utility model and advantage will become.
Description of drawings
Fig. 1 is the schematic cross-section of execution mode of the present utility model.
Embodiment
With an execution mode the utility model is described in further detail below, but should illustrates, protection range of the present utility model is not limited only to this.
Consult Fig. 1, a kind of integrated integrated circuit board heat radiation screening arrangement, this integrated circuit board heat radiation screening arrangement is used on the wire cable modem terminal system, and it comprises radome 10; Described radome 10 is the heat radiation radome; the heat radiation radome can be aluminium alloy heat radiation radome; one-body molded at heat radiation radome top have a plurality of fin 50; fin 50 can adopt the fin-shaped aluminum alloy heat sink; wherein the quantity of fin-shaped aluminum alloy heat sink can arrange arbitrarily as required, as can not influencing protection range of the present utility model for 10,20 etc.
As the further improvement to present embodiment, described heat radiation radome is installed in chip 30 1 sides of pcb board card 40 of the microarray strip 30 of described wire cable modem terminal system.By adopting monolateral Design of device, namely the heat radiation radome is installed and opposite side is vacated in chip 30 1 sides of pcb board card 40, arrange more closely thereby can satisfy the limited device space, improve the device space utilance of the mainframe box of wire cable modem terminal system.Can improve the heat dispersion of the integrated circuit board heat radiation screening arrangement of present embodiment, can play shockproof effect by shockproof thermal conductive silicon glue-line again.
Though described execution mode of the present utility model by reference to the accompanying drawings; but those skilled in the art can make various distortion or modification within the scope of the appended claims; as long as be no more than the described protection range of claim of the present utility model, all should be within protection range of the present utility model.
Claims (3)
1. integrated integrated circuit board heat radiation screening arrangement, this integrated circuit board heat radiation screening arrangement is used on the wire cable modem terminal system, and it comprises radome; It is characterized in that: described radome is the heat radiation radome, and one-body molded at this heat radiation radome top have several fin.
2. a kind of integrated integrated circuit board heat radiation screening arrangement according to claim 1, it is characterized in that: described heat radiation radome is aluminium alloy heat radiation radome, and described fin is the fin-shaped aluminum alloy heat sink.
3. a kind of integrated integrated circuit board heat radiation screening arrangement according to claim 1 and 2, it is characterized in that: it also comprises shockproof thermal conductive silicon glue-line, and described heat radiation radome contacts chip one side of pcb board card of the microarray strip of described wire cable modem terminal system by described shockproof thermal conductive silicon glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320068798 CN203151926U (en) | 2013-02-05 | 2013-02-05 | Integrated board card heat radiation shield assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320068798 CN203151926U (en) | 2013-02-05 | 2013-02-05 | Integrated board card heat radiation shield assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203151926U true CN203151926U (en) | 2013-08-21 |
Family
ID=48979412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320068798 Expired - Fee Related CN203151926U (en) | 2013-02-05 | 2013-02-05 | Integrated board card heat radiation shield assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203151926U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494029A (en) * | 2019-08-27 | 2019-11-22 | 山东浪潮人工智能研究院有限公司 | The shielding case and arbitrary waveform generator of board for arbitrary waveform generator |
-
2013
- 2013-02-05 CN CN 201320068798 patent/CN203151926U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110494029A (en) * | 2019-08-27 | 2019-11-22 | 山东浪潮人工智能研究院有限公司 | The shielding case and arbitrary waveform generator of board for arbitrary waveform generator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20160205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |