CN203151925U - Board card heat radiation shielding device - Google Patents
Board card heat radiation shielding device Download PDFInfo
- Publication number
- CN203151925U CN203151925U CN 201320068684 CN201320068684U CN203151925U CN 203151925 U CN203151925 U CN 203151925U CN 201320068684 CN201320068684 CN 201320068684 CN 201320068684 U CN201320068684 U CN 201320068684U CN 203151925 U CN203151925 U CN 203151925U
- Authority
- CN
- China
- Prior art keywords
- heat radiation
- radome
- chip
- board card
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a board card heat radiation shielding device, comprising a shielding cover cooperating with a PCB board card with chip. The shielding cover is a heat radiation shielding cover arranged at one side of the PCB board card with chip; and a shockproof heat conduction silica gel layer is arranged between the heat radiation shielding cover and the chip, and respectively tightly contacts with the heat radiation shielding cover and the chip. The utility model has advantages of simple structure, good heat radiation performance and shock resistance, etc.
Description
Technical field
The utility model relates to the accessory of wired Cable Modem Terminal System (CMTS), relates in particular to a kind of integrated circuit board heat radiation screening arrangement that is used on the wire cable modem terminal system (CMTS).
Background technology
At present, on wire cable modem terminal system (CMTS) equipment, radome and the fansink designs of separating are relatively poor to the heat dispersion of the chip on the pcb board card, and because lack the chip pyrotoxin of heat conductive silica gel contact integrated circuit board, thereby cause that chip is easy to burn out etc., influence the operate as normal of wire cable modem terminal system (CMTS) equipment.How to solve this technical barrier, become a big technical bottleneck.
The utility model content
The purpose of this utility model is to provide a kind of simple in structure, perfect heat-dissipating and shockproof integrated circuit board heat radiation screening arrangement.
The technical scheme of this utility model is such:
A kind of integrated circuit board heat radiation screening arrangement, it comprises the radome that cooperates with the pcb board card of microarray strip; Described radome is for heat radiation radome and this heat radiation radome are installed in chip one side of the pcb board card of above-mentioned microarray strip, is provided with shockproof thermal conductive silicon glue-line and above-mentioned shockproof thermal conductive silicon glue-line closely contacts with described chip with described heat radiation radome respectively between this heat radiation radome and described chip.
Preferentially, above-mentioned heat radiation radome is aluminium alloy heat radiation radome.
Compared with prior art, the utility model is after adopting said structure, and its beneficial effect that has is:
In the utility model, radome is the heat radiation radome, so the utlity model has heat dispersion; Shockproof thermal conductive silicon glue-line closely contacts by the chip pyrotoxin to the pcb board card, improves heat dispersion, simultaneously, also plays shockproof effect with tight contact of described heat radiation radome and chip respectively by shockproof thermal conductive silicon glue-line; Integrated circuit board heat radiation screening arrangement of the present utility model is monolateral Design of device, namely the heat radiation radome is installed and opposite side is vacated in chip one side of pcb board card, arrange more closely thereby can satisfy the limited device space, improve the device space utilance of the mainframe box of wire cable modem terminal system.
After the detailed description of reading execution mode of the present utility model by reference to the accompanying drawings, it is clearer that characteristics of the present utility model and advantage will become.
Description of drawings
Fig. 1 is the schematic cross-section of execution mode of the present utility model.
Embodiment
With an execution mode the utility model is described in further detail below, but should illustrates, protection range of the present utility model is not limited only to this.
Consult Fig. 1, a kind of integrated circuit board heat radiation screening arrangement, this integrated circuit board heat radiation screening arrangement is the integrated circuit board heat radiation screening arrangement that is used on the wire cable modem terminal system, it comprises radome 10; Described radome 10 is chip 30 1 sides that heat radiation radome and this heat radiation radome are installed in the pcb board card 40 of extraneous microarray strip 30, is aluminium alloy heat radiation radome as the heat radiation radome; Being provided with shockproof thermal conductive silicon glue-line 20 and above-mentioned shockproof thermal conductive silicon glue-line 20 between heat radiation radome and chip 30 closely contacts with chip 30 with the heat radiation radome respectively.
Though described execution mode of the present utility model by reference to the accompanying drawings; but those skilled in the art can make various distortion or modification within the scope of the appended claims; as long as be no more than the described protection range of claim of the present utility model, all should be within protection range of the present utility model.
Claims (2)
1. integrated circuit board heat radiation screening arrangement, it comprises the radome that cooperates with the pcb board card of microarray strip; It is characterized in that: described radome is for heat radiation radome and this heat radiation radome are installed in chip one side of the pcb board card of above-mentioned microarray strip, is provided with shockproof thermal conductive silicon glue-line and above-mentioned shockproof thermal conductive silicon glue-line closely contacts with described chip with described heat radiation radome respectively between this heat radiation radome and described chip.
2. a kind of integrated circuit board heat radiation screening arrangement according to claim 1, it is characterized in that: above-mentioned heat radiation radome is aluminium alloy heat radiation radome.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320068684 CN203151925U (en) | 2013-02-05 | 2013-02-05 | Board card heat radiation shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320068684 CN203151925U (en) | 2013-02-05 | 2013-02-05 | Board card heat radiation shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203151925U true CN203151925U (en) | 2013-08-21 |
Family
ID=48979411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320068684 Expired - Fee Related CN203151925U (en) | 2013-02-05 | 2013-02-05 | Board card heat radiation shielding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203151925U (en) |
-
2013
- 2013-02-05 CN CN 201320068684 patent/CN203151925U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130821 Termination date: 20160205 |