CN205122567U - Semiconductor heat -dissipating device - Google Patents
Semiconductor heat -dissipating device Download PDFInfo
- Publication number
- CN205122567U CN205122567U CN201520828409.2U CN201520828409U CN205122567U CN 205122567 U CN205122567 U CN 205122567U CN 201520828409 U CN201520828409 U CN 201520828409U CN 205122567 U CN205122567 U CN 205122567U
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- China
- Prior art keywords
- fin
- circuit board
- semiconductor heat
- heat dissipation
- clamping part
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The application discloses semiconductor heat -dissipating device, include with the fin of the perpendicular setting of circuit board, this fin is fixed in the circuit board through the mounting on, the mounting includes a clamping part and connects in the portion of planting of clamping part bottom, the clamping part has one to be fixed the centre gripping space of fin, the portion of planting is fixed in the circuit board. The utility model discloses heat radiation structure is simple, with low costs, installation stability is high, the radiating effect is good.
Description
Technical field
The application belongs to technical field of semiconductors, particularly relates to a kind of semiconductor heat dissipation device.
Background technology
Circuit board of the prior art, usually adopt heat dissipation metal structure, this radiator structure complex structure, cost is high.
In view of this, be necessary to provide a kind of novel radiator structure and the mounting structure between this radiator structure and circuit board.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor heat dissipation device, to overcome deficiency of the prior art.
For achieving the above object, the utility model provides following technical scheme:
The embodiment of the present application discloses a kind of semiconductor heat dissipation device, comprise the vertically disposed fin with circuit board, this fin is fixed on circuit board by fixture, described fixture comprises a clamping part and is connected to the inserting part of clamping part bottom, described clamping part has the grasping part of a fixing described fin, and described inserting part is fixed on described circuit board.
Preferably, in above-mentioned semiconductor heat dissipation device, described fin is ceramic radiating fin.
Preferably, in above-mentioned semiconductor heat dissipation device, described fin offers the through hole holding heater element.
Preferably, in above-mentioned semiconductor heat dissipation device, the surface of described fin is formed with Graphene coating.
Compared with prior art, the utility model has the advantage of: the utility model radiator structure is simple, cost is low, installation stability is high, good heat dissipation effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Figure 1 shows that the structural representation of semiconductor heat dissipation device in the utility model specific embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be described in detail the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of the utility model protection.
Shown in ginseng Fig. 1, semiconductor heat dissipation device, comprise the vertically disposed fin 1 with circuit board, this fin is fixed on circuit board by fixture 2, fixture comprises a clamping part 21 and is connected to the inserting part 22 of clamping part bottom, clamping part has the grasping part of a fixing cooling fins, and inserting part is fixed on circuit board.
Further, fin is ceramic radiating fin.
Further, fin offers the through hole 11 holding heater element.
Further, the surface of fin is formed with Graphene coating.
The utility model radiator structure is simple, cost is low, installation stability is high, good heat dissipation effect.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.
Claims (4)
1. a semiconductor heat dissipation device, it is characterized in that, comprise the vertically disposed fin with circuit board, this fin is fixed on circuit board by fixture, described fixture comprises a clamping part and is connected to the inserting part of clamping part bottom, described clamping part has the grasping part of a fixing described fin, and described inserting part is fixed on described circuit board.
2. semiconductor heat dissipation device according to claim 1, is characterized in that: described fin is ceramic radiating fin.
3. semiconductor heat dissipation device according to claim 2, is characterized in that: described fin offers the through hole holding heater element.
4. semiconductor heat dissipation device according to claim 1, is characterized in that: the surface of described fin is formed with Graphene coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520828409.2U CN205122567U (en) | 2015-10-24 | 2015-10-24 | Semiconductor heat -dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520828409.2U CN205122567U (en) | 2015-10-24 | 2015-10-24 | Semiconductor heat -dissipating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205122567U true CN205122567U (en) | 2016-03-30 |
Family
ID=55578148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520828409.2U Active CN205122567U (en) | 2015-10-24 | 2015-10-24 | Semiconductor heat -dissipating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205122567U (en) |
-
2015
- 2015-10-24 CN CN201520828409.2U patent/CN205122567U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Du Peizhi Inventor before: Zhao Weida |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160817 Address after: 528000 Guangdong Province, Foshan city Shunde District Lunjiao street community residents often teach Guang Zhu Lu (Hefeng Wai) east of Guang Zhu Lu No. 2 (No. 301, No. 8 West woodworking mall on the third floor) Patentee after: Guangdong six Licensing Electronic Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215624 Zhangjiagang City Jin (Fengzhen Jinxiu road Jiangsu Yangtze River International Metallurgical Industrial Park No. 1 Jiulong Logistics Park) Jiangsu Wo Yi Import & Export Co. Ltd. Patentee before: JIANGSU YIHE IMPORT & EXPORT CO., LTD. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170309 Address after: 528000 Guangdong Province, Foshan city Shunde District Lunjiao often teach East Hefeng Wei Guang Zhu Lu Guang Zhu Lu 2-3 (carpenter City No. 8 two floor) Patentee after: Shunde District, Foshan, the United States and the United States Electronics Manufacturing Co., Ltd. Address before: 528000 Guangdong Province, Foshan city Shunde District Lunjiao street community residents often teach Guang Zhu Lu (Hefeng Wai) east of Guang Zhu Lu No. 2 (No. 301, No. 8 West woodworking mall on the third floor) Patentee before: Guangdong six Licensing Electronic Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 528000 No. 2-3, hefengwei Guangzhu Road, east of Lunjiao changjiao Guangzhu Road, Shunde District, Foshan City, Guangdong Province (floor 2, No. 8, carpentry city) Patentee after: Foshan Meite Intelligent Technology Co., Ltd Address before: 528000 No. 2-3, hefengwei Guangzhu Road, east of Lunjiao changjiao Guangzhu Road, Shunde District, Foshan City, Guangdong Province (floor 2, No. 8, carpentry city) Patentee before: Foshan Shunde Temei Electronic Manufacturing Co., Ltd |