CN205122566U - Semiconductor fin fixing device - Google Patents
Semiconductor fin fixing device Download PDFInfo
- Publication number
- CN205122566U CN205122566U CN201520828274.XU CN201520828274U CN205122566U CN 205122566 U CN205122566 U CN 205122566U CN 201520828274 U CN201520828274 U CN 201520828274U CN 205122566 U CN205122566 U CN 205122566U
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- China
- Prior art keywords
- fin
- circuit board
- fixtures
- semiconductor heat
- dissipating sheet
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Abstract
The application discloses semiconductor fin fixing device, fin are on a parallel with the setting of circuit board, and the fin is installed on the circuit board through at least one mounting, every mounting include one with a fixed clamping part of fin and a portion of fixing with the circuit board of planting. The utility model discloses heat radiation structure is simple, with low costs, installation stability is high, the radiating effect is good.
Description
Technical field
The application belongs to technical field of semiconductors, particularly relates to a kind of semiconductor heat-dissipating sheet fixture.
Background technology
Circuit board of the prior art, usually adopt heat dissipation metal structure, this radiator structure complex structure, cost is high.
In view of this, be necessary to provide a kind of novel radiator structure and the mounting structure between this radiator structure and circuit board.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor heat-dissipating sheet fixture, to overcome deficiency of the prior art.
For achieving the above object, the utility model provides following technical scheme:
The embodiment of the present application discloses a kind of semiconductor heat-dissipating sheet fixture, fin is parallel to circuit board and arranges, fin is installed on circuit board by least one fixture, and described each fixture comprises a clamping part fixed with described fin and an inserting part fixed with circuit board.
Preferably, in above-mentioned semiconductor heat-dissipating sheet fixture, fin is installed on circuit board by 2 fixtures, and these 2 fixtures are individually fixed in two drift angle places at described fin diagonal angle.
Preferably, in above-mentioned semiconductor heat-dissipating sheet fixture, fin is installed on circuit board by 2 fixtures, and these 2 fixtures are individually fixed in the relative both sides of described fin.
Preferably, in above-mentioned semiconductor heat-dissipating sheet fixture, fin is installed on circuit board by 4 fixtures, and these 4 fixtures are individually fixed in described fin 4 drift angle places.
Preferably, in above-mentioned semiconductor heat-dissipating sheet fixture, fin is installed on circuit board by 4 fixtures, and these 4 fixtures are individually fixed in described fin 4 sides.
Preferably, in above-mentioned semiconductor heat-dissipating sheet fixture, described fin is ceramic radiating fin.
Preferably, in above-mentioned semiconductor heat-dissipating sheet fixture, the surface of described fin is formed with Graphene coating.
Compared with prior art, the utility model has the advantage of: the utility model radiator structure is simple, cost is low, installation stability is high, good heat dissipation effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Figure 1 shows that the structural representation of semiconductor heat-dissipating sheet fixture in the utility model specific embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be described in detail the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of the utility model protection.
Shown in ginseng Fig. 1, semiconductor heat-dissipating sheet fixture, fin 1 is parallel to circuit board and arranges, and fin is installed on circuit board by least one fixture 2, and each fixture comprises the clamping part fixed with fin 21 and the inserting part 22 fixed with circuit board.
Further, fin is installed on circuit board by 2 fixtures, and these 2 fixtures are individually fixed in two drift angle places at fin diagonal angle.
In another embodiment, fin is installed on circuit board by 2 fixtures, and these 2 fixtures are individually fixed in the relative both sides of fin.
Further, fin is installed on circuit board by 4 fixtures, and these 4 fixtures are individually fixed in fin 4 drift angle places.
In another embodiment, fin is installed on circuit board by 4 fixtures, and these 4 fixtures are individually fixed in fin 4 sides.
Further, fin is ceramic radiating fin.
Further, the surface of fin is formed with Graphene coating.
The utility model radiator structure is simple, cost is low, installation stability is high, good heat dissipation effect.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.
Claims (7)
1. a semiconductor heat-dissipating sheet fixture, it is characterized in that: fin is parallel to circuit board and arranges, fin is installed on circuit board by least one fixture, and described each fixture comprises a clamping part fixed with described fin and an inserting part fixed with circuit board.
2. semiconductor heat-dissipating sheet fixture according to claim 1, is characterized in that: fin is installed on circuit board by 2 fixtures, these 2 fixtures are individually fixed in two drift angle places at described fin diagonal angle.
3. semiconductor heat-dissipating sheet fixture according to claim 1, is characterized in that: fin is installed on circuit board by 2 fixtures, these 2 fixtures are individually fixed in the relative both sides of described fin.
4. semiconductor heat-dissipating sheet fixture according to claim 1, is characterized in that: fin is installed on circuit board by 4 fixtures, these 4 fixtures are individually fixed in described fin 4 drift angle places.
5. semiconductor heat-dissipating sheet fixture according to claim 1, is characterized in that: fin is installed on circuit board by 4 fixtures, these 4 fixtures are individually fixed in described fin 4 sides.
6. semiconductor heat-dissipating sheet fixture according to claim 1, is characterized in that: described fin is ceramic radiating fin.
7. semiconductor heat-dissipating sheet fixture according to claim 1, is characterized in that: the surface of described fin is formed with Graphene coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520828274.XU CN205122566U (en) | 2015-10-24 | 2015-10-24 | Semiconductor fin fixing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520828274.XU CN205122566U (en) | 2015-10-24 | 2015-10-24 | Semiconductor fin fixing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205122566U true CN205122566U (en) | 2016-03-30 |
Family
ID=55578147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520828274.XU Active CN205122566U (en) | 2015-10-24 | 2015-10-24 | Semiconductor fin fixing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205122566U (en) |
-
2015
- 2015-10-24 CN CN201520828274.XU patent/CN205122566U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Du Peizhi Inventor before: Zhao Weida |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160823 Address after: 528000 Guangdong Province, Foshan city Shunde District Lunjiao street community residents often teach Guang Zhu Lu (Hefeng Wai) east of Guang Zhu Lu No. 2 (No. 301, No. 8 West woodworking mall on the third floor) Patentee after: Guangdong six Licensing Electronic Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215624 Zhangjiagang City Jin (Fengzhen Jinxiu road Jiangsu Yangtze River International Metallurgical Industrial Park No. 1 Jiulong Logistics Park) Jiangsu Wo Yi Import & Export Co. Ltd. Patentee before: JIANGSU YIHE IMPORT & EXPORT CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170227 Address after: 528000 Guangdong Province, Foshan city Shunde District Lunjiao often teach East Hefeng Wei Guang Zhu Lu Guang Zhu Lu 2-3 (carpenter City No. 8 two floor) Patentee after: Shunde District, Foshan, the United States and the United States Electronics Manufacturing Co., Ltd. Address before: 528000 Guangdong Province, Foshan city Shunde District Lunjiao street community residents often teach Guang Zhu Lu (Hefeng Wai) east of Guang Zhu Lu No. 2 (No. 301, No. 8 West woodworking mall on the third floor) Patentee before: Guangdong six Licensing Electronic Technology Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: No.2-3, Guangzhu Road, hefengwei, east of Guangzhu Road, changjiao, Lunjiao, Shunde District, Foshan City, Guangdong Province Patentee after: Foshan Meite Intelligent Technology Co., Ltd Address before: No.2-3, Guangzhu Road, hefengwei, east of Guangzhu Road, changjiao, Lunjiao, Shunde District, Foshan City, Guangdong Province Patentee before: Foshan Shunde Temei Electronic Manufacturing Co., Ltd |
|
| CP01 | Change in the name or title of a patent holder |