CN205179602U - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN205179602U CN205179602U CN201520828772.4U CN201520828772U CN205179602U CN 205179602 U CN205179602 U CN 205179602U CN 201520828772 U CN201520828772 U CN 201520828772U CN 205179602 U CN205179602 U CN 205179602U
- Authority
- CN
- China
- Prior art keywords
- buckle
- mounting panel
- heat abstractor
- section
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses heat dissipation device, including the mounting panel, the mounting panel is stretched to the epirelief respectively in the both sides that the first direction is relative has first buckle and second buckle, and this first buckle and second buckle are fixed in the fin the upper surface of mounting panel, be equipped with resilient mount between fin and the circuit board, this resilient mount including press in the first section of fin top surface and extend respectively in the second section and the third section at first section both ends, second section and third section are fixed in on the circuit board. The utility model discloses heat radiation structure is simple, with low costs, installation stability is high, the radiating effect is good.
Description
Technical field
The application belongs to technical field of semiconductors, particularly relates to a kind of heat abstractor.
Background technology
Circuit board of the prior art, usually adopt heat dissipation metal structure, this radiator structure complex structure, cost is high.
In view of this, be necessary to provide a kind of novel radiator structure and the mounting structure between this radiator structure and circuit board.
Utility model content
The purpose of this utility model is to provide a kind of heat abstractor, to overcome deficiency of the prior art.
For achieving the above object, the utility model provides following technical scheme:
The embodiment of the present application discloses a kind of heat abstractor, comprise mounting panel, described mounting panel the relative both sides of first direction respectively on protruded out the first buckle and the second buckle, fin is fixed on the upper surface of described mounting panel by this first buckle and the second buckle, flexible fastening piece is provided with between described fin and circuit board, this flexible fastening piece comprises the first paragraph being pressed on described heat sink top surface and the second segment extending described first paragraph two ends respectively and the 3rd section, and described second segment and the 3rd section are fixed on described circuit board.
Preferably, in above-mentioned heat abstractor, described first buckle and the second buckle offer the first cell body and the second cell body respectively, described first paragraph is spacing in described first cell body and the second cell body.
Preferably, in above-mentioned heat abstractor, described second segment and the 3rd section of difference extend in the opposite direction.
Preferably, in above-mentioned heat abstractor, the end of described second segment and the 3rd section is formed with a snap fit respectively.
Preferably, in above-mentioned heat abstractor, between described fin and described mounting panel, be formed with Graphene coating.
Preferably, in above-mentioned heat abstractor, described mounting panel the relative both sides of second direction respectively on protruded out baffle plate, described fin is between described baffle plate, and described first direction is perpendicular to described second direction.
Preferably, in above-mentioned heat abstractor, the drift angle place of the bottom of described mounting panel is also provided with pad.
Preferably, in above-mentioned heat abstractor, described fin is ceramic radiating fin.
Compared with prior art, the utility model has the advantage of: the utility model radiator structure is simple, cost is low, installation stability is high, good heat dissipation effect.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Figure 1 shows that the structural representation of heat abstractor in the utility model specific embodiment.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be described in detail the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of the utility model protection.
Shown in ginseng Fig. 1, heat abstractor, comprise mounting panel 1, mounting panel the relative both sides of first direction respectively on protruded out the first buckle 2 and the second buckle 3, fin 10 is fixed on the upper surface of mounting panel by this first buckle and the second buckle, be provided with flexible fastening piece 4 between fin and circuit board, this flexible fastening piece comprises the first paragraph 41 being pressed on heat sink top surface and the second segment 42 extending first paragraph two ends respectively and the 3rd section 43, and second segment and the 3rd section are fixed on circuit board.
Further, the first buckle and the second buckle offer the first cell body 21 and the second cell body 31 respectively, and first paragraph is spacing in the first cell body and the second cell body.
Further, second segment and the 3rd section of difference extend in the opposite direction.
Further, the end of second segment and the 3rd section is formed with a snap fit 44 respectively.
Further, Graphene coating is formed between fin and mounting panel.
Further, mounting panel the relative both sides of second direction respectively on protruded out baffle plate 5, fin is between baffle plate, and first direction is perpendicular to second direction.
Further, the drift angle place of the bottom of mounting panel is also provided with pad 6.
Further, fin is ceramic radiating fin.
The utility model radiator structure is simple, cost is low, installation stability is high, good heat dissipation effect.
It should be noted that, in this article, the such as relational terms of first and second grades and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element limited by statement " comprising ... ", and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical element.
The above is only the embodiment of the application; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the application's principle; can also make some improvements and modifications, these improvements and modifications also should be considered as the protection range of the application.
Claims (8)
1. a heat abstractor, it is characterized in that, comprise mounting panel, described mounting panel the relative both sides of first direction respectively on protruded out the first buckle and the second buckle, fin is fixed on the upper surface of described mounting panel by this first buckle and the second buckle, flexible fastening piece is provided with between described fin and circuit board, this flexible fastening piece comprises the first paragraph being pressed on described heat sink top surface and the second segment extending described first paragraph two ends respectively and the 3rd section, and described second segment and the 3rd section are fixed on described circuit board.
2. heat abstractor according to claim 1, is characterized in that: described first buckle and the second buckle offer the first cell body and the second cell body respectively, and described first paragraph is spacing in described first cell body and the second cell body.
3. heat abstractor according to claim 1, is characterized in that: described second segment and the 3rd section of difference extend in the opposite direction.
4. heat abstractor according to claim 1, is characterized in that: the end of described second segment and the 3rd section is formed with a snap fit respectively.
5. heat abstractor according to claim 1, is characterized in that: be formed with Graphene coating between described fin and described mounting panel.
6. heat abstractor according to claim 1, is characterized in that: described mounting panel the relative both sides of second direction respectively on protruded out baffle plate, described fin is between described baffle plate, and described first direction is perpendicular to described second direction.
7. heat abstractor according to claim 1, is characterized in that: the drift angle place of the bottom of described mounting panel is also provided with pad.
8. heat abstractor according to claim 1, is characterized in that: described fin is ceramic radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520828772.4U CN205179602U (en) | 2015-10-24 | 2015-10-24 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520828772.4U CN205179602U (en) | 2015-10-24 | 2015-10-24 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205179602U true CN205179602U (en) | 2016-04-20 |
Family
ID=55743526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520828772.4U Expired - Fee Related CN205179602U (en) | 2015-10-24 | 2015-10-24 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205179602U (en) |
-
2015
- 2015-10-24 CN CN201520828772.4U patent/CN205179602U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Yang Gang Inventor before: Zhao Weida |
|
| COR | Change of bibliographic data | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160812 Address after: 100162 Beijing City, Xihongmen Town, Henan village, West Village, No., No. 1 Patentee after: Beijing STLAWRENCE Radiator Manufacturing Co., Ltd. Address before: Suzhou City, Jiangsu province 215624 Zhangjiagang City Jin (Fengzhen Jinxiu road Jiangsu Yangtze River International Metallurgical Industrial Park No. 1 Jiulong Logistics Park) Jiangsu Wo Yi Import & Export Co. Ltd. Patentee before: JIANGSU YIHE IMPORT & EXPORT CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160420 Termination date: 20161024 |