CN210199678U

CN210199678U - Liquid cooling placing box for chip

Info

Publication number: CN210199678U
Application number: CN201921370166.7U
Authority: CN
Inventors: Guoguang Mu; 母国光
Original assignee: Suzhou Chi Fu Electronic Technology Co Ltd
Current assignee: Sichuan Yiheyuan Technology Co ltd
Priority date: 2019-08-22
Filing date: 2019-08-22
Publication date: 2020-03-27
Anticipated expiration: 2029-08-22

Abstract

The utility model discloses a box is placed to liquid cooling for chip, including the heat conduction bottom plate, heat conduction bottom plate upper end both sides are the fixed heat conduction copper pipe that is provided with all, heat conduction copper pipe upper end outside fixed surface is provided with a plurality of heat conduction fin boards, the fixed communicating pipe that is provided with between the heat conduction fin board, the fixed feed liquor pipe that is provided with in communicating pipe one side, the fixed drain pipe that is provided with in one side of feed liquor pipe is kept away from to communicating pipe, the fixed heat dissipation mechanism that is provided with in one side of communicating pipe is kept away from to the drain. The utility model discloses the result of use is better, can help the CPU chip to dispel the heat fast, and the cooling liquid for the heat dissipation simultaneously also can dispel the heat fast to improve device's result of use.

Description

Liquid cooling placing box for chip

Technical Field

The utility model relates to a cooling device technical field specifically is a box is placed to liquid cooling for chip.

Background

The CPU is also called a CPU, which is an ultra-large scale integrated circuit and is an operation core and a control core of a computer. Its functions are mainly to interpret computer instructions and to process data in computer software. The CPU generates heat when working, so that the CPU needs to be radiated, and the existing radiation prevention is mostly water cooling and air cooling.

However, most of the currently used water-cooling heat dissipation methods are that cooling liquid is guided through a water pipe from the upper end of the CPU, and then the heat of the CPU is taken away through the flow of the cooling liquid.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a box is placed to liquid cooling for chip to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a box is placed to liquid cooling for chip, includes the heat conduction bottom plate, heat conduction bottom plate upper end both sides are all fixed and are provided with the heat conduction copper pipe, heat conduction copper pipe upper end outside fixed surface is provided with a plurality of heat conduction fin boards, the fixed communicating pipe that is provided with between the heat conduction fin board, the fixed feed liquor pipe that is provided with in communicating pipe one side, the fixed drain pipe that is provided with in one side of keeping away from the feed liquor pipe communicating pipe, the fixed heat dissipation mechanism that is provided with in one side of keeping away from communicating pipe.

Preferably, heat dissipation mechanism includes splitter box, screwed pipe, collection groove, the fixed one end of keeping away from communicating pipe at the drain pipe that sets up of splitter box, the fixed a plurality of screwed pipes that are provided with in one side that the drain pipe was kept away from to the splitter box, the fixed collection groove that is provided with of one end that the splitter box was kept away from to the screwed pipe, thereby increase the area of contact of coolant liquid and air in shunting the screwed pipe through the splitter box with the coolant liquid to help the coolant liquid dispel the heat fast.

Preferably, one side of the flow collecting groove, which is far away from the threaded pipe, is fixedly provided with a return pipe, and an external device can be conveniently connected through the return pipe.

Preferably, the fixed heat conduction silica gel that is provided with of heat conduction bottom plate lower extreme improves the heat conduction effect of device through heat conduction silica gel and CPU chip contact, and the heat conduction silica gel is soft simultaneously and the not fragile CPU chip of CPU chip contact.

Preferably, the connecting blocks are fixedly arranged on two sides of the heat conducting bottom plate, threaded holes are formed in the upper end surface of each connecting block, and the device can be conveniently installed on the main board through the threaded holes and the connecting blocks.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses the heat that the CPU chip during operation produced can be through heat conduction bottom plate transmission to the heat conduction copper pipe on, then transmit heat conduction fin board, at this moment can open micro-water pump with the coolant liquid from the inside pump of coolant liquid storage storehouse to go into the feed liquor pipe, go into communicating pipe from the feed liquor pipe pump afterwards, take away the heat on heat conduction fin board surface through communicating pipe, in order to reach quick radiating effect, and increase its area of contact through heat conduction fin board and communicating pipe, in order to improve its radiating rate.

2. The utility model discloses carry during thermal coolant liquid can flow in the splitter box through the drain pipe, then flow in the screwed pipe, increase the area of contact of coolant liquid and air through the screwed pipe to help the coolant liquid dispel the heat fast.

Drawings

Fig. 1 is a schematic view of the overall structure of a liquid cooling placing box for chips according to the present invention;

fig. 2 is a right side view of a liquid cooling placing box for a chip according to the present invention;

fig. 3 is the utility model relates to a box heat dissipation mechanism overall structure schematic diagram is placed to liquid cooling for chip.

In the figure: 1. a thermally conductive base plate; 2. a heat conducting copper pipe; 3. a heat conductive fin plate; 4. a communicating pipe; 5. a liquid inlet pipe; 6. a liquid outlet pipe; 7. a shunt slot; 8. a threaded pipe; 9. a collecting groove; 10. a return pipe; 11. connecting blocks; 12. a threaded hole; 13. thermally conductive silicone.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a box is placed to liquid cooling for chip, includes heat

conduction bottom plate

1, 1 upper end both sides of heat conduction bottom plate are all fixed and are provided with heat

conduction copper pipe

2, 2 upper end outside fixed surfaces of heat conduction copper pipe are provided with a plurality of heat conduction fin boards 3, the fixed communicating pipe 4 that is provided with between the heat

conduction fin board

3, 4 one side of communicating pipe is fixed and is provided with

feed liquor pipe

5, 4 one side of keeping away from feed liquor pipe 5 of communicating pipe is fixed and is provided with drain pipe 6, the fixed heat dissipation mechanism that is provided with in one side of 4 communicating pipe is kept away from.

The heat dissipation mechanism comprises a diversion channel 7, a threaded pipe 8 and a flow collecting channel 9, the diversion channel 7 is fixedly arranged at one end of the liquid outlet pipe 6 far away from the communicating pipe 4, one side of the diversion channel 7 far away from the liquid outlet pipe 6 is fixedly provided with a plurality of threaded pipes 8, one end of the threaded pipe 8 far away from the diversion channel 7 is fixedly provided with a flow collecting channel 9, the cooling liquid is distributed into the threaded pipes 8 through the diversion channel 7 so as to enlarge the contact area of the cooling liquid and air, thereby helping the cooling liquid to dissipate heat quickly, one side of the flow collecting channel 9 far away from the threaded pipes 8 is fixedly provided with a return pipe 10, an external device can be facilitated through the return pipe 10, the lower end of the heat conduction bottom plate 1 is fixedly provided with heat conduction silica gel 13, the heat conduction effect of the device is improved through the contact of the heat conduction silica gel 13 and a CPU chip, meanwhile, the heat, the threaded hole 12 is opened on the surface of the upper end of the connecting block 11, and the device can be conveniently installed on the main board through the threaded hole 12 and the connecting block 11.

The working principle is as follows: before the device is used, the device can be arranged in a target area on a main board through a threaded hole 12 and a connecting block 11, so that a heat-conducting silica gel 13 is tightly contacted with a CPU chip, the heat-conducting effect of the device is improved through the contact of the heat-conducting silica gel 13 with the CPU chip, meanwhile, the heat-conducting silica gel 13 is softer and is contacted with the CPU chip, the CPU chip is not easy to damage, a return pipe 10 is connected with a cooling liquid storage bin, a liquid inlet pipe 5 is connected with a micro water pump, the micro water pump is connected with the cooling liquid storage bin, heat generated during the working of the CPU chip is transferred to a heat-conducting copper pipe 2 through a heat-conducting bottom plate 1 and then is transferred to a heat-conducting fin plate 3, at the moment, the micro water pump can be opened to pump cooling liquid into the liquid inlet pipe 5 from the inside the cooling liquid storage bin, then the heat is pumped into a communicating pipe, and increase its area of contact through heat conduction fin plate 3 and communicating pipe 4 to improve its radiating rate, carry thermal coolant liquid at last and can flow into splitter box 7 through drain pipe 6, then flow into in screwed pipe 8, increase the area of contact of coolant liquid and air through screwed pipe 8, thereby help the coolant liquid dispel the heat fast, the coolant liquid after the cooling at last flows into the coolant liquid through back flow 10 and stores the storehouse, it is exactly the utility model relates to a box is placed to liquid cooling for chip theory of operation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a box is placed to liquid cooling for chip, includes heat conduction bottom plate (1), its characterized in that: heat conduction bottom plate (1) upper end both sides are all fixed and are provided with heat conduction copper pipe (2), heat conduction copper pipe (2) upper end outside fixed surface is provided with a plurality of heat conduction fin boards (3), fixed communicating pipe (4) of being provided with between heat conduction fin board (3), fixed feed liquor pipe (5) of being provided with in communicating pipe (4) one side, one side that feed liquor pipe (5) were kept away from in communicating pipe (4) is fixed and is provided with drain pipe (6), the fixed heat dissipation mechanism that is provided with in one side that communicating pipe (4) were kept away from in drain pipe (6).

2. The liquid-cooled chip placing case according to claim 1, wherein: the heat dissipation mechanism comprises a diversion trench (7), threaded pipes (8) and a flow collection trench (9), wherein the diversion trench (7) is fixedly arranged at one end, far away from the communicating pipe (4), of the liquid outlet pipe (6), one side, far away from the liquid outlet pipe (6), of the diversion trench (7) is fixedly provided with a plurality of threaded pipes (8), and one end, far away from the diversion trench (7), of each threaded pipe (8) is fixedly provided with the flow collection trench (9).

3. The liquid-cooled chip placing case according to claim 2, wherein: a return pipe (10) is fixedly arranged on one side of the flow collecting groove (9) far away from the threaded pipe (8).

4. The liquid-cooled chip placing case according to claim 1, wherein: and the lower end of the heat-conducting bottom plate (1) is fixedly provided with heat-conducting silica gel (13).

5. The liquid-cooled chip placing case according to claim 1, wherein: both sides of the heat conduction bottom plate (1) are fixedly provided with connecting blocks (11), and threaded holes (12) are formed in the upper end surface of each connecting block (11).