CN211044162U - Computer CPU heat dissipation heat sink - Google Patents
Computer CPU heat dissipation heat sink Download PDFInfo
- Publication number
- CN211044162U CN211044162U CN201922257289.6U CN201922257289U CN211044162U CN 211044162 U CN211044162 U CN 211044162U CN 201922257289 U CN201922257289 U CN 201922257289U CN 211044162 U CN211044162 U CN 211044162U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- water
- heat
- dissipation plate
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 82
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 239000000110 cooling liquid Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 239000002826 coolant Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer CPU heat dissipation and cooling device, which comprises a case, wherein both sides of the case are provided with heat dissipation windows, heat dissipation fans are arranged in the heat dissipation windows, a water tank and a heat dissipation plate are arranged in the case, the heat dissipation plate is fixedly arranged in the case through screws, the heat dissipation plate is positioned between the two heat dissipation fans, one side of the bottom surface of the heat dissipation plate is provided with a water inlet, the other side of the bottom surface of the heat dissipation plate is provided with a water outlet, a heat dissipation water channel is arranged in the heat dissipation plate, the head end and the tail end of the heat dissipation water channel are respectively communicated with the water inlet and the water outlet; the device is used for radiating the CPU of the computer, and the specific heat capacity of water is overlarge, so that a large amount of heat can be absorbed, the temperature can not be obviously changed, the temperature of the CPU connected with the radiating plate can be well controlled, and sudden operation can not cause instantaneous and large-amplitude change of the internal temperature of the CPU.
Description
Technical Field
The utility model relates to a computer heat dissipation technical field puts, especially relates to a computer CPU heat dissipation heat sink.
Background
The development of computer chip technology makes the heat productivity of the CPU larger and larger, and the development of effective cooling technology to solve the heat dissipation of the CPU is an important subject being researched in the world today. The most widely used CPU heat dissipation technology at present is still forced air cooling heat dissipation. However, the air cooling heat dissipation efficiency is poor, and the heat dissipation requirement of the modern computer cannot be met gradually.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of prior art, the utility model provides a computer CPU heat dissipation heat sink can improve the radiating effect for computer CPU heat dissipation cooling through forced air cooling heat dissipation and water-cooling heat dissipation cooperation.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model provides a computer CPU heat dissipation heat sink, includes quick-witted case, the both sides of machine case all are provided with the heat dissipation window, install radiator fan in the heat dissipation window, the machine incasement is provided with water tank and heating panel, the heating panel passes through the screw and adorns admittedly in quick-witted incasement, and the heating panel is located between two radiator fan, one side of heating panel bottom surface is provided with the water inlet, and the opposite side is provided with the delivery port, the inside of heating panel is provided with the heat dissipation water course of head and tail end respectively with water inlet and delivery port intercommunication, the water tank is adorned in quick-witted incasement portion one corner admittedly, the water outlet end of water tank is connected with the water inlet of heating panel through the pipe.
As an optimized technical solution of the present invention, the back of the heat dissipation plate is provided with a plurality of evenly distributed heat dissipation fins.
As a preferred technical scheme of the utility model, the heating panel is made for copper or aluminium material.
As a preferred technical scheme of the utility model, the pipe is the transparent plastic tubing of water proofness.
As an optimized technical scheme of the utility model, the coolant liquid has been stored in the water tank, add the brightener in the coolant liquid.
Compared with the prior art, the utility model discloses the beneficial effect that can reach is:
the device is used for radiating the CPU of the computer, and the specific heat capacity of water is overlarge, so that a large amount of heat can be absorbed, the temperature cannot be obviously changed, the temperature of the CPU connected with the radiating plate can be well controlled, and the sudden operation cannot cause the instantaneous and large change of the internal temperature of the CPU; after the cooling water absorbs the heat of the CPU, the cooling water continuously flows in the guide pipe and gradually dissipates the heat, and even if the external temperature is high, the water dissipates heat slowly, and after the heat dissipation fan is started, the heat dissipation speed of the water can be greatly accelerated only by a low rotating speed.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a cross-sectional view of the heat dissipating plate of the present invention;
FIG. 3 is a bottom view of the heat dissipating plate of the present invention;
wherein: 1. a chassis; 2. a heat dissipation window; 3. a heat radiation fan; 4. a heat dissipation plate; 5. a water tank; 6. a micro water pump; 7. a conduit; 8. a heat dissipation water channel; 9. heat dissipation fins; 10. a water inlet; 11. and (7) a water outlet.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Referring to fig. 1-3, a computer CPU heat dissipation and cooling device includes a case 1, heat dissipation windows 2 are disposed on both sides of the case 1, heat dissipation fans 3 are installed in the heat dissipation windows 2, a water tank 5 and a heat dissipation plate 4 are disposed in the case 1, the heat dissipation plate 4 is fixedly installed in the case 1 through screws, the heat dissipation plate 4 is located between the two heat dissipation fans 3, a water inlet 10 is disposed on one side of the bottom surface of the heat dissipation plate 4, a water outlet 11 is disposed on the other side of the bottom surface of the heat dissipation plate 4, a heat dissipation water channel 8 is disposed in the heat dissipation plate 4, the head and the tail of the heat dissipation water channel are respectively communicated with the water inlet 10 and the water outlet 11, the water tank 5 is fixedly installed at one corner of the case 1, the water outlet of the water tank 5 is connected with the.
The back of the heat dissipation plate 4 is provided with a plurality of uniformly distributed heat dissipation fins 9, the heat dissipation fins 9 can increase the heat dissipation area of the heat dissipation plate 4, so that the heat dissipation effect is improved, meanwhile, the heat dissipation fins 9 form a plurality of heat dissipation air channels between the two heat dissipation fans 3, the air speed flowing on the surface of the heat dissipation plate 4 can be accelerated, and the heat dissipation effect is further improved.
The heat dissipation plate 4 is made of copper or aluminum, and copper and aluminum have good thermal conductivity and can increase the heat dissipation efficiency.
The conduit 7 is a water-tight transparent plastic pipe, the water tank 5 is internally stored with cooling liquid, a brightener is added into the cooling liquid, and the brightener is added into the water tank, so that the water is more attractive under the irradiation of lamplight in the case when circularly flowing in the transparent conduit.
Specifically, a computer CPU is arranged at one side of a heat dissipation plate 4 in a case 1, cooling liquid in a heat dissipation water channel 8 in the heat dissipation plate 4 circularly flows through the driving of a micro water pump 6, and the specific heat capacity of water is very large, so that a large amount of heat can be absorbed, the temperature cannot be obviously changed, the temperature of the CPU connected with the heat dissipation plate 4 can be well controlled, and sudden operation cannot cause instantaneous and large change of the internal temperature of the CPU; after the heat of the CPU is absorbed by the cooling liquid, the cooling liquid continuously flows in the guide pipe 7 to gradually dissipate the heat, if the external temperature is higher, the heat dissipation of the cooling liquid is slower, and the cooling fan 3 can directly dissipate the heat of the cooling plate 4 and the cooling liquid through wind power, so that the temperature is quickly reduced.
The embodiments of the present invention are not limited to the above embodiments, and according to the contents of the above embodiments of the present invention, the above preferred embodiments can also make modifications, replacements or combinations of other forms by using conventional technical knowledge and conventional means in the field without departing from the basic technical idea of the present invention, and the obtained other embodiments all fall within the scope of the present invention.
Claims (5)
1. A computer CPU heat dissipation and cooling device comprises a case (1) and is characterized in that heat dissipation windows (2) are arranged on two sides of the case (1), heat dissipation fans (3) are installed in the heat dissipation windows (2), a water tank (5) and a heat dissipation plate (4) are arranged in the case (1), the heat dissipation plate (4) is fixedly installed in the case (1) through screws, the heat dissipation plate (4) is located between the two heat dissipation fans (3), a water inlet (10) is arranged on one side of the bottom surface of the heat dissipation plate (4), a water outlet (11) is arranged on the other side of the bottom surface of the heat dissipation plate (4), a heat dissipation water channel (8) with the head end and the tail end communicated with the water inlet (10) and the water outlet (11) is arranged in the case (1) fixedly, the water outlet end of the water tank (5) is connected with the water inlet (10) of the heat dissipation plate (4, the water inlet end of the water tank (5) is connected with the water outlet (11) of the heat dissipation plate (4) through a guide pipe (7), and a micro water pump (6) is installed on the guide pipe (7).
2. The computer CPU heat sink according to claim 1, wherein the back of the heat sink (4) is provided with a plurality of uniformly distributed heat dissipating fins (9).
3. The computer CPU heat sink according to claim 1, wherein the heat sink (4) is made of copper or aluminum.
4. The computer CPU heat sink according to claim 1, wherein said conduit (7) is a watertight transparent plastic tube.
5. The computer CPU heat sink device according to claim 1, wherein the water tank (5) stores a cooling liquid, and a brightener is added to the cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922257289.6U CN211044162U (en) | 2019-12-17 | 2019-12-17 | Computer CPU heat dissipation heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922257289.6U CN211044162U (en) | 2019-12-17 | 2019-12-17 | Computer CPU heat dissipation heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211044162U true CN211044162U (en) | 2020-07-17 |
Family
ID=71537553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922257289.6U Expired - Fee Related CN211044162U (en) | 2019-12-17 | 2019-12-17 | Computer CPU heat dissipation heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211044162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112612352A (en) * | 2021-01-06 | 2021-04-06 | 邵阳学院 | Computer cooling system |
-
2019
- 2019-12-17 CN CN201922257289.6U patent/CN211044162U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112612352A (en) * | 2021-01-06 | 2021-04-06 | 邵阳学院 | Computer cooling system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200717 |