CN212364945U - Computer radiator - Google Patents
Computer radiator Download PDFInfo
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- CN212364945U CN212364945U CN202021396368.1U CN202021396368U CN212364945U CN 212364945 U CN212364945 U CN 212364945U CN 202021396368 U CN202021396368 U CN 202021396368U CN 212364945 U CN212364945 U CN 212364945U
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- heat
- pipe
- liquid tank
- peristaltic pump
- nozzle
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Abstract
The utility model provides a computer radiator, which comprises a heat absorption mechanism, a refrigeration mechanism and a circulation mechanism; the heat absorption mechanism can absorb the heat emitted by the CPU to the heat absorption plate; the heat is absorbed by the cooling liquid in the heat conduction circulating pipe; conveying the cooling liquid into the liquid box through a peristaltic pump, and rapidly cooling the cooling liquid which absorbs heat and causes temperature rise again through a semiconductor refrigerating sheet; then enters the next cycle again under the driving of the peristaltic pump; compared with the prior art, the beneficial effects of the utility model are that: the temperature of the cooling liquid is constant and low, the heat dissipation efficiency is high, and the cooling effect is not influenced by the use duration.
Description
Technical Field
The utility model belongs to the radiator field, concretely relates to computer radiator.
Background
When the computer is used, the CPU heating problem exists, and the heating value is large in the process of consuming CPU resources such as image rendering, data operation and the like, so that the computer runs in a jam and the work is influenced. Most of the existing radiators are provided with a radiating fan to a CPU (central processing unit), and hot air is exhausted by rotating fan blades, but the existing radiators have the problems of low radiating efficiency and unsatisfactory effect; in addition, a water-cooled radiator is adopted, the micropump drives water flow to circulate to the upper part of the CPU, heat is absorbed by water and is transported to a water tank for cooling circulation, and the water temperature is relatively constant with the room temperature, and the water temperature is higher, so that the radiating efficiency of the radiator is higher than that of a radiating fan, but the water temperature is heated after long-time operation, so that the radiating efficiency has an upper limit, and the requirement of the radiating efficiency cannot be met when the heat productivity of a computer is huge. Therefore, a computer heat sink with high heat dissipation efficiency is urgently needed.
SUMMERY OF THE UTILITY MODEL
In order to solve the existing problems, the utility model provides a computer radiator, which comprises a heat absorption mechanism 1, a refrigeration mechanism 2 and a circulation mechanism 3;
the heat absorbing mechanism 1 can absorb the heat emitted by the CPU to the heat absorbing plate 11; and the heat is absorbed by the cooling liquid inside the heat conduction and circulation pipe 31; the cooling liquid is conveyed into the liquid tank 25 through the peristaltic pump 35, and the cooling liquid which absorbs heat and is increased in temperature is rapidly cooled again through the semiconductor refrigerating sheet 26; then enters the next cycle again under the driving of the peristaltic pump 35;
compared with the prior art, the beneficial effects of the utility model are that: the temperature of the cooling liquid is constant and low, the heat dissipation efficiency is high, and the cooling effect is not influenced by the use duration.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required for the use of the present invention are briefly introduced below, and it is obvious that the drawings in the following description are only some examples of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is an overall structure of the present invention;
fig. 2 is a schematic structural view of the heat absorbing mechanism of the present invention;
fig. 3 is a schematic structural diagram of the circulation mechanism of the present invention;
fig. 4 is a schematic structural diagram of the refrigeration mechanism of the present invention.
Detailed Description
The invention will be described in further detail with reference to the following detailed description and accompanying drawings:
a computer radiator comprises a heat absorption mechanism 1, a refrigeration mechanism 2 and a circulation mechanism 3;
the heat absorption mechanism 1 comprises a heat absorption bottom plate 11, a gland 12 and a pipe passing groove 13;
the refrigerating mechanism 2 comprises a flow outlet 21, a flow inlet 22, a liquid injection port pressure nozzle 23, an air outlet pressure nozzle 24, a liquid tank 25, a semiconductor refrigerating sheet 26, a heat dissipation plate 27 and a heat dissipation fan 28;
the circulating mechanism 3 comprises a heat conduction circulating pipe 31, an inflow pipe 32, an inflow adapter pipe 33, an outflow adapter pipe 34, a peristaltic pump 35 and a peristaltic pump bracket 36;
the features of the various components and their connections and positional relationships are described below:
the heat absorption mechanism 1 is positioned at the front part of the whole radiator;
the refrigerating mechanism 2 is positioned at the rear part of the radiator;
the circulating mechanism 3 is positioned at the upper part and the front part of the refrigerating mechanism 2;
the circulating mechanism 3 is positioned inside and behind the heat absorbing mechanism 1;
the heat absorption bottom plate 11 is in a rectangular box shape, and is made of a heat conduction material, preferably brass;
two pipe passing grooves 13 are formed in the side wall of the heat absorption bottom plate 11, and a flow inlet pipe 32 and a flow outlet pipe 37 penetrate through the pipe passing grooves;
the gland 12 is in a rectangular plate shape and is fixedly connected with the heat absorption bottom plate 11;
the heat conduction circulation tube 31 is in a winding tube shape, and is made of a heat conduction material, preferably brass;
the heat conduction circulating pipe 31 is arranged in the heat absorption bottom plate 11 box;
the left straight pipe of the heat conduction circulation pipe 31 is a flow outlet pipe 37 for introducing liquid;
the right straight pipe of the heat conduction circulation pipe 31 is an inlet pipe 32 for leading out liquid;
one end of the inflow adapter tube 33 is hermetically connected with the inflow tube 32, and the other end is hermetically connected with the inflow port of the peristaltic pump 35;
an outlet on the peristaltic pump 35 is hermetically connected with the outflow adapter tube 34;
the peristaltic pump 35 is fixedly connected to the upper part of the liquid tank 25 through a peristaltic pump bracket 36;
the outflow adapter pipe 34 is hermetically connected with the inflow nozzle 22;
the outflow pipe 37 is connected with the outflow nozzle 21 in a sealing way;
the outflow nozzle 21 is hermetically connected to the front side wall of the liquid tank 25;
the inlet nozzle 22 is hermetically connected to the upper part of the liquid tank 25;
the liquid tank 25 is a hollow cavity structure;
the liquid injection port pressure nozzle 23 and the air outlet pressure nozzle 24 are hermetically connected to the upper part of the liquid tank 25;
the semiconductor refrigeration piece 26 is attached to the bottom of the liquid tank 25;
the heat dissipation plate 27 is attached to the semiconductor refrigeration sheet 26 and is fixedly connected with the liquid tank 25;
the heat radiation fan 28 is fixed to the heat radiation plate 27.
The specific implementation is described below:
the liquid injection port pressure nozzle 23 and the air outlet pressure nozzle 24 are unscrewed, cooling liquid is injected from the liquid injection port, air is discharged from the air outlet, and the situation that air stored in the liquid tank 25 cannot be injected is avoided; then screwing down the liquid injection port pressure nozzle 23 and the air outlet pressure nozzle 24; the bottom surface of the heat absorption mechanism 1 is coated with heat dissipation grease and is pasted on the CPU or is pasted on the CPU in a close range; the semiconductor refrigerating sheet 26 is electrified for refrigeration, so that the cooling liquid in the liquid tank 25 is cooled; the heat emitted from the semiconductor refrigeration sheet 26 is dissipated through the heat dissipation plate 27 and is dissipated through the heat dissipation fan 28; the pneumatic peristaltic pump 35 drives the cooled cooling liquid to flow into the heat conduction circulating pipe 31 along the flow outlet pipe 37, the cooling liquid absorbs heat transferred to the heat absorption bottom plate 11 by the CPU in the heat conduction circulating pipe 31, enters the liquid tank 25 through the flow inlet pipe 32, the flow inlet adapter pipe 33, the peristaltic pump 35 and the flow outlet adapter pipe 34, is cooled again, and then is expanded to flow circularly, so that heat dissipation is effectively realized; the radiator has the advantages of constant low temperature of the cooling liquid, high radiating efficiency and no influence of long time of use on the cooling effect.
Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. The computer radiator is characterized by comprising a heat absorption mechanism (1), a refrigeration mechanism (2) and a circulation mechanism (3);
the heat absorption mechanism (1) is positioned at the front part of the whole radiator;
the refrigerating mechanism (2) is positioned at the rear part of the radiator;
the circulating mechanism (3) is positioned at the upper part and the front part of the refrigerating mechanism (2);
the circulating mechanism (3) is positioned inside and behind the heat absorbing mechanism (1).
2. A computer heat sink according to claim 1, wherein the heat absorbing mechanism (1) comprises a heat absorbing base plate (11), a cover (12), a tube slot (13);
the heat absorption bottom plate (11) is in a rectangular box shape;
two pipe passing grooves (13) are formed in the side wall of the heat absorption bottom plate (11);
the gland (12) is in a rectangular plate shape and is fixedly connected with the heat absorption bottom plate (11).
3. The computer radiator according to claim 1, wherein the refrigerating mechanism (2) comprises a flow outlet nozzle (21), a flow inlet nozzle (22), a liquid injection port pressure nozzle (23), an air outlet pressure nozzle (24), a liquid tank (25), a semiconductor refrigerating sheet (26), a heat dissipation plate (27) and a heat dissipation fan (28);
the outflow nozzle (21) is hermetically connected to the front side wall of the liquid tank (25);
the inflow nozzle (22) is hermetically connected to the upper part of the liquid tank (25);
the liquid tank (25) is a hollow cavity structure;
the liquid injection port pressure nozzle (23) and the air outlet pressure nozzle (24) are hermetically connected to the upper part of the liquid tank (25);
the semiconductor refrigeration sheet (26) is pressed against the bottom of the liquid tank (25);
the heat dissipation plate (27) is attached to the semiconductor refrigeration sheet (26) and is fixedly connected with the liquid tank (25);
the heat radiation fan (28) is fixed on the heat radiation plate (27).
4. The computer radiator according to claim 1, wherein the circulation mechanism (3) comprises a heat conduction circulation tube (31), an inflow tube (32), an inflow adapter tube (33), an outflow adapter tube (34), a peristaltic pump (35), and a peristaltic pump bracket (36);
the heat conduction circulating pipe (31) is in a winding pipe shape;
the heat conduction circulating pipe (31) is arranged in the heat absorption bottom plate (11) box;
the outlet pipe (37) is positioned on the left side of the heat conduction circulating pipe (31);
the inlet pipe (32) is positioned on the right side of the heat conduction circulating pipe (31);
one end of the inflow adapter tube (33) is hermetically connected with the inflow tube (32), and the other end is hermetically connected with the inflow port of the peristaltic pump (35);
an outflow port on the peristaltic pump (35) is hermetically connected with the outflow adapter tube (34);
the peristaltic pump (35) is fixedly connected to the upper part of the liquid tank (25) through a peristaltic pump bracket (36);
the outflow adapter tube (34) is connected with the inflow nozzle (22) in a sealing way;
the outflow pipe (37) is connected with the outflow nozzle (21) in a sealing way.
5. A computer heat sink as claimed in claim 2, wherein: the heat absorption bottom plate (11) is made of brass.
6. The computer heat sink of claim 4, wherein: the heat conduction circulating pipe (31) is made of brass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021396368.1U CN212364945U (en) | 2020-07-07 | 2020-07-07 | Computer radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021396368.1U CN212364945U (en) | 2020-07-07 | 2020-07-07 | Computer radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212364945U true CN212364945U (en) | 2021-01-15 |
Family
ID=74130891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021396368.1U Expired - Fee Related CN212364945U (en) | 2020-07-07 | 2020-07-07 | Computer radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212364945U (en) |
-
2020
- 2020-07-07 CN CN202021396368.1U patent/CN212364945U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210115 Termination date: 20210707 |