CN219841805U - Ceramic product fritting furnace cooling device - Google Patents
Ceramic product fritting furnace cooling device Download PDFInfo
- Publication number
- CN219841805U CN219841805U CN202321085669.6U CN202321085669U CN219841805U CN 219841805 U CN219841805 U CN 219841805U CN 202321085669 U CN202321085669 U CN 202321085669U CN 219841805 U CN219841805 U CN 219841805U
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- Prior art keywords
- cooling
- fixedly connected
- water tank
- water
- heat dissipation
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- 238000001816 cooling Methods 0.000 title claims abstract description 72
- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 66
- 230000017525 heat dissipation Effects 0.000 claims abstract description 24
- 238000005245 sintering Methods 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims description 31
- 238000005057 refrigeration Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 abstract description 16
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
Abstract
The utility model discloses a ceramic product sintering furnace cooling device, and relates to the technical field of cooling devices. The cooling device comprises a bottom plate, supports are fixedly connected to the two ends of the top of the bottom plate, a furnace body is fixedly connected to the top of the supports, a cooling assembly is fixedly connected to the middle of the top of the bottom plate and used for cooling the outer wall of the furnace body, a heat dissipation assembly is arranged at the first end of the cooling assembly, and the heat dissipation assembly is used for heat dissipation of the cooling assembly. Compared with the prior art, the utility model has the advantages that the pump is started to pump the cooling water in the water tank into the water inlet pipe, the cooling water is sent into the sealed shell through the water inlet pipe, the outer wall of the furnace body is subjected to direct cold and heat exchange, the heat absorption efficiency is improved, after the cold and heat exchange is finished, the cooling water returns to the inside of the water tank through the water outlet pipe for circulating heat dissipation, and the cooling efficiency of the device is improved.
Description
Technical Field
The utility model relates to the technical field of cooling devices, in particular to a cooling device of a ceramic product sintering furnace.
Background
In the process of sintering ceramic products, a vacuum sintering furnace is required, and the vacuum sintering furnace generates large heat during use, so that a cooling device is required.
The utility model patent of China with publication number of CN216592809U discloses a cooling device of a vacuum sintering furnace, which comprises a base plate, wherein the top of the base plate is fixedly provided with a vacuum sintering furnace body, the top of the base plate is provided with a water cooling mechanism below the vacuum sintering furnace body, the device can efficiently cool the vacuum sintering furnace body, the utilization effect of resources is improved, the device is energy-saving and environment-friendly, but when the device is used, the device realizes water cooling operation through a cooling pipe wound on the outer wall of the vacuum sintering furnace, and because a water body for water cooling is not directly contacted with the outer wall, the effect of absorbing heat is limited, and the cooling efficiency of the device is reduced.
Disclosure of Invention
The utility model aims to provide a ceramic product sintering furnace cooling device, which aims to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a ceramic product fritting furnace cooling device, includes the bottom plate, the top both ends fixedly connected with support of bottom plate, the top fixedly connected with furnace body of support, the centre fixedly connected with cooling module at bottom plate top, cooling module is used for the cooling of furnace body outer wall, cooling module's first end is provided with cooling module, cooling module is used for cooling module's heat dissipation.
Preferably, the cooling assembly comprises a water tank, the water tank being fixed to an intermediate phase at the top of the base plate.
Preferably, the sealing shell is fixedly connected in the middle of the outer wall of the furnace body, the pump is fixedly connected to the first side of the water tank, the water inlet pipe is fixedly connected to the first side of the pump, and the top of the water inlet pipe is fixed to the first side of the outer wall of the sealing shell.
Preferably, the second side of the water tank is fixedly connected with a water outlet pipe, and the top of the water outlet pipe is fixed with the second side of the outer wall of the sealing shell.
Preferably, the heat dissipation assembly comprises a semiconductor refrigeration piece, the semiconductor refrigeration piece penetrates through the first end of the water tank and is fixed with the water tank, the cold end of the semiconductor refrigeration piece is arranged at the second end of the semiconductor refrigeration piece, and the hot end of the semiconductor refrigeration piece is arranged at the first end of the semiconductor refrigeration piece.
Preferably, the hot end of the semiconductor refrigeration piece is provided with a plurality of radiating fins, the second ends of the radiating fins are fixed with the water tank, the heat conducting shell is arranged outside the radiating fins, and the first side inside the heat conducting shell is fixedly connected with a radiating fan.
Compared with the prior art, the utility model has the beneficial effects that:
this ceramic product fritting furnace cooling device, with prior art's difference lies in, in drawing in the inlet tube with the inside cooling water of water tank through starting the pump machine to in sending into sealed casing through the inlet tube, carrying out direct cold and hot exchange to the outer wall of furnace body, improved thermal absorption efficiency, treat after cold and hot exchange is accomplished, the cooling water returns to the inside of water tank through the outlet pipe and carries out the circulation heat dissipation, has improved the cooling efficiency of device.
Simultaneously, through starting the semiconductor refrigeration piece, make the cold junction of semiconductor refrigeration piece cool down to the cooling water in the water tank, then through radiating fin's setting, the hot junction of semiconductor refrigeration piece dispels the heat with higher speed, simultaneously, starts the heat dissipation fan and blows off the heat of heat conduction shell inside fast, avoids heat gathering near the water tank, influences the radiating effect of water tank.
Drawings
FIG. 1 is an axial view of the present utility model;
FIG. 2 is a perspective view of a cooling assembly of the present utility model;
fig. 3 is an exploded view of a heat dissipating assembly according to the present utility model.
In the figure: 1. a bottom plate; 2. a bracket; 3. a furnace body; 4. a cooling assembly; 401. a water tank; 402. a seal housing; 403. a pump machine; 404. a water inlet pipe; 405. a water outlet pipe; 5. a heat dissipation assembly; 501. a semiconductor refrigeration sheet; 502. a heat radiation fin; 503. a heat conductive shell; 504. a heat radiation fan.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the process of cooling the vacuum sintering furnace, a cooling device is needed, and the ceramic product sintering furnace cooling device provided by the utility model is specially used for cooling the vacuum sintering furnace, and compared with the cooling device of the vacuum sintering furnace disclosed in Chinese patent publication No. CN216592809U, the cooling device has the advantages that the cooling water body is tightly contacted with the outer wall of the furnace body 3 through the arrangement of the cooling component 4, so that the cooling heat exchange can be more efficiently performed, and the cooling efficiency of the device is improved.
As shown in fig. 1-3, the present utility model provides a technical solution: a cooling device for a ceramic product sintering furnace.
Referring to fig. 1, the utility model comprises a bottom plate 1, two ends of the top of the bottom plate 1 are fixedly connected with a bracket 2, the top of the bracket 2 is fixedly connected with a furnace body 3, the middle of the top of the bottom plate 1 is fixedly connected with a cooling component 4, the cooling component 4 is used for cooling the outer wall of the furnace body 3, a heat dissipation component 5 is arranged at the first end of the cooling component 4, and the heat dissipation component 5 is used for dissipating heat of the cooling component 4.
It should be emphasized that, in the present utility model, when the furnace body 3 needs to be cooled, the cooling assembly 4 is started to perform efficient heat exchange on the outer wall of the furnace body 3, and meanwhile, the heat dissipation assembly 5 is started to perform synchronous auxiliary heat dissipation on the cooling assembly 4, so as to maintain efficient heat dissipation efficiency of the cooling assembly 4.
Referring to fig. 2, in the present utility model, the cooling assembly 4 includes a water tank 401, a middle phase of the top of the water tank 401 and the bottom plate 1 is fixed, a sealing shell 402 is fixedly connected in the middle of the outer wall of the furnace body 3, a pump 403 is fixedly connected to a first side of the water tank 401, a water inlet pipe 404 is fixedly connected to a first side of the pump 403, the top of the water inlet pipe 404 is fixed to a first side of the outer wall of the sealing shell 402, a water outlet pipe 405 is fixedly connected to a second side of the water tank 401, and the top of the water outlet pipe 405 is fixed to a second side of the outer wall of the sealing shell 402.
It should be emphasized that, in the present utility model, when heat dissipation needs to be performed on the furnace body 3, the pump 403 is started to pump the cooling water in the water tank 401 into the water inlet pipe 404, and the cooling water is sent into the sealed housing 402 through the water inlet pipe 404, so as to perform direct heat exchange on the outer wall of the furnace body 3, and after the heat exchange is completed, the cooling water returns to the water tank 401 through the water outlet pipe 405 for circulation heat dissipation.
Referring to fig. 3, in the present utility model, the heat dissipating assembly 5 includes a semiconductor cooling plate 501, the semiconductor cooling plate 501 penetrates through a first end of the water tank 401 and is fixed to the water tank 401, a cold end of the semiconductor cooling plate 501 is disposed at a second end of the semiconductor cooling plate 501, a hot end of the semiconductor cooling plate 501 is disposed at the first end of the semiconductor cooling plate 501, a plurality of heat dissipating fins 502 are disposed at the hot end of the semiconductor cooling plate 501, the second end of the heat dissipating fins 502 is fixed to the water tank 401, a heat conducting shell 503 is disposed outside the heat dissipating fins 502, and a heat dissipating fan 504 is fixedly connected to a first side inside the heat conducting shell 503.
It should be emphasized that in the present utility model, when cooling water is required to dissipate heat, the semiconductor refrigeration piece 501 is started, the cooling water in the water tank 401 is cooled by the cold end of the semiconductor refrigeration piece 501, then the heat of the hot end of the semiconductor refrigeration piece 501 is dissipated in an accelerating way by the arrangement of the heat dissipation fins 502, and meanwhile, the heat dissipation fan 504 is started to quickly blow out the heat in the heat conduction shell 503, so that the heat is prevented from being accumulated near the water tank 401 and affecting the heat dissipation effect of the water tank 401.
Working principle: when the device is used, firstly, the pump 403 is started to pump cooling water in the water tank 401 into the water inlet pipe 404, the cooling water is fed into the sealed shell 402 through the water inlet pipe 404, direct cold and heat exchange is carried out on the outer wall of the furnace body 3, after the cold and heat exchange is completed, the cooling water returns to the inside of the water tank 401 through the water outlet pipe 405 to circulate, meanwhile, the semiconductor refrigerating sheet 501 is started, the cooling water in the water tank 401 is cooled through the cold end of the semiconductor refrigerating sheet 501, then the heat of the hot end of the semiconductor refrigerating sheet 501 is accelerated and dissipated through the arrangement of the radiating fin 502, and meanwhile, the radiating fan 504 is started to quickly blow out heat in the heat conducting shell 503, so that heat is prevented from being concentrated near the water tank 401, and the radiating effect of the water tank 401 is prevented from being influenced.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made hereto without departing from the spirit and scope of the utility model as defined by the appended embodiments and equivalents thereof.
Claims (6)
1. The utility model provides a ceramic product sintering furnace cooling device, includes bottom plate (1), its characterized in that: the cooling device comprises a bottom plate (1), wherein two ends of the top of the bottom plate (1) are fixedly connected with a support (2), the top of the support (2) is fixedly connected with a furnace body (3), the middle of the top of the bottom plate (1) is fixedly connected with a cooling assembly (4), the cooling assembly (4) is used for cooling the outer wall of the furnace body (3), a heat dissipation assembly (5) is arranged at the first end of the cooling assembly (4), and the heat dissipation assembly (5) is used for heat dissipation of the cooling assembly (4).
2. A ceramic product sintering furnace cooling apparatus according to claim 1, wherein: the cooling assembly (4) comprises a water tank (401), and the water tank (401) is fixed with the middle phase at the top of the bottom plate (1).
3. A ceramic product sintering furnace cooling apparatus according to claim 2, wherein: the sealing device is characterized in that a sealing shell (402) is fixedly connected in the middle of the outer wall of the furnace body (3), a pump (403) is fixedly connected to the first side of the water tank (401), a water inlet pipe (404) is fixedly connected to the first side of the pump (403), and the top of the water inlet pipe (404) is fixed to the first side of the outer wall of the sealing shell (402).
4. A ceramic product sintering furnace cooling apparatus according to claim 3, wherein: the second side of the water tank (401) is fixedly connected with a water outlet pipe (405), and the top of the water outlet pipe (405) is fixed with the second side of the outer wall of the sealing shell (402).
5. A ceramic product sintering furnace cooling apparatus according to claim 2, wherein: the heat dissipation assembly (5) comprises a semiconductor refrigerating piece (501), the semiconductor refrigerating piece (501) penetrates through the first end of the water tank (401) and is fixed with the water tank (401), the cold end of the semiconductor refrigerating piece (501) is arranged at the second end of the semiconductor refrigerating piece (501), and the hot end of the semiconductor refrigerating piece (501) is arranged at the first end of the semiconductor refrigerating piece (501).
6. The ceramic product sintering furnace cooling apparatus according to claim 5, wherein: the hot end of semiconductor refrigeration piece (501) is provided with a plurality of radiating fins (502), the second end and the water tank (401) of radiating fins (502) are fixed mutually, the outside of radiating fins (502) is provided with heat conduction shell (503), inside first side fixedly connected with heat dissipation fan (504) of heat conduction shell (503).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321085669.6U CN219841805U (en) | 2023-05-08 | 2023-05-08 | Ceramic product fritting furnace cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321085669.6U CN219841805U (en) | 2023-05-08 | 2023-05-08 | Ceramic product fritting furnace cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219841805U true CN219841805U (en) | 2023-10-17 |
Family
ID=88302253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321085669.6U Active CN219841805U (en) | 2023-05-08 | 2023-05-08 | Ceramic product fritting furnace cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219841805U (en) |
-
2023
- 2023-05-08 CN CN202321085669.6U patent/CN219841805U/en active Active
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