CN219642204U - Heat radiation structure for computer host - Google Patents

Abstract

The utility model relates to a heat dissipation structure for a computer mainframe, which belongs to the technical field of computer heat dissipation, and includes a mainframe box body, a memory bar and a CPU installed on a mainboard, and is characterized in that: a heat dissipation plate is fixedly arranged on the back of the mainframe box body, and the A plurality of water inlet ports are arranged on the top of the heat dissipation plate, and cooling liquid is installed inside the heat dissipation plate. The beneficial effect of the utility model is that the heat-conducting film of the flexible heat-conducting component is provided with an inner cavity, which can be used for the circulation of cooling liquid, and the heat-conducting film can be changed in any shape through the heat-conducting plastic film on the outer surface, thereby ensuring that the heat-conducting film sticks It is attached to the outer surface of the graphics card or memory stick, so that the heat generated by it can exchange heat with the cooling liquid in the inner cavity through the heat conduction film, and the flexible heat conduction component can be fixed on the motherboard through the mounting piece with screws to ensure its stability and heat dissipation. The structure can wrap and water-cool and dissipate various components in the computer mainframe, effectively improving the adaptability of water-cooling and dissipating heat.

Description

A heat dissipation structure for a computer mainframe

technical field

The utility model relates to the technical field of computer heat dissipation, in particular to a heat dissipation structure for a computer host.

Background technique

The heat dissipation problem has always been a big problem since the birth of the computer, and this problem has become more and more serious with the continuous improvement of the performance of the computer. The heat dissipation is related to the stability of the computer operation and the service life of the whole machine. It has always been the main source of heat generation, especially the high-frequency multi-core processors that are widely used at present, which generate more heat. Secondly, graphics cards and memory sticks are also the main heat-generating components.

Application number: 201921334432.0; discloses a heat dissipation structure for a computer mainframe, including a mainframe, a metal mounting plate is vertically arranged in the mainframe, a main board is installed on the left side of the metal mounting plate, and the metal The mounting plate is provided with a rectangular through-hole structure corresponding to the board body of the main board, and also includes metal heat dissipation fins, a rear heat dissipation fan, a water absorption assembly and a water box, and the metal heat dissipation fins, a rear heat dissipation fan, a water absorption assembly and a water box are all It is arranged in the space between the metal mounting plate and the right side wall of the main box, and the water absorbing component is arranged between the rear cooling fan and the metal cooling fins; the utility model only uses the cooling fan to dissipate heat on the front side of the motherboard Improvements have been made by installing a rear cooling fan on the rear side of the motherboard, and at the same time, the wind blown by the rear cooling fan on the metal cooling fins connected to the rear side of the motherboard contains water vapor, which has a better heat dissipation effect on the motherboard.

The heat dissipation method of the above comparison file is to improve the heat dissipation effect through the principle of water vapor evaporation, but this method can only improve the heat dissipation efficiency of the motherboard, and the CPU, memory sticks and other components on the motherboard cannot efficiently dissipate heat. The heat conduction block plus water-cooling heat dissipation method, but the memory stick including the graphics card is only limited to the air-cooling method, which leads to poor heat dissipation effect. In view of the above situation, we have introduced a heat dissipation structure for computer hosts.

Utility model content

The purpose of this utility model is to provide a kind of heat dissipation structure for computer mainframe, in order to solve the problem that the general computer heat dissipation structure proposed in the above background technology adopts two modes of air cooling and liquid cooling. Better, but the problem of poor heat dissipation uniformity.

The technical scheme of the utility model is:

It includes a mainframe box and a memory stick and a CPU installed on the main board, and is characterized in that: a heat dissipation plate is fixedly arranged on the back of the mainframe box, and several water inlet ports are arranged on the top of the heat dissipation plate, and the inside of the heat dissipation plate is equipped with Cooling liquid, the lower end of the heat dissipation plate is provided with a water outlet, the water outlet is connected to a water pump, the water outlet of the water pump is connected to a multi-way pipe, and the two water outlets of the multi-way pipe are connected to a liquid inlet pipe , the end of the liquid inlet pipe is communicated with a flexible heat-conducting component, the flexible heat-conducting component includes a heat-conducting film, and the heat-conducting film is coated on the outer surface of the memory stick and the CPU, and the inside of the heat-conducting film is provided with a cavity for cooling liquid to circulate , the two ends of the heat-conducting plastic film are fixedly provided with connecting terminals, the outer wall of the connecting terminal is fixedly provided with a mounting piece, one of the connecting terminals is connected with a liquid outlet pipe, and the outer surface of the heat dissipation plate is equidistantly fixed Provided with cooling fins.

Further, the water inlet end of the heat dissipation plate and the water outlet of the multi-way pipe are equipped with sealing caps.

Further, the outer surface of the heat dissipation fins is fixedly provided with a first heat dissipation fan.

Further, the outer surface of the heat-conducting film is pasted with a heat-conducting plastic film.

Further, the outer surface of the liquid outlet pipe and the liquid inlet pipe is engaged with pipeline fixing pieces.

Further, a second cooling fan is fixedly installed at the bottom of the main chassis.

The utility model provides a heat dissipation structure for a computer mainframe through improvement. Compared with the prior art, the utility model has the following improvements and advantages:

One: In the utility model, the heat-conducting film of the flexible heat-conducting component is provided with an inner cavity, which can be used for the circulation of cooling liquid, and the heat-conducting film can be changed in any shape through the heat-conducting plastic film on the outer surface, so as to ensure the bonding of the heat-conducting film On the outer surface of the graphics card or memory stick, the heat generated by it is exchanged with the cooling liquid in the inner cavity through the heat conduction film, and the flexible heat conduction component can be fixed on the motherboard through the mounting piece with screws to ensure its stability and heat dissipation. The structure can wrap and water-cool and dissipate various components in the computer mainframe, effectively improving the adaptability of water-cooling and dissipating heat.

Second: In the utility model, the water pump provided can suck the coolant in the cooling plate into the multi-way pipe, and communicate with the connecting end of the flexible heat-conducting component through the water outlet and the liquid inlet pipe of the multi-way pipe, so that the cooling water It circulates through the inner cavity of the heat-conducting film, thereby taking away the heat of the host components, and re-introduces it into the cooling cavity of the cooling plate through the liquid outlet pipe, and the outer surface of the cooling plate is fixed with cooling fins, which can absorb the heat in the cooling cavity , and increase its heat dissipation area, and at the same time cooperate with the first heat dissipation fan to dissipate heat from the coolant, and the process greatly improves the heat dissipation efficiency of the flexible heat conduction component.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further explained:

Fig. 1 is a schematic diagram of the main view structure of the utility model;

Fig. 2 is a structural schematic diagram of the flexible heat-conducting assembly of the utility model;

Fig. 3 is a schematic diagram of enlarged structure at A place in the figure of the utility model;

Fig. 4 is a schematic diagram of the side view structure of the heat dissipation plate of the present invention.

Explanation of reference numerals: 1. Main engine box; 2. Heat dissipation plate; 3. Water pump; 4. Multi-way pipe; 5. Liquid inlet pipe; 6. Flexible heat-conducting component; 7. Heat-conducting film; Thermally conductive plastic film; 10. Connecting terminal; 11. Mounting piece; 12. Memory bar; 13. CPU; 14. Liquid outlet pipe; ; 18, the second cooling fan.

Detailed ways

The utility model will be described in detail below in conjunction with accompanying drawings 1 to 4, and the technical solutions in the embodiments of the utility model are clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than Full examples. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

The utility model provides a heat dissipation structure for a computer mainframe through improvement, as shown in Figures 1-4, comprising a mainframe box 1 and a memory stick 12 and a CPU13 installed on the mainboard, the back of the mainframe box 1 is fixedly provided with Radiating plate 2, several water inlet ends are arranged on the upper end of the cooling plate 2, cooling liquid is installed inside the cooling plate 2, a water outlet end is arranged on the lower end of the cooling plate 2, and a water pump 3 is connected to the water outlet end, and the water outlet end of the water pump 3 is connected to a multi-channel The pipe 4 and the two water outlets of the multi-way pipe 4 are connected with the liquid inlet pipe 5, and the end of the liquid inlet pipe 5 is connected with a flexible heat conduction component 6, and the flexible heat conduction component 6 includes a heat conduction film 7, and the heat conduction film 7 is coated on the memory stick 12 and the outer surface of the CPU 13, the heat conducting film 7 is provided with an inner cavity 8 for the circulation of cooling fluid, the two ends of the heat conducting plastic film 9 are fixedly provided with connecting terminals 10, and the outer wall of the connecting terminal 10 is fixedly provided with mounting parts 11, one of which is connected The end 10 is connected with a liquid outlet pipe 14, the outer surface of the heat dissipation plate 2 is equidistantly fixed with heat dissipation fins 16, the outer surface of the heat dissipation fins 16 is fixed with a first heat dissipation fan 17, and the outer surface of the heat conduction film 7 is bonded with heat conduction plastic. Forming film 9.

The implementation of the above features is: the heat-conducting film 7 of the flexible heat-conducting component 6 is provided with an inner cavity 8, which can be used for the circulation of cooling liquid, and the heat-conducting film 7 can be changed in any shape through the heat-conducting plastic film 9 on the outer surface, so that Ensure that the heat conduction film 7 is attached to the outer surface of the graphics card or memory stick 12, so that the heat generated by the heat conduction film 7 exchanges heat with the coolant in the inner cavity 8, and the water pump 3 provided can transfer the coolant in the heat sink 2 It is sucked into the multi-way pipe 4, and communicates with the connection end 10 of the flexible heat-conducting component 6 through the water outlet of the multi-way pipe 4 and the liquid inlet pipe 5, so that the cooling water flows through the inner cavity 8 of the heat-conducting film 7, thereby bringing Take the heat from the host components, and re-enter the cooling cavity of the cooling plate 2 through the liquid outlet pipe 14, and the outer surface of the cooling plate 2 is fixed with cooling fins 16, which can absorb the heat in the cooling cavity and increase its heat dissipation area At the same time, the first heat dissipation fan 17 is used to dissipate heat from the coolant, the process greatly improves the heat dissipation efficiency of the flexible heat conduction component 6, and ensures the heat dissipation effect of the computer mainframe. , which effectively improves the adaptability of water cooling and heat dissipation, wherein the material of the thermally conductive plastic film 9 is copper, and the material of the thermally conductive film 7 is polyimide.

The water inlet end of the cooling plate 2 and the water outlet of the multi-way pipe 4 are equipped with sealing caps, which can seal the redundant water inlet and water outlets, thereby preventing the coolant from flowing out, and can be used according to the heat dissipation of the host components. According to requirements, multiple sets of pipelines are selected to communicate with the flexible heat conduction component 6 for water cooling and heat dissipation of the components.

The outlet pipe 14 and the inlet pipe 5 are snapped together with a pipeline fixing piece 15, and the pipeline fixing piece 15 can cooperate with screws to fix the outlet pipe 14 and the inlet pipe 5 inside the chassis to ensure a neat layout and stable.

A second heat dissipation fan 18 is fixedly installed at the bottom of the mainframe casing 1, which can further air-cool the heat inside the mainframe casing 1, thereby ensuring the heat dissipation effect of the internal environment.

Working principle: firstly, the water pump 3 provided can suck the cooling liquid in the cooling plate 2 into the multi-way pipe 4, and connect with the connection end 10 of the flexible heat-conducting component 6 through the water outlet of the multi-way pipe 4 and the liquid inlet pipe 5 through, so that the cooling water circulates from the inner cavity 8 of the heat conduction film 7, thereby taking away the heat of the host components, and re-passing into the cooling cavity of the heat dissipation plate 2 through the liquid outlet pipe 14, and then the heat dissipation fins fixed on the outer surface of the heat dissipation plate 2 The sheet 16 can absorb the heat in the cooling cavity and increase its heat dissipation area. At the same time, it cooperates with the first heat dissipation fan 17 to dissipate the cooling liquid. The heat conduction film 7 can be changed in any shape through the heat conduction plastic film 9 on the outer surface, so as to ensure heat conduction The film 7 is attached to the outer surface of the graphics card or the memory stick 12, so that the heat generated by it can exchange heat with the cooling liquid in the inner cavity 8 through the heat conduction film 7, and the flexible heat conduction component 6 can be fixed on the motherboard through the mounting piece 11 and the screws , to ensure its stability, its heat dissipation structure can cover various components in the computer mainframe for water cooling and heat dissipation, which effectively improves the adaptability of water cooling and heat dissipation.

The above description of the disclosed embodiments enables those skilled in the art to realize or use the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims (6)

1. A cooling structure for a computer mainframe, comprising a mainframe casing (1) and a memory stick (12) and a CPU (13) installed on the mainboard, characterized in that: the back side of the mainframe casing (1) is fixedly provided with The heat dissipation plate (2), the upper end of the heat dissipation plate (2) is provided with several water inlet ports, the interior of the heat dissipation plate (2) is equipped with cooling liquid, and the lower end of the heat dissipation plate (2) is provided with a water outlet end, the The water outlet is connected with a water pump (3), the water outlet of the water pump (3) is connected with a multi-way pipe (4), and the two water outlets of the multi-way pipe (4) are connected with a liquid inlet pipe (5), The end of the liquid inlet pipe (5) is communicated with a flexible heat-conducting component (6), and the flexible heat-conducting component (6) includes a heat-conducting film (7) and a heat-conducting plastic film (9), and the heat-conducting film (7) covers On the outer surface of the memory stick (12) and the CPU (13), an inner cavity (8) for the circulation of cooling liquid is opened inside the heat-conducting film (7), and two ends of the heat-conducting plastic film (9) are fixedly provided with connection terminal (10), the outer wall of the connecting terminal (10) is fixedly provided with a mounting piece (11), one of the connecting terminal (10) is connected with a liquid outlet pipe (14), and the heat dissipation plate (2) Radiating fins (16) are fixedly arranged on the outer surface at equal distances. 2. The heat dissipation structure for a computer mainframe according to claim 1, characterized in that: the water inlet end of the heat dissipation plate (2) and the water outlet of the multi-way pipe (4) are both equipped with sealing caps. 3 . The heat dissipation structure for a computer mainframe according to claim 1 , characterized in that: a first heat dissipation fan ( 17 ) is fixedly arranged on the outer surface of the heat dissipation fin ( 16 ). 4 . 4. The heat dissipation structure for a computer mainframe according to claim 1, characterized in that: a heat-conducting plastic film (9) is pasted on the outer surface of the heat-conducting film (7). 5 . The heat dissipation structure for a computer mainframe according to claim 1 , characterized in that: the outer surfaces of the liquid outlet pipe ( 14 ) and the liquid inlet pipe ( 5 ) are engaged with pipe fixing pieces ( 15 ). 6 . The heat dissipation structure for a computer mainframe according to claim 1 , characterized in that: a second heat dissipation fan ( 18 ) is fixedly installed at the bottom of the mainframe box ( 1 ). 7 .