CN216792839U - Portable server water-cooling radiator - Google Patents
Portable server water-cooling radiator Download PDFInfo
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- CN216792839U CN216792839U CN202220430548.XU CN202220430548U CN216792839U CN 216792839 U CN216792839 U CN 216792839U CN 202220430548 U CN202220430548 U CN 202220430548U CN 216792839 U CN216792839 U CN 216792839U
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- conducting plate
- water tank
- portable server
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Abstract
The utility model discloses a portable server water-cooling radiator, which relates to the technical field of radiators and comprises a water tank and a heat conducting plate arranged on the water tank, wherein water-cooling liquid is arranged in the water tank; threaded holes are formed in the periphery of an upper port of the water tank, and the heat-conducting plate is hermetically mounted at the upper port of the water tank through fixing screws; the upper end face of the heat conducting plate is connected with a plurality of radiating fins. The utility model provides a portable server water-cooling radiator, which is characterized in that a plurality of heat-conducting thin columns are arranged at the lower end of a heat-conducting plate, so that the heat-conducting plate is in large-area direct contact with water-cooling liquid in a water tank, the contact surface area is large, and meanwhile, a plurality of heat-radiating fins are arranged at the upper end of the heat-conducting plate, so that the heat-radiating area of the heat-conducting plate is increased, the heat conduction of the heat-conducting plate is accelerated, and the heat-radiating efficiency is increased; and the influence of the water flow speed on the heat dissipation efficiency is small, the requirement on the rotating speed of the water pump is not high, the silencing effect is good, the volume is reduced, and the heat conduction efficiency is greatly improved.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a portable server water-cooling radiator.
Background
A Central Processing Unit (CPU) is used as an operation and control core of a computer system, and is a final execution unit for information processing and program operation, and the CPU has been greatly developed in terms of logic structure, operation efficiency and function extension since its generation, but the CPU generates a large amount of heat during the working process, which greatly damages the CPU, and therefore a certain heat dissipation device is required for heat dissipation.
The water tank and the radiating fins (cold rows) of the traditional split type water-cooled radiator are connected through water pipes, so that the contact area is small, the radiating effect is poor, and the influence of the rotating speed of a water pump and the water flow speed is large; for this purpose, we design a portable server water-cooling radiator.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a portable server water-cooled heat sink, so as to solve the problems mentioned in the background art.
In order to achieve the purpose, the utility model provides the following technical scheme:
a portable server water-cooling radiator comprises a water tank and a heat conducting plate arranged on the water tank, wherein water-cooling liquid is arranged inside the water tank; threaded holes are formed in the periphery of the upper port of the water tank, and the heat conducting plate is hermetically installed at the upper port of the water tank through fixing screws; the upper end surface of the heat conducting plate is connected with a plurality of radiating fins, the lower end surface of the heat conducting plate is provided with a plurality of heat conducting thin columns, and the lower ends of the heat conducting thin columns extend into the water cooling liquid of the water tank; one end of the heat conducting plate is provided with a water inlet pipe and a water outlet pipe, one end of the heat conducting plate is provided with a water pump mounting groove, a water pump is arranged in the water pump mounting groove, the bottom of the water pump mounting groove is provided with a water pump water inlet, and the lower end of the water outlet pipe is connected with the water outlet end of the water pump; the lower end of the water inlet pipe penetrates through the heat conducting plate and extends into the water tank; the water outlet end of the water outlet pipe is connected with the water inlet end of the water cooling end of the CPU; the water inlet end of the water inlet pipe is connected with the water outlet of the CPU water cold end.
As a further improvement of the above scheme, a plurality of heat dissipation fans are arranged on one side of the upper end surface of the heat conduction plate, which is located on the heat dissipation fins, the plurality of heat dissipation fans are linearly distributed and are parallel to the heat dissipation fins, and the total length of the heat dissipation fans is equal to the total length of the heat dissipation fins.
As a further improvement of the scheme, the lower end of the water inlet pipe is transversely distributed along the lower end face of the heat conducting plate and is integrally welded with the heat conducting plate, so that the contact area of the water cooling liquid and the heat conducting plate can be increased, and the heat conductivity is increased.
As a further improvement of the above scheme, the joint of the upper end of the water tank and the heat conducting plate is further provided with a silica gel sealing strip, so that the sealing effect of the water tank is improved.
As a further improvement of the scheme, the heat conducting plate, the water inlet pipe, the water outlet pipe, the heat radiating fins and the heat conducting fine columns are all made of red copper or pure aluminum.
As a further improvement of the scheme, the heat conducting fine columns are distributed at the lower end of the heat conducting plate in a rectangular shape, the radiating fin liquid is distributed at the upper end of the heat conducting plate in a rectangular shape, and the heat conducting fine columns, the heat conducting plate and the radiating fins are integrally welded.
As a further improvement of the scheme, the water tank is made of acrylic plates.
As a further improvement of the scheme, the lower end face of the water tank is provided with a water injection and drainage hole, and the water injection and drainage hole is provided with a sealing plug, so that water cooling liquid can be conveniently injected into the water tank or discharged from the water tank.
Compared with the prior art, the utility model has the beneficial effects that:
the utility model provides a portable server water-cooling radiator, which is characterized in that a plurality of heat-conducting thin columns are arranged at the lower end of a heat-conducting plate, so that the heat-conducting plate is in large-area direct contact with water-cooling liquid in a water tank, the contact surface area is large, and meanwhile, a plurality of heat-radiating fins are arranged at the upper end of the heat-conducting plate, so that the heat-radiating area of the heat-conducting plate is increased, the heat conduction of the heat-conducting plate is accelerated, and the heat-radiating efficiency is increased; and the influence of the water flow speed on the heat dissipation efficiency is small, the requirement on the rotating speed of the water pump is not high, the silencing effect is good, the volume is reduced, and the heat conduction efficiency is greatly improved.
Drawings
Fig. 1 is an exploded view of a portable server water-cooled heat sink.
Fig. 2 is a schematic structural diagram of a portable server water-cooled heat sink.
Fig. 3 is a bottom oblique view of a heat conducting plate in a portable server water-cooled heat sink.
Fig. 4 is a bottom oblique view of a portable server water-cooled heat sink.
FIG. 5 is a front view of a portable server water-cooled heat sink.
FIG. 6 is a rear view of a portable server water cooled heat sink.
In the figure: 1. a water tank; 2. a heat conductive pillar; 3. a heat conducting plate; 4. a heat dissipating fin; 5. a fixing screw; 6. a water inlet pipe; 7. a water outlet pipe; 8. a water pump; 9. a water pump mounting groove; 10. a threaded hole; 11. a heat radiation fan; 12. a water inlet of the water pump; 13. and (4) water injection and drainage holes.
Detailed Description
The technical solution of the present patent will be further described in detail with reference to the following embodiments.
Referring to fig. 1-6, the portable server water-cooling radiator comprises a water tank 1 and a heat conducting plate 3 arranged on the water tank 1, wherein water-cooling liquid is arranged inside the water tank 1; threaded holes 10 are formed in the periphery of an upper port of the water tank 1, and the heat conducting plate 3 is hermetically installed at the upper port of the water tank 1 through fixing screws 5;
the upper end surface of the heat conducting plate 3 is connected with a plurality of radiating fins 4, the lower end surface of the heat conducting plate 3 is provided with a plurality of heat conducting thin columns 2, and the lower ends of the heat conducting thin columns 2 extend into the water cooling liquid of the water tank 1; one end of the heat conducting plate 3 is provided with a water inlet pipe 6 and a water outlet pipe 7, one end of the heat conducting plate 3 is provided with a water pump mounting groove 9, a water pump 8 is arranged in the water pump mounting groove 9, the bottom of the water pump mounting groove 9 is provided with a water pump water inlet hole 12, and the lower end of the water outlet pipe 7 is connected with the water outlet end of the water pump 8; the lower end of the water inlet pipe 6 penetrates through the heat conducting plate 3 and extends into the water tank 1; the water outlet end of the water outlet pipe 7 is connected with the water inlet of the CPU water cold end; the water inlet end of the water inlet pipe 6 is connected with the water outlet of the CPU water cold end.
The upper end surface of the heat conducting plate 3 is provided with a plurality of heat radiating fans 11 at one side of the heat radiating fins 4, the plurality of heat radiating fans 11 are linearly distributed, the heat radiating fans 11 are parallel to the heat radiating fins 4, and the total length of the heat radiating fans 11 is equal to the total length of the heat radiating fins 4.
The lower extreme of inlet tube 6 transversely distributes along the lower terminal surface of heat-conducting plate 3, and its and the welding of heat-conducting plate 3 integral type, and multiplicable liquid cooling and heat conduction plate 3's area of contact increases the heat conductivity.
The junction of the upper end of the water tank 1 and the heat conducting plate 3 is also provided with a silica gel sealing strip, so that the sealing effect of the water tank 1 is improved.
The heat conducting plate 3, the water inlet pipe 6, the water outlet pipe 7, the radiating fins 4 and the heat conducting fine columns 2 are all made of red copper or pure aluminum.
The heat conducting thin columns 2 are distributed at the lower end of the heat conducting plate 3 in a rectangular shape, the heat radiating fins 4 are distributed at the upper end of the heat conducting plate 3 in a rectangular shape, and the heat conducting thin columns 2, the heat conducting plate 3 and the heat radiating fins 4 are integrally welded.
The water tank 1 is made of acrylic plate material.
The lower end face of the water tank 1 is provided with a water injection and drainage hole 13, and the water injection and drainage hole 13 is provided with a sealing plug, so that water cooling liquid can be conveniently injected into the water tank 1 or discharged from the water tank.
The working principle of the utility model is as follows: the water cooling device is characterized in that water cooling liquid is pumped out from a water tank 1 by a water pump 8, flows into a water cooling head of a CPU processor through a water outlet pipe 7 and then flows out from an outlet end of the water cooling head of the CPU processor, water heated by the CPU flows back into the water tank 1 of the water cooling radiator through a water inlet pipe 6, heat conducting thin columns 2 on a heat conducting plate 3 fully absorb heat of hot water in the water tank 1 and transfer the heat to radiating fins 4 at the upper end of the heat conducting plate 3, and then the radiating fins 4 are blown by a radiating fan 11 to enable the heat on the radiating fins 4 to rapidly exit, so that the hot water in the water tank 1 is cooled; this is continuously cycled to remove heat from the surface of the CPU. The water pump 8 is used for pushing the water cooling liquid to flow, the liquid absorbing the heat of the CPU flows out of the water cooling head of the CPU, and the new low-temperature water cooling liquid continuously absorbs the heat of the CPU. The water pipe is connected with the water pump, the water tank and the CPU water cooling head, and the water cooling head is used for enabling water cooling liquid to circularly flow in a closed channel without leaking. The water tank is used for storing the water cooling liquid, the heat of the CPU is released by the backflow water cooling liquid, the low-temperature water cooling liquid flows into the pipeline again, and the water cooling liquid with large capacity stored in the water tank can ensure that the temperature of the water cooling liquid does not rise obviously. The equipment has good silencing effect, reduces the volume and greatly improves the heat conduction efficiency.
Claims (8)
1. A portable server water-cooling radiator comprises a water tank (1) and a heat-conducting plate (3) arranged on the water tank (1), and is characterized in that water-cooling liquid is arranged inside the water tank (1); threaded holes (10) are formed in the periphery of an upper port of the water tank (1), and the heat-conducting plate (3) is hermetically mounted at the upper port of the water tank (1) through fixing screws (5);
the upper end surface of the heat conducting plate (3) is connected with a plurality of radiating fins (4), the lower end surface of the heat conducting plate (3) is provided with a plurality of heat conducting thin columns (2), and the lower ends of the heat conducting thin columns (2) extend into the water cooling liquid of the water tank (1); a water inlet pipe (6) and a water outlet pipe (7) are arranged at one end of the heat conducting plate (3), a water pump mounting groove (9) is arranged at one end of the heat conducting plate (3), a water pump (8) is arranged in the water pump mounting groove (9), a water pump water inlet hole (12) is arranged at the bottom of the water pump mounting groove (9), and the lower end of the water outlet pipe (7) is connected to the water outlet end of the water pump (8);
the lower end of the water inlet pipe (6) penetrates through the heat conducting plate (3) and extends into the water tank (1); the water outlet end of the water outlet pipe (7) is connected with the water inlet of the CPU water cooling end; the water inlet end of the water inlet pipe (6) is connected with the water outlet of the CPU water cooling end.
2. The portable server water-cooling radiator according to claim 1, wherein a plurality of heat dissipation fans (11) are disposed on the upper end surface of the heat conduction plate (3) at one side of the heat dissipation fins (4), the plurality of heat dissipation fans (11) are linearly distributed, the heat dissipation fans (11) are parallel to the heat dissipation fins (4), and the total length of the heat dissipation fans (11) is equal to the total length of the heat dissipation fins (4).
3. A portable server water-cooled radiator according to claim 2, characterized in that the lower end of the water inlet pipe (6) is distributed transversely along the lower end face of the heat conducting plate (3) and is welded integrally with the heat conducting plate (3).
4. The portable server water-cooling radiator of claim 3, characterized in that a silica gel sealing strip is further arranged at the joint of the upper end of the water tank (1) and the heat conducting plate (3).
5. The portable server water-cooling radiator as claimed in claim 4, wherein the heat-conducting plate (3), the water inlet pipe (6), the water outlet pipe (7), the heat-radiating fins (4) and the heat-conducting fine columns (2) are all made of red copper or pure aluminum.
6. The portable server water-cooling radiator of claim 5, wherein a plurality of the heat-conducting thin columns (2) are distributed at the lower end of the heat-conducting plate (3) in a rectangular shape, a plurality of the heat-radiating fins (4) are distributed at the upper end of the heat-conducting plate (3) in a rectangular shape, and the heat-conducting thin columns (2), the heat-conducting plate (3) and the heat-radiating fins (4) are welded in an integrated manner.
7. The portable server water-cooling radiator as claimed in claim 6, wherein the water tank (1) is made of acrylic plate material.
8. The portable server water-cooling radiator of claim 7, characterized in that the lower end surface of the water tank (1) is provided with a water injection and discharge hole (13), and the water injection and discharge hole (13) is provided with a sealing plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220430548.XU CN216792839U (en) | 2022-03-01 | 2022-03-01 | Portable server water-cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220430548.XU CN216792839U (en) | 2022-03-01 | 2022-03-01 | Portable server water-cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216792839U true CN216792839U (en) | 2022-06-21 |
Family
ID=82000611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220430548.XU Active CN216792839U (en) | 2022-03-01 | 2022-03-01 | Portable server water-cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216792839U (en) |
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2022
- 2022-03-01 CN CN202220430548.XU patent/CN216792839U/en active Active
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