CN213399496U

CN213399496U - Computer heat dissipation mechanism for cloud computing

Info

Publication number: CN213399496U
Application number: CN202023006264.8U
Authority: CN
Inventors: 陈文娟
Original assignee: College Of Technology And Enigneering Lut
Current assignee: College Of Technology And Enigneering Lut
Priority date: 2020-12-14
Filing date: 2020-12-14
Publication date: 2021-06-08
Anticipated expiration: 2030-12-14

Abstract

The utility model relates to a computer heat dissipation mechanism for cloud computing, which comprises a base, wherein a case is fixedly arranged at the top of the base, a mounting plate is fixedly arranged in the inner cavity of the case, a reservoir is arranged in the inner cavity of the base, a circulating water pump is fixedly arranged in the inner cavity of the reservoir, a cooling pipeline is arranged in the inner cavity of the mounting plate, the circulating water pump is connected with the cooling pipeline, a heat dissipation plate is fixedly arranged at the top of the inner cavity of the case, a first heat dissipation fan is uniformly and fixedly arranged at the bottom of the heat dissipation plate, a heat dissipation pipe is fixedly arranged in the heat dissipation plate, one end of the heat dissipation pipe is connected with the cooling pipeline, the other end of the heat dissipation pipe is connected with the reservoir, the installation of a computer mainboard is facilitated, meanwhile, the cooling pipeline is arranged in the, and the air in the case can flow quickly, so that the heat dissipation efficiency of the computer is further improved.

Description

Computer heat dissipation mechanism for cloud computing

Technical Field

The utility model relates to a computer heat dissipation mechanism for cloud calculates belongs to computer technology field.

Background

The cloud computer adopts a distributed system architecture completely different from a personal computer and a super computer, and is a computer with strong computing capability formed by fusing a plurality of relatively low-cost computing resources by means of a virtualization technology of cloud computing; the system can efficiently support various application requirements such as big data processing, high throughput rate, high safety information service and the like, and the computing capacity and the storage capacity of the system can be dynamically expanded and infinitely expanded; when a computer processes large and complex tasks, the heat generation amount is huge, and if the heat is not discharged in time, the performance of the computer is affected, so that the heat dissipation structure is generated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer heat dissipation mechanism for cloud calculates, when using, the coolant liquid gets into in the mounting panel to make things convenient for the heat dissipation of mainboard, then discharge the heat in the coolant liquid through cooling fan, also let the quick flow of air of quick-witted incasement, further accelerate the radiating efficiency of computer, with the problem of proposing in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer heat dissipation mechanism for cloud calculates, the on-line screen storage device comprises a base, the fixed quick-witted case that is equipped with in base top, the fixed mounting panel that is equipped with of machine incasement chamber, the cistern has been seted up to base inner chamber, cistern inner chamber fixed mounting has circulating water pump, cooling tube has been seted up to the mounting panel inner chamber, circulating water pump is connected with cooling tube, the fixed heating panel that is equipped with in machine incasement chamber top, the even fixed mounting in heating panel bottom has a radiator fan, the heating panel internal fixation is equipped with the cooling tube, cooling tube one end is connected with cooling tube, and the.

Furthermore, a heat conducting block is fixedly arranged on the mounting plate, and a cooling cavity is arranged in the inner cavity of the mounting plate and corresponds to the heat conducting block.

Furthermore, the cooling pipeline is arranged in the mounting plate in an S shape, and the cooling cavity is communicated with the cooling pipeline.

Furthermore, a rectangular through hole for installing a heat dissipation plate is formed in the top of the case, a second heat dissipation fan is arranged on the right side of the case, and a dust screen is fixedly arranged in the heat dissipation hole of the case.

Furthermore, the radiating pipe is S-shaped, and radiating fins are uniformly and fixedly arranged on the radiating pipe.

Furthermore, a filter plate is fixedly arranged between the water inlet of the circulating water pump and the outlet of the radiating tube, a water filling port is formed in one side of the base, and a sealing cover is arranged in the water filling port.

The utility model has the advantages that:

1. the installation of the computer mainboard is facilitated by arranging the installation plate, and meanwhile, the cooling pipeline is arranged in the inner cavity of the installation plate, so that the installation plate is ensured to be in a low-temperature state when in use, and the heat dissipation of the mainboard is facilitated;

2. through setting up the heating panel, when the coolant liquid passes through the mounting panel, can take the heat out, get into in the radiator pipe, open radiator fan, effectively blow off the heat in the coolant liquid outside quick-witted case, can let coolant liquid cooling back circulation use, radiator fan can let quick-witted incasement air flow fast simultaneously for the radiating efficiency of computer.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a schematic structural diagram of a computer heat dissipation mechanism for cloud computing according to the present invention;

fig. 2 is a top view of a heat dissipating plate of a computer heat dissipating mechanism for cloud computing according to the present invention;

fig. 3 is a schematic cross-sectional view of a mounting plate of a computer heat dissipation mechanism for cloud computing according to the present invention;

reference numbers in the figures: 1. a base; 2. a chassis; 3. mounting a plate; 4. a reservoir; 5. a water circulating pump; 6. a cooling duct; 7. a heat dissipation plate; 8. a first heat dissipation fan; 9. a radiating pipe; 10. a heat conducting block; 11. a cooling chamber; 12. a second heat dissipation fan; 13. a heat dissipating fin; 14. a filter plate; 15. a water injection port.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a computer heat dissipation mechanism for cloud computing comprises a base 1, wherein a case 2 is fixedly arranged at the top of the base 1, a mounting plate 3 is fixedly arranged in an inner cavity of the case 2, a water reservoir 4 is arranged in an inner cavity of the base 1, a circulating water pump 5 is fixedly arranged in an inner cavity of the water reservoir 4, a cooling pipeline 6 is arranged in an inner cavity of the mounting plate 3, the circulating water pump 5 is connected with the cooling pipeline 6, so that a computer mainboard can be conveniently mounted, the cooling pipeline 6 is arranged in an inner cavity of the mounting plate 3, when the computer heat dissipation mechanism is used, the mounting plate 3 is ensured to be in a low-temperature state, so that the heat dissipation of the mainboard is convenient, a heat dissipation plate 7 is fixedly arranged at the top of the inner cavity of the case 2, a first heat dissipation fan 8 is uniformly and fixedly arranged at the bottom of the heat dissipation, open first radiator fan 8, effectively blow off the heat in the coolant liquid outside quick-witted case 2, can let coolant liquid cooling back circulation use, radiator fan can let the quick-witted incasement of 2 air flows fast simultaneously for the radiating efficiency of computer, 9 one end of cooling tube are connected with cooling tube 6, and the other end is connected with cistern 4.

Specifically, as shown in fig. 1 and 3, the mounting plate 3 is fixedly provided with a heat conduction block 10, a cooling cavity 11 is arranged at the corresponding position of the inner cavity of the mounting plate 3 and the heat conduction block 10, the heat conduction block 10 corresponds to the position of the CPU on the main board, the heat dissipation effect of the heat conduction block is improved, the cooling pipeline 6 is arranged in the mounting plate 3 in an S shape, the cooling cavity 11 is communicated with the cooling pipeline 6, a filter plate 14 is fixedly arranged between the water inlet of the circulating water pump 5 and the outlet of the heat dissipation pipe 9, a water filling port 15 is formed in one side of the base 1, a sealing cover is arranged in the water filling port 15, the cooling liquid is conveniently injected into the water storage tank, and the filter.

Specifically, as shown in fig. 2, a rectangular through hole for installing the heat dissipation plate 7 is provided at the top of the case 2, the right side of the case 2 is provided with a second heat dissipation fan 12, and a dust screen is fixedly arranged in the heat dissipation hole of the case 2, so that dust is prevented from entering the computer, the heat dissipation tube 9 is in an S-shaped configuration, and the heat dissipation tube 9 is uniformly and fixedly provided with heat dissipation fins 13, so that the heat dissipation effect is improved.

The utility model discloses the theory of operation: when using, carry the coolant liquid in the cistern 4 to cooling tube 6 in through circulating water pump 5, thereby guarantee that mounting panel 3 is in the low temperature state, thereby make things convenient for the heat dissipation of mainboard, the coolant liquid continues to flow and gets into in the cooling tube 9, open first radiator fan 8, outside effectively blowing off quick-witted case 2 with the heat in the coolant liquid, can let coolant liquid cooling back circulation use, radiator fan can let the quick flow of air in quick-witted case 2 simultaneously, further accelerate the radiating efficiency of computer.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. A computer heat dissipation mechanism for cloud computing, includes base (1), its characterized in that: the improved water-cooling type solar water heater is characterized in that a case (2) is fixedly arranged at the top of the base (1), a mounting plate (3) is fixedly arranged in an inner cavity of the case (2), a water storage tank (4) is arranged in an inner cavity of the base (1), a circulating water pump (5) is fixedly arranged in the inner cavity of the water storage tank (4), a cooling pipeline (6) is arranged in the inner cavity of the mounting plate (3), the circulating water pump (5) is connected with the cooling pipeline (6), a heat dissipation plate (7) is fixedly arranged at the top of the inner cavity of the case (2), a first heat dissipation fan (8) is uniformly and fixedly arranged at the bottom of the heat dissipation plate (7), a heat dissipation pipe (9) is fixedly arranged in the heat dissipation plate (.

2. The computer heat dissipation mechanism for cloud computing of claim 1, wherein: the mounting plate (3) is fixedly provided with a heat conduction block (10), and a cooling cavity (11) is arranged at the position of the inner cavity of the mounting plate (3) corresponding to the heat conduction block (10).

3. The computer heat dissipation mechanism for cloud computing of claim 2, wherein: the cooling pipeline (6) is arranged in the mounting plate (3) in an S shape, and the cooling cavity (11) is communicated with the cooling pipeline (6).

4. The computer heat dissipation mechanism for cloud computing of claim 1, wherein: the top of the case (2) is provided with a rectangular through hole for installing a heat dissipation plate (7), the right side of the case (2) is provided with a second heat dissipation fan (12), and a dust screen is fixedly arranged in the heat dissipation hole of the case (2).

5. The computer heat dissipation mechanism for cloud computing of claim 1, wherein: the radiating pipe (9) is arranged in an S shape, and radiating fins (13) are uniformly and fixedly arranged on the radiating pipe (9).

6. The computer heat dissipation mechanism for cloud computing of claim 1, wherein: a filter plate (14) is fixedly arranged between the water inlet of the circulating water pump (5) and the outlet of the radiating pipe (9), a water filling port (15) is formed in one side of the base (1), and a sealing cover is arranged in the water filling port (15).