CN112612352A - Computer cooling system - Google Patents
Computer cooling system Download PDFInfo
- Publication number
- CN112612352A CN112612352A CN202110013317.9A CN202110013317A CN112612352A CN 112612352 A CN112612352 A CN 112612352A CN 202110013317 A CN202110013317 A CN 202110013317A CN 112612352 A CN112612352 A CN 112612352A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- water pipe
- case
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 83
- 230000017525 heat dissipation Effects 0.000 claims abstract description 60
- 238000002791 soaking Methods 0.000 claims description 21
- 239000012530 fluid Substances 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 11
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 241000270295 Serpentes Species 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 34
- 230000000694 effects Effects 0.000 description 13
- 238000001704 evaporation Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 230000002349 favourable effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
Abstract
The invention discloses a computer heat dissipation system, which comprises a case, wherein one side of the bottom in the case is fixedly provided with a water tank, the water tank is connected with a water pipe through a circulating water pump, the circulating water pump is fixed on the inner wall of the bottom of the case, the inner walls of the two sides of the case, which are positioned above the water tank, are fixedly provided with heat dissipation plates, the upper surfaces of the heat dissipation plates are provided with heat conduction fins, and the upper surfaces of the heat conduction fins are contacted with the bottom of a CPU (central processing unit). Gradually dissipating heat.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a computer cooling system.
Background
The computer is more and more common in use, can satisfy many-sided demands of contemporary people's life and work, and the host computer of computer can produce the heat under long-time working condition, generates heat for a long time and influences computer life easily, therefore computer cooling system's radiating effect is vital.
At present, the most widely used CPU heat dissipation technology is still forced air cooling heat dissipation, but the air cooling heat dissipation efficiency is poor, the noise is high, and the heat dissipation requirements of modern computers cannot be met gradually.
Disclosure of Invention
The present invention is directed to a computer cooling system to solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme:
a computer heat dissipation system comprises a case, a water tank is fixedly mounted on one side of the bottom in the case, the water tank is connected with a water pipe through a circulating water pump, the circulating water pump is fixed on the inner wall of the bottom of the case, heat dissipation plates are fixedly mounted on the inner walls of two sides of the case above the water tank, heat conduction plates are arranged on the upper surfaces of the heat dissipation plates, the upper surfaces of the heat conduction plates are in contact with the bottom of a CPU, a heat dissipation fan is arranged at the position, at the same height as the heat dissipation plates, of the inner wall of the rear side of the case, the water pipe is in contact with the bottom of the heat dissipation plates along the inner wall of the case, the water pipe is coiled on the bottom of the heat dissipation plates in a snake shape and extends to the inner wall of the top of the case along the inner wall of the case, a condenser is, rivers pass through quick-witted incasement wall, the heating panel bottom, machine top of the case inner wall, the condenser is connected with the water tank, because the characteristics of the specific heat capacity super large of water, consequently can absorb a large amount of heats and keep the temperature can not have obvious change, the temperature of the CPU who links to each other with the heating panel can obtain fine control, rivers absorb CPU's heat after, continuously flow in the water pipe, dispel the heat gradually, and under the effect of condenser, make rivers rapid cooling, start radiator fan simultaneously, can carry out rapid cooling to the heating panel.
As a further scheme of the invention: the heating panel comprises two soaking boards, and two be formed with the wind channel between the soaking board, two the relative one side of soaking board all is provided with the fin of mutual crisscross equidistant evenly distributed, through the wind channel that sets up for the wind current that radiator fan blew out flows through the wind channel, and under the effect of fin, has increased the heat transfer area of heating panel, makes the heat of conduction on the heating panel come by quick dispersion, and under the effect in wind channel, carries out quick heat dissipation cooling to the heating panel.
As a still further scheme of the invention: the soaking plate comprises a sealing wall, capillary holes are formed in the inner side of the sealing wall, a steam chamber is arranged on the inner side of the capillary holes, working fluid is arranged in the steam chamber, the working fluid is arranged in the sealed steam chamber, the heat generated by the CPU is transferred to the sealing wall of the soaking plate under the action of a heat conducting sheet at the moment, the working fluid in the steam chamber is transferred through the sealing wall, so that an evaporation area is formed, the working fluid absorbs the heat to be vaporized and rapidly expands to the whole cavity, the heat is emitted on the soaking plate to be condensed into a liquid state, the liquid working medium returns to the evaporation area through the capillary holes, the rapid heat transfer is realized through the circulation, the rapid cooling of the heating plate is facilitated, the rapid cooling of the CPU is facilitated, and meanwhile, the heat on the heating plate can be conducted through water flow under the action of a water pipe which is coiled in a, thereby rapidly cooling the heat dissipation plate.
As a still further scheme of the invention: the bottom of heating panel is provided with equidistant distribution's water pipe groove, just water pipe groove transverse distribution and heating panel bottom, the size of water pipe groove is identical with the size of water pipe, through the setting of water pipe groove, has increased the area of contact of water pipe with the heating panel to be favorable to cooling to the heating panel more.
As a still further scheme of the invention: the both sides of heating panel all are provided with the fixed plate, the fixed plate is T type structure, through the setting of fixed plate, is convenient for install the heating panel.
As a still further scheme of the invention: the upper surface of the heat conducting fin is coated with heat conducting silicone grease, and heat on the CPU is conveniently conducted to the heat dissipation plate through the arrangement of the heat conducting silicone grease.
Compared with the prior art, the invention has the beneficial effects that:
the invention has simple structure and good heat dissipation effect, greatly improves the heat dissipation efficiency of the CPU in the case, ensures that the computer runs more stably, is beneficial to normal use of people, can absorb a large amount of heat without obvious change of temperature due to the characteristic of super large specific heat capacity of water, can well control the temperature of the CPU connected with the heat dissipation plate, ensures that the water flow continuously flows in the water pipe after absorbing the heat of the CPU, gradually dissipates the heat, quickly cools the water flow under the action of the condenser, simultaneously starts the heat dissipation fan to quickly cool the heat dissipation plate, ensures that the air flow blown out by the heat dissipation fan flows through the air channel, increases the heat exchange area of the heat dissipation plate under the action of the heat dissipation fins, quickly disperses the heat conducted on the heat dissipation plate and is under the action of the air channel, carry out the cooling of dispelling the heat fast to the heating panel, through be provided with working fluid in sealed steam chamber, this moment under the effect of conducting strip, with the heat transfer of CPU production to the sealed wall of soaking plate on, conduct to the working fluid in the steam chamber through the sealed wall on, thereby form the evaporation zone, make working fluid absorb the heat vaporization and expand to whole cavity rapidly, it becomes liquid to emit the heat condensation on the soaking plate, liquid working medium returns the evaporation zone through the capillary hole, so circulate and realize thermal quick transfer, thereby be favorable to the rapid cooling of heating panel, thereby be favorable to the rapid cooling of CPU, and simultaneously, be under the effect of the water pipe that snakelike coiling bottom the heating panel, can pass through rivers with the heat on the heating panel and conduct, thereby cool down the heating panel fast.
Drawings
Fig. 1 is a schematic structural diagram of a computer cooling system.
Fig. 2 is a schematic structural diagram of a heat dissipation plate in a computer heat dissipation system.
Fig. 3 is a schematic view of another perspective structure of a heat dissipation plate in a computer heat dissipation system.
Fig. 4 is a schematic structural diagram of a vapor chamber in a computer cooling system.
FIG. 5 is a connection diagram of a water pipe and a heat sink plate in a computer heat sink system.
In the figure: 1. a chassis; 2. a water tank; 3. a water circulating pump; 4. a water pipe; 5. a heat dissipation plate; 6. a heat conductive sheet; 7. a heat radiation fan; 8. a condenser; 9. a heat sink; 10. an air duct; 11. a water pipe groove; 12. a sealing wall; 13. a steam chamber; 14. a working fluid; 15. and (4) capillary pores.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 5, in the embodiment of the present invention, a computer heat dissipation system includes a chassis 1, a water tank 2 is fixedly installed on one side of the bottom inside the chassis 1, the water tank 2 is connected to a water pipe 4 through a circulating water pump 3, the circulating water pump 3 is fixed on the inner wall of the bottom inside the chassis 1, heat dissipation plates 5 are fixedly installed on the inner walls of the two sides of the chassis 1 above the water tank 2, a heat conduction plate 6 is installed on the upper surface of the heat dissipation plate 5, the upper surface of the heat conduction plate 6 contacts with the bottom of a CPU, a heat dissipation fan 7 is installed at the same height position of the inner wall of the rear side of the chassis 1 and the heat dissipation plate 5, the water pipe 4 contacts with the bottom of the heat dissipation plate 5 along the inner wall of the chassis 1, the water pipe 4 is coiled in a serpentine shape at the bottom of the heat dissipation plate 5 and extends to the, the water pipe 4 is connected with the water tank 2 through a condenser 8.
During the use, start circulating water pump 3, there is rivers circulation flow in water pipe 4 this moment, rivers pass through quick-witted case 1 inner wall, heating panel 5 bottom, machine case 1 top inner wall, condenser 8 is connected with water tank 2, because the characteristics of the specific heat capacity super large of water, consequently, can absorb a large amount of heats and keep the temperature can not have obvious change, the temperature of the CPU who links to each other with heating panel 5 can obtain fine control, behind the heat of CPU was absorbed to rivers, continuously flow in water pipe 4, dispel the heat gradually, and under condenser 8's effect, make rivers rapid cooling, start radiator fan 7 simultaneously, can carry out rapid cooling to heating panel 5.
The heating panel 5 comprises two soaking plates, and is two be formed with wind channel 10 between the soaking plate, two the opposite side of soaking plate all is provided with the fin 9 of crisscross equidistant evenly distributed each other.
Through the wind channel 10 that sets up for the wind current that radiator fan 7 blew out flows through wind channel 10, and under the effect of fin 9, has increased the heat transfer area of heating panel 5, makes the heat of conduction on the heating panel 5 by the fast dispersion come, and under the effect of wind channel 10, carries out the cooling of dispelling the heat fast to heating panel 5.
The soaking plate comprises a sealing wall 12, capillary holes 15 are formed in the inner side of the sealing wall 12, a steam chamber 13 is arranged on the inner side of the capillary holes 15, and working fluid 14 is arranged in the steam chamber 13.
Through being provided with working fluid 14 in sealed steam chamber 13, this moment under the effect of conducting strip 6, heat transfer to the soaking plate that produces CPU is on the sealed wall 12 of soaking plate, conduct to the working fluid 14 in the steam chamber 13 through sealed wall 12, thereby form the evaporation zone, make working fluid 14 absorb the heat vaporization and expand to whole cavity rapidly, it becomes liquid to emit the heat condensation on the soaking plate, liquid working medium returns the evaporation zone through capillary hole 15, so circulate and realize thermal quick transfer, thereby be favorable to the rapid cooling of heating panel 5, thereby be favorable to the rapid cooling of CPU, simultaneously, be under the effect of snakelike coiled water pipe 4 bottom heating panel 5, can pass through rivers with the heat on the heating panel 5 and conduct, thereby cool down heating panel 5 fast.
The bottom of the heat dissipation plate 5 is provided with water pipe grooves 11 which are distributed at equal intervals, the water pipe grooves 11 are transversely distributed at the bottom of the heat dissipation plate 5, and the size of the water pipe grooves 11 is matched with that of the water pipes 4.
Through the setting of water pipe groove 11, the area of contact of water pipe 4 with heating panel 5 has been increased to be favorable to cooling to heating panel 5 more.
The both sides of heating panel 5 all are provided with the fixed plate, the fixed plate is T type structure.
The heat dissipation plate 5 is easily mounted by the fixing plate.
The upper surface of the heat-conducting fin 6 is coated with heat-conducting silicone grease.
The heat on the CPU is conveniently conducted to the heat dissipation plate 5 by the provision of the heat conductive silicone grease.
The working principle of the invention is as follows:
when in use, the circulating water pump 3 is started, at the moment, the water pipe 4 has water flow circulation flow, the water flow passes through the inner wall of the case 1, the bottom of the heat dissipation plate 5, the inner wall of the top end of the case 1, the condenser 8 is connected with the water tank 2, due to the characteristic of overlarge specific heat capacity of water, a large amount of heat can be absorbed, the temperature can not be obviously changed, the temperature of a CPU (central processing unit) connected with the heat dissipation plate 5 can be well controlled, after the water flow absorbs the heat of the CPU, the water flow continuously flows in the water pipe 4, the heat is gradually dissipated, the water flow is rapidly cooled under the action of the condenser 8, meanwhile, the heat dissipation fan 7 is started, the heat dissipation plate 5 can be rapidly cooled, through the arranged air duct 10, air flow blown by the heat dissipation fan 7 flows through the air duct 10, the heat exchange area of the heat dissipation plate 5 is increased under the, under the action of the air duct 10, the heat dissipation plate 5 is rapidly cooled, through the working fluid 14 arranged in the sealed steam chamber 13, at this time, the heat generated by the CPU is transferred to the sealing wall 12 of the soaking plate under the action of the heat conduction sheet 6, and is conducted to the working fluid 14 in the steam chamber 13 through the sealing wall 12, thereby forming an evaporation zone, so that the working fluid 14 absorbs heat to be vaporized and rapidly expands to the whole cavity, the heat emitted from the soaking plate is condensed into liquid state, the liquid working medium returns to the evaporation area through the capillary 15, the circulation realizes the rapid transfer of the heat, thereby facilitating the rapid cooling of the heat radiating plate 5 and thus the CPU, and at the same time, under the effect of the water pipe 4 that is snakelike coiling at the bottom of the heat dissipation plate 5, heat on the heat dissipation plate 5 can be conducted through water flow, and therefore the heat dissipation plate 5 is cooled down quickly.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. A computer cooling system comprises a case (1) and is characterized in that a water tank (2) is fixedly mounted on one side of the bottom in the case (1), the water tank (2) is connected with a water pipe (4) through a circulating water pump (3), the circulating water pump (3) is fixed on the inner wall of the bottom of the case (1), cooling plates (5) are fixedly mounted on the inner walls of two sides of the case (1) above the water tank (2), heat conducting fins (6) are arranged on the upper surface of the cooling plates (5), the upper surfaces of the heat conducting fins (6) are in contact with the bottom of a CPU, cooling fans (7) are arranged at the positions of the inner wall of the rear side of the case (1) and the same height of the cooling plates (5), the water pipe (4) is in contact with the bottom of the cooling plates (5) along the inner wall of the case (1), and the water pipe (4) is coiled on the bottom of the cooling plates (5) in a snake shape and extends to the inner wall of the, and the inner wall of the top end of the case (1) is provided with a condenser (8), and the water pipe (4) is connected with the water tank (2) through the condenser (8).
2. The computer heat dissipation system of claim 1, wherein the heat dissipation plate (5) is composed of two soaking plates, an air channel (10) is formed between the two soaking plates, and the opposite sides of the two soaking plates are provided with heat dissipation fins (9) which are staggered and evenly distributed at equal intervals.
3. The computer heat dissipation system according to claim 2, wherein the soaking plate comprises a sealing wall (12), the sealing wall (12) is provided with capillary holes (15) inside, the capillary holes (15) are provided with a steam chamber (13) inside, and the steam chamber (13) is provided with a working fluid (14) inside.
4. The computer heat dissipation system according to claim 1, wherein the bottom of the heat dissipation plate (5) is provided with water pipe grooves (11) distributed at equal intervals, the water pipe grooves (11) are transversely distributed at the bottom of the heat dissipation plate (5), and the size of the water pipe grooves (11) is matched with the size of the water pipes (4).
5. The computer cooling system according to claim 1, wherein fixing plates are disposed on both sides of the cooling plate (5), and the fixing plates are T-shaped.
6. The computer heat dissipation system according to claim 1, wherein the upper surface of the heat conductive sheet (6) is coated with a heat conductive silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110013317.9A CN112612352A (en) | 2021-01-06 | 2021-01-06 | Computer cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110013317.9A CN112612352A (en) | 2021-01-06 | 2021-01-06 | Computer cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112612352A true CN112612352A (en) | 2021-04-06 |
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ID=75253329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110013317.9A Pending CN112612352A (en) | 2021-01-06 | 2021-01-06 | Computer cooling system |
Country Status (1)
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104164A (en) * | 1996-06-14 | 1998-01-06 | Toyo Radiator Co Ltd | Air cooling heat sink |
| KR200380189Y1 (en) * | 2004-12-27 | 2005-03-29 | 주식회사 웰드라인 | Heat exchanging structure of an inverter |
| CN102299491A (en) * | 2011-06-16 | 2011-12-28 | 杭州恒信电气有限公司 | Vapor chamber for heat radiation of large-current switch cabinet |
| US20120050983A1 (en) * | 2010-08-24 | 2012-03-01 | Foxconn Technology Co., Ltd. | Heat dissipation device for electronic apparatus |
| CN206039415U (en) * | 2016-07-22 | 2017-03-22 | 济宁市金蓝领教育咨询有限公司 | Heat radiation structure of computer main part |
| CN207471500U (en) * | 2017-12-04 | 2018-06-08 | 天津龙鼎熙石化新能源科技有限公司 | Lamp radiator |
| CN211044162U (en) * | 2019-12-17 | 2020-07-17 | 李海舟 | Computer CPU heat dissipation heat sink |
| CN111642103A (en) * | 2020-04-29 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High heat flow density porous heat sink flow cooling device |
-
2021
- 2021-01-06 CN CN202110013317.9A patent/CN112612352A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104164A (en) * | 1996-06-14 | 1998-01-06 | Toyo Radiator Co Ltd | Air cooling heat sink |
| KR200380189Y1 (en) * | 2004-12-27 | 2005-03-29 | 주식회사 웰드라인 | Heat exchanging structure of an inverter |
| US20120050983A1 (en) * | 2010-08-24 | 2012-03-01 | Foxconn Technology Co., Ltd. | Heat dissipation device for electronic apparatus |
| CN102299491A (en) * | 2011-06-16 | 2011-12-28 | 杭州恒信电气有限公司 | Vapor chamber for heat radiation of large-current switch cabinet |
| CN206039415U (en) * | 2016-07-22 | 2017-03-22 | 济宁市金蓝领教育咨询有限公司 | Heat radiation structure of computer main part |
| CN207471500U (en) * | 2017-12-04 | 2018-06-08 | 天津龙鼎熙石化新能源科技有限公司 | Lamp radiator |
| CN211044162U (en) * | 2019-12-17 | 2020-07-17 | 李海舟 | Computer CPU heat dissipation heat sink |
| CN111642103A (en) * | 2020-04-29 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High heat flow density porous heat sink flow cooling device |
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