CN219716062U - High-power radiator - Google Patents
High-power radiator Download PDFInfo
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- CN219716062U CN219716062U CN202320539624.5U CN202320539624U CN219716062U CN 219716062 U CN219716062 U CN 219716062U CN 202320539624 U CN202320539624 U CN 202320539624U CN 219716062 U CN219716062 U CN 219716062U
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- Prior art keywords
- heat
- pipe
- fan
- heat dissipation
- conducting plate
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 239000003507 refrigerant Substances 0.000 claims abstract description 20
- 230000005855 radiation Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 abstract description 33
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 11
- 230000008859 change Effects 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 6
- 238000013021 overheating Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The utility model discloses a high-power radiator, which comprises: the heat dissipation device comprises a left fan and a right fan, wherein a heat dissipation fin group is arranged at air outlets of the left fan and the right fan, a first heat pipe is arranged between the first heat conduction plate, the second heat conduction plate and the heat dissipation fin group, a loop heat pipe is arranged on one side of the first heat pipe, which is opposite to the first heat conduction plate and the second heat conduction plate, an evaporator filled with a refrigerant in a cavity is communicated with a liquid reservoir, a guide pipe is respectively arranged at the left end of the liquid reservoir and the right end of the evaporator, a heat dissipation return pipe is connected between the two guide pipes, so that the heat dissipation return pipe is communicated with the evaporator and the inside of the liquid reservoir, and the upper surface of the heat dissipation return pipe is connected with at least one temperature equalizing plate. The high-power radiator can radiate heat through air cooling and through phase change circulation of the refrigerant, and transfers heat in the phase change process of the refrigerant, so that the situation of local overheating is greatly reduced, and the overall radiating power is improved.
Description
Technical Field
The utility model relates to a high-power radiator, and belongs to the field of electronic product heat dissipation.
Background
The prior art generally adopts the radiator to dispel the heat to the electronic component that generates heat, and the radiator generally includes fin, heat pipe and heating panel, and the one end of heat pipe is fixed at the heating panel, and the other end is fixed at the fin, and the fin is assembled at the air outlet of fan, and the chip is pasted through the heat conduction of melting form on the surface of heating panel, thereby the fan air-out blows out the heat.
In the existing device, part of notebook computers are provided with a CPU and a GPU at the same time, the CPU and the GPU can generate a large amount of heat during working, if the radiator is only used for radiating heat, the radiating power is low, and when the notebook computers are used for a long time, the problem that the notebook computers are overheated still exists, so that the radiating power of the radiator is further improved to be a technical problem which needs to be solved by the technicians in the field.
Disclosure of Invention
The utility model aims to provide a high-power radiator which can radiate heat through air cooling and through phase change circulation of a refrigerant, and transfer heat in the phase change process of the refrigerant, so that the situation of local overheating is greatly reduced, and the overall radiating power is improved.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a high power heat sink comprising: the heat-dissipation device comprises a left fan and a right fan, wherein air inlets of the left fan and the right fan are arranged oppositely, a heat-dissipation fin group is arranged at air outlets of the left fan and the right fan, a first heat-conducting plate contacted with a high-temperature heat source and a second heat-conducting plate contacted with a low-temperature heat source are arranged between the left fan and the right fan, the first heat-conducting plate and the second heat-conducting plate are distributed at left and right intervals, a first heat pipe is arranged between the first heat-conducting plate, the second heat-conducting plate and the heat-dissipation fin group, and a loop heat pipe is arranged at one side of the first heat pipe opposite to the first heat-conducting plate and the second heat-conducting plate;
the loop heat pipe further comprises an evaporator, a liquid storage device and a hollow heat dissipation return pipe, wherein a cavity is arranged in the evaporator, the evaporator filled with a refrigerant in the cavity is communicated with the liquid storage device, a guide pipe is respectively arranged at the left end of the liquid storage device and the right end of the evaporator, the heat dissipation return pipe is connected between the two guide pipes, so that the heat dissipation return pipe is communicated with the inside of the evaporator and the liquid storage device, and the upper surface of the heat dissipation return pipe is connected with at least one temperature equalizing plate.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the top of the left fan and the top of the right fan are respectively provided with a cover plate, and one end of the first heat pipe is positioned between the cover plates and the radiating fin group.
2. In the scheme, the opposite sides of the two cover plates are respectively provided with a clearance groove for installing the heat dissipation return pipe.
3. In the above scheme, the samming board is provided with two, and the interval sets up between two samming boards.
4. In the scheme, the two guide pipes are distributed in a staggered mode.
5. In the above scheme, the first heat pipes are two, and the two first heat pipes are arranged in parallel.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages and effects:
the utility model relates to a high-power radiator, which is characterized in that a first heat pipe is arranged between a first heat conducting plate and a second heat conducting plate between a left fan and a right fan and a radiating fin group, a loop heat pipe is arranged on one side of the first heat pipe, which is opposite to the first heat conducting plate and the second heat conducting plate, an evaporator filled with a refrigerant in a cavity is communicated with a liquid reservoir, a radiating return pipe is connected between two guide pipes, so that the radiating return pipe is communicated with the inside of the evaporator and the liquid reservoir, the upper surface of the radiating return pipe is connected with at least one temperature equalizing plate, the heat emitted by a high-temperature heat source and a low-temperature heat source is respectively transferred to the evaporator and the radiating fin group through the first heat pipe, the fan cools the radiating fin group at an air outlet thereof in the working process, and on the basis of realizing air cooling and radiating, the gasified refrigerant in the cavity is enabled to be transferred through the return pipe and the temperature equalizing plate in the flowing process along the radiating return pipe, so that the situation that the heat is accumulated together to cause local overheating is greatly improved.
Drawings
FIG. 1 is a schematic view of a first view angle structure of a high power heat sink according to the present utility model;
FIG. 2 is a schematic view of a second view angle structure of the high power heat sink of the present utility model;
fig. 3 is an enlarged view of fig. 1 at a in accordance with the present utility model.
In the above figures: 1. a left fan; 2. a right fan; 3. a heat radiation fin group; 4. a first heat-conducting plate; 5. a second heat-conducting plate; 6. a first heat pipe; 7. loop heat pipe; 8. an evaporator; 9. a heat dissipation return pipe; 10. a guide tube; 11. a temperature equalizing plate; 12. a reservoir; 13. a clearance groove; 14. and a cover plate.
Description of the embodiments
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Example 1: a high power heat sink comprising: the air inlets of the left fan 1 and the right fan 2 are arranged oppositely, a heat radiation fin group 3 is arranged at the air outlets of the left fan 1 and the right fan 2, a first heat conduction plate 4 contacted with a high-temperature heat source and a second heat conduction plate 5 contacted with a low-temperature heat source are arranged between the left fan 1 and the right fan 2, the first heat conduction plate 4 and the second heat conduction plate 5 are distributed at left and right intervals, a first heat pipe 6 is arranged between the first heat conduction plate 4, the second heat conduction plate 5 and the heat radiation fin group 3, and a loop heat pipe 7 is arranged at one side of the first heat pipe 6 opposite to the first heat conduction plate 4 and the second heat conduction plate 5;
the heat of the high-temperature heat source and the low-temperature heat source is transferred to the first heat pipe through the first heat conducting plate and the second heat conducting plate which are arranged at intervals, the first heat pipe transfers the heat to the evaporator and the heat radiating fin group respectively, and the fan cools the heat radiating fin group positioned at the air outlet in the working process;
the loop heat pipe 7 further comprises an evaporator 8, a liquid storage device 12 and a hollow heat dissipation return pipe 9, wherein a cavity is arranged in the evaporator 8, the evaporator 8 filled with a refrigerant in the cavity is communicated with the liquid storage device 12, a guide pipe 10 is respectively arranged at the left end of the liquid storage device 12 and the right end of the evaporator 8, the heat dissipation return pipe 9 is connected between the two guide pipes 10, so that the heat dissipation return pipe 9 is communicated with the evaporator 8 and the interior of the liquid storage device 12, and the upper surface of the heat dissipation return pipe 9 is connected with at least one temperature equalizing plate 11;
the evaporator of the loop heat pipe absorbs heat to evaporate liquid refrigerant in the loop heat pipe, the vapor enters the heat dissipation return pipe through the guide pipe close to the high-temperature heat source and flows in the heat dissipation return pipe, and heat dissipation and temperature reduction are performed through the heat dissipation return pipe and the temperature equalizing plate in the flowing process of the vapor.
The top of the left fan 1 and the top of the right fan 2 are respectively provided with a cover plate 14, and one end of the first heat pipe 6 is located between the cover plate 14 and the heat dissipation fin group 3.
Opposite sides of the two cover plates 14 are provided with a clearance groove 13 for mounting the heat radiation return pipe 9.
The number of the temperature equalizing plates 11 is two, and the two temperature equalizing plates 11 are arranged at intervals.
The two guide tubes 10 are distributed in a staggered manner.
The refrigerant is water.
The lower surface of the evaporator 8 is welded to the upper surface of the first heat pipe 6.
The power of the high-temperature heat source is 60W, and the power of the low-temperature heat source is 30W.
Example 2: a high power heat sink comprising: the air inlets of the left fan 1 and the right fan 2 are arranged oppositely, a heat radiation fin group 3 is arranged at the air outlets of the left fan 1 and the right fan 2, a first heat conduction plate 4 contacted with a high-temperature heat source and a second heat conduction plate 5 contacted with a low-temperature heat source are arranged between the left fan 1 and the right fan 2, the first heat conduction plate 4 and the second heat conduction plate 5 are distributed at left and right intervals, a first heat pipe 6 is arranged between the first heat conduction plate 4, the second heat conduction plate 5 and the heat radiation fin group 3, and a loop heat pipe 7 is arranged at one side of the first heat pipe 6 opposite to the first heat conduction plate 4 and the second heat conduction plate 5;
the heat emitted by the high-temperature heat source and the low-temperature heat source is respectively transmitted to the evaporator and the radiating fin group through the first heat pipe, and on the basis of realizing air cooling and radiating, the radiating area is enlarged through the cooperation of the evaporator, the radiating return pipe and the temperature equalizing plate, so that the overall radiating power is greatly improved;
the loop heat pipe 7 further comprises an evaporator 8, a liquid storage device 12 and a hollow heat dissipation return pipe 9, wherein a cavity is arranged in the evaporator 8, the evaporator 8 filled with a refrigerant in the cavity is communicated with the liquid storage device 12, a guide pipe 10 is respectively arranged at the left end of the liquid storage device 12 and the right end of the evaporator 8, the heat dissipation return pipe 9 is connected between the two guide pipes 10, so that the heat dissipation return pipe 9 is communicated with the evaporator 8 and the interior of the liquid storage device 12, and the upper surface of the heat dissipation return pipe 9 is connected with at least one temperature equalizing plate 11;
the temperature equalizing plate absorbs heat from the heat dissipation return pipe, so that the liquid refrigerant in the temperature equalizing plate is evaporated and is condensed into liquid again on the upper surface of the temperature equalizing plate, heat dissipation of the heat dissipation return pipe is realized, vapor in the heat dissipation return pipe is condensed into liquid again, the liquid enters the liquid storage device through the guide pipe close to the low-temperature heat source, and the liquid in the liquid storage device is replenished into the evaporator.
The top of the left fan 1 and the top of the right fan 2 are respectively provided with a cover plate 14, and one end of the first heat pipe 6 is located between the cover plate 14 and the heat dissipation fin group 3.
The heat can be dissipated through air cooling, and can be dissipated through the phase change circulation of the refrigerant, and the heat is transferred in the phase change process of the refrigerant, so that the local overheating condition is greatly reduced, and the overall heat dissipation power is improved.
The number of the temperature equalizing plates 11 is two, and the two temperature equalizing plates 11 are arranged at intervals.
The number of the first heat pipes 6 is two, and the two first heat pipes 6 are arranged in parallel.
The heat radiation return pipe 9 is a stainless steel pipe.
The power of the high-temperature heat source is 70W, and the power of the low-temperature heat source is 40W.
The working principle of the utility model is as follows:
when the heat pipe is used, the heat of the high-temperature heat source and the low-temperature heat source is transferred to the first heat pipe through the first heat conducting plate and the second heat conducting plate which are arranged at intervals, the first heat pipe transfers the heat to the evaporator and the heat dissipation fin group respectively, and the fan cools the heat dissipation fin group positioned at the air outlet of the fan in the working process;
the evaporator of the loop heat pipe absorbs heat to evaporate liquid refrigerant in the loop heat pipe, the vapor enters the heat dissipation return pipe through the guide pipe close to the high-temperature heat source and flows in the heat dissipation return pipe, and heat dissipation and temperature reduction are carried out through the heat dissipation return pipe and the temperature equalizing plate in the flowing process of the vapor;
the temperature equalizing plate absorbs heat from the heat dissipation return pipe, so that the liquid refrigerant in the temperature equalizing plate is evaporated and is condensed into liquid again on the upper surface of the temperature equalizing plate, heat dissipation of the heat dissipation return pipe is realized, vapor in the heat dissipation return pipe is condensed into liquid again, the liquid enters the liquid storage device through the guide pipe close to the low-temperature heat source, and the liquid in the liquid storage device is replenished into the evaporator.
When the high-power radiator is adopted, the heat emitted by the high-temperature heat source and the low-temperature heat source is respectively transmitted to the evaporator and the radiating fin group through the first heat pipe, the fan cools the radiating fin group positioned at the air outlet of the fan in the working process, and on the basis of realizing air cooling and heat dissipation, the gasified refrigerant in the cavity can be gasified through heat absorption of the evaporator, and the gasified refrigerant dissipates heat through the return pipe and the temperature equalizing plate in the flowing process along the heat dissipation return pipe, so that the integral heat dissipation power is greatly improved.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (6)
1. A high power heat sink comprising: left fan (1), right fan (2), the air intake of left fan (1), right fan (2) sets up relatively, and left fan (1), right fan (2)'s air outlet all installs a heat radiation fin group (3), its characterized in that: a first heat conducting plate (4) contacted with a high-temperature heat source and a second heat conducting plate (5) contacted with a low-temperature heat source are arranged between the left fan (1) and the right fan (2), the first heat conducting plate (4) and the second heat conducting plate (5) are distributed at left and right intervals, a first heat pipe (6) is arranged between the first heat conducting plate (4), the second heat conducting plate (5) and the radiating fin group (3), and a loop heat pipe (7) is arranged on one side of the first heat pipe (6) opposite to the first heat conducting plate (4) and one side of the second heat conducting plate (5);
this loop heat pipe (7) is further including being equipped with evaporimeter (8), reservoir (12) and hollow heat dissipation back flow (9) of cavity in, this cavity intussuseption be filled with evaporimeter (8) of refrigerant with reservoir (12) intercommunication, and be provided with respectively in the left end of reservoir (12), the right-hand member of evaporimeter (8) one guide tube (10), be connected with between these two guide tubes (10) heat dissipation back flow (9) to with heat dissipation back flow (9) and evaporimeter (8), the inside intercommunication of reservoir (12), the upper surface of heat dissipation back flow (9) is connected with at least one samming board (11).
2. The high power heat sink of claim 1, wherein: the top of left fan (1), right fan (2) all is provided with a apron (14), the one end of first heat pipe (6) is located between this apron (14) and fin group (3).
3. The high power heat sink of claim 2, wherein: and the opposite sides of the two cover plates (14) are respectively provided with a clearance groove (13) for installing the heat dissipation return pipe (9).
4. The high power heat sink of claim 1, wherein: the two temperature equalizing plates (11) are arranged at intervals between the two temperature equalizing plates (11).
5. The high power heat sink of claim 1, wherein: the two guide pipes (10) are distributed in a staggered manner.
6. The high power heat sink of claim 1, wherein: the two first heat pipes (6) are arranged in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320539624.5U CN219716062U (en) | 2023-03-20 | 2023-03-20 | High-power radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320539624.5U CN219716062U (en) | 2023-03-20 | 2023-03-20 | High-power radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219716062U true CN219716062U (en) | 2023-09-19 |
Family
ID=87977094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320539624.5U Active CN219716062U (en) | 2023-03-20 | 2023-03-20 | High-power radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219716062U (en) |
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2023
- 2023-03-20 CN CN202320539624.5U patent/CN219716062U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240207 Address after: No. 258, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province, 215311 Patentee after: KUNSHAN PING TAI ELECTRONIC CO.,LTD. Country or region after: China Address before: No. 388, Sanjia Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou pindai Electronic Technology Co.,Ltd. Country or region before: China |