CN214226907U

CN214226907U - Cavity radiator with direct-contact heat source

Info

Publication number: CN214226907U
Application number: CN202120296722.1U
Authority: CN
Inventors: 陈峙民
Original assignee: Suzhou Geometry Future Creative Technology Co ltd
Current assignee: Suzhou Geometry Future Creative Technology Co ltd
Priority date: 2021-02-02
Filing date: 2021-02-02
Publication date: 2021-09-17
Anticipated expiration: 2031-02-02

Abstract

The utility model discloses a cavity radiator with directly touch heat source, including touching hot cavity, touch and connect the cooling tube on the hot cavity, just touch hot cavity and cooling tube intercommunication, be in simultaneously touch and set up heat-conducting medium in the hot cavity, just heat-radiating medium carries out reciprocating flow between touching hot cavity and cooling tube, just touch one of them or a plurality of sides and the heat source contact of hot cavity. Through touching set up the heat dissipation medium in the hot cavity, when the heat source generates heat, touch the hot cavity in time with heat transfer to heat dissipation medium, and take place to dispel the heat by the flow of hot junction to cold junction by heat dissipation medium, so reciprocal, reach the efficient heat dissipation, touch the setting that hot cavity and cooling tube were for intercommunication each other promptly, the quick homogenization heat of its inside heat conduction medium is and heat every cooling tube, it is inhomogeneous to have avoided local heat dissipation, cause all the other parts high temperature, the potential safety hazard that exists in electronic equipment's the normal operating has been got rid of.

Description

Cavity radiator with direct-contact heat source

Technical Field

The utility model relates to a radiator equipment field especially relates to a cavity radiator with directly touch heat source.

Background

A heat sink is a device that quickly dissipates heat from a heat source. According to the basic physical common knowledge, because the superconducting material used in the normal environment is not found, when the electronic equipment or the equipment related to electricity is used, more or less heat is generated due to the existence of the resistor, the heat is accumulated in the equipment, the temperature of the working environment of the electronic equipment is increased after the heat is accumulated for a long time, and the temperature is increased to influence the electronic equipment to exceed the optimal temperature range for the operation of the electronic equipment, so that the performance is reduced.

For example, in the computer industry, particularly desktop computers, in the CPU/GPU part, because the high-speed operation of the computer raises the temperature of the CPU/GPU part, it is necessary to perform rapid cooling and heat dissipation on the CPU/GPU, although there are cooling and heat dissipation devices in the existing devices, these devices are mainly implemented in two ways, the first is air cooling, and air circulation is performed by a fan, so as to achieve the heat dissipation effect, and this heat dissipation way is simple and crude, and has extremely low heat dissipation efficiency, and is also affected by the outside air, for example, when the computer is hotter, this air cooling way is difficult to meet the requirements; second, refer to CN103629851A, which is an air-cooling and liquid-cooling dual-purpose radiator, mainly using heat pipes and internal cooling liquid to dissipate heat, but in this design, the heat pipes are independent, and the heat pipe located in the middle will quickly reach the maximum degree of heat dissipation, while the heat pipes on both sides may reach the heat dissipation effect after being continuously used, and the heat conduction components of the conventional heat dissipation device are more, which causes a large accumulation of thermal resistance, and the heat dissipation medium cannot contact the heat source at the nearest distance, thereby affecting the heat conduction efficiency; furthermore, the volume of the heat-conducting liquid in the conventional heat pipe is limited, so that the heat-conducting capacity is limited. The heat pipes of the conventional radiator are generally arranged to penetrate through two side surfaces, so that the number of the heat pipes is small, and the integral heat dissipation capacity is limited.

Therefore, the inventor of the present invention aims to provide a cavity heat sink with a direct-contact heat source, aiming at solving the problem of low heat dissipation efficiency of the existing heat dissipation device.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above disadvantages, an object of the present invention is to provide a cavity heat sink with a direct-contact heat source.

In order to achieve the above purpose, the utility model discloses a technical scheme is: the utility model provides a cavity radiator with directly touch heat source, is including touching hot cavity, touch and connect the cooling tube on the hot cavity, just touch hot cavity and cooling tube intercommunication, be in simultaneously touch set up the heat dissipation medium in the hot cavity, just the heat dissipation medium carries out reciprocating flow between touching hot cavity and cooling tube, just touch at least one side and the heat source contact of hot cavity.

Preferably, the heat dissipation medium is a heat conduction liquid. When the heat source generates heat promptly, with heat transfer to touching hot cavity inside, touch the inside radiating medium of hot cavity (low boiling point heat-conducting liquid or coolant liquid or the radiating material of other liquid or solid class) and absorb the heat, radiating medium is because of the gasification of thermal expansion and pressure differential effect, take the heat to the cold junction by the hot junction along the radiating pipe inside and conduct heat, again by the fin surface with the cooling tube contact, give off the heat in the air, the radiating medium after the cooling back gets back to again after cooling and touches hot cavity and absorb heat, so reciprocal, the efficient heat dissipation has been realized. Specifically, when the CPU/GPU is cooled, one side face of the heat contact cavity is in contact with the CPU/GPU, when the CPU/GPU generates heat, the heat is transferred to a heat dissipation medium through the side wall of the heat contact cavity, the heat dissipation medium dissipates the heat through temperature rise and temperature reduction and even physical state change, namely, the ideal state is that the heat dissipation medium is a liquid substance with a low boiling point, when absorbing heat, the heat dissipation medium evaporates and becomes a gaseous state, flows along the heat dissipation pipe, heat dissipation occurs at the heat dissipation pipe part, the temperature of the gaseous heat dissipation medium is reduced and then becomes a liquid state, and the gaseous heat dissipation medium flows into the heat contact cavity, so that a heat dissipation cycle is realized, and the operation is repeated, and the high-efficiency heat dissipation is realized.

Preferably, the radiating pipe is provided in plurality, and a plurality of radiating pipes all extend to one side of the heat contact cavity body far away from the heat source. And referring to the attached drawings, the plurality of radiating pipes are arranged in parallel or at any angle according to the design, so that the limitation of the arrangement quantity of the traditional heat pipe air-cooled radiator caused by the fact that the arrangement of the heat pipes independently needs to penetrate through the two sides of the heat conducting plate is avoided. And each radiating pipe is communicated with the heat contact cavity, when the radiating medium absorbs heat energy and flows along the radiating pipe, the heat is radiated by the surface of the radiating fin contacted with the radiating pipe, the surface area of the radiating pipe increases the radiating speed, the temperature of the radiating medium is reduced, the radiating medium returns to the heat contact cavity, and the heat absorption in the heat contact cavity is realized again, namely the heat source is radiated in a reciprocating way.

Preferably, a plurality of radiating fins are further arranged outside the radiating pipe, and the radiating fins are sleeved on the radiating pipe. The arrangement of the radiating fins is shown in the attached drawings, the radiating fins are arranged in parallel, and the arrangement of the radiating fins can quickly radiate heat by utilizing the characteristic of large surface area of the radiating fins, so that the temperature of a radiating medium is reduced.

Preferably, the radiator further comprises an air cooling assembly, and the air cooling assembly can blow air to the radiating pipe and the radiating fin surface.

Preferably, the air cooling assembly comprises at least one fan, and the fan can blow air to the surfaces of the heat sink and the heat dissipation pipe. The arrangement of the fan is an example of the air cooling assembly, and in fact, the equipment capable of forming wind can be the air cooling assembly, mainly forms air into wind, and blows to the surfaces of the radiating pipe and the radiating fins to accelerate the heat dissipation, even referring to the attached drawings, two fans are arranged and symmetrically arranged at the two sides of the radiating fins, namely the symmetrically arranged fans can ensure that the amount of wind blowing to the surfaces of the radiating pipe and the radiating fin is uniform, if only one is arranged, the wind blows from one side, and when the wind blows from the other side, the wind carries heat and becomes hot wind, therefore, two fans are arranged, so that the air cooling of two sides can be timely and effective, the heat dissipation of a heat dissipation medium is further accelerated, the number and the performance of the fans can be matched with the requirement of the overall heat dissipation efficiency, the direction of an air duct formed by the air cooling assembly is not limited, and the heat dissipation purpose can be achieved by matching the fans with heat dissipation fins in the transverse direction, the vertical direction or the circumferential direction.

The utility model relates to a cavity radiator with directly touch heat source's beneficial effect is, through touching hot cavity and setting up the heat dissipation medium in touching hot cavity, when the heat source generates heat, touch hot cavity in time with heat transfer to heat dissipation medium, and take place to flow by heat dissipation medium and dispel the heat, so reciprocal, reach the efficient heat dissipation, touch hot cavity promptly and cooling tube setting for mutual intercommunication, it is inhomogeneous to have avoided local heat dissipation, cause all the other parts high temperature, the potential safety hazard that exists in electronic equipment's the normal operating has been got rid of.

Drawings

Fig. 1 is a schematic structural view of a cavity heat sink with a direct-contact heat source.

Fig. 2 is a schematic longitudinal sectional view of fig. 1.

FIG. 3 is a schematic view of a thermal contact chamber.

FIG. 4 is a schematic view of the heat-contacting chamber and the heat pipe.

In the figure:

1-heat contact cavity, 2-radiating pipe, 3-air cooling component, 4-fan and 5-radiating fin.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

Referring to fig. 1-4, the cavity heat sink with a direct contact heat source in the present embodiment includes a contact heat cavity 1, a heat dissipation pipe 2 connected to the contact heat cavity 1, the contact heat cavity 1 communicating with the heat dissipation pipe 2, a heat dissipation medium disposed in the contact heat cavity 1 and reciprocating between the contact heat cavity 1 and the heat dissipation pipe 2, and at least one side of the contact heat cavity 1 contacting with the heat source, referring to the drawings, the side of the bottom contacting with the heat source.

The heat dissipation medium is heat conduction liquid. When the heat source generates heat promptly, with heat transfer to touch hot cavity 1 inside, touch the inside radiating medium (heat-conducting liquid or coolant liquid or the radiating material of other liquid or solid class) of hot cavity 1 and absorb the heat to move along radiating tube 2, radiating tube 2's surface area is very big, gives off the heat in the air, and the radiating medium after the cooling off gets back to again and touches hot cavity 1 and absorb heat, so reciprocal, has realized the efficient heat dissipation. Specifically, when the CPU/GPU is cooled, one side face of the heat contact cavity 1 is in contact with the CPU/GPU, when the CPU/GPU generates heat, the heat is transferred to a heat dissipation medium through the side wall of the heat contact cavity 1, the heat dissipation medium dissipates the heat through temperature rise and temperature reduction and even physical state change, namely, the ideal state is that the heat dissipation medium is a liquid substance with a low boiling point, when absorbing the heat, the heat dissipation medium evaporates and becomes a gaseous state and flows along the heat dissipation pipe 2, heat dissipation occurs at the heat dissipation pipe 2 part, the temperature of the gaseous heat dissipation medium is reduced and then becomes a liquid state and flows into the heat contact cavity 1, a heat dissipation cycle is realized, the reciprocating is realized, and the efficient heat dissipation is realized.

The heat dissipation pipe 2 is provided with a plurality of heat dissipation pipes 2, and the heat dissipation pipes 2 all extend to one side of the heat contact cavity 1 far away from the heat source. A plurality of cooling tubes 2 are parallel arrangement, and every cooling tube 2 all with touch hot cavity 1 intercommunication, absorb heat energy as the heat dissipation medium, and flow along cooling tube 2, give off the heat by 5 surfaces of fin with the contact of cooling tube 2 again, the radiating speed has been increased to the surface area of cooling tube 2, the reduction of heat dissipation medium temperature has been realized, the heat dissipation medium returns and touches hot cavity 1, realize once more touching the heat absorption of hot cavity 1, realize reciprocating heat dissipation promptly to the heat source.

Moreover, the heat dissipation pipes 2 can be arranged according to the requirement without affecting the contact with the heat source, and the heat dissipation pipes 5 are used for heat dissipation in the following process, so the extension direction of the heat dissipation pipes 2 needs to be far away from the heat source, and of course, the extension direction can be vertical to the plane of the heat contact cavity 1, horizontal or other directions as shown in the attached drawings, and the adjustment can be carried out according to the consideration of space or cost during actual use.

A plurality of radiating fins 5 are further arranged outside the radiating pipe 2, and the radiating fins 5 are sleeved on the radiating pipe 2. The arrangement of the radiating fins 5 is shown in the attached drawings, a plurality of radiating fins 5 are arranged in parallel, and the arrangement principle of the radiating fins 5 is that heat is quickly radiated by utilizing the characteristic of large surface area of the radiating fins 5, so that the temperature of a radiating medium is reduced; on the basis of following the principle, the shape, size or number of the radiating fins can be adjusted by a user according to actual conditions.

The radiator also comprises an air cooling assembly 3, and the air cooling assembly 3 can blow air to the surfaces of the radiating pipe 2 and the radiating fins 5.

The air cooling assembly 3 includes at least one fan 4, and the fan 4 is capable of blowing air to the heat sink 5 and the surface of the heat pipe 2. The arrangement of the fan 4 is an example of the air-cooling assembly 3, and in fact, the wind-forming device can be the air-cooling assembly 3, mainly forms air into wind, and blows to the surfaces of the radiating pipe 2 and the radiating fins 5 to accelerate the heat dissipation, and referring to the attached drawings, two fans 4 are arranged and symmetrically arranged at the two sides of the radiating fins 5, that is, the symmetrically arranged fans 4 can ensure that the amount of wind blown to the surfaces of the radiating pipe 2 and the radiating fin 5 is uniform, if only one is arranged, the wind blows from one side, and when the wind blows from the other side, the wind carries heat and becomes hot wind, therefore, two fans 4 are arranged, so that the air cooling of two sides can be ensured to be timely and effective, the heat dissipation of a heat dissipation medium is further accelerated, the number and the performance of the fans can be matched with the requirement of the overall heat dissipation efficiency, the direction of an air duct formed by the air cooling assembly is not limited, and the heat dissipation purpose can be achieved by matching the fans with heat dissipation fins in the transverse direction, the vertical direction or the circumferential direction.

Referring to the attached drawing 2, the inside of the heat contact cavity 1 is a cavity, referring to the side in the attached drawing 4, the side is in contact with a heat source, when the heat is in contact, the heat is transferred to a heat dissipation medium in the heat contact cavity 1 through the side, if the heat generation amount of the heat source is large, the side in the attached drawing 4 is difficult to meet the large requirement, so that a vertical inner wall plate can be arranged inside the heat contact cavity 1, a plurality of inner wall plates are arranged in parallel, a plurality of water channels are formed inside the heat contact cavity 1, the contact area is increased, and the heat absorption speed is increased.

The utility model provides a cavity radiator with directly touch heat source, through touching hot cavity 1 and setting up the heat dissipation medium in touching hot cavity 1, when the heat source generates heat, touch hot cavity 1 in time with heat transfer to heat dissipation medium, and take place to flow by heat dissipation medium and dispel the heat, so reciprocal, reach the efficient heat dissipation, touch hot cavity 1 promptly and the setting of cooling tube 2 for intercommunication each other, it is inhomogeneous to have avoided the local heat dissipation, cause all the other parts high temperature, the potential safety hazard that exists in electronic equipment's the normal operating has been got rid of.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. The utility model provides a cavity radiator with directly touch heat source which characterized in that: including touching hot cavity, touch and connect the cooling tube on the hot cavity, just touch hot cavity and cooling tube intercommunication, be in simultaneously touch and set up the heat dissipation medium in the hot cavity, just the heat dissipation medium carries out reciprocating motion between touching hot cavity and cooling tube, just touch at least one side and the heat source contact of hot cavity.

2. The cavity heat sink with direct-contact heat source of claim 1, wherein: the heat dissipation medium is heat conduction liquid.

3. The cavity heat sink with direct-contact heat source of claim 1, wherein: the cooling tube sets up a plurality ofly, and is a plurality of the cooling tube all extends to and touches one side that the hot cavity body is kept away from the heat source.

4. The cavity heat sink with direct contact heat source of claim 3, wherein: a plurality of radiating fins are further arranged outside the radiating tubes and are arranged on the radiating tubes.

5. The cavity heat sink with direct-contact heat source of claim 4, wherein: the air cooling component can blow air to the surfaces of the radiating pipe and the radiating fins.

6. The cavity heat sink with direct-contact heat source of claim 5, wherein: the air cooling assembly comprises at least one fan, and the fan can blow air to the surfaces of the radiating fins and the radiating pipes.