CN210155613U

CN210155613U - Funnel type liquid cooling server

Info

Publication number: CN210155613U
Application number: CN201920882310.9U
Authority: CN
Inventors: 祝长宇
Original assignee: Beijing Deneng Hengxin Technology Co Ltd
Current assignee: Beijing Deneng Hengxin Technology Co Ltd
Priority date: 2019-06-13
Filing date: 2019-06-13
Publication date: 2020-03-17
Anticipated expiration: 2029-06-13

Abstract

The utility model discloses a funnel type liquid cooling server, which comprises a shell, a mainboard, a power supply, a hard disk, an overflow pipe, a clapboard, a connecting flexible wire and an I/O port; the shell comprises a panel, a cover plate and a back plate, and cooling liquid can be contained in the shell; the panel is provided with an I/O port; the main board is fixed on one side of the back board, and elements such as a CPU, a CPU radiating fin, a memory bank, a chip set and the like are arranged on the main board; the clapboard is fixed on the back plate; one end of the connecting flexible wire is electrically connected with the main board, and the other end of the connecting flexible wire is connected with the power supply and the hard disk connecting port; the overflow pipe is arranged in the main plate area. The funnel type liquid cooling server adopts a direct cooling mode, cooling liquid is in direct contact with a cooling object, a server power supply, a hard disk area and a main board area are separated by partition plates, and different cooling modes are adopted, so that the heat dissipation efficiency is improved, and the energy consumption is reduced; the server power supply and the hard disk are electrically connected with the main board through the connecting flexible wires, so that the convenience of maintenance operation is improved.

Description

Funnel type liquid cooling server

Technical Field

The utility model relates to a computer technology field, specific theory relates to a liquid cooling server.

Background

With the advent of the internet of things, big data and cloud computing era, the amount of data created by people is increasing day by day, a large amount of data storage and computation are required to be completed by a server, the server density of a data center is increasing, larger energy sources need to be consumed, and more heat is generated. Currently, many data center servers are cooled by air, i.e., air, to dissipate heat. As server density has increased, air cooling has not been able to meet the heat dissipation requirements of high density servers. Therefore, the liquid cooling technology is adopted for heat dissipation, and the excellent cooling scheme for realizing high-efficiency heat dissipation of the server and reducing energy consumption of the data center is formed.

The liquid cooling server takes liquid as a cooling medium to take away heat generated by the server during operation, so that the heat dissipation of the server is realized. According to the system mode, the liquid cooling server can be divided into two main categories, namely an indirect cooling type and a direct cooling type. The direct cooling type liquid cooling server immerses the CPU, the memory bank, the hard disk, the power supply, the chip set and other elements with large heat productivity into the cooling liquid, and the cooling liquid is in direct contact with the heating elements, so that the heat resistance in the heat transfer process is reduced, and the cooling efficiency is higher.

At present, different elements of a direct cooling type liquid cooling server adopt the same cooling liquid flow in the cooling process, and the difference of heat dissipation requirements of different elements is not considered in the cooling mode, so that a funnel type control mode is adopted for the cooling liquid flow, and the problem that the heat dissipation requirements of different elements are different is solved.

Disclosure of Invention

A primary object of the present invention is to provide a funnel-type liquid cooling server, which can effectively solve the problems of poor heat dissipation efficiency and different heat dissipation requirements of different components of the existing liquid cooling server.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a funnel type liquid cooling server comprises a shell, a main board, a power supply, a hard disk, an overflow pipe, a partition board, a connecting flexible wire and an I/O port; the shell comprises a panel, a cover plate and a back plate, and cooling liquid can be contained in the shell; the panel is provided with an I/O port; the main board is fixed on one side of the back board, and elements such as a CPU, a CPU radiating fin, a memory bank, a chip set and the like are arranged on the main board; the clapboard is fixed on the back plate; one end of the connecting flexible wire is electrically connected with the main board, and the other end of the connecting flexible wire is connected with the power supply and the hard disk connecting port; the overflow pipe is arranged in the main plate area.

Further, the housing comprises a face plate, a cover plate and a back plate, and the cooling liquid can be contained in the housing.

Furthermore, an I/O port is arranged on the panel.

Furthermore, the main board is fixed on one side of the back board, and the main board is provided with elements such as a CPU, a CPU cooling fin, a memory bank, a chip set and the like.

Further, the arrangement direction of the CPU heat sinks may be the same as the arrangement direction of the memory banks, and preferably, may be perpendicular to the arrangement direction of the memory banks.

Furthermore, the cover plate comprises an upper cover plate and a lower cover plate, the upper cover plate is provided with a diversion trench corresponding to the power supply and the hard disk side, and the corresponding main plate side is open; the lower cover plate is open corresponding to the power supply and the hard disk, and a diversion trench is arranged corresponding to the main plate.

Furthermore, the partition board is fixed on the panel to divide the power supply, the hard disk and the mainboard into two areas.

Furthermore, the partition board may be provided with a connection port for connecting a cord, and may also be provided with a slot for connecting a cord.

Furthermore, one end of the connecting flexible wire can be electrically connected with the main board through a connecting port on the partition plate or can be directly electrically connected with the main board and is led out through a wire slot on the partition plate, and the other end of the connecting flexible wire is connected with a power supply and a hard disk connecting port.

Furthermore, the mainboard area is provided with an overflow pipe for controlling the liquid level height of the cooling liquid.

Furthermore, the cooling liquid is nonvolatile, nontoxic, harmless, noncorrosive and nonconductive.

The utility model discloses following beneficial effect has: the funnel type liquid cooling server adopts a direct cooling mode, cooling liquid is in direct contact with a cooling object, a server power supply, a hard disk area and a main board area are separated by partition plates, and different cooling modes are adopted, so that the heat dissipation efficiency is improved, and the energy consumption is reduced; the server power supply and the hard disk are electrically connected with the main board through the connecting flexible wires, so that the convenience of maintenance operation is improved.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of a funnel type liquid cooling server.

Fig. 2 is a schematic structural diagram of a section of a funnel type liquid cooling server.

Fig. 3 is another schematic structural diagram of a cross section of a funnel-type liquid-cooling server.

In the figure: the device comprises a shell (1), a partition plate (2), a cover plate (3), a flow guide groove (4), a CPU (central processing unit) cooling fin (5), a memory bank (6), a connecting flexible wire (7), an overflow pipe (8), a power supply (9), a hard disk (10) and cooling liquid (11) (not shown in the figure).

Detailed Description

As shown in fig. 1 and fig. 2, the utility model provides a funnel type liquid cooling server, which comprises a shell 1, a main board, a power supply 9, a hard disk 10, an overflow pipe 8, a baffle plate 2, a connecting flexible wire 7 and an I/O port; the shell 1 comprises a panel, a cover plate 3 and a back plate, and cooling liquid 11 can be contained in the shell 1; the panel is provided with an I/O port; the mainboard is fixed on one side of the backboard, and is provided with elements such as a CPU, a CPU heat sink 5, a memory bank 6, a chip set and the like; the clapboard 2 is fixed on the back plate; one end of the connecting flexible wire 7 is electrically connected with the main board, and the other end of the connecting flexible wire is connected with the connecting ports of the power supply 9 and the hard disk 10; the overflow pipe 8 is arranged in the main plate area.

The shell 1 comprises a face plate, a cover plate 3 and a back plate, and cooling liquid 11 can be contained in the shell 1. The power supply 9 and the hard disk 10 are arranged on one side of the back plate, the main plate is fixed on the other side of the back plate, and the partition plate 2 is fixed on the panel to divide the power supply 9, the hard disk 10 and the main plate into a falling film cooling area and an immersion cooling area. The cover plate 3 comprises an upper cover plate and a lower cover plate, the upper cover plate is provided with a diversion trench 4 corresponding to the power supply 9 and the hard disk 10, and the corresponding main plate side is open; the lower cover plate is open corresponding to the power supply 9 and the hard disk 10, and a diversion trench 4 is arranged corresponding to the main plate.

When the server operates, the cooling liquid 11 is sprayed onto the server by the spraying device. In the falling film cooling area, the cooling liquid 11 flows into the server through the diversion trench 4 under the action of gravity, directly flows out of the server from the lower side after exchanging heat with the power supply 9 and the hard disk 10, and the cooling liquid 11 flows in the falling film cooling area in a funnel type with a slow flow rate and a fast flow rate. When the cooling liquid 11 flows through the power supply 9 and the hard disk 10, a liquid film is formed on the surfaces of the power supply 9 and the hard disk 10, and the power supply 9 and the hard disk 10 are cooled down in a falling film manner. In the immersion cooling area, the cooling liquid 11 directly flows into the server from the upper side under the action of gravity, and after heat exchange with the main board, the cooling liquid flows out of the server through the diversion trench 4, the cooling liquid 11 flows in a funnel type with a fast flow rate and a slow flow rate in the immersion cooling area, and the main board is immersed or partially immersed in the cooling liquid 11. Set up control liquid level's overflow pipe 8 in mainboard district, when liquid level reached or was higher than 8 top height of overflow pipe, coolant liquid 11 directly flowed out the server through overflow pipe 8, made the liquid level control of coolant liquid 11 in mainboard district set up the height.

The mainboard is fixed on one side of the backboard, and is provided with elements such as a CPU, a CPU heat sink 5, a memory bank 6, a chip set and the like. As shown in fig. 2, the CPU heat sinks 5 may be arranged in the same direction as the memory banks 6. Preferably, as shown in fig. 3, the CPU fins 5 may be arranged in a direction perpendicular to the direction in which the memory banks 6 are arranged, and the flow channel direction of the CPU fins 5 is made the same as the flow direction of the coolant 11, thereby reducing the flow resistance of the coolant 11 and improving the heat exchange efficiency.

The partition plate 2 can be provided with a connecting port for connecting the flexible wire 7 and a wire slot for connecting the flexible wire 7, one end of the connecting flexible wire 7 can be electrically connected with the main board through the connecting port on the partition plate 2 and can also be directly electrically connected with the main board and led out through the wire slot on the partition plate 2, and the other end of the connecting flexible wire is connected with connecting ports of the power supply 9 and the hard disk 10, so that the power supply 9 and the hard disk 10 can keep working states when being pulled out, and the convenience of server maintenance operation is improved.

The panel is provided with an I/O port, and the server can be connected with external equipment through the I/O port.

The cooling liquid 11 is a nonvolatile, nontoxic, harmless, noncorrosive, nonconductive liquid, such as silicone oil.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A funnel type liquid cooling server is characterized by comprising a shell, a main board, a power supply, a hard disk, an overflow pipe, a partition board, a connecting flexible wire and an I/O port; the shell comprises a panel, a cover plate and a back plate, and cooling liquid can be contained in the shell; the panel is provided with an I/O port; the main board is fixed on one side of the back board, and elements such as a CPU, a CPU radiating fin, a memory bank, a chip set and the like are arranged on the main board; the clapboard is fixed on the back plate; one end of the connecting flexible wire is electrically connected with the main board, and the other end of the connecting flexible wire is connected with the power supply and the hard disk connecting port; the overflow pipe is arranged in the main plate area.

2. The funnel-type liquid cooling server as claimed in claim 1, wherein the housing comprises a front plate, a cover plate and a back plate, and the cooling liquid can be contained in the housing.

3. The funnel-type liquid cooling server as claimed in claim 1, wherein the panel is provided with an I/O port.

4. The funnel-type liquid cooling server as claimed in claim 1, wherein the main board is fixed on one side of the back plate, and the main board is provided with components such as a CPU, a CPU heat sink, a memory bank, and a chipset.

5. The funnel-type liquid cooling server as claimed in claim 4, wherein the CPU heat sink is arranged in the same direction as the memory bank or perpendicular to the memory bank.

6. The funnel type liquid cooling server according to claim 1, wherein the cover plate comprises an upper cover plate and a lower cover plate, the upper cover plate is provided with a diversion trench corresponding to the power supply and the hard disk side, and the side corresponding to the main plate is open; the lower cover plate is open corresponding to the power supply and the hard disk, and a diversion trench is arranged corresponding to the main plate.

7. The funnel-type liquid cooling server as claimed in claim 1, wherein the partition is fixed to the panel to separate the power supply, the hard disk and the main board into two regions.

8. The funnel type liquid cooling server as claimed in claim 7, wherein the partition board is provided with a connection port for connecting a flexible wire, or a wire slot for connecting a flexible wire.

9. The funnel type liquid cooling server as claimed in claim 1, wherein one end of the connection cord is electrically connected to the main board through a connection port on the partition board, or is directly electrically connected to the main board, and is led out through a wire slot on the partition board, and the other end of the connection cord is connected to a power supply and a hard disk connection port.

10. The funnel-type liquid cooling server as claimed in claim 1, wherein the main board area is provided with an overflow pipe for controlling the height of the liquid level of the cooling liquid.

11. The funnel-type liquid-cooled server as recited in claim 1, wherein the cooling liquid is a non-volatile, non-toxic, non-hazardous, non-corrosive, non-electrically conductive liquid.