CN204216024U

CN204216024U - Wafer Radiator

Info

Publication number: CN204216024U
Application number: CN201420311580.1U
Authority: CN
Inventors: 何思达
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-06-12
Filing date: 2014-06-12
Publication date: 2015-03-18
Anticipated expiration: 2024-06-12

Abstract

The utility model discloses a kind of wafer Radiator, comprise a circuit board, a semiconductor wafer and a heat dissipation element; Circuit board has the fixing hole of more than two; Semiconductor wafer to be configured on circuit board and to be connected with circuit board; Heat dissipation element is configured on semiconductor wafer, and the surface that heat dissipation element contacts with semiconductor wafer is a flat surfaces; Heat dissipation element comprises upper casing and lower casing, and upper casing and lower casing surround an enclosed cavity, the working fluid being provided with capillary layer, enhanced water evaporation layer in enclosed cavity and being filled in enclosed cavity; Capillary layer is connected on lower casing, and enhanced water evaporation layer is fixed on lower casing by capillary layer, and upper casing upper surface is provided with multiple thermal column.Effectively can improve the heat dispersion of semiconductor wafer electronic product.

Description

Wafer Radiator

Technical field

A kind of heat abstractor of the utility model, is specifically related to a kind of wafer Radiator.

Background technology

Along with the progress and development of computer technology, information semiconductor industry wafer constantly towards at a high speed and high frequency stride forward, the processing speed of the electronic installation such as such as central processing unit is at a tremendous pace especially in recent years, however incident under high speed processing be high temperature.Under considering the condition of cost and heat radiation at the same time, and how the effective high temperature produced by electronic installation thermal source is discharged, and electronic installation can be operated under suitable working temperature and just become the task of top priority.

The heat dissipation problem of current electronic device has following feature:

1, local heat flux density is increasing, and heat is easily locally focusing on, and causes local temperature too high;

2, heat flux distribution is uneven, and high heat flux is mostly just confined in very little spatial dimension;

3, in electronic equipment start-up course, easily occur that instantaneous power " rises violently ", burn out electronic equipment.

So the key solving Electronic cooling how to be derived by heat fast, reduce local temperature too high, prevent focus and cause equipment fault.In order to prevent the inner traditional means producing focus due to heat accumulation of electronic chip, being the solid fine copper plate or the aluminium block that attach tool high thermal conductivity coefficient at chip surface, the heat that electronic chip inside produces is drawn out on radiator in thermo-conducting manner.Solid fine copper plate soaking device can play to a certain extent and make heat flux distribution even, eliminates the effect of focus.But because the conductive coefficient of copper is limited, cannot meet the demands in many occasions.The price spikes of copper in recent years, these problems illustrate that traditional cooling system must in performance, and efficiency, the aspects such as cost are improved.

Utility model content

The purpose of this utility model is to provide a kind of wafer Radiator, effectively can improve the heat dispersion of semiconductor wafer electronic product.

For achieving the above object, technical solution adopted in the utility model is:

Comprise a circuit board, a semiconductor wafer and a heat dissipation element; Circuit board has the fixing hole of more than two; Semiconductor wafer to be configured on circuit board and to be connected with circuit board; Heat dissipation element is configured on semiconductor wafer, and the surface that heat dissipation element contacts with semiconductor wafer is a flat surfaces; Heat dissipation element comprises upper casing and lower casing, and upper casing and lower casing surround an enclosed cavity, the working fluid being provided with capillary layer, enhanced water evaporation layer in enclosed cavity and being filled in enclosed cavity; Capillary layer is connected on lower casing, and enhanced water evaporation layer is fixed on lower casing by capillary layer, and upper casing upper surface is provided with multiple thermal column.

Preferably, this device is also provided with two fixtures, and heat dissipation element has two through holes; Fixture is a buckle bolt, and two ends of buckle bolt all include grab, and this buckle bolt configures through through hole and fixing hole, and two grabs are locked to heat dissipation element and circuit board respectively.

The beneficial effect that this wafer Radiator produces is:

1, be capillary and the enhanced water evaporation function utilizing foam copper, the heat needing the chip of heat radiation or other component to be heated work to produce will conduct on lower casing, the heat of lower casing imports to enhanced water evaporation layer, working fluid absorbs a large amount of heat at enhanced water evaporation layer and becomes steam, and heat is released when the condensation of heat dissipation element side by steam.Heat is directly passed to heat dissipation element fast, and heat sheds by heat dissipation element, reaches the object of high efficiency and heat radiation.The working fluid of condensation is transmitted back to enhanced water evaporation layer by capillary layer and heat absorption evaporation forms duty cycle again.This process is carried out with high-speed circulating, thus is distributed at a high speed by heat.

2, utilize fixture by fixing between heat dissipation element and this circuit substrate, but not stick together fixing with such as viscose material.Heat dissipation element does not need to use adhesive tape or adhesive agent, thus cause due to the relation of wafer heating under not needing to worry Long-Time Service that adhesive agent is rotten, cull problem or other not expected problems after dismounting.

Accompanying drawing explanation

Fig. 1 is the schematic diagram of an embodiment of a kind of wafer Radiator of the present utility model.

Fig. 2 is the cross-sectional schematic of heat dissipation element of the present utility model.

Embodiment

For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with the utility model specific embodiment and corresponding accompanying drawing, technical solutions of the utility model are clearly and completely described.

With reference to figure 1, Fig. 2, Fig. 1, Figure 2 shows that the structural representation of an embodiment of a kind of wafer Radiator of the present utility model.In the present embodiment, wafer Radiator comprises a circuit board 1, semiconductor wafer 2 and a heat dissipation element 3; Circuit board has the fixing hole 4 of more than two; Semiconductor wafer 2 to be configured on circuit board 1 and to be connected with circuit board 1; Heat dissipation element 3 is configured on semiconductor wafer 2, and the surface that heat dissipation element 3 contacts with semiconductor wafer 2 is a flat surfaces; Heat dissipation element 3 comprises upper casing 10 and lower casing 11, and upper casing 10 and lower casing 11 surround an enclosed cavity 7, is provided with capillary layer 8, enhanced water evaporation layer 9 and is filled in the working fluid of in enclosed cavity 7 in enclosed cavity 7; Capillary layer 8 is connected on lower casing 11, and enhanced water evaporation layer 9 is by capillary layer solid 8 on lower casing 11, and upper casing 10 upper surface is provided with multiple thermal column 6.

With reference to figure 1, in an embodiment of the present utility model, this device is also provided with two fixtures 12, and heat dissipation element has two through holes 5; Fixture 12 is buckle bolts, and two ends of buckle bolt all include grab, and this buckle bolt configures through through hole 5 and fixing hole 4, and two grabs are locked to heat dissipation element 3 and circuit board 1 respectively.

Above-mentioned execution mode is used for explaining and the utility model is described; instead of the utility model is limited; in the protection range of spirit of the present utility model and claim, any amendment make the utility model and change, all fall into protection range of the present utility model.

Claims

1. a wafer Radiator, is characterized in that: comprise a circuit board, a semiconductor wafer and a heat dissipation element; Described circuit board has the fixing hole of more than two; Described semiconductor wafer to be configured on circuit board and to be connected with circuit board; Described heat dissipation element is configured on semiconductor wafer, and the surface that heat dissipation element contacts with semiconductor wafer is a flat surfaces; Described heat dissipation element comprises upper casing and lower casing, and described upper casing and lower casing surround an enclosed cavity, the working fluid being provided with capillary layer, enhanced water evaporation layer in described enclosed cavity and being filled in enclosed cavity; Described capillary layer is connected on lower casing, and described enhanced water evaporation layer is fixed on lower casing by capillary layer, and described upper casing upper surface is provided with multiple thermal column.

2. wafer Radiator according to claim 1, is characterized in that: this device is also provided with two fixtures, and described heat dissipation element has two through holes; Described fixture is a buckle bolt, and two ends of buckle bolt all include grab, and this buckle bolt configures through through hole and fixing hole, and two grabs are locked to described heat dissipation element and described circuit board respectively.