CN204706553U - A kind of non-homogeneous microchannel heat radiating fin structure - Google Patents
A kind of non-homogeneous microchannel heat radiating fin structure Download PDFInfo
- Publication number
- CN204706553U CN204706553U CN201520448548.2U CN201520448548U CN204706553U CN 204706553 U CN204706553 U CN 204706553U CN 201520448548 U CN201520448548 U CN 201520448548U CN 204706553 U CN204706553 U CN 204706553U
- Authority
- CN
- China
- Prior art keywords
- microchannel
- homogeneous
- fin
- heat radiating
- heating panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a kind of radiator, especially relates to a kind of non-homogeneous microchannel heat radiating fin structure.A kind of non-homogeneous microchannel heat radiating fin structure, comprise microchannel, heating panel and fin, it is characterized in that: microchannel is positioned at heating panel inside, along direction, microchannel, fin is vertically arranged in heating panel surface, and described radiation fin array is in heating panel surface non-uniform Distribution.The utility model beneficial effect: non-homogeneous microchannel heat radiating fin structure improves radiating efficiency effectively, saves fin quantity, reduces material cost.
Description
Technical field
The utility model relates to a kind of radiator, especially relates to a kind of non-homogeneous microchannel heat radiating fin structure.
Background technology
Along with the continuous growth of microelectronic circuit integration density, the power and thermal of chip is increasing, and this just requires more effective heat dissipation technology.In numerous heat dissipation technologys, microchannel heat radiation is the cooling integrated important development direction of high power.Microchannel heat radiating fin structure general at present, is dispersed in heating panel surface.Reduce gradually along direction, microchannel heat, homodisperse fin radiating effect is restricted.Optimize heat radiating fin structure, improve the research direction that radiating efficiency is the art.
Utility model content
The utility model, in order to improve the radiating efficiency of microchannel fin, designs a kind of non-homogeneous microchannel heat radiating fin structure.
A kind of non-homogeneous microchannel heat radiating fin structure, comprise microchannel, heating panel and fin, it is characterized in that: microchannel is positioned at heating panel inside, along direction, microchannel, fin is vertically arranged in heating panel surface, and described radiation fin array is in heating panel surface non-uniform Distribution.
Along direction, microchannel, radiation fin array density reduces.
Through the experimental verification of ANSYS theoretical modeling, under identical condition of work, non-homogeneous radiation fin array radiating effect is better than evenly distributed radiation fin array.
The utility model beneficial effect: non-homogeneous microchannel heat radiating fin structure improves radiating efficiency effectively, saves fin quantity, reduces material cost.
Accompanying drawing explanation
Fig. 1 is the utility model structure chart
Embodiment
As shown in Figure 1, it is inner that microchannel 1 is positioned at heating panel 2, and along direction, microchannel 1, fin 3 is vertically arranged in heating panel 2 surface, and described fin 3 array is in the surperficial non-uniform Distribution of heating panel 2.Along direction, microchannel 1, temperature gradient reduces, and fin 3 array density reduces.
Claims (2)
1. a non-homogeneous microchannel heat radiating fin structure, comprise microchannel (1), heating panel (2) and fin (3), it is characterized in that: it is inner that microchannel (1) is positioned at heating panel (2), along microchannel (1) direction, fin (3) is vertically arranged in heating panel (2) surface, and described fin (3) array is in heating panel (2) surperficial non-uniform Distribution.
2. a kind of non-homogeneous microchannel heat radiating fin structure according to claim 1, is characterized in that: along microchannel (1) direction, and fin (3) array density reduces.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520448548.2U CN204706553U (en) | 2015-06-23 | 2015-06-23 | A kind of non-homogeneous microchannel heat radiating fin structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520448548.2U CN204706553U (en) | 2015-06-23 | 2015-06-23 | A kind of non-homogeneous microchannel heat radiating fin structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204706553U true CN204706553U (en) | 2015-10-14 |
Family
ID=54286152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520448548.2U Expired - Fee Related CN204706553U (en) | 2015-06-23 | 2015-06-23 | A kind of non-homogeneous microchannel heat radiating fin structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204706553U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107285268A (en) * | 2016-04-13 | 2017-10-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | Fluid channel heat radiation chip and preparation method thereof |
-
2015
- 2015-06-23 CN CN201520448548.2U patent/CN204706553U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107285268A (en) * | 2016-04-13 | 2017-10-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | Fluid channel heat radiation chip and preparation method thereof |
CN107285268B (en) * | 2016-04-13 | 2019-08-02 | 中国科学院苏州纳米技术与纳米仿生研究所 | Fluid channel heat radiation chip and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN204360312U (en) | A kind of CPU heat abstractor with Graphene heat dissipating layer | |
CN106879230A (en) | A kind of cooling system of three-dimensional power amplifier | |
CN204360313U (en) | A kind of CPU efficient radiating apparatus | |
CN204706553U (en) | A kind of non-homogeneous microchannel heat radiating fin structure | |
CN205161003U (en) | Efficient radiator | |
CN205158261U (en) | Computer CPU heat dissipation sheet | |
CN204631764U (en) | Adjustable computer cooling cabinet | |
CN201590980U (en) | Radiator | |
CN202151035U (en) | Heat radiator | |
CN203024110U (en) | Composite type light-emitting diode (LED) integrated optical source radiator | |
CN202617578U (en) | Low-temperature soldered electronic radiator | |
CN202205731U (en) | Heat radiating module for IGBT (Insulated Gate Bipolar Transistor) module superconductive heat pipe | |
CN203814114U (en) | Heat dissipator for large-capacity reactive compensation device | |
CN204029791U (en) | A kind of polygon radiator | |
CN204707389U (en) | A kind of flexible heat sink fin | |
CN104812215B (en) | A kind of welding machine radiator | |
CN103796476A (en) | Locomotive power module air-cooling heat-dissipating device | |
CN204707395U (en) | A kind of electronic product components and parts ceramic insulation conducting strip | |
CN204227973U (en) | Heat pipe radiating fin array radiator | |
CN203773456U (en) | Mainboard radiator for sealed computer case | |
CN204560100U (en) | A kind of blade inserting air-cooled heat dissipation structure of high-power industrial power | |
CN203859967U (en) | Heat-radiating fin | |
CN203301923U (en) | High multiple heat dissipation device | |
CN203951724U (en) | A kind of heat abstractor | |
CN204242081U (en) | A kind of passive cpu heat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151014 Termination date: 20160623 |