CN204538010U - There is the liquid cooling chips type radiator of enhanced heat exchange effect - Google Patents
There is the liquid cooling chips type radiator of enhanced heat exchange effect Download PDFInfo
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- CN204538010U CN204538010U CN201520266292.3U CN201520266292U CN204538010U CN 204538010 U CN204538010 U CN 204538010U CN 201520266292 U CN201520266292 U CN 201520266292U CN 204538010 U CN204538010 U CN 204538010U
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- upper cover
- injection chamber
- fluid injection
- pin post
- rectangular array
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Abstract
The utility model discloses a kind of liquid cooling chips type radiator with enhanced heat exchange effect, its technical scheme is: radiator is made up of two-layer upper cover and collet, and collet is as fluid injection chamber, and on chamber, end face is square, is ramped shaped at the bottom of from upper end face to chamber.Be provided with polygonal pin post rectangular array in fluid injection chamber, rectangular array is surrounded by four broadsides and four narrow limits.In array, each pin post is separately independently cylinder, and the surrounding of rectangular array is equipped with flow-guiding channel, and on fluid injection chamber, four angles of end face are provided with opening blind hole, and the opening part of blind hole communicates with fluid injection chamber.Cooling fluid enters from two-layer upper cover inlet, and pin post rectangular array is immersed in chamber, and cooling fluid is discharged from ground floor upper cover liquid outlet channel from center to surrounding flowing.Because fluid injection chamber is provided with flow deflector, cooling fluid can form uniform flow field, can effectively reduce flow resistance.This liquid cooling mode can significantly improve heat exchange efficiency 25% compared with traditional water-filled radiator, can more effectively reduce cpu chip working temperature.
Description
Technical field
The utility model belongs to Thermal Power Engineering Field, is specifically related to a kind of liquid cooling type radiation apparatus with efficient heat transfer effect.
Background technology
The cpu chip of high-performance computer can as the Typical Representative of high heat flux heater members, a large server has tens pieces of even hundreds of pieces of multinuclear formula cpu chips usually, in the behind of powerful performance, along with higher caloric value and density of heat flow rate, can say that the high efficiency cooling problem of cpu chip has become computing power and further developed Zhi Ku.Be applied to the heat dissipation technology of high heat flux device cooling at present mainly still based on air-cooled, namely install a radiator additional on the surface of cooled device, the cold wind that heat is forced to flow by the fin on radiator is taken away.As everyone knows, adopt the liquid type of cooling to have higher heat transfer efficiency, but liquid cooling type radiation has two large difficult points, one is the seepage of cooling fluid; Another one is because the excessive radiating efficiency that causes of flow resistance of the intraluminal fluid that dispels the heat reduces.The former belongs to the precision of processing and the problem of installation, and the latter will relate to the Theory and technology of heat transfer and flow.A such as at present conventional class liquid cooling heat radiator, processes (portraying shape) and goes out a square or polygonal pin post matrix in sap cavity, and its Main Function increases heat exchange area in sap cavity to improve cooling effect.But the defect of the type radiator is, each pin post is not respective independently structure, and pin post is short and small, relatively thick bottom sap cavity, this structure causes cannot forming fluid course in pin post matrix.Therefore this structure is except processing problems, and key is the shortcoming of heat transfer and flow theoretical side.Therefore how can improve efficiency and the performance of liquid cooling radiator, just become the difficult point of the problem of research high heat flux device cooling both at home and abroad.
Summary of the invention
The purpose of this utility model is, propose a kind of have can reducing flow resistance, the liquid cooling chips type radiator with enhanced heat exchange effect, effectively can improve the heat dispersion of high heat flux heater members.
The technical scheme taked for realizing this utility model object is: radiator is made up of first, second two-layer upper cover and collet, and the center of ground floor upper cover is provided with feed pathway; The side of feed pathway is provided with liquid outlet channel.The center at the second layer upper cover back side is provided with projective table type inlet; The corner of second layer upper cover is provided with fluid hole.Collet is inner, and as fluid injection chamber, fluid injection chamber is square pond, is provided with polygonal pin post rectangular array in fluid injection chamber, and each pin post is separately independently cylinder.Four drift angles in fluid injection chamber are provided with opening blind hole, and the opening part of blind hole communicates with fluid injection chamber.The surrounding of rectangular array is equipped with flow-guiding channel, and the fluid hole at second layer upper cover four angles and the liquid outlet channel of ground floor upper cover stagger in the horizontal direction.
Except the structure of collet, with the contrast of prior art in the type of flow of cooling fluid: bottom and the high heat flux device into intimate of radiator collet stick together, and cooling liquid enters from the inlet of ground floor upper cover feed pathway and second layer upper cover.The effect of second layer upper cover makes the flowing of fluid in fluid injection chamber more even, and cooling fluid is through the fluid hole of second layer upper cover corner, and the liquid outlet channel returning ground floor upper cover flows out.The type of flow of this cooling fluid can make the cpu chip contacted with radiator bottom surface fully be cooled.Fluid injection chamber is a foursquare pond body, and pin post rectangular array is immersed in chamber, because fluid injection chamber is provided with flow deflector, so cooling fluid can form very uniform flow field.The effect of pin post is equal to the fin of heat exchanger, and the heat of heater members (for cpu chip) reaches the pin post in collet body and fluid injection chamber by heat conduction, heat sheds in the mode of (fluid) convection current by last heat.
Adjusting temperature and the flow of cooling fluid according to the heat load (density of heat flow rate) of heater members, making it reach good parameter matching by calculating.Effect due to water conservancy diversion makes the pressure drop that produces in fluid injection chamber very little, according to the principle of thermal conduction study, the distribution transmission of heat dissipation capacity in other words of temperature is upwards carried out by the root (wing root) of collet and pin post, and cooling liquid is flowed downward by top, this structure forms countercurrent flow, so can have good radiating effect.The Main Function of pin post is not direct heat radiation, but is spread out of in the mode of high heat conduction by the heat of collet, finally by cooling fluid by this disperses heat.
The beneficial effect of feature of the present utility model and generation is, the design of pin post rectangular array and flow-guiding channel in collet fluid injection chamber, there is the effect of strong radiator heat transfer, especially the pin post in rectangular array is processed as separately independently structure, the temperature gradient of each root pin post is contrary with the temperature gradient carrying out flowing liquid, thus has stronger heat transfer effect.Flow-guiding structure can form very uniform flow field, can effectively reduce flow resistance.This liquid cooling mode can significantly improve heat exchange efficiency 25% compared with traditional water-filled radiator.This structure not only can the volume of radiator greatly reduce, and is applicable to the space that computer server is narrow, and makes the even temperature effect of cpu chip better, more effectively can reduce working temperature.
Accompanying drawing explanation
Fig. 1 is the Principles and methods plane sketch in collet fluid injection chamber in the utility model.
Fig. 2 is the three-dimensional structure diagram of Fig. 1.
Fig. 3 is the three-dimensional structure diagram of ground floor upper cover in the utility model.
Fig. 4 is the three-dimensional structure diagram of second layer upper cover in the utility model.
Fig. 5 is the structure chart in the utility model after first and second layers of upper cover assembling.
Embodiment
Principles and methods of the present utility model to be further described by specific embodiment below in conjunction with accompanying drawing.It should be noted that the present embodiment is narrative, instead of determinate, do not limit protection range of the present utility model with this embodiment.
Have the liquid cooling chips type radiator of enhanced heat exchange effect, its concrete structure is: radiator is made up of ground floor upper cover 1-1, second layer upper cover 1-2 and collet 2, and the center of ground floor upper cover is provided with feed pathway 1-3; The side of feed pathway is provided with liquid outlet channel 1-4.The center at the second layer upper cover back side is provided with projective table type inlet 1-5, and the corner of second layer upper cover is provided with fluid hole 1-6.Collet is inner as fluid injection chamber 3, and fluid injection chamber is square pond.Be provided with polygonal pin post rectangular array 4 in fluid injection chamber, each pin post is separately independently cylinder, and four drift angles in fluid injection chamber are provided with opening blind hole 5, and the opening part of blind hole communicates with fluid injection chamber.The surrounding of rectangular array is equipped with (being made up of flow deflector) flow-guiding channel 6, and the fluid hole at second layer upper cover four angles and the liquid outlet channel of ground floor upper cover stagger in the horizontal direction.
Polygonal pin post rectangular array is surrounded by four broadsides and four narrow limits, and broadside is corresponding with the flow-guiding channel of corner, fluid injection chamber; Narrow limit is corresponding with the flow-guiding channel of fluid injection chamber periphery.The flow-guiding channel of collet four angular direction is provided with N number of arc flow deflector 7; The flow-guiding channel of fluid injection chamber periphery is provided with M little oval flow deflector 8.The height of polygonal its central circular pin post of pin post rectangular array is lower than the height of around pin post; The height of polygonal pin post rectangular array periphery is lower than end face on fluid injection chamber; Area shared by polygonal pin post rectangular array central circular region is 1/3 ~ 1/2 of the polygon pin post rectangular array gross area.
The back side of ground floor and second layer upper cover is all concave shaped planes, the feed pathway of ground floor upper cover and the projective table type inlet of second layer upper cover are positioned at same center line, and the feed pathway of ground floor upper cover is inserted in the inlet of second layer upper cover projective table type, and the diameter of second layer upper cover projective table type inlet is equal with the border circular areas in the middle part of polygon pin post rectangular array.Cooling fluid enters collet fluid injection chamber by ground floor feed pathway and second layer projective table type inlet, then flows along flow-guiding channel to corner, and the liquid outlet of the cooling fluid after intensification through second layer upper cover corner returns the liquid outlet channel of ground floor upper cover.The feed pathway of ground floor upper cover and liquid outlet channel are equipped with ell paths interface.
Upper cover is opaque plastic material, or transparent plastic material.Between first and second layers of upper cover, and be equipped with seal groove between collet and second layer upper cover, be provided with sealing ring in seal groove, two-layer upper cover and collet are sealed by screw fastening.
As embodiment, the flow-guiding channel at four angles, fluid injection chamber is provided with 5 arc flow deflectors; The flow-guiding channel of fluid injection chamber periphery is provided with 2 narrow little oval flow deflectors.Two upper covers adopt opaque plastic material.Fluid injection chamber is typical pond shape structure.Area in the middle part of polygonal pin post rectangular array shared by pin post is 1/3 of the polygon pin post rectangular array gross area, and pin post rectangular array other parts account for 2/3.The height of polygonal pin post rectangular array central circular pin post is 3mm; Peripheral height is 4mm; Wing column diameter 0.8mm; The distance of each pin intercolumniation is 0.7mm.The area of two upper covers and collet is 50 × 50mm; The thickness of ground floor upper cover is 11mm; Second layer upper cover equal thickness is 9mm; Collet thickness is 6mm.Collet adopts red copper material, and in fluid injection chamber, the liquid of work is water.
Dispel the heat during use collet with fixed by radiating element close contact, collet and be provided with the thermal bond material of high thermal conductivity between radiating element.As embodiment, two upper covers adopt transparent plastic material to carry out experiment and detect and observe, prove that the flowing of liquid does not exist in " dead band ".
Claims (8)
1. there is the liquid cooling chips type radiator of enhanced heat exchange effect, it is characterized in that: radiator is made up of ground floor upper cover (1-1), second layer upper cover (1-2) and collet (2), the center of ground floor upper cover is provided with feed pathway (1-3); The side of feed pathway is provided with liquid outlet channel (1-4), and the center at the second layer upper cover back side is provided with projective table type inlet (1-5); Four angles of second layer upper cover are provided with fluid hole (1-6), collet is inner as fluid injection chamber (3), fluid injection chamber is square pond, polygonal pin post rectangular array (4) is provided with in fluid injection chamber, each pin post is separately independently cylinder, four drift angles in fluid injection chamber are provided with opening blind hole (5), the opening part of blind hole communicates with fluid injection chamber, the surrounding of rectangular array is equipped with flow-guiding channel (6), and the fluid hole at second layer upper cover four angles and the liquid outlet channel of ground floor upper cover stagger in the horizontal direction.
2. according to the liquid cooling chips type radiator with enhanced heat exchange effect according to claim 1, it is characterized in that: described polygonal pin post rectangular array is surrounded by four broadsides and four narrow limits, and broadside is corresponding with the flow-guiding channel of corner, described fluid injection chamber; Narrow limit is corresponding with the flow-guiding channel of fluid injection chamber periphery.
3. according to the liquid cooling chips type radiator with enhanced heat exchange effect according to claim 1, it is characterized in that: the height of described polygonal its central circular pin post of pin post rectangular array is lower than the height of around pin post; The height of polygonal pin post rectangular array periphery is lower than end face on fluid injection chamber; Area shared by polygonal pin post rectangular array central circular region is 1/3 ~ 1/2 of the polygon pin post rectangular array gross area.
4. according to the liquid cooling chips type radiator with enhanced heat exchange effect described in claim 1 or 2, it is characterized in that: the flow-guiding channel of described collet four angular direction is provided with N number of arc flow deflector (7); The flow-guiding channel of described fluid injection chamber periphery is provided with M little oval flow deflector (8).
5. according to the liquid cooling chips type radiator with enhanced heat exchange effect described in claim 1 or 2 or 3, it is characterized in that: the back side of described ground floor and second layer upper cover is all concave shaped planes, the feed pathway of ground floor upper cover and the projective table type inlet of second layer upper cover are positioned at same center line, and the feed pathway of ground floor upper cover is inserted in the inlet of second layer upper cover projective table type, the diameter of second layer upper cover projective table type inlet is equal with the border circular areas in the middle part of polygon pin post rectangular array, cooling fluid enters described collet fluid injection chamber by ground floor feed pathway and second layer projective table type inlet, then cooling fluid flows along flow-guiding channel to corner, cooling fluid after intensification returns the liquid outlet channel of ground floor upper cover through the corner fluid hole of second layer upper cover, the feed pathway of described ground floor upper cover and liquid outlet channel are equipped with ell paths interface.
6. according to the liquid cooling chips type radiator with enhanced heat exchange effect according to claim 1, it is characterized in that: between described first and second layers of upper cover, and be equipped with seal groove between collet and second layer upper cover, be provided with sealing ring in seal groove, described two-layer upper cover and collet are sealed by screw fastening.
7. according to the liquid cooling chips type radiator with enhanced heat exchange effect according to claim 1, it is characterized in that: described upper cover is opaque plastic material, or transparent plastic material.
8. according to the liquid cooling chips type radiator with enhanced heat exchange effect according to claim 1, it is characterized in that: described collet adopts red copper material; Cooling liquid in described fluid injection chamber is water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520266292.3U CN204538010U (en) | 2015-04-28 | 2015-04-28 | There is the liquid cooling chips type radiator of enhanced heat exchange effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520266292.3U CN204538010U (en) | 2015-04-28 | 2015-04-28 | There is the liquid cooling chips type radiator of enhanced heat exchange effect |
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| CN204538010U true CN204538010U (en) | 2015-08-05 |
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| CN201520266292.3U Withdrawn - After Issue CN204538010U (en) | 2015-04-28 | 2015-04-28 | There is the liquid cooling chips type radiator of enhanced heat exchange effect |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779226A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled high heating flux device radiator with flow guide channels |
| CN105979753A (en) * | 2016-05-10 | 2016-09-28 | 福建省汽车工业集团云度新能源汽车股份有限公司 | Balanced heat dissipation device and method of electric vehicle |
| CN108024486A (en) * | 2018-01-04 | 2018-05-11 | 钦州学院 | Minitype radiator and its manufacture method based on dragonfly wing microcosmic surface |
| CN111366838A (en) * | 2020-03-16 | 2020-07-03 | 华北电力大学 | Power device characteristic testing cavity in immersion cooling environment |
| CN112188796A (en) * | 2020-09-07 | 2021-01-05 | 杭州电子科技大学 | High-power chip heat dissipation system and method with built-in small intestine villus-imitating micro needle ring |
-
2015
- 2015-04-28 CN CN201520266292.3U patent/CN204538010U/en not_active Withdrawn - After Issue
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779226A (en) * | 2015-04-28 | 2015-07-15 | 天津商业大学 | Liquid-cooled high heating flux device radiator with flow guide channels |
| CN104779226B (en) * | 2015-04-28 | 2017-06-30 | 天津商业大学 | Liquid-cooled high heat flux device radiator with flow-guiding channel |
| CN105979753A (en) * | 2016-05-10 | 2016-09-28 | 福建省汽车工业集团云度新能源汽车股份有限公司 | Balanced heat dissipation device and method of electric vehicle |
| CN108024486A (en) * | 2018-01-04 | 2018-05-11 | 钦州学院 | Minitype radiator and its manufacture method based on dragonfly wing microcosmic surface |
| CN111366838A (en) * | 2020-03-16 | 2020-07-03 | 华北电力大学 | Power device characteristic testing cavity in immersion cooling environment |
| CN112188796A (en) * | 2020-09-07 | 2021-01-05 | 杭州电子科技大学 | High-power chip heat dissipation system and method with built-in small intestine villus-imitating micro needle ring |
| CN112188796B (en) * | 2020-09-07 | 2022-01-25 | 杭州电子科技大学 | High-power chip heat dissipation system and method with built-in small intestine villus-imitating micro needle ring |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150805 Effective date of abandoning: 20170630 |
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| AV01 | Patent right actively abandoned |