CN204537035U - The liquid cooling heat radiator of fin concentric circles distribution - Google Patents

The liquid cooling heat radiator of fin concentric circles distribution Download PDF

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Publication number
CN204537035U
CN204537035U CN201520266507.1U CN201520266507U CN204537035U CN 204537035 U CN204537035 U CN 204537035U CN 201520266507 U CN201520266507 U CN 201520266507U CN 204537035 U CN204537035 U CN 204537035U
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China
Prior art keywords
fin
upper cover
collet
concentric circles
liquid
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Withdrawn - After Issue
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CN201520266507.1U
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Chinese (zh)
Inventor
诸凯
王雅博
魏杰
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Tianjin University of Commerce
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Tianjin University of Commerce
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Abstract

The utility model discloses the liquid cooling heat radiator of a kind of fin concentric circles distribution, its structure is: the back side of upper cover is the square fluid injection chamber of depression, and the front of upper cover is provided with inlet, and side is provided with liquid outlet.Collet is square, and with fluid injection chamber central point for the center of circle, collet is provided with the fin that N encloses concentric distribution, is also provided with the stepped appearance fin of concentric circles distribution at the corner location of fin N+1 circle, collet.Each fin is all respective independently structures.Cooling liquid enters fin groups from upper cover center feed inlet, and then to surrounding scattering, the direction of liquid inlet and outlet is 180 °.Concentric circles flow-guiding structure can form very uniform flow field, can effectively reduce resistance to flow.This liquid cooling mode can significantly improve heat exchange efficiency compared with traditional water-filled radiator, and not only volume can reduce relatively, is applicable to the space that computer server is narrow, and makes the even temperature effect of cpu chip better, more effectively can reduce working temperature.

Description

The liquid cooling heat radiator of fin concentric circles distribution
Technical field
The utility model belongs to Thermal Power Engineering Field, is specifically related to a kind of heat sink arrangement for cooling computer cpu chip.
Background technology
The cpu chip of computing machine can be used as the Typical Representative of high heat flux heater members, a large server has tens pieces of even hundreds of pieces of multinuclear formula cpu chips usually, in the behind of powerful performance, along with higher thermal value and heat flow density, can say that the high efficiency cooling problem of cpu chip has become computing power and further developed Zhi Ku.Be applied to the heat dissipation technology of high heat flux device cooling at present mainly still based on air-cooled, namely install a heating radiator additional on the surface of cooled device, the cold wind that heat is forced to flow by the fin on heating radiator is taken away.As everyone knows, adopt the liquid type of cooling to have higher heat transfer efficiency, but liquid cooling type radiation has two large difficult points, one is the seepage of liquid coolant; Another one is because the excessive radiating efficiency that causes of resistance to flow of the intraluminal fluid that dispels the heat reduces.The former belongs to the precision of processing and the problem of installation, and the latter will relate to the Theory and technology of heat transfer and flow.A such as at present conventional class liquid cooling heat radiator, processes (portraying shape) and goes out a square or polygonal pin post matrix in sap cavity, and its Main Function increases heat interchanging area in sap cavity to improve cooling effect.But the defect of the type heating radiator is, portraying the pin post processed not is that separately independently this structure causes cooling effect undesirable.Therefore this structure is except processing problems, and key is the shortcoming of heat transfer and flow theoretical side.Therefore how can improve efficiency and the performance of liquid cooling radiator, just become the difficult point of the problem of research high heat flux device cooling both at home and abroad.
Summary of the invention
The purpose of this utility model is, proposes the liquid-cooling heat radiation apparatus that a kind of fin concentric circles for cooling computer cpu chip distributes, can reduce the resistance to flow of cooling fluid, effectively improves the heat dispersion of cpu chip.
The technical scheme taked for realizing this utility model object is: heating radiator is made up of upper cover and collet, and the back side of upper cover is provided with the square fluid injection chamber of depression, and the front of upper cover is provided with inlet, and liquid outlet is located at the side of upper cover.Collet is square, with upper cover fluid injection chamber central point for the center of circle, collet is provided with the fin that N encloses the distribution of complete concentric, also the stepped appearance fin of concentric circles distribution is provided with at the corner location of fin N+1 circle, collet, each fin is the thin slice of rectangle, and be arranged in order into round along the direction of fin thickness, and each fin is all respective independently structures.
Except the structure of heating radiator, the type of flow of liquid coolant and the contrast of prior art: utilize the upper cover of heating radiator as fluid injection chamber, fin is rendered as concentric circles distribution with center, fluid injection chamber, even if be also like this at the corner location of collet, so this Structure composing fluid passage smoothly.Cooling liquid enters fin groups from upper cover inlet, and then to surrounding scattering, the direction of liquid inlet and outlet is 180 °, and last cooling fluid flows out from the liquid outlet of upper cover side.The type of flow of this liquid coolant can make (contacting with heating radiator bottom surface) cpu chip be cooled fully.Whole fin is immersed in fluid injection chamber, because the arrangement mode of each fin has guide functions, so enable fluid form very uniform flow field.The heat that cpu chip produces reaches the fin in collet body and fluid injection chamber by heat conduction, heat sheds in the mode of (fluid) convection current by last heat.
Adjusting temperature and the flow of liquid coolant according to the thermal load (heat flow density) of CPU, making it reach good parameter matching by calculating.Effect due to water conservancy diversion makes the pressure drop that produces in fluid injection chamber very little, according to the principle of thermal conduction study, the heat radiation of fin is upwards carried out by collet and (fin) root, and cooling liquid downwards, is then laterally flowed out by top, this structure forms countercurrent flow, so can have good radiating effect.In fluid injection chamber, the Main Function of fin is not direct heat radiation, but is spread out of in the mode of high heat conduction by the heat of collet, finally by liquid coolant by this disperses heat.
The beneficial effect of feature of the present utility model and generation is, the design of collet fin groups and flow-guiding channel, there is the effect of strong radiator heat transfer, especially fin machining is respective independently structure, the thermograde of every a slice fin is contrary with incoming flow fluid temperature, thus has stronger heat transfer effect.Concentric circles flow-guiding structure can form very uniform flow field, can effectively reduce resistance to flow.This liquid cooling mode can significantly improve heat exchange efficiency compared with traditional water-filled radiator.This kind of heating radiator not only can the volume of heating radiator greatly reduce, and is applicable to the space that computer server is narrow, and makes the even temperature effect of cpu chip better, more effectively can reduce working temperature.
Accompanying drawing explanation
Fig. 1 is the diagrammatic perspective view of collet fin setting principle and structure in the utility model.
Fig. 2 is the stereographic map of superstructure in the utility model.
Fig. 3 is the external structure stereographic map of upper cover in the utility model.
Embodiment
Principles and methods of the present utility model to be further described by specific embodiment below in conjunction with accompanying drawing.It should be noted that the present embodiment is narrative, instead of determinate, do not limit protection domain of the present utility model with this embodiment.
The liquid cooling heat radiator of fin concentric circles distribution is made up of upper cover and collet, and its concrete structure is: the back side of upper cover 1 is the square fluid injection chamber 1-1 of depression, and the front of upper cover is provided with inlet 1-2; Liquid outlet 1-3 is located at the side of upper cover.Collet 3 is square, with upper cover fluid injection chamber central point for the center of circle, collet is provided with the fin 3-1 that N encloses the distribution of complete concentric, and be also provided with the stepped appearance fin 3-2 of concentric circles distribution at the corner location of fin N+1 circle, collet, the fin of collet central point is cruciform.Each fin is the thin slice of rectangle, and through-thickness (transverse direction) is arranged in order into round, and each fin is all respective independently structures.
Upper cover inlet departs from the center in fluid injection chamber, and inlet is provided with quarter bend pipe interface; Liquid outlet is provided with straight-through pipe interface, and it is 180 ° that inlet quarter bend pipe interface and liquid outlet lead directly to pipe interface direction.
The back side of upper cover and collet be equipped with seal groove above, O-ring seals is placed in seal groove, and the corner of upper cover and collet is provided with through hole, adopts stainless steel screw fit sealing.Upper cover adopts opaque plastic material to make, or adopts transparent plastic material to make.Collet adopts red copper material to make; In fluid injection chamber, the liquid of work is water.
As embodiment, the fin distributed in complete concentric circles is provided with 8 circles (N=8), and the stepped appearance fin that collet corner location also distributes in concentric circles is established and had three layers.By interior to calculating: the 9th circle is provided with 11 independent arc fins; 10th circle is provided with 6 independent arc fins; 11th round is provided with 2 independent arc fins.All fins are all rectangle and stand up, and the thickness of fin is 0.3mm; The height of fin is 4mm; The spacing of each circle (radial direction) fin is 1mm; The spacing of each (axis) fin is 1mm; The area of collet is 50 × 50mm; The thickness of upper cover is 20mm; Collet body thickness is 3mm.
Dispel the heat during use collet with fixed by radiating element close contact, collet and be provided with the thermal bond material of high thermal conductivity between radiating element.As embodiment, upper cover adopts transparent plastic material to carry out experiment and detects and observe, and proves that the flowing of liquid does not exist in " dead band ".

Claims (6)

1. the liquid cooling heat radiator of fin concentric circles distribution, heating radiator is made up of upper cover and collet, it is characterized in that: the back side of upper cover (1) is the square fluid injection chamber (1-1) of depression, the front of upper cover is provided with inlet (1-2), and liquid outlet (1-3) is located at the side of upper cover; Collet (3) is square, with upper cover fluid injection chamber central point for the center of circle, collet is provided with the fin (3-1) that N encloses the distribution of complete concentric, also the stepped appearance fin (3-2) of concentric circles distribution is provided with at the corner location of fin N+1 circle, collet, each fin is the thin slice of rectangle, and be arranged in order into round along the direction of fin thickness, and each fin is all respective independently structures.
2., according to the liquid cooling heat radiator of fin concentric circles distribution according to claim 1, it is characterized in that: described upper cover inlet departs from the center in upper cover fluid injection chamber, inlet is provided with quarter bend pipe interface; Liquid outlet is provided with straight-through pipe interface, and the direction that inlet quarter bend pipe interface and liquid outlet lead directly to pipe interface is 180 °.
3., according to the liquid cooling heat radiator of fin concentric circles distribution according to claim 1, it is characterized in that: the fin of described collet central point is cruciform.
4. according to the liquid cooling heat radiator of fin concentric circles distribution according to claim 1, it is characterized in that: the back side of described upper cover and collet be equipped with seal groove above, O-ring seals is placed in seal groove, and the corner of upper cover and collet is provided with through hole, adopts stainless steel screw fit sealing.
5. according to the liquid cooling heat radiator of fin concentric circles distribution according to claim 1, it is characterized in that: described upper cover adopts opaque plastic material to make, or adopt transparent plastic material to make.
6. according to the liquid cooling heat radiator of fin concentric circles distribution according to claim 1, it is characterized in that: described collet adopts red copper material to make; In described fluid injection chamber, the liquid of work is water.
CN201520266507.1U 2015-04-28 2015-04-28 The liquid cooling heat radiator of fin concentric circles distribution Withdrawn - After Issue CN204537035U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520266507.1U CN204537035U (en) 2015-04-28 2015-04-28 The liquid cooling heat radiator of fin concentric circles distribution

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104779227A (en) * 2015-04-28 2015-07-15 天津商业大学 Liquid-cooled chip radiator with annularly-distributed fins

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104779227A (en) * 2015-04-28 2015-07-15 天津商业大学 Liquid-cooled chip radiator with annularly-distributed fins
CN104779227B (en) * 2015-04-28 2017-10-10 天津商业大学 Fin annular spread liquid cooling chips type radiator

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AV01 Patent right actively abandoned

Granted publication date: 20150805

Effective date of abandoning: 20171010

AV01 Patent right actively abandoned