CN206340536U - A kind of IGBT module liquid cooling plate - Google Patents

Abstract

The utility model discloses a IGBT module liquid cooling board, wherein, IGBT module liquid cooling board includes: the liquid-discharging device comprises a substrate, wherein a plurality of liquid flow grooves are formed in the upper end of the substrate in parallel, and a liquid inlet flow passage and a liquid outlet flow passage are respectively communicated with two ends of each liquid flow groove; the base plate is provided with a cover plate on each liquid flow groove. The utility model provides an IGBT module liquid cooling board, make this IGBT module liquid cooling board channel flow distribution below each apron even, the cold drawing surface and coolant liquid are imported and exported between have good temperature uniformity, and import and export pressure drop can be controlled in reasonable scope, the heat dissipation power is high; the problem of among the prior art IGBT module liquid cooling board between import and the export pressure drop too big, too high to liquid cooling system circulating pump power requirement to and the difference in temperature between import and the export is too big, easily arouses cold plate structure thermal stress distribution inhomogeneous is solved.

Description

A kind of IGBT module liquid cooling plate

technical field

The utility model relates to an IGBT module liquid cooling plate, in particular to an IGBT module liquid cooling plate in which an inlet flow channel and an outlet flow channel are respectively arranged on two sides of a base plate.

Background technique

In recent years, with the development of electronic devices towards high power density and high integration, the heat flux has been increasing continuously. Usually, the package of IGBT module packs the IGBT chip, drive circuit, control circuit and protection circuit into one module. IGBT combines the advantages of MOSFET and other power devices. It has small conduction voltage drop and high working voltage level. The industry continues to be widely used.

As the current density of IGBT module packaging continues to increase, the power continues to increase, and the volume is getting smaller and smaller, IGBT has a problem: the internal heat generation of the IGBT module has doubled, so that the failure of the IGBT module is mainly due to overheating loss. The increase in temperature will bring a series of effects to the device. The thermal and mechanical loads caused by the temperature are getting heavier and heavier. The heat generated is accumulated inside and is not easy to dissipate, reducing reliability and even interrupting the operation. Effective heat dissipation is important for Key issues facing IGBT development.

The traditional IGBT module cold plate structure is mostly a series S-shaped flow channel, and the cold plate is usually installed directly under the IGBT module. This cold plate structure has the following disadvantages: 1) The pressure drop between the inlet and the outlet of the S-type series flow channel structure cold plate is too large, which requires high power for the circulation pump of the liquid cooling system and correspondingly increases the cost of the system; 2) The temperature difference between the inlet and outlet of the S-type series flow channel structure cold plate is too large, which can easily cause the uneven distribution of thermal stress of the cold plate structure and cause failure.

Therefore, the prior art still needs to be improved and developed.

Utility model content

In view of the above-mentioned deficiencies in the prior art, the purpose of this utility model is to provide an IGBT module liquid cooling plate, aiming at solving the problem of excessive pressure drop between the inlet and outlet of the IGBT module liquid cooling plate in the prior art, which affects the circulation of the liquid cooling system. The pump power requirements are too high, and the temperature difference between the inlet and the outlet is too large, which will easily cause the problem of uneven distribution of thermal stress in the cold plate structure.

The technical scheme of the utility model is as follows:

A liquid cooling plate for an IGBT module is arranged on the lower end surface of the IGBT module, wherein the liquid cooling plate for the IGBT module includes:

A substrate, the upper end of the substrate is provided with a plurality of liquid flow grooves in parallel, and the two ends of the liquid flow grooves are respectively connected with a liquid inlet channel and a liquid outlet channel;

The base plate is installed with a cover plate on each liquid flow tank.

In a preferred solution, in the liquid cooling plate of the IGBT module, the liquid inlet channel is open at one end and closed at one end; the liquid outlet channel is open at one end and closed at one end.

In a preferred solution, in the liquid cooling plate of the IGBT module, the opening directions of the liquid inlet channel and the liquid outlet channel are the same.

In a preferred solution, the liquid cold plate of the IGBT module, wherein the liquid flow tank includes:

a first groove part arranged at the bottom of the liquid flow tank and communicating with the liquid inlet channel and the liquid outlet channel;

and a second groove disposed above the first groove and communicating with it for holding the cover;

And a third groove arranged above the second groove and communicated with it for accommodating the cover plate.

In the preferred solution, the liquid cold plate of the IGBT module, wherein, the lower end surface of the cover plate is provided with several flow channel plates arranged at intervals, and the several flow channel plates divide the liquid flow tank into a plurality of parallel the first branch channel.

In a preferred solution, in the liquid cold plate of the IGBT module, several cylinders are arranged on the lower end surface of the cover plate to increase the turbulence performance of the cover plate on the fluid flowing in the liquid flow tank.

In a preferred solution, in the liquid cold plate of the IGBT module, the cylinders include: first cylinders arranged in rows and columns, and second cylinders arranged in rows and columns and alternately arranged with the first cylinders.

In a preferred solution, the liquid cold plate of the IGBT module, wherein, the cover plate is provided with at least one splitter near the end port of the liquid inlet channel, and the splitter will come from the liquid inlet channel Coolant is evenly distributed to both sides of the liquid flow slot.

In a preferred solution, in the liquid cooling plate of the IGBT module, the cover plate is made of an aluminum plate with high thermal conductivity, a copper-aluminum composite plate or an aluminum alloy profile.

A method for manufacturing the IGBT module liquid-cooled plate according to any one of the above, wherein the manufacturing method includes: after processing the cover plate and the base plate respectively, welding them into one body by friction stir welding.

Compared with the prior art, the IGBT module liquid cooling plate provided by the utility model adopts a plurality of liquid flow grooves arranged in parallel on the upper end of the substrate, and a liquid inlet channel and a the liquid outlet channel; and the base plate, a cover plate is arranged in each liquid flow channel. The IGBT module liquid cold plate has a uniform distribution of channel flow under each cover plate, good temperature uniformity between the surface of the cold plate and the inlet and outlet of the coolant, and the pressure drop at the inlet and outlet can be controlled within a reasonable range. High; it solves the excessive pressure drop between the inlet and outlet of the IGBT module liquid cooling plate in the prior art, the high power requirement for the circulating pump of the liquid cooling system, and the excessive temperature difference between the inlet and the outlet, which may easily cause the structure of the cold plate to heat up. The problem of uneven stress distribution.

Description of drawings

Fig. 1 is a schematic diagram of the substrate structure of a preferred embodiment of the IGBT module liquid cooling plate in the present invention.

Fig. 2 is a schematic diagram of the internal channel structure of the substrate of the preferred embodiment of the IGBT module liquid cooling plate in the present invention.

Fig. 3 is a structural schematic diagram of a straight-fin structure cover plate of a preferred embodiment of the IGBT module liquid cooling plate in the present invention.

Fig. 4 is a structural schematic diagram of a cylindrical needle-shaped structure cover plate of a preferred embodiment of the IGBT module liquid cooling plate in the present invention.

Fig. 5 is a structural schematic diagram of a corrugated fin structure cover plate of a preferred embodiment of the IGBT module liquid cooling plate in the present invention.

Fig. 6 is a schematic diagram of the cooperation position between the liquid cooling plate and the IGBT module in a preferred embodiment of the IGBT module liquid cooling plate in the present invention.

detailed description

The utility model provides an IGBT module liquid cooling plate. In order to make the purpose, technical solution and effect of the utility model clearer and clearer, the utility model will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

The utility model provides an IGBT module liquid cold plate, which is arranged on the lower end surface of the IGBT module, comprising: a substrate 1, as shown in Fig. The two ends of the flow tank 13 are respectively connected with a liquid inlet channel 4 and a liquid outlet channel 5, as shown in Figure 2; the substrate 1 is provided with a cover plate 8 in each liquid flow channel 13, as shown in Figure 3 to Figure 2 5.

IGBT (Insulated Gate Bipolar Transistor), Insulated Gate Bipolar Transistor, is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (Bipolar Transistor) and MOS (Insulated Gate Field Effect Transistor), with MOSFET The advantages of high input impedance and low conduction voltage drop of GTR.

In a preferred embodiment of the utility model, the IGBT module is electronically packaged, and its structure is shown in Figure 6. Three IGBT sub-modules 12 are provided. As shown in Figure 6, each IGBT sub-module 12 corresponds to a cover plate, namely The number of the liquid flow grooves 13 and cover plates corresponds to the number of the IGBT sub-modules 12 , and the position is preferably directly below the IGBT sub-modules 12 .

During specific implementation, the liquid inlet channel 4 and the liquid outlet channel 5 are both open at one end and closed at one end, as shown in FIG. 2, and a liquid outlet 3 connected with the liquid outlet channel 5, the liquid inlet 2 and the liquid outlet 3 are preferably arranged at the same end of the cover plate, so as to circulate the cooling liquid and simplify the liquid cold plate structure.

As shown in Figure 2, the internal flow channel in the substrate 1 includes the liquid inlet flow channel 4, the liquid flow channel 13 flow channel and the liquid outlet flow channel 5 arranged in sequence, wherein the liquid inlet flow channel 4 and the liquid outlet flow channel 5 are preferably Adopting a circular structure, on the one hand, it ensures the smooth flow of the cooling liquid in it, on the other hand, it facilitates the connection between the liquid inlet 2 and the joint (the joint refers to the joint between the cooling liquid source and the substrate 1), and on the other hand, it can The flow distribution at the inlets of the plurality of liquid flow tanks 13 is evenly distributed. The liquid flow groove 13 is preferably a hexagonal structure, which makes the flow channel width of the liquid flow groove 13 gradually increase from the entrance to the middle area, so that the cooling liquid can fully contact the part of the middle area and prevent the cooling liquid from being too large at the entrance. Scatter, resulting in uneven flow. The connection mode of transition is adopted between the liquid flow tank 13 and the inlet flow channel 4 and the outlet flow channel 5, so that the inlet of the liquid flow tank 13 can be made very small, and the surface area of the three inlet parts in the inlet flow channel 4 is relatively large compared to the entire inlet flow channel. The surface area of the channel 4 is very small, so that the cooling liquid in the inlet channel 4 can fully contact the inlets of the three liquid flow tanks 13, and the uniformity of the flow distribution between each parallel liquid flow tank 13 can be greatly improved.

Compared with the prior art, the IGBT module liquid cold plate provided by the utility model adopts a plurality of liquid flow grooves 13 arranged in parallel on the upper end of the substrate 1, and a liquid inlet is respectively connected to each other at both ends of the liquid flow groove 13. The channel 4 and the liquid outlet channel 5 ; and the base plate 1 are provided with a cover plate in each liquid channel 13 . The IGBT module liquid cold plate has a uniform distribution of channel flow under each cover plate, good temperature uniformity between the surface of the cold plate and the inlet and outlet of the coolant, and the pressure drop at the inlet and outlet can be controlled within a reasonable range. High; it solves the excessive pressure drop between the inlet and outlet of the IGBT module liquid cooling plate in the prior art, the high power requirement for the circulating pump of the liquid cooling system, and the excessive temperature difference between the inlet and the outlet, which may easily cause the structure of the cold plate to heat up. The problem of uneven stress distribution.

At the same time, the utility model adopts a liquid-cooled plate structure which is actually a modular structure, which has a good market prospect, is convenient to assemble and disassemble, and has good sealing performance of the liquid-cooled plate. Moreover, since the base plate 1 of the entire liquid cooling plate adopts a symmetrical structure, the positions of the inlet and the outlet can be reversed, and only the installation direction of the cover plate needs to be changed.

The liquid cold plate of this structure not only overcomes the problems of excessive flow resistance of a single channel and uneven flow distribution of multiple channels, but also makes the whole liquid cold plate have good temperature uniformity and low pressure drop at the inlet and outlet. Adjusting the fin structure of the cover plate can effectively change The heat dissipation capability of the entire cold plate, the manufacturing process of the base plate 1 and the cover plate structure are mature and simple.

In a further preferred embodiment of the present utility model, as shown in FIG. 1 , the liquid flow tank 13 includes: disposed at the bottom of the liquid flow tank 13 and connected to the liquid inlet channel 4 and the liquid outlet channel 5 and a second groove 14 arranged above the first groove 6 and communicating with it for clamping the cover plate; and arranged above the second groove 14 , and communicating with it, for accommodating the third groove portion 15 of the cover plate.

The second groove portion 14 is provided with four engaging openings for engaging the cover plate. The middle part of the engaging opening is curved, one end is semicircular, and the other end is flat, so that the cover plate is easy to install and can Precisely positioned so that it can only move vertically within the range of the second groove portion 14 . The shape structure of the cover plate 8 is designed to be the same structure as the second groove part 14 and the third groove part 15 of the liquid flow tank 13, which not only facilitates the cooperation between the cover plate 8 and the base plate 1, but also improves the overall cooling capacity of the liquid cooling plate. of tightness.

In a further preferred embodiment, as shown in FIG. 3 , the lower end surface of the cover plate is provided with several flow channel plates arranged at intervals, and the several flow channel plates divide the liquid flow tank 13 into a plurality of parallel flow channels. First runner.

During specific implementation, the flow channel plate can be set as straight or corrugated, that is, straight fin structure 9 or corrugated structure 11. When it is set as straight fin structure 9, its straight fins are arranged in a close-packed manner The feature of this structure is that the densely packed straight fins can cooperate with the liquid flow groove 13 to form a multi-channel flow channel structure, which can greatly reduce the resistance along the flow channel, so that only the fin structure of the cover plate The design can solve the design of the traditional multi-channel structure. The design of the corrugated structure 11 is the same as that of the straight fin structure 9 , and will not be repeated here.

The close-packed straight fins can be replaced by several cylinders to increase the turbulence performance of the cover plate on the fluid flowing in the liquid flow tank 13. The cylinders can include: the first cylinders 16 arranged in rows and rows, and the first cylinders 16 arranged in rows and rows The second cylinders 17 are set and interlaced with the first cylinders 16 .

In a further preferred embodiment of the present utility model, the cover plate is provided with at least one splitter 7 near one end port of the liquid inlet channel 4, as shown in Figure 3, the splitter 7 will come from the inlet The cooling liquid in the liquid flow channel 4 is evenly distributed to both sides of the liquid flow groove 13 .

Preferably, there are two splitters 7, and the two splitters are arranged in parallel, and the angle between them and the end face of the inlet end of the cover plate is 45°.

The setting of the splitter 7 can solve the problem that the cooling liquid at the inlet of the flow channel of the liquid flow tank 13 only flows to one side of the cavity, and can make the flow distribution of the flow channel of the entire cavity more uniform. On this basis, the optimized straight fin structure 9 on the cover plate 8 can form a multi-channel structure in the middle area when the cover plate 8 cooperates with the liquid flow groove 13, effectively increasing the cooling liquid and effectively contacting the cold plate. area, thereby improving the heat exchange capacity of the entire cold plate; the cylindrical needle structure 10 and the corrugated structure 11 are the same as the straight fin structure 9 .

Different from the prior art, the utility model designs three IGBT modules in a parallel structure, and the liquid inlet channel 4 and the liquid outlet channel 5 adopt a circular flow channel, which adopts a transition connection mode with the hexagonal cavity, The entrance area of each cavity of the substrate 1 is smaller than the surface area of the liquid inlet channel 4 and the liquid outlet channel 5, so that the cooling liquid can fully contact the inlet part of each cavity. When the cavity enters the cooling liquid, the substrate 1 The cross-sectional area of each cavity gradually increases, which can greatly reduce the problem of uneven flow distribution in each branch of the U-shaped multi-channel parallel flow channel.

Moreover, in order to ensure good cooperation between the cover plate and the liquid cooling tank, the utility model designs the middle part of the cover plate as a stepped platform, and the concave area can be designed to increase the fin structure of any shape, and the density of the fins can be changed. The comprehensive heat dissipation capacity of the cold plate forms a multi-channel flow channel structure when assembled with the cavity. A pair of parallel oblique splitters 7 are added to the corresponding water inlet flow channel of each cover plate, which can effectively solve the problem that the fluid is only biased in one direction when flowing into the cavity.

In a further preferred embodiment of the present utility model, the liquid cooling plate adopts a high thermal conductivity aluminum alloy material (aluminum plate or aluminum extruded profile) substrate 1 and a high thermal conductivity aluminum plate, a copper-aluminum composite plate or a cover plate of an aluminum alloy profile through stirring Friction welding process welding composition; the plane in contact with the cover plate and the IGBT is the copper surface of the copper-aluminum composite material. If aluminum is used, there is no direction requirement. The plane in contact with the cover plate and the water tank is processed into a dense For fine water channels, the ratio of water channels to wall thickness is 2:1.

A method for manufacturing the IGBT module liquid cooling plate as described in any one of the above, wherein the manufacturing method includes: after processing the cover plate and the base plate 1 respectively, welding them into one body by means of friction stir welding.

In the specific embodiment proposed by the utility model, there are many alternatives, such as 3-module U-shaped parallel multi-channel flow channel structure, the alternative solution can be a multi-module Z-shaped multi-channel flow channel structure; cylindrical liquid inlet flow channel 4 and the connection mode of the transition between the outlet flow channel 5 and the hexagonal cavity flow channel, alternatives may be the quadrangle inlet and outlet flow channels and the quadrangle cavity transition connection. Another example is the ladder-shaped cover plate structure, the concave area can be designed to increase the fin structure of any shape; the parallel splitter 7 is added at the entrance, the alternative can be a flat plate with fin structure, and the shape of the splitter 7 can be changed Cylindrical spoiler, etc. The separated modular design adopted in the utility model can be replaced by an integral design on the existing basis.

It should be understood that the application of the present utility model is not limited to the above examples, and those skilled in the art can improve or change according to the above description, and all these improvements and changes should belong to the protection of the appended claims of the present utility model scope.

Claims (9)

1. a kind of IGBT module liquid cooling plate, is arranged at IGBT module lower surface, it is characterised in that the IGBT module liquid cooling plate bag Include：

Substrate, the substrate upper end has been arranged in parallel multiple spouts, and the spout two ends are provided with and respectively communicated with a feed liquor Runner and go out liquid runner；

Substrate installation settings on each spout has a cover plate.

2. IGBT module liquid cooling plate according to claim 1, it is characterised in that the feed liquor runner is one end open, one End seal is closed；It is described go out liquid runner be one end open, one end closing.

3. IGBT module liquid cooling plate according to claim 2, it is characterised in that the feed liquor runner and go out liquid flow passage openings Direction is identical.

4. IGBT module liquid cooling plate according to claim 1, it is characterised in that the spout includes：

It is arranged at the spout bottom and with the feed liquor runner and going out the first groove portion that liquid runner is connected；

And be arranged above first groove portion and communicate therewith, the second groove portion for cover plate described in clamping；

And be arranged above second groove portion and communicate therewith, the 3rd groove portion for accommodating the cover plate.

5. IGBT module liquid cooling plate according to claim 1, it is characterised in that the cover plate lower surface is provided with several The spout is divided into multiple first runners in parallel by spaced runner plate, several described runner plates.

6. IGBT module liquid cooling plate according to claim 1, it is characterised in that the cover plate lower surface is provided with several Cylinder, to increase cover plate to flowing in the flow-disturbing performance of fluid in spout.

7. IGBT module liquid cooling plate according to claim 6, it is characterised in that the cylinder includes：What ranks were set First cylinder, and the second cylinder that ranks set and are staggered with first cylinder.

8. the IGBT module liquid cooling plate according to claim 1 to 7 any one, it is characterised in that the cover plate is close One end port of the feed liquor runner is provided with least one splitter, and the splitter will come from the cooling of feed liquor runner Liquid uniform divided flows are to the both sides of spout.

9. the IGBT module liquid cooling plate according to claim 1 to 7 any one, it is characterised in that the cover plate is using high Aluminium sheet, copper-aluminum composite board or the aluminium alloy extrusions of thermal conductivity factor are processed.