CN209882443U - Brazing type water cooling plate applied to land wind power semiconductor device heat dissipation - Google Patents
Brazing type water cooling plate applied to land wind power semiconductor device heat dissipation Download PDFInfo
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- CN209882443U CN209882443U CN201920299887.7U CN201920299887U CN209882443U CN 209882443 U CN209882443 U CN 209882443U CN 201920299887 U CN201920299887 U CN 201920299887U CN 209882443 U CN209882443 U CN 209882443U
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Abstract
The utility model provides a be applied to radiating brazing formula water-cooling board of land wind-powered electricity generation power semiconductor device, including base plate, brazing filler metal plate and apron are located in proper order the substrate surface, be equipped with two recesses on the base plate side by side, install a radiating fin in two recesses respectively, two recess one end intercommunication inhalant canal, other end intercommunication exhalant canal, inhalant canal department is equipped with the water inlet and connects, exhalant canal department is equipped with the delivery port and connects, all is equipped with first water catch bowl in inhalant canal and two recess intercommunication departments, all is equipped with the second water catch bowl in exhalant canal and recess intercommunication department. The utility model discloses a runner design in the unique cold drawing has not only solved the too high problem of power semiconductor device long-time during operation, requires to obtain effectively solving the radiating temperature uniformity of device moreover.
Description
Technical Field
The utility model mainly relates to a water-cooling correlation technique field of land wind power equipment specifically is a be applied to radiating brazing type water-cooling board of land wind power semiconductor device.
Background
Wind power generation is widely applied globally as a clean and abundant renewable energy source. For a power system, the working frequency of a power semiconductor device is seriously influenced by temperature, the temperature can be continuously increased along with long-time working, and when the temperature exceeds the safety temperature specified by the device, the device can not work normally, even the device is burnt.
The traditional water cooling plate is limited by the limitation of a processing technology because a deep hole processing mode is adopted or a cold water pipeline is installed on an aluminum plate, the area where a water channel of the formed water cooling plate flows through is limited, the heat generated when a device is taken away for working is limited, and the water channel mode is simple and has high requirements on the placement position of the device. However, the heat sources of devices in the wind power industry often appear in the form of surface heat sources, and the high-low temperature difference between different devices needs to be controlled within a specific range when multiple devices work simultaneously, and if the problems cannot be solved by adopting the traditional process, the devices have the risk of failure when working for a long time; meanwhile, due to the structural characteristics and size limitations of the water cooling plate, the traditional water flow channel structural design is difficult to ensure that a plurality of heat dissipation units can dissipate heat uniformly at the same time.
SUMMERY OF THE UTILITY MODEL
For solving the not enough of prior art, the utility model discloses combine prior art, from practical application starting, provide one kind and be applied to radiating brazing type water-cooling plate of land wind-powered electricity generation power semiconductor device, through the design of runner in the unique cold drawing, not only solved the too high problem of power semiconductor device long-time during operation, obtain effectively solving the radiating temperature uniformity requirement of device moreover.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a be applied to radiating brazing formula water-cooling plate of land wind-powered electricity generation power semiconductor device, includes base plate, brazing filler metal board and apron are located in proper order the substrate surface, be equipped with two recesses on the base plate side by side, install a radiating fin in two recesses respectively, two recess one end intercommunication inhalant canal, other end intercommunication exhalant canal, inhalant canal department is equipped with the water inlet and connects, exhalant canal department is equipped with the delivery port and connects, all is equipped with first water catch bowl in inhalant canal and two recess intercommunication departments, all is equipped with the second water catch bowl in exhalant canal and recess intercommunication department.
Furthermore, the width of the first water collecting groove is larger than that of the water inlet channel, and the width of the second water collecting groove is larger than that of the water outlet channel.
Furthermore, the water inlet joint and the water outlet interface are arranged on the same side of the substrate.
Furthermore, the water inlet channel firstly extends from one end of the substrate to the direction parallel to the length of the groove, then inclines towards the direction close to the groove, then extends towards the direction parallel to the width of the groove, and flows into the groove through the first water collecting groove on the channel extending towards the width of the groove.
Furthermore, two second water collecting grooves arranged at the grooves are communicated with the water outlet channel after being converged at the middle of the two grooves.
Furthermore, the base plate, the brazing plate, the cover plate and the radiating fins are all made of aluminum materials, and the water inlet connector and the water outlet connector are made of stainless steel materials.
Furthermore, the base plate and the cover plate are connected through a brazing mode.
The utility model has the advantages that:
1. the utility model discloses a water-cooling mode, radiating fin through setting up is used for semiconductor device's heat dissipation, radiating fin adopts unique parallel mode, good radiating effect has, through the first water catch bowl at inhalant canal and exhalant canal setting, the second water catch bowl, can make rivers flow through when even under the effect of pressure about the fin, can effectually take away the heat of cold plate surface heating device, the too high problem of power semiconductor device long-time during operation temperature has not only been solved, and can satisfy the temperature uniformity requirement of device.
2. The utility model discloses the circulation of rivers in the inside even flexibility of cold drawing can be guaranteed to the unique rivers passageway that sets up, and cold water is connected from the water inlet and is got into inside the cold drawing, again through the delivery port joint outflow cold drawing, flows into the water inlet again after forced cooling and connects, finally forms a duty cycle, satisfies and lasts the heat dissipation demand.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
figure 2 is the utility model discloses split structure sketch map.
Reference numerals shown in the drawings:
1. a substrate; 2. a brazing plate; 3. a cover plate; 4. a heat dissipating fin; 5. a groove; 6. a water inlet connection; 7. a water outlet joint; 8. a first water collection tank; 9. a second water collection tank; 10. a water inlet channel; 11. and a water outlet channel.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope defined in the present application.
As shown in fig. 1-2, a brazing type water-cooling plate applied to heat dissipation of land wind power semiconductor devices comprises a base plate 1, a brazing filler metal plate 2 and a cover plate 3, wherein the brazing filler metal plate 2 and the cover plate 3 are sequentially arranged on the surface of the base plate 1, two grooves 5 are arranged on the base plate 1 in parallel, a heat dissipation fin 4 is respectively arranged in each of the two grooves 5, one end of each of the two grooves 5 is communicated with a water inlet channel 10, the other end of each of the two grooves 5 is communicated with a water outlet channel 11, a water inlet joint 6 is arranged at the position of the water inlet channel 10, a water outlet joint 7 is arranged at the position of the water outlet channel 11, first water collecting grooves 8 are arranged at the positions where the water inlet channel 10 is communicated with the two.
In the utility model, firstly, a high-efficiency fluid simulation technology is adopted, the specifications and forms of a cover plate 3, a base plate 1, a radiating fin 4, a brazing filler metal plate 2, a water inlet joint 6 and a water outlet joint 7 are calculated to ensure that the simulated result meets the use requirement, the CNC mode is utilized to process the cover plate 3, the base plate 1, the radiating fin 4, the fin brazing filler metal plate 2, the water inlet joint 6 and the water outlet joint 7, the processed fin brazing filler metal plate 2 and the radiating fin 4 are sequentially placed into a groove 5 on the base plate 1 and are covered with the cover plate 3, and a special crimping tool is utilized to fix the positions of all components and is placed into a brazing furnace; and after welding, a final finished product is processed by utilizing a CNC (computer numerical control) processing mode, and a water inlet connector 6 and a water outlet connector 7 are installed.
The utility model discloses a theory of operation:
when cooling water enters the cold plate from the water inlet joint 6, the cooling water flows into the first water collecting tank 8 according to the direction shown by the arrow; after the first water collecting tank 8 is filled, the water flow uniformly flows through the left and right radiating fins 4 under the action of pressure; when water flows through the radiating fins 4, heat generated by devices above the radiating fins 4 during working is taken away; the water flow flows into the second water collecting tank 9 after passing through the radiating fins, and the water in the second water collecting tank 9 continuously flows through the water outlet joint 7 in the direction shown by the arrow after being fully stored; finally, the heat generated when the device works is taken out to the outside of the cold plate; the hot water left out of the brazing type water cooling plate is changed into cold water through forced cooling and then flows into the water inlet joint 6, and finally a working cycle is formed.
As shown in fig. 1, in the utility model, the width of the first water collecting groove 8 is greater than the width of the water inlet channel 10 so as to store water, thereby ensuring that water flow can enter two heat dissipation fins 4 simultaneously, and the width of the second water collecting groove 9 is greater than the water outlet channel 11. The water inlet channel 10 is shown in the figure, firstly extends from one end of the substrate 1 to the parallel direction of the length of the groove 5, then inclines to the direction close to the groove 5, then extends to the parallel direction of the width of the groove 5, and flows into the groove 5 through the first water collecting groove 8 on the channel extending to the width direction of the groove 5; the two second water collecting grooves 9 arranged at the grooves 5 are communicated with the water outlet channel 11 after being converged at the middle of the two grooves 5. Through unique rivers passageway design, can guarantee the temperature uniformity demand of device.
The utility model discloses a base plate 1, brazing filler metal board 2, apron 3, radiating fin 4 are the aluminum product and are convenient for process and heat transfer, and for dismouting and corrosion-resistant consideration many times, water inlet joint 6, delivery port joint 7 are stainless steel.
Claims (7)
1. The utility model provides a be applied to radiating brazing type water-cooling plate of land wind-powered electricity generation power semiconductor device, includes base plate, brazing filler metal board and apron are located in proper order the substrate surface, its characterized in that: the base plate is provided with two grooves in parallel, the two grooves are internally provided with a radiating fin respectively, one end of each of the two grooves is communicated with the water inlet channel, the other end of each of the two grooves is communicated with the water outlet channel, the water inlet channel is provided with a water inlet joint, the water outlet channel is provided with a water outlet joint, the water inlet channel and the two grooves are communicated to form a first water collecting tank, and the water outlet channel and the grooves are communicated to form a second water collecting tank.
2. The brazing type water cooling plate applied to heat dissipation of the land wind power semiconductor device as claimed in claim 1, wherein: the width of the first water collecting groove is larger than that of the water inlet channel, and the width of the second water collecting groove is larger than that of the water outlet channel.
3. The brazing type water cooling plate applied to heat dissipation of the land wind power semiconductor device as claimed in claim 1, wherein: the water inlet connector and the water outlet connector are arranged on the same side of the substrate.
4. The brazed water cooling plate applied to land wind power semiconductor device heat dissipation of claim 3, wherein: the water inlet channel firstly extends from one end of the substrate to the direction parallel to the length of the groove, then inclines towards the direction close to the groove, then extends towards the direction parallel to the width of the groove, and flows into the groove through the first water collecting groove on the channel extending towards the width of the groove.
5. The brazed water cooling plate applied to land wind power semiconductor device heat dissipation of claim 4, wherein: the two second water collecting grooves arranged at the grooves are communicated with the water outlet channel after being converged at the middle of the two grooves.
6. The brazing type water cooling plate applied to heat dissipation of the land wind power semiconductor device as claimed in claim 1, wherein: the base plate, the brazing plate, the cover plate and the radiating fins are all made of aluminum materials, and the water inlet connector and the water outlet connector are made of stainless steel materials.
7. The brazing type water cooling plate applied to heat dissipation of the land wind power semiconductor device as claimed in claim 1, wherein: the base plate and the cover plate are connected through a brazing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920299887.7U CN209882443U (en) | 2019-03-08 | 2019-03-08 | Brazing type water cooling plate applied to land wind power semiconductor device heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920299887.7U CN209882443U (en) | 2019-03-08 | 2019-03-08 | Brazing type water cooling plate applied to land wind power semiconductor device heat dissipation |
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| Publication Number | Publication Date |
|---|---|
| CN209882443U true CN209882443U (en) | 2019-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920299887.7U Active CN209882443U (en) | 2019-03-08 | 2019-03-08 | Brazing type water cooling plate applied to land wind power semiconductor device heat dissipation |
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| CN (1) | CN209882443U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116618619A (en) * | 2023-07-06 | 2023-08-22 | 山西昌鸿电力器材有限公司 | Cooling device for hardware casting mold |
-
2019
- 2019-03-08 CN CN201920299887.7U patent/CN209882443U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116618619A (en) * | 2023-07-06 | 2023-08-22 | 山西昌鸿电力器材有限公司 | Cooling device for hardware casting mold |
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