CN217644098U - High-power pulse power amplifier heat abstractor - Google Patents
High-power pulse power amplifier heat abstractor Download PDFInfo
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- CN217644098U CN217644098U CN202221334041.0U CN202221334041U CN217644098U CN 217644098 U CN217644098 U CN 217644098U CN 202221334041 U CN202221334041 U CN 202221334041U CN 217644098 U CN217644098 U CN 217644098U
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Abstract
The utility model discloses a high-power pulse power amplifier heat dissipation device, belonging to the field of pulse power amplification, comprising a cold plate and a plurality of power amplifier modules; the cold plate comprises a plate body, a plate cover and a connector, wherein a liquid cooling runner communicated with the liquid inlet and the liquid outlet is formed in the plate body, and the connector is fixed at the liquid inlet and the liquid outlet of the plate body; the liquid cooling runner comprises a plurality of sub-runners which are sequentially communicated end to end, at least one of the plurality of sub-runners is a high heat flow density runner, the high heat flow density runner corresponds to a chip with high heat consumption in the power amplification module, a plurality of cut-off channels which are vertical to the sub-runners are further arranged in the high heat flow density runner, the cut-off channels penetrate through the sub-runners, and the width of the high heat flow density runner and the number of the sub-runners are larger than those of the rest sub-runners; two liquid passages are arranged in the joint, one ends of the two liquid passages are respectively communicated with the liquid inlet and the liquid outlet correspondingly, and the other ends of the two liquid passages are conical threaded holes. The heat dissipation of the high heat flux area is enhanced while the whole heat dissipation performance of the power amplifier module is ensured.
Description
Technical Field
The utility model belongs to the pulse power amplifier field, concretely relates to high-power pulse power amplifier heat abstractor.
Background
The temperature of electronic components in the power amplifier module is one of the main factors influencing the performance of the power amplifier module, and the heat dissipation problem directly influences the service life of the power amplifier module. At present, the air cooling mode and the liquid cooling mode are adopted, the air cooling mode is the traditional heat exchange means, the air cooling mode is firstly researched and developed and is applied to heat dissipation of various electronic equipment including airborne equipment, and the air cooling heat dissipation has the advantage that external air is directly adopted as a cold source, so that the air cooling heat dissipation device is simple in structure, convenient and easy to operate and low in cost. However, the biggest drawbacks resulting therefrom are three: the first is that the heat exchange capacity is not strong enough, the heat dissipation capacity is at least one order of magnitude smaller than forced convection, and the heat dissipation of the high heat flow density electronic equipment cannot be realized; secondly, the air cooling is greatly influenced by the external weather conditions, and the working stability is not strong enough; and thirdly, the air cooling cold plate has a complex structure and needs a large-size air cooling cold plate for equipment with large heat dissipation capacity.
Liquid cooling, also known as water cooling, is a heat dissipation method using single-phase liquid as a cooling medium, and is widely applied to the heat dissipation field of electronic equipment with high heat flux density. The liquid cooling system mainly comprises a cold plate, a circulating pipeline, a pump and an external heat exchanger. The working principle is simple, the cooling medium flows through the cold plate under the action of the pump to take away waste heat generated by the electronic element, the waste heat is dissipated through the external heat exchanger, the cooled liquid flows back to the cold plate again, and the purpose of heat control is achieved through the circulation and reciprocation, and the cooling medium is commonly used for heat dissipation of high-power electronic devices. The liquid cooling working medium needs to have good heat conductivity, high stability and the like, and common cooling liquids include water, ethanol, ethylene glycol and the like. The liquid cooling cold plate has simple structure and high heat exchange efficiency, and although the integral heat dissipation is greatly improved compared with air cooling, the heat consumption of a part of chips in the power amplifier module is large, and the heat dissipation of the part with high heat flux density still needs to be enhanced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-power pulse power amplifier heat abstractor to solve the regional local heat dissipation problem of hot current density height in the current power amplifier module.
The utility model discloses the technical scheme who adopts does: a high-power pulse power amplifier heat dissipation device comprises a cold plate and a plurality of power amplifier modules fixed on the top surface and the bottom surface of the cold plate, wherein a plurality of chips are arranged in the power amplifier modules; the cold plate comprises a plate body, a plate cover and a connector, wherein a liquid inlet and a liquid outlet are formed in one end of the side surface of the plate body, a liquid cooling runner communicated with the liquid inlet and the liquid outlet is formed in the plate body, and the connector is fixed at the liquid inlet and the liquid outlet of the plate body; the liquid cooling runner comprises a plurality of sub-runners which are sequentially communicated end to end, a plurality of sub-runners are arranged in the sub-runners side by side, and the sub-runners are arranged along the direction of liquid flow; at least one of the plurality of sub-runners is a high heat flow density runner, the high heat flow density runner corresponds to a chip with high heat consumption in the power amplifier module, a plurality of cross-sectional channels perpendicular to the sub-runners are further arranged in the high heat flow density runner, the cross-sectional channels penetrate through the sub-runners, and the width of the high heat flow density runner and the number of the sub-runners are both larger than those of the rest sub-runners; the one end that connects to be close to the plate body is provided with the sealing washer that corresponds inlet and liquid outlet, has seted up two liquid passageways in the joint, and the one end of two liquid passageways corresponds the intercommunication with inlet and liquid outlet respectively, and the other end is awl screw hole.
As a further alternative, both of said liquid passages are L-shaped.
As a further alternative, the joint is clamped with the plate body and fixed with the plate body through screws.
As a further alternative, the top surface and the bottom surface of the cold plate are both provided with a plurality of positioning strips at intervals, and each power amplifier module is positioned between two adjacent positioning strips.
As a further alternative, the power amplifier module comprises a cavity and a cavity cover fixed on the cavity, two side walls of the cavity close to the two positioning strips are respectively provided with a V-shaped groove, and the positioning strips are provided with clamping protrusions correspondingly clamped into the V-shaped grooves.
The beneficial effects of the utility model are that: the high heat flow density runner is enabled to correspondingly flow through a chip with high heat consumption by arranging the high heat flow density runner different from other sub-runners, the high heat flow density runner is enabled to be refined by utilizing a plurality of rows of branch runners, meanwhile, the channel is cut to enhance the timely communication of the branch runners, the liquid flow of all the branch runners is enabled to be balanced, the width of the high heat flow density runner is wider, the number of the branch runners is larger, the heat dissipation of a high heat flow density area with high heat consumption is enhanced, the heat dissipation of the high heat flow density area is enhanced while the integral heat dissipation performance of the power amplifier module is ensured, the heat dissipation is balanced, in addition, the liquid inlet and outlet are integrated at one end of the cold plate through the joint at one end, the cooling medium inlet and outlet pipelines are directly screwed into two conical threaded holes respectively, the connection and the fixation can be realized, the operation is simple and fast, and the efficiency is high.
Drawings
Fig. 1 is a top view of a heat dissipation device of a high-power pulse power amplifier according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a power amplifier module and a cold plate in the high-power pulse power dissipation device according to the embodiment of the present invention;
fig. 3 is a top view of a cold plate body in the high-power pulse power dissipation device according to the embodiment of the present invention;
FIG. 4 is an enlarged view at A in FIG. 1;
fig. 5 is a front view of the heat dissipation device of the high power pulse power amplifier provided in the embodiment of the present invention;
FIG. 6 is an enlarged view at B in FIG. 5;
fig. 7 is a top view of the power amplifier module of the heat dissipation device for high-power pulse power amplifier provided in the embodiment of the present invention;
fig. 8 is a schematic distribution diagram of a hydraulic runner and a power amplifier module in the heat dissipation device for a high-power pulse power amplifier provided by the embodiment of the present invention;
fig. 9 is a simulation diagram of the temperature distribution of the mounting surface of the power amplifier module in the high-power pulse power amplification and radiation device provided by the embodiment of the present invention;
fig. 10 is a simulation diagram of the surface temperature distribution of the cold plate in the heat dissipation device of the high-power pulse power amplifier provided in the embodiment of the present invention;
fig. 11 is a cross-sectional temperature field simulation diagram of a liquid-cold runner in the heat dissipation device of the high-power pulse power amplifier provided by the embodiment of the present invention;
fig. 12 is a cross-sectional velocity field simulation diagram of a liquid-cold runner in the heat dissipation device of the high-power pulse power amplifier provided by the embodiment of the present invention.
In the figure: 1-power amplifier module, 2-chip, 3-plate body, 4-plate cover, 5-joint, 6-liquid inlet, 7-liquid outlet, 8-liquid cooling flow passage, 9-sub flow passage, 10-branch flow passage, 11-high heat flow density flow passage, 12-cut passage, 13-sealing ring, 14-liquid passage, 15-taper thread hole, 16-trip, 17-positioning strip, 18-trip and 19-V type groove.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be briefly described below with reference to the accompanying drawings and the description of the embodiments or the prior art, and it is obvious that the following description of the structure of the accompanying drawings is only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without any inventive work.
The technical solution provided by the present invention will be described in detail by way of embodiments with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In some instances, some embodiments are not described or not in detail, as they are conventional or customary in the art.
Furthermore, the technical features described herein, or steps in all methods or processes disclosed, may be combined in any suitable manner in one or more embodiments, in addition to the mutually exclusive features and/or steps. It will be readily appreciated by those of skill in the art that the order of the steps or operations of the methods associated with the embodiments provided herein may be varied. Any order in the drawings and examples is for illustrative purposes only and does not imply that a certain order is required unless explicitly stated to be required.
Fig. 1 to 8 show a high-power pulse power amplifier heat dissipation device provided by an embodiment of the present invention, which includes a cold plate and a plurality of power amplifier modules 1 fixed on the top surface and the bottom surface of the cold plate, wherein a plurality of chips 2 are disposed in the power amplifier modules 1; the cold plate comprises a plate body 3, a plate cover 4 and a connector 5, wherein a liquid inlet 6 and a liquid outlet 7 are formed in one end of the side surface of the plate body 3, a liquid cooling runner 8 for communicating the liquid inlet 6 with the liquid outlet 7 is formed in the plate body 3, and the connector 5 is fixed at the liquid inlet 6 and the liquid outlet 7 of the plate body 3; the liquid cooling runner 8 comprises a plurality of sub-runners 9 which are sequentially communicated end to end, a plurality of sub-runners 10 are arranged in the sub-runners 9 side by side, and the sub-runners 10 are arranged along the direction of liquid flow; at least one of the plurality of sub-runners 9 is a high heat flux density runner 11, the high heat flux density runner 11 corresponds to the chip 2 with high heat consumption in the power amplifier module 1, a plurality of cross-sectional channels 12 perpendicular to the sub-runners 10 are further arranged in the high heat flux density runner 11, the cross-sectional channels 12 penetrate through the sub-runners 10, and the width of the high heat flux density runner 11 and the number of the sub-runners 10 are both larger than that of the rest of the sub-runners 9; the one end that connects 5 to be close to plate body 3 is provided with the sealing washer 13 that corresponds inlet 6 and liquid outlet 7, has seted up two liquid route 14 in connecting 5, and the one end of two liquid route 14 corresponds the intercommunication with inlet 6 and liquid outlet 7 respectively, and the other end is awl screw hole 15.
The liquid inlet 6 and the liquid outlet 7 are communicated with the top surface of the plate body 3 like the liquid cooling runner 8, and the plate cover 4 is fixed on the plate body 3 in a sealing way. The end-to-end sub-flow channels 9 sequentially flow through different chips 2 of the cold plate front and back side power amplifier module 1, wherein the high heat flow density flow channel 11 corresponds to the area of the chip 2 with large heat loss in the power amplifier module 1, as shown in fig. 8, the chips 2 in the power amplifier module 1 are distributed as shown in fig. 7 in this embodiment, and the parameters of the five chips 2 are shown in table 1. The chips A1 and A2 have large heat consumption, and the high heat flow density runner 11 corresponds to the areas A1 and A2 of all the power amplifier modules 1 to strengthen heat dissipation.
TABLE 1
| Serial number | Number of bits | Heat loss (W) | Thermal resistance (DEG C/W) | Temperature regulation (℃） |
| 1 | A1 | 60.27 | 0.5 | 180 |
| 2 | A2 | 60.27 | 0.5 | 180 |
| 3 | A3 | 18.3 | 0.6 | 180 |
| 4 | A4 | 4.1 | 2.5 | 225 |
| 5 | A5 | 2.9 | 3 | 225 |
The taper threaded hole 15 corresponds to the joint 5 of the matched connection water pipe and the like, the joint 5 not only enables the liquid inlet and outlet 7 to be connected with the external water pipe in an integrated and rapid mode, but also avoids the interference between the liquid inlet 6 and the liquid outlet 7 which are close to the arrangement when the water pipes are connected respectively. The liquid passages 14 are all arranged in an L shape, so that the volume and the occupied space of the joint 5 are reduced while the effect is achieved.
Connect 5 and plate body 3 joint to pass through the fix with screw with plate body 3, specifically can be that the one end that connects 5 sets up trip 16, and is corresponding, 3 one side of plate body set up with the draw-in groove of trip 16 adaptation, the other end that connects 5 then passes through the screw-up in 3 sides of the plate body, carries out preliminary location installation through trip 16 like this, recycles the screw and fastens fixedly.
The top surface and the bottom surface of cold drawing all are provided with a plurality of location strip 17 at an interval, and each power amplifier module 1 is located between two adjacent location strips 17, installs through power amplifier module 1 and fixes a position between two location strips 17, and is easy to assemble. The specific power amplifier module 1 comprises a cavity and a cavity cover fixed on the cavity, wherein V-shaped grooves 19 are respectively formed in two side walls of the cavity close to the two positioning strips 17, the positioning strips 17 are provided with clamping protrusions 18 correspondingly clamped into the V-shaped grooves 19, the power amplifier module 1 is fixed between the positioning strips 17 through the matching of the clamping protrusions 18 and the V-shaped grooves 19, and the positioning strips 17 play a certain heat dissipation role while playing a role in positioning the power amplifier module 1.
In this embodiment, the liquid cooling working medium is 65 # antifreeze solution, the cavity material of the power amplifier module 1 is 6063 aluminum alloy, the ambient temperature is 50 ℃, the inlet temperature of the liquid cooling working medium is 15 ℃ (i.e. 65 ℃) higher than the ambient temperature, and the inlet flow of the liquid cooling plate is 6.5L/min. In the working process, the simulation graph of the temperature distribution of the mounting surface of the power amplifier module 1 is shown in figure 9, the simulation graph of the temperature distribution of the surface of the cold plate is shown in figure 10, the simulation graph of the section temperature field of the liquid cooling runner 8 is shown in figure 11, and the simulation graph of the section velocity field is shown in figure 12.
According to the simulation result, the following results are obtained:
(1) The thermal resistance of the chips A1 and A2 is 0.5 ℃/W, and the calculated junction temperature is 90.84+0.5 multiplied by 60.3=120.99 ℃;
(2) The chip thermal resistance of A3 is 0.6 ℃/W, the calculated junction temperature is 77.59+0.6 multiplied by 18.3=88.57 ℃;
(3) The thermal resistance of the A4 chip is 2.5 ℃/W, and the calculated junction temperature is 76.66+2.5 multiplied by 4.1=86.91 ℃;
(4) The chip thermal resistance of A5 is 3 ℃/W, and the calculated junction temperature is 77.13+3 multiplied by 2.9=85.83 ℃;
(5) The pressure difference of the liquid cooling inlet and the liquid cooling outlet is 2.976Kpa;
all the chip junction temperatures are far less than the allowable junction temperatures, and the heat dissipation requirements are met.
The present invention is not limited to the above-mentioned optional embodiments, and any other products in various forms can be obtained by anyone under the teaching of the present invention, and any changes in the shape or structure thereof, all the technical solutions falling within the scope of the present invention, are within the protection scope of the present invention.
Claims (5)
1. The high-power pulse power amplifier heat dissipation device is characterized by comprising a cold plate and a plurality of power amplifier modules fixed on the top surface and the bottom surface of the cold plate, wherein a plurality of chips are arranged in the power amplifier modules; the cold plate comprises a plate body, a plate cover and a joint, wherein one end of the side surface of the plate body is provided with a liquid inlet and a liquid outlet, a liquid cooling runner communicated with the liquid inlet and the liquid outlet is arranged on the plate body, and the joint is fixed at the liquid inlet and the liquid outlet of the plate body; the liquid cooling runner comprises a plurality of sub-runners communicated end to end in sequence, a plurality of sub-runners are arranged in the sub-runners side by side, and the sub-runners are arranged along the direction of liquid flow; at least one of the plurality of sub-runners is a high heat flow density runner, the high heat flow density runner corresponds to a chip with high heat consumption in the power amplifier module, a plurality of cross-sectional channels perpendicular to the sub-runners are further arranged in the high heat flow density runner, the cross-sectional channels penetrate through the sub-runners, and the width of the high heat flow density runner and the number of the sub-runners are both larger than those of the rest sub-runners; the one end that connects to be close to the plate body is provided with the sealing washer that corresponds inlet and liquid outlet, has seted up two liquid passageways in the joint, and the one end of two liquid passageways corresponds the intercommunication with inlet and liquid outlet respectively, and the other end is awl screw hole.
2. The heat dissipating device of a high power pulse power amplifier according to claim 1, wherein both of the liquid passages are L-shaped.
3. The heat dissipation device for the high-power pulse power amplifier according to claim 1, wherein the joint is clamped with the plate body and fixed with the plate body through a screw.
4. The heat dissipating device of a high power pulse power amplifier of claim 1, wherein the top surface and the bottom surface of the cold plate are both provided with a plurality of positioning bars at intervals, and each power amplifier module is located between two adjacent positioning bars.
5. The heat dissipation device for the high-power pulse power amplifier according to claim 4, wherein the power amplifier module comprises a cavity and a cavity cover fixed on the cavity, the two side walls of the cavity close to the two positioning strips are respectively provided with a V-shaped groove, and the positioning strips are provided with a clamping protrusion correspondingly clamped into the V-shaped grooves.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221334041.0U CN217644098U (en) | 2022-05-31 | 2022-05-31 | High-power pulse power amplifier heat abstractor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221334041.0U CN217644098U (en) | 2022-05-31 | 2022-05-31 | High-power pulse power amplifier heat abstractor |
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| Publication Number | Publication Date |
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| CN217644098U true CN217644098U (en) | 2022-10-21 |
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| CN202221334041.0U Active CN217644098U (en) | 2022-05-31 | 2022-05-31 | High-power pulse power amplifier heat abstractor |
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