CN207021255U - A kind of modular IGBT liquid cooling plates - Google Patents

Abstract

The utility model discloses a modularized IGBT liquid cold plate. The IGBT liquid cold plate comprises: a base plate; The tank is connected with a liquid inlet flow channel, and the second liquid flow tank is connected with a liquid outlet flow channel; the first liquid flow tank and the second liquid flow tank are connected through an intermediate liquid flow channel; Both the first liquid flow tank and the second liquid flow tank are composed of multiple liquid flow tanks of the same size connected in parallel; a sealing ring for sealing the IGBT module is arranged above the substrate; a sealing ring for sealing the IGBT module is arranged above the substrate; The cover plate that is closed with the sealing ring. The utility model makes the channel flow distribution under each IGBT module uniform through the IGBT liquid cooling plate, the surface of the liquid cooling plate has good temperature uniformity, the pressure drop of the inlet and outlet is controlled within a reasonable range, the heat dissipation power is high, and the overall sealing performance it is good.

Description

A modular IGBT liquid cold plate

technical field

The utility model relates to the heat dissipation technology of electronic devices, in particular to a modularized IGBT liquid cooling plate.

Background technique

With the increasing heat flux density of electronic device packaging, it is difficult for a single-channel cold plate structure to meet its heat dissipation requirements. For the design of mesoscale cold plate structures, multi-channel cold plate structures are increasingly favored by researchers. With the development of the new energy industry, IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor or high-power switching device) has gradually been widely used as a high-power switching device. The IGBT module is mainly a package for a series of chips. The internal chips are IGBT chips and diode chips, which are often accompanied by high heat flux in the actual working process. Therefore, the failure of the IGBT module is mainly due to overheating failure. The timely dissipation of heat inside the IGBT module is the key problem to be solved at present. Due to the simple structure of the cold plate, compact structure, high efficiency, and wide range of thermal loads, but as the heat flux density of the chip continues to expand, the single-channel cold plate structure no longer meets its heat dissipation requirements.

The traditional IGBT module cold plate structure is mostly a series S-shaped single-channel cold plate structure or a multi-channel cold plate structure, that is, the main topology of the flow channel is S-shaped, and the cold plate structure is usually only designed for a specific number of IGBT modules. The traditional flow channel has the following disadvantages: (1) In the S-type single-channel or multi-channel structure in series, the inlet and outlet pressure loss along the way is relatively large, which will cause a large pressure drop, so the power requirement for the circulating pump of the liquid cooling system is high , the required cost increases accordingly (2) The traditional cold plate structure is likely to cause a large temperature difference on the surface of the cold plate when the inlet and outlet channels are too long, which may easily lead to uneven distribution of thermal stress and failure; (3) the traditional cold plate The structure is only designed for a certain number of IGBT modules. When the number of modules increases or decreases, the cold plate structure needs to be redesigned, which does not have good versatility.

Therefore, the prior art still needs to be improved and developed.

Utility model content

The technical problem to be solved by the utility model is to provide a modular IGBT liquid cooling plate for the above-mentioned defects of the prior art, aiming to make the channel flow distribution under each IGBT module uniform through the IGBT liquid cooling plate, The surface of the liquid cold plate has good temperature uniformity, the pressure drop of the inlet and outlet is controlled within a reasonable range, and the heat dissipation power is high. It has good versatility for the cold plate structure design of other numbers of IGBT modules, making the entire flow channel structure easy to process. The overall sealing is good.

The technical solution adopted by the utility model to solve technical problems is as follows:

A modular IGBT liquid cold plate, wherein the modular IGBT liquid cold plate includes:

A substrate arranged on the lower end surface of the IGBT module;

A first liquid flow groove and a second liquid flow groove for cooling the IGBT module are arranged in series on the upper end of the substrate;

The first liquid flow tank is connected with a liquid inlet flow channel, and the second liquid flow tank is connected with a liquid outlet flow channel;

The first liquid flow tank is connected to the second liquid flow tank through an intermediate liquid flow channel;

Both the first liquid flow tank and the second liquid flow tank are composed of a plurality of liquid flow tanks of the same size connected in parallel;

A sealing ring for sealing the IGBT module is arranged above the substrate;

A cover plate for covering the base plate and the sealing ring is arranged above the base plate.

In a preferred solution, in the modularized IGBT liquid cold plate, the liquid inlet channel and the liquid outlet channel are arranged in a symmetrical structure.

In a preferred solution, in the modularized IGBT liquid cold plate, a plurality of fins with the same pitch are arranged in the middle of the liquid flow groove, and the fins are used to transfer the cooling liquid flowing through the liquid flow groove Divided into multiple channels.

In the preferred solution, the modularized IGBT liquid cold plate, wherein, the liquid flow tank is provided with an inlet part where the IGBT module is placed to adjust the uneven flow distribution between the IGBT modules and increase the liquid cold plate Chamfer for surface temperature uniformity.

In a preferred solution, the modularized IGBT liquid cold plate, wherein, the chips in the IGBT module are distributed directly above the middle multi-channel area; one end of the liquid flow tank is provided with a number of deflectors, and the The deflector is used to control the concentration of coolant in the multi-channel area directly under the heat-generating chip to increase heat exchange efficiency.

In a preferred solution, in the modularized IGBT liquid cold plate, the number of the guide fins is six, and the pitch of the guide fins is the same as that of the fins in the multi-channel.

In the preferred solution, the modularized IGBT liquid cold plate, wherein, the upper end surface of the substrate is provided with several local spoiler structures in the chip layout area of the IGBT module, so as to increase the convective flow of the substrate in the liquid flow tank Fluid turbulence properties.

In a preferred solution, in the modularized IGBT liquid-cooled plate, the local spoiler structure includes: a circular structure, a square structure or a rhombus structure.

In a preferred solution, the modularized IGBT liquid cold plate, wherein the base plate and the cover plate are connected by screws;

The base plate and the cover plate are processed by aluminum plate, copper-aluminum composite plate or aluminum alloy profiles with high thermal conductivity.

Compared with the prior art, the utility model provides a modular IGBT liquid cold plate, the IGBT liquid cold plate includes: a substrate arranged on the lower end surface of the IGBT module; Circulate the first liquid flow tank and the second liquid flow tank for cooling the IGBT module; the first liquid flow tank is connected with a liquid inlet channel, and the second liquid flow tank is connected with a liquid outlet flow channel The first liquid flow tank and the second liquid flow tank are connected through an intermediate liquid flow channel; the first liquid flow tank and the second liquid flow tank are both composed of a plurality of liquid flow tanks of the same size connected in parallel; A sealing ring for sealing the IGBT module is arranged above the substrate; a cover plate for covering the substrate and the sealing ring is arranged above the substrate. The utility model makes the channel flow distribution under each IGBT module uniform through the IGBT liquid cooling plate, the surface of the liquid cooling plate has good temperature uniformity, the pressure drop of the inlet and outlet is controlled within a reasonable range, and the heat dissipation power is high. For other numbers The cold plate structure design of the advanced IGBT module has good versatility, which makes the entire flow channel structure easy to process and has good overall sealing.

Description of drawings

Fig. 1 is a schematic diagram of the combination structure of liquid flow grooves on the substrate of a preferred embodiment of the modularized IGBT liquid cooling plate of the present invention.

Fig. 2 is a schematic diagram of the flow channel structure and heat source distribution structure of a preferred embodiment of the modularized IGBT liquid cooling plate of the present invention.

Fig. 3 is a structural schematic diagram of the spoiler column and the heat source concentration area on the substrate of the preferred embodiment of the modularized IGBT liquid cooling plate of the present invention.

Fig. 4 is a structural schematic diagram of three shapes of spoiler columns on the substrate of the preferred embodiment of the modularized IGBT liquid-cooled plate of the present invention.

Fig. 5 is a schematic diagram of the internal channel structure of the substrate of the preferred embodiment of the modularized IGBT liquid cooling plate of the present invention.

Fig. 6 is a schematic diagram of the composition and structure of the entire liquid cooling plate of a preferred embodiment of the modularized IGBT liquid cooling plate of the present invention.

detailed description

In order to make the purpose, technical solution and advantages of the utility model more clear and definite, the utility model will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

The utility model provides a modular IGBT liquid cold plate, as shown in Figure 1, the modular IGBT liquid cold plate includes: a substrate 10 arranged on the lower end surface of the IGBT module; the upper end of the substrate 10 is arranged in series A first liquid flow tank 11 and a second liquid flow tank 12 for cooling the IGBT module through circulation of cooling liquid; the first liquid flow tank 11 is communicated with a liquid inlet flow channel 13, and the second liquid flow tank 12 is communicated with a liquid outlet channel 14; of course, a liquid outlet channel 14 can also be provided in communication with the first liquid flow tank 11, and a liquid inlet channel 13 is provided in communication with the second liquid channel 12, which conforms to the one-in-one-out The rules will do.

The first liquid flow tank 11 and the second liquid flow tank 12 are connected through an intermediate liquid flow channel 15; the first liquid flow tank 11 and the second liquid flow tank 12 are composed of a plurality of liquid flows of the same size The grooves are connected in parallel; as shown in Figure 1, the preferred mode of the present invention is that the first liquid flow groove 11 is composed of 2 liquid flow grooves of the same size, and the second liquid flow groove 12 is composed of 2 liquid flow grooves of the same size. Composition of liquid flow tanks, of course, other numbers of liquid flow tanks can also be connected in parallel to form the first liquid flow tank 11 and the second liquid flow tank 12 .

As shown in FIG. 6 , a sealing ring 19 for sealing the IGBT module is arranged above the substrate 10 ; a cover plate 21 for covering the substrate 10 and the sealing ring 19 is arranged above the substrate 10 .

IGBT (Insulated Gate Bipolar Transistor), Insulated Gate Bipolar Transistor, is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (Bipolar Transistor) and MOS (Insulated Gate Field Effect Transistor), with MOSFET The advantages of high input impedance and low conduction voltage drop of GTR.

The IGBT module is mainly a package for a series of chips. The internal chips are IGBT chips and diode chips. In the modular liquid cold plate structure, the chip is mainly arranged directly above the middle multi-channel area, and the fluid domain 3 fully fills the middle multi-channel area. The liquid inlet channel 13 and the liquid outlet channel 14 are arranged in a symmetrical structure, which can enhance the interchangeability between liquid cooling plates of a single IGBT module.

As shown in Figure 6, the substrate 10 is provided with a liquid inlet 22 connected with the liquid inlet channel 13, and a liquid outlet 23 connected with the liquid outlet channel 14, the liquid inlet 22 and the outlet The liquid port 23 is preferably arranged at the same end of the substrate 10 so as to recycle the cooling liquid and simplify the structure of the liquid cold plate. The liquid inlet 22 is connected to a conversion interface 24, and the liquid outlet 23 is connected to a conversion interface 25. The size and structure of the conversion interface 24 and the conversion interface 25 are the same, which is convenient to improve the interchangeability between IGBT modules.

Among them, the liquid inlet channel 13 and the liquid outlet channel 14 preferably adopt a cylindrical structure, on the one hand to ensure the smooth flow of the cooling liquid in it, and on the other hand to facilitate the connection between the liquid inlet 22 and the joint (the joint refers to the cooling liquid The joint between the source and the substrate 10), and on the other hand, the flow distribution at the inlets of multiple liquid flow channels can be evenly distributed. The single liquid flow tank is preferably a hexagonal structure, which makes the width of the liquid flow channel increase gradually from the entrance to the middle area, so that the cooling liquid can fully contact the middle area while preventing the cooling liquid from being too dispersed at the entrance , resulting in uneven flow. The transitional connection mode is adopted between the liquid flow tank and the liquid inlet flow channel 13, the liquid outlet flow channel 14 and the intermediate flow channel 15, so that the inlet of the liquid flow tank can be made very small, and the two inlet parts in the liquid inlet flow channel 13 The surface area of the liquid inlet flow channel 13 is relatively small, so that the cooling liquid in the liquid inlet flow channel 13 can fully contact the inlet parts of the two liquid flow channels, and the gap between each parallel liquid flow channel can be greatly improved. The uniformity of the flow distribution is the same as the design principle of the outlet flow channel 14 .

In a further preferred embodiment of the present utility model, as shown in Figure 5, the middle part of the liquid flow tank is provided with a plurality of fins 16 with the same spacing, and the number of fins 16 in the present utility model is preferably 15 (the The liquid flow slot is divided into 16 channels), and the fins 16 are used to divide the cooling liquid flowing through the liquid flow slot into multiple channels.

Further, the fins 16 can be arranged in a straight line or a corrugated type, that is, a straight fin structure or a corrugated structure. When it is set in a straight fin structure, the straight fins are arranged in a close-packed manner, and the structure The feature is that the densely packed straight fins can cooperate with the liquid flow groove to form a multi-channel flow channel structure, which can greatly reduce the resistance along the flow channel. The design of the corrugated structure is the same as that of the straight fin structure, and will not be repeated here. The close-packed straight fins can also be replaced with several cylinders to increase the turbulence performance of the substrate 10 on the fluid flowing in the liquid flow channel.

Among them, the cross section of the fluid domain 3 is enlarged (horizontally and vertically) in the middle area, the structural design of the transition from the inlet to the middle area adopts a gradual expansion type, the structural design from the middle area to the outlet adopts a tapered type, and the middle area is designed as a multi-channel Fin structure; as shown in Figure 3, the upper end surface of the substrate 10 is provided with several local spoiler structures in the chip layout area 4 of the IGBT module (that is, the heat source concentration area) to increase the convection flow of the substrate in the liquid flow tank The turbulence performance of the internal fluid; as shown in Figure 4, the local turbulence structure arranged can be a circular structure 5, a square structure 6 or a rhombus structure 7, wherein the rhombus structure 7 can overcome the circular structure 5 destroying the velocity boundary The disadvantage of weak layers also overcomes the disadvantage of insufficient contact between the square structure 6 and the fluid domain, and has the advantage of high local heat exchange efficiency.

In a further preferred embodiment of the present utility model, as shown in Fig. 5, the liquid flow tank is provided at the entrance of the IGBT module to adjust the uneven flow distribution between the IGBT modules and increase the surface of the liquid cooling plate. Uniform chamfer 18. The utility model proposes adding a chamfer structure 18 to the inlet part of a single IGBT module, which can effectively control the flow distribution ratio between adjacent IGBT modules, can effectively adjust the problem of uneven flow distribution between IGBT modules, and increase the surface of the liquid cooling plate. temperature uniformity.

In a further preferred embodiment of the present utility model, as shown in Figure 5 and Figure 6, since the chips in the IGBT module are distributed directly above the middle multi-channel area, one end of the liquid flow tank is provided with several flow guides 17. The deflector 17 is used to control the concentration of cooling liquid in the multi-channel area directly under the heat-generating chip to increase heat exchange efficiency. The number of guide vanes 17 in the utility model is preferably 6, and the spacing of the guide vanes 17 is the same as that of the fins 16 in the multi-channel, so that the fluid can be effectively concentrated in the multi-channel area In the 6 small channels in the middle, the flow distribution of the small channels inside the module shows a normal distribution trend, which is also the area directly under the heating chip (chip layout area 4). The heat dissipation effect of the middle area is better, which can effectively increase the heat transfer efficiency .

In a further preferred embodiment of the present utility model, as shown in FIG. 6, the base plate and the cover plate are connected by screws 20 (the screw types at different positions are set according to needs), and the base plate 10 and the cover plate A sealing ring 16 is also arranged between the plates 21, and the sealing ring 16 can effectively control the tightness of the entire cold plate structure; in addition, the base plate 10 and the cover plate 21 are made of aluminum plates with high thermal conductivity, copper-aluminum composite plates or Aluminum alloy profiles (aluminum plate or aluminum extruded profiles) are welded by friction stir welding.

At the same time, the utility model adopts a liquid-cooled plate structure which is actually a modular structure, which has a good market prospect, is convenient to assemble and disassemble, and has good sealing performance of the liquid-cooled plate. Moreover, since the base plate 10 of the entire liquid cooling plate adopts a symmetrical structure, the positions of the inlet and the outlet can be reversed, and only the installation direction of the cover plate needs to be changed.

The liquid cold plate of this structure not only overcomes the problems of excessive flow resistance of a single channel and uneven flow distribution of multiple channels, but also makes the whole liquid cold plate have good temperature uniformity and low pressure drop at the inlet and outlet. Adjusting the fin structure of the cover plate can effectively change The heat dissipation capability of the entire cold plate, the manufacturing process of the structure of the base plate 10 and the cover plate 21 are mature and simple.

The purpose of this utility model is to overcome the shortcomings of the traditional runner structure design ideas, and propose a modular design of cold plate structure. The utility model has the advantage of finding the best comprehensive heat dissipation performance under the premise of meeting the required performance indicators. The topological connection structure of the flow channel, that is, the utility model adopts the method of two parallel and two strings (two parallel and two strings of the liquid flow tank), the optimal structure has the smallest pressure drop at the inlet and outlet, and the structure is compact. The interchangeability between them is good, the installation and disassembly of the liquid cold plate are flexible and convenient, and the heat dissipation power is large.

In summary, the utility model provides a modular IGBT liquid cold plate, the IGBT liquid cold plate includes: a substrate arranged on the lower end surface of the IGBT module; The first liquid flow tank and the second liquid flow tank for cooling the IGBT module; the first liquid flow tank is connected with a liquid inlet flow channel, and the second liquid flow tank is connected with a liquid outlet flow channel; The first liquid flow tank and the second liquid flow tank are connected through an intermediate liquid flow channel; the first liquid flow tank and the second liquid flow tank are both composed of a plurality of liquid flow tanks of the same size connected in parallel; the substrate A sealing ring for sealing the IGBT module is arranged above; a cover plate for covering the substrate and the sealing ring is arranged above the substrate. The utility model makes the channel flow distribution under each IGBT module uniform through the IGBT liquid cooling plate, the surface of the liquid cooling plate has good temperature uniformity, the pressure drop of the inlet and outlet is controlled within a reasonable range, and the heat dissipation power is high. For other numbers The cold plate structure design of the advanced IGBT module has good versatility, which makes the entire flow channel structure easy to process and has good overall sealing.

In the specific embodiment proposed by the utility model, there are many alternatives, such as the first liquid flow tank and the second liquid flow tank. Two (for example, 3 or 4) liquid flow channels are connected in parallel; the connection mode of the transition between the cylindrical liquid inlet channel 13 and the liquid outlet channel 14 and the hexagonal cavity flow channel (ie, the internal shape of the liquid flow channel), Alternatives can be quadrilateral inlet and outlet channels and quadrilateral cavity transition connections. Alternatives can be a V-shaped structure of the middle fin structure, a straight row fork structure, a corrugated structure, etc.; the chamfered part of the multi-channel liquid cooling plate can be replaced by an increase in the size of the inlet of the local module, and the number and spacing of the deflectors The design may not be constrained according to the fin spacing in the middle area, etc.; a deflector 17 is added at the entrance, and the alternative can be a flat plate with fins, and the shape of the deflector 17 can be replaced by a cylindrical spoiler. The separated modular design adopted in the utility model can be replaced by an integral design on the existing basis.

It should be understood that the application of the present utility model is not limited to the above examples, and those skilled in the art can improve or change according to the above description, and all these improvements and changes should belong to the protection of the appended claims of the present utility model scope.

Claims (9)

1. a kind of modular IGBT liquid cooling plates, it is characterised in that the modular IGBT liquid cooling plates include：

It is arranged at the substrate of IGBT module lower surface；

The substrate upper end is arranged in series cooling but logical the first spout cooled down to the IGBT module of liquid stream and the Two spouts；

First spout is provided with and communicated with a feed liquor runner, and second spout is provided with and communicated with one and goes out liquid stream road；

First spout is connected with second spout by an intermediate liquid stream road；

First spout and the second spout compose in parallel by multiple size identical spouts；

The surface is provided with a sealing ring for being used to seal IGBT module；

The surface is provided with a cover plate for being covered the substrate and sealing ring.

2. modular IGBT liquid cooling plates according to claim 1, it is characterised in that the feed liquor runner with it is described go out liquid Runner is arranged to symmetrical structure.

3. modular IGBT liquid cooling plates according to claim 1, it is characterised in that be provided with the middle part of the spout more Individual spacing identical fin, the fin are used to the coolant for flowing through the spout being divided into multiple passages.

4. modular IGBT liquid cooling plates according to claim 1, it is characterised in that the spout is described in placement The import position of IGBT module sets one to be used to adjusting, and flow distribution between IGBT module is uneven and to increase liquid cooling plate surface equal The chamfering of warm nature.

5. modular IGBT liquid cooling plates according to claim 4, it is characterised in that the chip point in the IGBT module Cloth is in the surface in middle multichannel region；Described spout one end is provided with several flow deflectors, and the flow deflector is used to control Multichannel region that coolant processed is concentrated on immediately below euthermic chip increases heat exchange efficiency.

6. modular IGBT liquid cooling plates according to claim 5, it is characterised in that the flow deflector quantity is 6, institute The spacing for stating flow deflector is identical and equal with the spacing of fin in multichannel.

7. modular IGBT liquid cooling plates according to claim 1, it is characterised in that the substrate upper surface is described The chip layout region of IGBT module is provided with several local turbulence structures, to increase substrate to flowing in fluid in spout Flow-disturbing performance.

8. modular IGBT liquid cooling plates according to claim 7, it is characterised in that the local turbulence structure includes： Circular configuration, square structure or diamond structure.

9. modular IGBT liquid cooling plates according to claim 1, it is characterised in that pass through between the substrate and cover plate Screw is attached；

The substrate and cover plate are process using aluminium sheet, copper-aluminum composite board or the aluminium alloy extrusions of high thermal conductivity coefficient.