CN206685366U - Power device heat abstractor and power device radiating module - Google Patents
Power device heat abstractor and power device radiating module Download PDFInfo
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- CN206685366U CN206685366U CN201720218107.2U CN201720218107U CN206685366U CN 206685366 U CN206685366 U CN 206685366U CN 201720218107 U CN201720218107 U CN 201720218107U CN 206685366 U CN206685366 U CN 206685366U
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Abstract
It the utility model is related to a kind of power device heat abstractor and power device radiating module, the power device heat abstractor includes heat sink body, the first encapsulating structure, the second encapsulating structure, the feed tube for being available for coolant inflow and the drain pipe for being available for coolant to flow out, the at least one slot, at least runner completely cut off with the slot and the cooling passage completely cut off with the slot and runner, the runner and the slot arranged stacked of pluggable power device are provided with the heat sink body.Power device heat abstractor and power device radiating module of the present utility model, multiple heat sinks in the prior art and the welding of water inlet supervisor, water outlet main pipe are replaced with the arranged stacked of runner and slot, avoid excessive pad.
Description
Technical field
The utility model belongs to Heat Dissipation Technology for Power Device field, more particularly to a kind of power device heat abstractor and work(
Rate device radiating module.
Background technology
Power device (such as IGBT) has certain loss at work, and most loss becomes heat.In reality
In application process, IGBT is widely used in the fields such as frequency converter, inverter, electric automobile, IGBT as a power device
Very big loss can be produced during work, these losses are usually expressed as heat.To enable IGBT normal works, it is necessary to add radiating
Device, the most frequently used is exactly that IGBT is arranged among radiator, heat is scattered into surrounding space using radiator, if necessary again
Plus radiator fan or water cooling, to increase radiating efficiency.In addition, to reduce temperature during IGBT work, the side of generally use
Formula is：Reduce IGBT operating currents or select bigger IGBT, increase radiator or be changed to the stronger copper radiator of the capacity of heat transmission
Or heat-pipe radiator.
As shown in figure 1, being a kind of existing IGBT heat abstractors, the heat abstractor includes water inlet supervisor 1a, water outlet main pipe
2a and multiple inside have a heat sink 3a of runner, heat sink 3a both ends be welded on into water supervisor 1a, water outlet main pipe 2a it is outer
Zhou Shang, heat sink 3a both ends internally connect with water inlet supervisor 1a, water outlet main pipe 2a respectively, and to cause, coolant is from water inlet
The entrance for being responsible for 1a enters, and flows through the runner in each heat sink 3a, and after absorbing the heat that IGBT4a is distributed, imports water outlet
2a is responsible for, is flowed out by water outlet main pipe 2a outlet.IGBT4a radiating is realized with this.
But the IGBT heat abstractors shown in Fig. 1, multiple heat sink 3a will weld with water inlet supervisor 1a, water outlet main pipe 2a,
Welding position is more, and manufacturing process is complicated, and cost is higher.
Utility model content
Technical problem to be solved in the utility model is, manufacture more for existing IGBT heat abstractors welding position
Complex process, and the defects of cost is higher, there is provided a kind of power device heat abstractor and power device radiating module.
Technical scheme is used by the utility model solves above-mentioned technical problem：
A kind of power device heat abstractor is provided, including heat sink body, the first encapsulating structure, the second encapsulating structure, is available for
Feed tube that coolant flows into and the drain pipe for being available for coolant to flow out, are provided with pluggable power device on the heat sink body
At least one slot, lead to an at least runner for slot isolation and the coolant completely cut off with the slot and runner
Road, the runner and the slot arranged stacked, first encapsulating structure are sealedly connected on the heat sink body and are in
One end of the runner, first chamber, second encapsulation are formed between first encapsulating structure and one end of the runner
Sealing structure is connected on the heat sink body and the other end in the runner, second encapsulating structure and the runner
The other end between form second chamber, be provided with first encapsulating structure on the outside of the first chamber and with it is described
3rd chamber of first chamber isolation, it is provided with second encapsulating structure on the outside of the second chamber and with described the
4th chamber of two chambers isolation, the feed tube and the 3rd chamber, the drain pipe connect with the 4th chamber
Logical, the cooling passage is communicated between the 3rd chamber and the 4th chamber, and the 3rd chamber is flowed into via the feed tube
Coolant the 4th chamber is flowed into by the cooling passage, and flowed out by the drain pipe, the first chamber and the
Be packaged between two chambers can phase transformation working medium.
Alternatively, the heat sink body is integrally formed by extruding metal.
Alternatively, the heat sink body is hexahedron structure, and the heat sink body has first end face, second end face,
One side, second side, the 3rd side and the 4th side, the first side, second side, the 3rd side and the 4th side are suitable
Secondary connection, and be connected between the first end face and second end face；
The both ends of the runner extend through the first side and the 3rd side；
The both ends of the slot extend through the second side and the 4th side；
The cooling passage both ends extend through the first side and the 3rd side, and the cooling passage is located at
The inner side of the second end face.
Alternatively, the heat sink body, which is located on the inside of the first end face, is provided with the admission chamber mutually completely cut off and goes out liquid
Chamber, the admission chamber and the 3rd chamber, it is described go out sap cavity and the 4th chamber；
Be provided with the first end face inlet opening that is connected with the admission chamber and with it is described go out sap cavity connect go out liquid
Hole, the feed tube are connected on the inlet opening, and the drain pipe is connected on the fluid hole.
Alternatively, the inlet with the 3rd chamber, second envelope are provided with first encapsulating structure
The liquid outlet with the 4th chamber is provided with assembling structure；
The feed tube is connected on the inlet, and the drain pipe is connected on the liquid outlet.
Alternatively, each runner includes being arranged in multiple microchannels of an at least row along power device grafting direction
Hole, the multiple microchannel pore are isolated from each other, and one end of the multiple microchannel pore connects with the first chamber, the multiple
The other end of microchannel pore connects with the second chamber.
Alternatively, the multiple microchannel pore parallel interval is set, and the bearing of trend of the multiple microchannel pore and institute
The bearing of trend for stating slot is orthogonal.
Alternatively, first groove of the first side formed with indent, first encapsulating structure include the first inner cover plate
And first outer cover plate, first inner cover plate are sealedly connected on the outside of first groove, first outer cover plate is tightly connected
In the outside of first inner cover plate, the first chamber is formed at the inner surface of first inner cover plate and first groove
Bottom surface between, the 3rd chamber is formed at the inner surface of first outer cover plate and the outside table of first inner cover plate
Between face；
Second groove of 3rd side formed with indent, second encapsulating structure are included outside the second inner cover plate and second
Cover plate, second inner cover plate are sealedly connected on the outside of second groove, and second outer cover plate is sealedly connected on described
The outside of two inner cover plates, the second chamber be formed at the inner surface of second inner cover plate and second groove bottom surface it
Between, the 4th chamber is formed between the inner surface of second outer cover plate and the outer surface of second inner cover plate.
Alternatively, first groove of the first side formed with indent, first encapsulating structure include the first inner cover plate
And first outer cover plate, step and the first outer step in first, first inner cover plate are provided with the madial wall of first groove
Abutted in embedded first groove of sealing and with step in described first, in embedded first groove of the first outer cover plate sealing
And abutted with first outer step, the outer surface of first outer cover plate is concordant with the first side, first chamber
Room is formed between the inner surface of first inner cover plate and the bottom surface of first groove, and the 3rd chamber is formed at described
Between the inner surface of first outer cover plate and the outer surface of first inner cover plate；
Second groove of 3rd side formed with indent, second encapsulating structure are included outside the second inner cover plate and second
Cover plate, step and the second outer step in second, the second inner cover plate sealing insertion are provided with the madial wall of second groove
Abutted in second groove and with step in described second, in embedded second groove of second outer cover plate sealing and with it is described
Second outer step abuts, and the outer surface of second outer cover plate is concordant with the 3rd side, and the second chamber is formed at
Between the bottom surface of the inner surface of second inner cover plate and second groove, the 4th chamber is formed at second enclosing cover
Between the inner surface of plate and the outer surface of second inner cover plate.
Alternatively, be provided with the heat sink body pluggable multiple power devices multiple slots and with it is the multiple
Multiple runners of slot isolation, the multiple runner and the alternately laminated arrangement of the multiple slot.
In addition, the utility model additionally provides a kind of power device radiating module, it include at least one power device and
Above-mentioned power device heat abstractor, the power device are plugged in the slot of the heat sink body.
Alternatively, it is provided with heat-conducting glue between the madial wall of the power device and the slot.
According to power device heat abstractor of the present utility model and power device radiating module, first chamber and second chamber
Between be packaged with can phase transformation working medium, so, the first encapsulating structure, runner and the second encapsulating structure form heat pipe, due to runner
With slot arranged stacked, power device (such as IGBT) is plugged in slot, and the middle part of runner is corresponding with power device (thermal source)
Position be formed as evaporator section, and the 4th chamber in the 3rd chamber and the second encapsulating structure in the first encapsulating structure is due to having
Coolant flows through, so, the first encapsulating structure, the second encapsulating structure are formed as condensation segment (cold end), and liquid refrigerant is in runner
The heat of middle part (evaporator section) absorbed power device and vaporization, gaseous working medium flow into first chamber and second chamber by runner,
After being contacted with the first encapsulating structure, the second encapsulating structure, gaseous working medium liquidation exothermic reaction, heat passes through the first encapsulating structure, second
Encapsulating structure passes to coolant, and then, liquid refrigerant is back to the middle part of runner, and with this, the heat of power device passes through cold
But liquid band is walked, and realizes the radiating of power device.Also, due to sharing cell wall between runner and slot, thus, runner and slot it
Between thermal resistance it is minimum, the radiating efficiency of power device is high, is radiated suitable for high power device.In addition, with runner and the layer of slot
Laying up is put instead of multiple heat sinks in the prior art and water inlet supervisor, the welding of water outlet main pipe, can avoid excessive pad,
Manufacturing process is simple, and cost is relatively low.
Brief description of the drawings
Fig. 1 is the schematic perspective view of existing IGBT heat abstractors；
Fig. 2 is the stereogram for the power device radiating module that the utility model first embodiment provides；
Fig. 3 be the utility model first embodiment provide power device radiating module exploded view (the first outer cover plate and
Second outer cover plate separates)；
Fig. 4 is exploded view (the first outer cover plate, for the power device radiating module that the utility model first embodiment provides
One inner cover plate, the second outer cover plate and the separation of the second inner cover plate)；
Fig. 5 is the top view for the power device radiating module that the utility model first embodiment provides；
Fig. 6 is the view (conversion visual angle) along 5 after the cutting of A-A directions；
Fig. 7 is the view (conversion visual angle) along 5 after the cutting of B-B directions；
Fig. 8 is standing for its power device heat abstractor of power device radiating module that the utility model first embodiment provides
Body figure；
Fig. 9 is dividing for its power device heat abstractor of power device radiating module that the utility model first embodiment provides
Solution figure (the first outer cover plate and the separation of the second outer cover plate)；
Figure 10 is its power device heat abstractor of the power device radiating module of the utility model first embodiment offer
Exploded view (the first outer cover plate, the first inner cover plate, the second outer cover plate and the separation of the second inner cover plate)；
Figure 11 is its power device heat abstractor of the power device radiating module of the utility model first embodiment offer
Top view；
Figure 12 is the view (conversion visual angle) along 11 after the cutting of C-C directions；
Figure 13 is the view (conversion visual angle) along Figure 11 after the cutting of D-D directions；
Figure 14 is the stereogram for the power device radiating module that the utility model second embodiment provides；
Figure 15 is to remove the view after the first outer cover plate and the second outer cover plate in Figure 14；
Figure 16 is the exploded view for the power device radiating module that the utility model second embodiment provides；
Figure 17 is the stereogram of its heat sink body of the power device radiating module of the utility model second embodiment offer.
Reference in specification is as follows：
1st, power device；
2nd, power device heat abstractor；21st, heat sink body；211st, slot；212nd, runner；2121st, microchannel pore；213rd, enter
Fluid apertures；214th, fluid hole；215th, the first groove；2151st, step in first；2152nd, the first outer step；216th, the second groove；2161st,
Step in two；2162nd, the second outer step；217th, cooling passage；22nd, the first encapsulating structure；221st, the first inner cover plate；222nd,
One outer cover plate；223rd, the 3rd chamber；23rd, the second encapsulating structure；231st, the second inner cover plate；232nd, the second outer cover plate；233rd, the 4th
Chamber；24th, feed tube；25th, drain pipe；26th, first chamber；27th, second chamber；28th, admission chamber；29th, sap cavity is gone out；
215b, the first groove；221b, the first inner cover plate；222b, the first outer cover plate；231b, the second inner cover plate；232b, second
Outer cover plate.
Embodiment
In order that technical problem, technical scheme and beneficial effect that the utility model solves are more clearly understood, below
With reference to drawings and Examples, the utility model is described in further detail.It is it should be appreciated that described herein specific real
Example is applied only to explain the utility model, is not used to limit the utility model.
As shown in Fig. 2-13, the power device radiating module of the utility model first embodiment offer, including multiple power
Device 1 and power device heat abstractor 2.
In the present embodiment, power device 1 is IGBT.However, produce in other embodiments or during other work
The power device of heat.
As shown in Fig. 2-13, power device heat abstractor 2 includes heat sink body 21, the first encapsulating structure 22, second encapsulates
Structure 23, the feed tube 24 that coolant flows into and the drain pipe 25 for being available for coolant to flow out are available for, are set on the heat sink body 21
It is equipped with multiple slots 211 of pluggable multiple power devices 1, is inserted with multiple runners 212 of the slot 211 isolation and with described
The cooling passage 217 that groove 211 and runner 212 completely cut off, the power device 1 are plugged in the slot 211 of the heat sink body.
Slot 211 is consistent with the quantity of power device 1.I.e., in the first embodiment, power device heat abstractor 2 can be simultaneously to multiple
Power device 1 is radiated.
In the present embodiment, heat-conducting glue is provided between the madial wall of the power device 1 and the slot 211.Heat-conducting glue
On the one hand being fixedly connected for power device 1 and heat sink body 21 is realized.On the other hand, power device 1 and slot 211 can be filled
Cell wall between gap so that power device 1 is in close contact with heat sink body 21.
As illustrated by figs. 12-13, the multiple runner 212 and the multiple 211 alternately laminated arrangement of slot.It is more highly preferred to
Ground, each slot 211 are both provided with a runner 212 in the both sides of stacked direction, i.e. two runners 212 clip a slot
211.So, the two relative surfaces of power device 1 in the stacking direction can rapidly with the runner 212 of both sides
Working medium exchanges heat, the heat of power device 1 can quick heat radiating, improve radiating efficiency.Such as Fig. 2-4, Fig. 6, Fig. 8-10, Figure 12
Shown, first encapsulating structure 22 includes the first inner cover plate 221 and the first outer cover plate 222, and second encapsulating structure 23 wraps
Include the first inner cover plate 231 and the first outer cover plate 232.First inner cover plate 221 is tightly connected by welding or gluing mode
On the heat sink body 21 and one end in the runner 212, the one of first inner cover plate 221 and the runner 212
First chamber 26 is formed between end, second inner cover plate 231 is sealedly connected on the radiating by welding or gluing mode
In main body 21 and the other end of the runner 212 is in, between second inner cover plate 231 and the other end of the runner 212
Form second chamber 27.Be provided with first encapsulating structure 22 in the outside of the first chamber 26 and with first chamber
The 3rd chamber 223 that room 26 completely cuts off, be provided with second encapsulating structure 23 in the outside of second chamber 27 and with institute
The 4th chamber 233 of the isolation of second chamber 27 is stated, the feed tube 24 connects with the 3rd chamber 223, the drain pipe 25
Connected with the 4th chamber 233, the cooling passage 217 be communicated in the 3rd chamber 223 and the 4th chamber 233 it
Between, the coolant that the 3rd chamber 223 is flowed into via the feed tube 24 flows into the 4th chamber by the cooling passage 217
233, and flowed out by the drain pipe 25.
In the present embodiment, be packaged between the first chamber 26 and second chamber 27 can phase transformation working medium.So, first
The second inner cover plate 231 in the first inner cover plate 221, the encapsulating structure 23 of runner 212 and second in encapsulating structure 22 forms closing
The heat pipe of circulation.Working medium has low boiling, the characteristic of the high coefficient of heat transfer, with by the heat of vaporization absorption power device 1, and leads to
Liquidation exothermic reaction is crossed, the coolant of flowing in cooling passage is transferred heat to, the heat of power component is quickly exported.Institute
State the mixing that working medium is selected from ethylene glycol, acetone, methanol, refrigerant (R134a, R410A etc.), one or more of which in ammonia
Thing.
Generally, coolant is made up of water, antifreezing agent and additive three parts, can be divided into alcohol by antifreeze component difference
The coolant of the types such as type, glycerol type and ethylene glycol type.But in the present embodiment, it is cold that coolant can be extended to low boiling
Matchmaker, such as liquid nitrogen, freon.
In the present embodiment, as shown in FIG. 12 and 13, each runner 212 includes arranging along the grafting direction of power device 1
Multiple microchannel pores 2121 of an at least row (being a row in figure) are arranged into, the multiple microchannel pore 2121 is isolated from each other, described
One end of multiple microchannel pores 2121 connects with the first chamber 26, the other end of the multiple microchannel pore 2121 with it is described
Second chamber 27 connects.Preferably, the multiple parallel interval of microchannel pore 2121 is set, and the multiple microchannel pore 2121
Bearing of trend it is orthogonal with the bearing of trend of the slot 211.
In the present embodiment, it is preferable that the heat sink body 21 is integrally formed by extruding metal, such as aluminium extrusion one into
Type, copper extruding are integrally formed.So, pad excessive in the prior art is avoided.The integrally formed radiating master of extruding metal
Body 21 can be directly used in power device heat abstractor 2 with without any processing.Can also be by after formation, making some machines
Processing (such as fluting, hole) is used further to power device heat abstractor 2.Certainly, as an alternative, heat sink body 21 can also be straight
Metal derby (aluminium block, copper billet etc.) machining was connected to obtain.
As shown in FIG. 9 and 10, the heat sink body 21 is hexahedron structure, and the heat sink body 21 has first end face
DM1, second end face DM2, first side CM1, second side CM2, the 3rd side CM3 and the 4th side CM4, the first side
CM1, second side CM2, the 3rd side CM3 and the 4th side CM4 are sequentially connected with, and are connected to the first end face DM1 and
Between biend DM2.
As shown in figure 12, the both ends of the runner 212 extend through the first side CM1 and the 3rd side CM3；It is described
The both ends of slot 211 extend through the second side CM2 and the 4th side CM4.The both ends of cooling passage 217 are passed through respectively
The first side CM1 and the 3rd side CM3 are worn, and the cooling passage 217 is located at the inner side of the second end face DM2.
Herein, slot 211 is the groove of both ends open, and such setting is for the power corresponding to the both ends outlet such as IGBT
Device.Thus, in other embodiments, if the outlet of power device one end, slot may also be one end open, one end is closed
Groove.
As shown in FIG. 12 and 13, the heat sink body 21 be located on the inside of the first end face DM1 be provided with mutually every
Exhausted admission chamber 28 and go out sap cavity 29, the admission chamber 28 connects with the 3rd chamber 223, it is described go out sap cavity 29 and described the
Four chambers 232 connect；Be provided with the first end face DM1 inlet opening 213 that is connected with the admission chamber 28 and with it is described go out
The fluid hole 214 that sap cavity 29 connects, the feed tube 24 are connected on the inlet opening 213, and the drain pipe 25 is connected to institute
State on fluid hole 214.
However, feed tube 24, drain pipe 25 are not limited to be connected on heat sink body 21, as long as feed tube 24 and the 3rd
Chamber 223, drain pipe 25 connect with the 4th chamber 233.For example, in other embodiments, the of the first encapsulating structure
The inlet opening connected with the 3rd chamber 223 is set on one outer cover plate 222, in the second outer cover plate 232 of the second encapsulating structure
It is upper that the fluid hole connected with the 4th chamber 233 is set；Feed tube is connected on the inlet opening, and drain pipe is connected to described
On fluid hole.That is, feed tube is connected on the first outer cover plate, and drain pipe is connected on the second outer cover plate.
As shown in Fig. 8-10 and Figure 12, first grooves 215 of the first side CM1 formed with indent, first groove 215
Madial wall on be provided with the outer step 2152 of step 2151 and first in first, first inner cover plate 221 is embedded in described first
Abut in groove 215 and with step 2151 in described first, and sealed by welding or gluing mode.First outer cover plate
Abut in 222 insertion first grooves 215 and with first outer step 2152, and sealed by welding or gluing mode.
The outer surface of first outer cover plate 222 is concordant with the first side CM1, and the first chamber 26 is formed at described first
Between the bottom surface of the inner surface of inner cover plate 22 and first groove 215.3rd chamber 223 is formed at first enclosing cover
Between the inner surface of plate 222 and the outer surface of first inner cover plate 221.The 3rd side CM3 is formed with indent
Second groove 216, is provided with the outer step 2162 of step 2161 and second in second on the madial wall of second groove 216, and described
Two inner cover plates 231 are embedded in second groove 216 and abutted with step 2161 in described second, and pass through welding or gluing side
Formula seals.Second outer cover plate 232 is embedded in second groove 216 and abutted with second outer step 2162, and described
The outer surface of two outer cover plates 232 is concordant with the 3rd side CM3, and the second chamber 27 is formed at second inner cover plate
Between the bottom surface of 231 inner surface and second groove 216, the 4th chamber 233 is formed at second outer cover plate 232
Inner surface and second inner cover plate 231 outer surface between.
In addition, the first inner cover plate 221 does not cover cooling liquid flowing channel 217 and admission chamber 28 so that the 3rd chamber 223 can
Connected with cooling liquid flowing channel 217 and admission chamber 28.Equally, the second inner cover plate 231 does not cover cooling liquid flowing channel 217 and goes out sap cavity
29 so that the 4th chamber 233 can be with cooling liquid flowing channel 217 and going out sap cavity 29 and connecting.
According to the power device heat abstractor and power device radiating module of the utility model above-described embodiment, first chamber
Be packaged between second chamber can phase transformation working medium, so, the first encapsulating structure, runner and the second encapsulating structure form heat
Pipe, because the first inner cover plate is between first chamber and the 3rd chamber, the second inner cover plate is located at second chamber and the 4th chamber
Between, and runner and slot arranged stacked, power device (such as IGBT) are plugged in slot, the middle part of runner and power device
Position corresponding to (thermal source) is formed as evaporator section, and the in the 3rd chamber and the second encapsulating structure in the first encapsulating structure the 4th
Chamber due to there is coolant to flow through, so, the first inner cover plate of the first encapsulating structure, the second inner cap plate shape of the second encapsulating structure
As condensation segment (cold end), heat and vaporization of the liquid refrigerant in the middle part of runner (evaporator section) absorbed power device, gaseous state work
Matter flows into first chamber and second chamber, after being contacted with the first inner cover plate, the second inner cover plate (cold end), gaseous working medium by runner
Liquidation exothermic reaction, heat pass to coolant by the first inner cover plate, the second inner cover plate, and then, liquid refrigerant is back to runner
Middle part, with this, the heat of power device is taken away by coolant, realizes the radiating of power device.Also, due to runner and slot
Between share cell wall, thus, the thermal resistance between runner and slot is minimum, and the radiating efficiency of power device is high, suitable for high-power
Device radiates.In addition, replace multiple heat sinks in the prior art and water inlet supervisor, water outlet master with the arranged stacked of runner and slot
The welding of pipe, excessive pad can be avoided, manufacturing process is simple, and cost is relatively low.
As shown in figures 14-17, the power device radiating module that the utility model second embodiment provides, including multiple power
Device 1 and power device heat abstractor 2.
The difference of second embodiment and first embodiment is, first encapsulating structure, the second encapsulating structure with
The connected mode of heat sink body is different.
As shown in figures 14-17, in second embodiment, first groove 215bs of the first side CM1 formed with indent, first
Groove 215b is located between one end and the admission chamber 28 of cooling passage 217, and the first inner cover plate 221b passes through welding or gluing
Mode be sealedly connected on the outside of the first groove 215b, therefore, the first inner cover plate 221b is block form, cover in the first groove
Outside 215b, in not embedded first groove 215b.The first chamber is formed at the inner surface of the first inner cover plate 221b
Between the bottom surface of the first groove 215b.The first outer cover plate 222b is arranged on the outside of the first inner cover plate 221b simultaneously
It is tightly connected with the heat sink body 21 by welding or gluing mode.Therefore, the first outer cover plate 222b is block form, lid
Outside first side CM1.3rd chamber is formed in the inner surface and described first of the first outer cover plate 222b
Between cover plate 221b outer surface.
Equally, second groove (not shown)s of the 3rd side CM3 formed with indent, the second groove lead to positioned at coolant
The other end in road 217 and go out between sap cavity 29, the second inner cover plate 231b is sealedly connected on by welding or gluing mode
The outside of second groove, therefore, the second inner cover plate 231b is block form, cover outside the second groove, be not embedded in the second groove
In.The second chamber is formed between the inner surface of the second inner cover plate 231b and the bottom surface of second groove.It is described
Second outer cover plate 232b is arranged on the outside of the second inner cover plate 231b and passes through welding or gluing with the heat sink body 21
Mode be tightly connected.Therefore, the second outer cover plate 232b is block form, cover outside the 3rd side CM3.4th chamber
It is formed between the inner surface of the second outer cover plate 232b and the outer surface of the second inner cover plate 231b.
In above example, be provided with heat sink body 21 pluggable multiple power devices 1 multiple slots 211 and with
Multiple runners 212 that the slot 211 completely cuts off, multiple runners 212 and multiple 211 alternately laminated arrangements of slot.Such power device
Part heat abstractor 2 can radiate to multiple power devices 1 simultaneously.
However, in other embodiments, corresponding to an only power device 1, slot 211 sets one, runner
212 with the arranged stacked of slot 211, i.e. runner 212 can be arranged on the one or both sides of slot 211 in the stacking direction.
In above example, the first encapsulating structure is made up of the first outer cover plate and the first inner cover plate, the second encapsulating structure by
Second outer cover plate and the second inner cover plate composition.
However, in other embodiments, the first encapsulating structure can also be integrally formed structure, directly in the first encapsulation
The 3rd chamber is formed in structure.Equally, the second encapsulating structure can also be integrally formed structure, directly in the second encapsulating structure
The 4th chamber of interior formation.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (12)
- A kind of 1. power device heat abstractor, it is characterised in that including heat sink body, the first encapsulating structure, the second encapsulating structure, The feed tube that coolant flows into and the drain pipe for being available for coolant to flow out are available for, pluggable power is provided with the heat sink body At least one slot of device, at least runner completely cut off with the slot and the coolant completely cut off with the slot and runner Passage, the runner and the slot arranged stacked, first encapsulating structure are sealedly connected on the heat sink body and located First chamber, second envelope are formed between one end of the runner, first encapsulating structure and one end of the runner Assembling structure is sealedly connected on the heat sink body and the other end in the runner, second encapsulating structure and the stream Second chamber is formed between the other end in road, be provided with first encapsulating structure on the outside of the first chamber and with institute State the 3rd chamber of first chamber isolation, be provided with second encapsulating structure on the outside of the second chamber and with it is described 4th chamber of second chamber isolation, the feed tube and the 3rd chamber, the drain pipe and the 4th chamber Connection, the cooling passage are communicated between the 3rd chamber and the 4th chamber, and the 3rd chamber is flowed into via the feed tube The coolant of room flows into the 4th chamber by the cooling passage, and is flowed out by the drain pipe, the first chamber with Be packaged between second chamber can phase transformation working medium.
- 2. power device heat abstractor according to claim 1, it is characterised in that the heat sink body passes through extruding metal It is integrally formed.
- 3. power device heat abstractor according to claim 1, it is characterised in that the heat sink body is hexahedron knot Structure, the heat sink body have first end face, second end face, first side, second side, the 3rd side and the 4th side, institute State first side, second side, the 3rd side and the 4th side to be sequentially connected with, and be connected to the first end face and second end face Between；The both ends of the runner extend through the first side and the 3rd side；The both ends of the slot extend through the second side and the 4th side；The cooling passage both ends extend through the first side and the 3rd side, and the cooling passage is positioned at described The inner side of second end face.
- 4. power device heat abstractor according to claim 3, it is characterised in that the heat sink body is located at described first The admission chamber mutually completely cut off is provided with the inside of end face and goes out sap cavity, the admission chamber and the 3rd chamber, it is described go out Sap cavity and the 4th chamber；Be provided with the first end face inlet opening that is connected with the admission chamber and with it is described go out the fluid hole that connects of sap cavity, institute State feed tube to be connected on the inlet opening, the drain pipe is connected on the fluid hole.
- 5. power device heat abstractor according to claim 1, it is characterised in that be provided with first encapsulating structure With the inlet of the 3rd chamber, it is provided with second encapsulating structure and goes out liquid with the 4th chamber Mouthful；The feed tube is connected on the inlet, and the drain pipe is connected on the liquid outlet.
- 6. power device heat abstractor according to claim 1, it is characterised in that each runner is included along power device Part grafting direction is arranged in multiple microchannel pores of an at least row, and the multiple microchannel pore is isolated from each other, the multiple micro- logical The one end in road hole connects with the first chamber, and the other end of the multiple microchannel pore connects with the second chamber.
- 7. power device heat abstractor according to claim 6, it is characterised in that the multiple microchannel pore parallel interval Set, and the bearing of trend of the multiple microchannel pore is orthogonal with the bearing of trend of the slot.
- 8. power device heat abstractor according to claim 3, it is characterised in that the first side is formed with indent First groove, first encapsulating structure include the first inner cover plate and the first outer cover plate, and first inner cover plate is sealedly connected on institute The outside of the first groove is stated, first outer cover plate, which is arranged on the outside of first inner cover plate and sealed with the heat sink body, to be connected Connecing, the first chamber is formed between the inner surface of first inner cover plate and the bottom surface of first groove, and the described 3rd Chamber is formed between the inner surface of first outer cover plate and the outer surface of first inner cover plate；Second groove of 3rd side formed with indent, second encapsulating structure include the second inner cover plate and the second enclosing cover Plate, second inner cover plate are sealedly connected on the outside of second groove, and second outer cover plate is sealedly connected on described second The outside of inner cover plate, the second chamber be formed at the inner surface of second inner cover plate and second groove bottom surface it Between, the 4th chamber is formed between the inner surface of second outer cover plate and the outer surface of second inner cover plate.
- 9. power device heat abstractor according to claim 3, it is characterised in that the first side is formed with indent First groove, first encapsulating structure include the first inner cover plate and the first outer cover plate, are provided with the madial wall of first groove Step and the first outer step in first, in embedded first groove of first inner cover plate sealing and with described first in step support Connect, abutted in embedded first groove of the first outer cover plate sealing and with first outer step, first outer cover plate Outer surface is concordant with the first side, and the first chamber is formed at the inner surface of first inner cover plate and described the Between the bottom surface of one groove, the 3rd chamber is formed at the outer of the inner surface of first outer cover plate and first inner cover plate Between side surface；Second groove of 3rd side formed with indent, second encapsulating structure include the second inner cover plate and the second enclosing cover Plate, step and the second outer step in second, the embedded institute of the second inner cover plate sealing are provided with the madial wall of second groove State in the second groove and abutted with step in described second, in embedded second groove of second outer cover plate sealing and with described the Two outer steps abut, and the outer surface of second outer cover plate is concordant with the 3rd side, and the second chamber is formed at institute State between the inner surface of the second inner cover plate and the bottom surface of second groove, the 4th chamber is formed at second outer cover plate Inner surface and second inner cover plate outer surface between.
- 10. according to the power device heat abstractor described in claim 1-9 any one, it is characterised in that the heat sink body On be provided with pluggable multiple power devices multiple slots and with the multiple slot isolation multiple runners, it is the multiple Runner and the alternately laminated arrangement of the multiple slot.
- 11. a kind of power device radiating module, it is characterised in that any including at least one power device and claim 1-10 Power device heat abstractor described in one, the power device are plugged in the slot of the heat sink body.
- 12. power device radiating module according to claim 11, it is characterised in that the power device and the slot Madial wall between be provided with heat-conducting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720218107.2U CN206685366U (en) | 2017-03-07 | 2017-03-07 | Power device heat abstractor and power device radiating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720218107.2U CN206685366U (en) | 2017-03-07 | 2017-03-07 | Power device heat abstractor and power device radiating module |
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| Publication Number | Publication Date |
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| CN206685366U true CN206685366U (en) | 2017-11-28 |
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| CN201720218107.2U Active CN206685366U (en) | 2017-03-07 | 2017-03-07 | Power device heat abstractor and power device radiating module |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919922A (en) * | 2018-07-11 | 2018-11-30 | 北京工业大学 | Microchannel phase-change heat sink |
| CN108925124A (en) * | 2018-09-18 | 2018-11-30 | 珠海格力电器股份有限公司 | Module immersion type cooling body and frequency converter |
| CN113141750A (en) * | 2020-01-20 | 2021-07-20 | 北京新能源汽车股份有限公司 | Modularization heat abstractor and have its vehicle |
| CN115696887A (en) * | 2023-01-04 | 2023-02-03 | 运城飞华科技有限公司 | Heat radiator for carborundum motor controller |
-
2017
- 2017-03-07 CN CN201720218107.2U patent/CN206685366U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108919922A (en) * | 2018-07-11 | 2018-11-30 | 北京工业大学 | Microchannel phase-change heat sink |
| CN108925124A (en) * | 2018-09-18 | 2018-11-30 | 珠海格力电器股份有限公司 | Module immersion type cooling body and frequency converter |
| WO2020056954A1 (en) * | 2018-09-18 | 2020-03-26 | 珠海格力电器股份有限公司 | Mechanism for cooling module by means of immersion, and frequency converter |
| CN113141750A (en) * | 2020-01-20 | 2021-07-20 | 北京新能源汽车股份有限公司 | Modularization heat abstractor and have its vehicle |
| CN115696887A (en) * | 2023-01-04 | 2023-02-03 | 运城飞华科技有限公司 | Heat radiator for carborundum motor controller |
| CN115696887B (en) * | 2023-01-04 | 2023-09-19 | 上海卓仝技术咨询中心(有限合伙) | Heat abstractor of carborundum motor controller |
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