CN112797827A - Phase change heat exchanger - Google Patents
Phase change heat exchanger Download PDFInfo
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- CN112797827A CN112797827A CN202011579788.8A CN202011579788A CN112797827A CN 112797827 A CN112797827 A CN 112797827A CN 202011579788 A CN202011579788 A CN 202011579788A CN 112797827 A CN112797827 A CN 112797827A
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- micro
- microchannel
- heat exchanger
- phase change
- pin
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
Abstract
The invention relates to the technical field of heat dissipation and heat exchangers, and discloses a phase change heat exchanger, which comprises a main body, a cover plate and a heat dissipation assembly, wherein the cover plate is arranged on the main body; the heat dissipation assembly comprises a plurality of heat dissipation pieces, wherein every two adjacent heat dissipation pieces are arranged at intervals to form a micro-channel, a plurality of first needle ribs are arranged in each micro-channel, and each micro-channel is combined to form a micro-channel area; the main body comprises an influx cavity and an efflux cavity, and the efflux cavity is communicated with the efflux cavity through a microchannel region; the cover plate is provided with an inflow pipe and an outflow pipe, the inflow pipe is communicated with the inflow cavity, and the outflow pipe is communicated with the outflow cavity. The invention provides a brand-new microchannel heat sink from the angle of increasing a vaporization core and enhancing the turbulence degree of fluid in a microchannel, namely, pin rib structures are arranged on the upper bottom surface and the lower bottom surface of the microchannel, so that the flow boiling stability in a heat exchanger is enhanced, and the cooling and temperature equalizing effects of the heat sink are greatly improved.
Description
Technical Field
The invention relates to the technical field of heat dissipation and heat exchangers, in particular to a phase change heat exchanger.
Background
With the rapid development of Micro-Electro-Mechanical systems (MEMS) and micromachining technologies, the miniaturization and integration speeds of electronic components are increasing. Meanwhile, the heating power of the electronic component is also increased, which leads to higher heat flux density of the electronic component. If the heat generated by the electronic element cannot be quickly released to the external environment, the temperature of the electronic element is continuously increased, but the working stability of the electronic element is very sensitive to the temperature, and the overhigh temperature not only influences the stable performance of the working performance of the electronic element, but also seriously burns the electronic element when the temperature breaks through a critical value, and even causes safety accidents such as fire and the like. In addition, in a high heat flux environment, the difference between the heating and heat dissipation conditions in different regions of the electronic component may cause the electronic component to have different local temperatures, thereby causing thermal stress on the electronic component. The presence of thermal stress can cause damage and failure of electronic components, shortening their useful life. Therefore, the heat dissipation problem of high heat flux density electronic components seriously restricts the rapid development of the microelectronic industry.
At present, the common method for heat dissipation of electronic components with high heat flux density is mainly micro-channel heat sink cooling, and the micro-channel heat sink cooling technology was firstly proposed by Tuckerman and Pease, and the micro-channel heat sink cooling technology is applied to cooling of integrated circuits. The microchannel heat sink has a large heat exchange area and a temperature gradient inside the microchannel heat sink, so that the microchannel heat sink has high-efficiency heat exchange capacity. However, for the conventional microchannel heat sink cooling, when no phase change phenomenon occurs in the flow channel, the heat sink absorbs external heat only by means of sensible heat absorbed by the increase of the temperature of the fluid, and the heat exchange capacity is very limited. Moreover, as the fluid flows in the heat sink flow channel, the fluid absorbs heat, the temperature of the fluid gradually rises, so that the temperature difference between the fluid and the external environment is continuously reduced, the local heat transfer driving force is gradually weakened, and finally the overall heat exchange capacity of the heat sink is unbalanced. Therefore, the traditional micro-channel heat sink only depends on the single-phase heat exchange, and has poor cooling and uniform effects.
Disclosure of Invention
The embodiment of the invention aims to provide a phase change heat exchanger to solve the problems of poor cooling and temperature equalizing effects and the like of the conventional micro-channel phase change heat radiator, and the following technical scheme is adopted, so that the phase change heat radiator has the advantage of high heat radiating efficiency.
In order to achieve the above object, an embodiment of the present invention provides a phase change heat exchanger, including a main body packaged in a box, a cover plate covering and sealing the main body, and a heat dissipation assembly disposed inside the main body;
the heat dissipation assembly comprises a plurality of heat dissipation pieces, wherein the heat dissipation pieces are arranged adjacent to each other at intervals to form micro-channels, a plurality of first needle ribs are arranged in the micro-channels, and the micro-channels are combined to form a micro-channel area;
the main body comprises an inlet cavity and an outlet cavity, and the outlet cavity is communicated with the outlet cavity through the micro-channel area;
the cover plate is provided with an inflow pipe and an outflow pipe, the inflow pipe is communicated with the inflow cavity, and the outflow pipe is communicated with the outflow cavity.
The traditional microchannel heat exchanger has the advantages that the wall surface of a channel of the traditional microchannel heat exchanger is smooth, the vaporization core is less, when phase change occurs, generated bubbles can rapidly develop and expand under the influence of larger wall surface superheat degree, and further, the whole microchannel is filled with the bubbles, so that two-phase backflow and unstable boiling channels occur, the phenomenon of air plug in the microchannel can be seriously caused, and the phenomenon of evaporation to dryness can be easily caused on the wall surface of the microchannel due to the fact that the microchannel filled with the large bubbles cannot be supplemented with fresh fluid, so that the temperature of the wall surface of the microchannel rises sharply, and the cooling and temperature equalizing effects of a heat sink are seriously influenced. The invention provides a brand-new microchannel heat sink from the angle of increasing a vaporization core and enhancing the turbulence degree of fluid in a microchannel, namely, pin rib structures are arranged on the upper bottom surface and the lower bottom surface of the microchannel, so that the flow boiling stability in a heat exchanger is enhanced, and the cooling and temperature equalizing effects of the heat sink are greatly improved.
As an improvement of the scheme, a pin rib belt for spacing the micro-channels is arranged in each micro-channel, and the pin rib belt is formed by uniformly spacing second pin ribs.
As an improvement of the scheme, the projection line formed by the needle rib belt at the bottom of the micro-channel is intersected with the flow direction formed by the micro-channel.
As an improvement of the scheme, each microchannel is provided with a plurality of pin rib belts, and the pin rib belts in the same microchannel are uniformly distributed along the length direction of the microchannel.
As an improvement of the scheme, the radiating pieces are arranged at equal intervals.
As an improvement of the scheme, the heat dissipation piece is arranged in a plate shape.
As an improvement of the scheme, the first needle ribs are densely and uniformly distributed in the micro-channel.
As an improvement of the above, the first needle rib and the second needle rib are both in a shape of an elongated cylinder.
As a modification of the above, the length of the first needle rib is 1/7 to 1/5 of the height of the microchannel, and the diameter is 1/25 of the width of the microchannel.
As a modification of the above, the length of the second needle rib is 6/7-4/5 of the height of the micro-channel, and the diameter of the second needle rib is the same as that of the first needle rib.
As an improvement of the scheme, the bottom surface of the main body is a smooth plane and is attached to the surface of a heat source when in use.
The method has the following specific beneficial effects:
1. the micro-channel area between the inlet cavity and the outlet cavity is a main heat exchange area. As a vaporization core, the liquid is easier to bubble in the phase change process, the superheat degree of the wall surface of the micro-channel is reduced, the heat on the wall surface of the micro-channel can be released quickly in time, and the instability of flow boiling and even the blockage of the micro-channel caused by the formation of larger bubbles in the micro-channel are avoided.
2. When the cover plate is covered on the main body and sealed, the second pin ribs below the cover plate are just distributed in the micro-channel flow channel according to the shape of the Z, and the effect of the cover plate is that the turbulence degree of fluid in the micro-channel is intensified, and the gas-liquid two-phase flow can be more uniformly mixed. In the process, when larger bubbles touch the pin ribs, the larger bubbles are broken into smaller bubbles, so that the boiling stability of the flow can be obviously improved, and the occurrence of an air lock phenomenon in the micro-channel is effectively avoided.
3. A hydrophobic coating may be applied on the surface of the first needle rib to enhance its bubbling ability as a vaporization core; the wall surface of the micro-channel, the bottom surface of the cover plate and the second pin rib can also be coated with a hydrophilic coating to enhance the heat transfer capability.
Drawings
FIG. 1 is a schematic diagram of a specific structure in an embodiment of the present invention;
FIG. 2 is a detailed structural view of a main body in the embodiment of the present invention;
fig. 3 is a specific structural view of the cover plate in the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, shall fall within the scope of the present invention.
Referring to fig. 1, 2 and 3, fig. 1 is a specific structural diagram in an embodiment of the present invention, fig. 2 is a specific structural diagram of a main body in an embodiment of the present invention, and fig. 3 is a specific structural diagram of a cover plate in an embodiment of the present invention.
A phase change heat exchanger comprises a main body 1 arranged in a box, a cover plate 2 covering and sealing the main body 1, and a heat radiation component arranged in the main body 1.
The heat dissipation assembly comprises a plurality of heat dissipation members 3, in the embodiment, the heat dissipation members 3 are arranged in a plate shape, the heat dissipation members 3 are arranged at uniform intervals, adjacent heat dissipation members 3 are arranged at intervals to form micro-channels, a plurality of first pin ribs 5 are arranged in each micro-channel, and each micro-channel is combined to form a micro-channel region 4.
The body 1 comprises an inlet chamber 11 and an outlet chamber 12, the outlet chamber 12 communicating with the outlet chamber 12 via the microchannel region 4.
The cover plate 2 is provided with an inlet pipe 21 and an outlet pipe 22, the inlet pipe 21 is communicated with the inlet cavity 11, and the outlet pipe 22 is communicated with the outlet cavity 12.
It should be noted that, in this embodiment, the first needle ribs 5 are densely and uniformly distributed, and the first needle ribs 5 are in a shape of a long and thin cylinder.
Preferably, each microchannel is provided with a strip of pin ribs which space the microchannels, the strip of pin ribs being formed by the second pin ribs 6 at regular intervals. The second pin rib 6 is fixedly arranged at the bottom of the cover plate 2.
For further refinement of the second pin fin 6, in this embodiment, the projected line formed by the pin fin at the bottom of the microchannel intersects the flow direction formed by the microchannel. In this embodiment, each microchannel is provided with a plurality of pin rib belts, the pin rib belts in the same microchannel are uniformly distributed along the length direction of the microchannel, and further, the pin rib belts are arranged in a zigzag shape along the length direction of the microchannel. Meanwhile, the spacing distance between the pin rib belts in the same microchannel is the same as the thickness of the heat dissipation member 3. When the cover plate 2 and the main body 1 are stacked and sealed, the second pin ribs 6 below the cover plate 2 are just distributed in the flow channel according to the Z shape,
in this embodiment, the microchannel region 4 between the inlet chamber 11 and the outlet chamber 12 is the main heat exchange region. Wherein, the length of the first pin rib 5 in the microchannel is 1/7-1/5 of the height of the microchannel, and the diameter is 1/25 of the width of the microchannel. The micro-channel phase change evaporator has the functions of serving as a vaporization core, enabling fluid to be easier to foam in the phase change process, reducing the superheat degree of the wall surface of the micro-channel, enabling heat on the wall surface of the micro-channel to be released rapidly in time, and avoiding the phenomenon that the micro-channel is blocked even due to instability of flow boiling caused by the formation of large bubbles in the micro-channel.
The length of the second needle rib 6 is 6/7-4/5 of the height of the micro-channel, and the diameter is the same as that of the first needle rib 5. When the cover plate 2 is covered on the main body 1 for sealing, the second pin ribs 6 below the cover plate 2 are just distributed in the micro-channel flow channel according to the shape of a Z, and the effect of the micro-channel is that the turbulence degree of fluid in the micro-channel is intensified, and the gas-liquid two-phase flow can be more uniformly mixed. In the process, when larger bubbles touch the pin ribs, the larger bubbles are broken into smaller bubbles, so that the boiling stability of the flow can be obviously improved, and the occurrence of an air lock phenomenon in the microchannel is effectively avoided.
The traditional microchannel heat exchanger has the advantages that the wall surface of a channel of the traditional microchannel heat exchanger is smooth, the vaporization core is less, when phase change occurs, generated bubbles can rapidly develop and expand under the influence of larger wall surface superheat degree, and further, the whole microchannel is filled with the bubbles, so that two-phase backflow and unstable boiling channels occur, the phenomenon of air plug in the microchannel can be seriously caused, and the phenomenon of evaporation to dryness can be easily caused on the wall surface of the microchannel due to the fact that the microchannel filled with the large bubbles cannot be supplemented with fresh fluid, so that the temperature of the wall surface of the microchannel rises sharply, and the cooling and temperature equalizing effects of a heat sink are seriously influenced. The invention provides a brand-new microchannel heat sink from the angle of increasing a vaporization core and enhancing the turbulence degree of fluid in a microchannel, namely, pin rib structures are arranged on the upper bottom surface and the lower bottom surface of the microchannel, so that the flow boiling stability in a heat exchanger is enhanced, and the cooling and temperature equalizing effects of the heat sink are greatly improved.
The specific implementation process comprises the following steps: the liquid refrigerant enters the merging cavity 11 from the merging pipe 21 on the cover plate 2, then the flowing direction of the liquid refrigerant is changed, the liquid refrigerant enters the micro-channel area 4 from the merging cavity 11, the liquid refrigerant is divided and flows along the slender micro-channel, the liquid refrigerant absorbs the external heat during the flowing, the phase change and the vaporization are carried out to form two-phase flow, and the fluid in each micro-channel is gathered in the merging cavity 12. Finally, it exits the heat exchanger under pressure via the outlet line 22.
During use, a hydrophobic coating may be applied to the surface of the first needle rib 5 to enhance its ability to foam as a vapour core; hydrophilic coatings can also be coated on the walls of the micro-channels, the bottom of the cover plate 2 and the second pin ribs 6 to enhance the heat transfer capability. Meanwhile, the heat exchanger can be made of materials such as copper, aluminum, silicon and the like, is convenient for batch production and processing and manufacturing in industrial production, and has great product competition advantages in the future market. The heat exchanger has wide application prospect, and various usable coolants, including various simple substance working media, non-azeotropic mixed working media and the like, are various according to different working conditions.
It should be noted that the cross-sectional shape of the micro-channel may be rectangular, trapezoidal, circular, etc., and the cross-sectional shape is mainly determined by the shape and structure of the heat sink 3, in this embodiment, the heat sink 3 is disposed in a plate shape, so the cross-sectional shape of the micro-channel is rectangular.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.
Claims (10)
1. A phase change heat exchanger is characterized by comprising a main body, a cover plate and a heat dissipation component, wherein the main body is arranged in a box, the cover plate is covered and sealed on the main body, and the heat dissipation component is arranged in the main body;
the heat dissipation assembly comprises a plurality of heat dissipation pieces, wherein the heat dissipation pieces are arranged adjacent to each other at intervals to form micro-channels, a plurality of first needle ribs are arranged in the micro-channels, and the micro-channels are combined to form a micro-channel area;
the main body comprises an inlet cavity and an outlet cavity, and the outlet cavity is communicated with the outlet cavity through the micro-channel area;
the cover plate is provided with an inflow pipe and an outflow pipe, the inflow pipe is communicated with the inflow cavity, and the outflow pipe is communicated with the outflow cavity.
2. A phase change heat exchanger as claimed in claim 1 wherein each of said microchannels has a strip of pin ribs spaced therein, said strip of pin ribs being formed by a second pin rib spaced uniformly.
3. A phase change heat exchanger as claimed in claim 2 wherein the projected line of the pin-fin strip formed at the bottom of the microchannel intersects the flow direction formed by the microchannel.
4. The phase change heat exchanger according to claim 3, wherein each of the microchannels is provided with a plurality of pin-rib strips, and the pin-rib strips in the same microchannel are uniformly distributed along the length direction of the microchannel.
5. A phase change heat exchanger as claimed in claim 1, wherein the heat dissipation members are evenly spaced.
6. A phase change heat exchanger as claimed in claim 1, wherein the heat sink is provided in a plate type.
7. The phase change heat exchanger of claim 1, wherein the first pin ribs are densely distributed in the micro channel.
8. The phase change heat exchanger of claim 2, wherein the first pin fin and the second pin fin are each in an elongated cylindrical shape.
9. The phase change heat exchanger of claim 8, wherein the first pin fin has a length of 1/7 to 1/5 of the microchannel height and a diameter of 1/25 of the microchannel width; the second pin fin has a length 6/7-4/5 of the height of the micro channel and a diameter identical to the first pin fin.
10. A phase change heat exchanger as claimed in claim 1 wherein the bottom surface of the body is a smooth flat surface which, in use, is adhered to the surface of the heat source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011579788.8A CN112797827A (en) | 2020-12-28 | 2020-12-28 | Phase change heat exchanger |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011579788.8A CN112797827A (en) | 2020-12-28 | 2020-12-28 | Phase change heat exchanger |
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| CN112797827A true CN112797827A (en) | 2021-05-14 |
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| CN202011579788.8A Pending CN112797827A (en) | 2020-12-28 | 2020-12-28 | Phase change heat exchanger |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113363626A (en) * | 2021-05-19 | 2021-09-07 | 广东省科学院半导体研究所 | Battery and battery phase change heat management system and method |
| CN114646231A (en) * | 2022-03-25 | 2022-06-21 | 高拓石油天然气技术（上海）有限责任公司 | Microchannel heat exchange core suitable for heterogeneous mixed separation structure |
| CN115474415A (en) * | 2022-10-14 | 2022-12-13 | 苏州浪潮智能科技有限公司 | Radiator and server |
| CN115540641A (en) * | 2022-09-30 | 2022-12-30 | 东南大学 | Tesla type micro-channel flowing boiling heat exchanger and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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