CN206251533U - A kind of pipe type microcirculation radiator and microcirculation heat-exchange system - Google Patents
A kind of pipe type microcirculation radiator and microcirculation heat-exchange system Download PDFInfo
- Publication number
- CN206251533U CN206251533U CN201621128469.4U CN201621128469U CN206251533U CN 206251533 U CN206251533 U CN 206251533U CN 201621128469 U CN201621128469 U CN 201621128469U CN 206251533 U CN206251533 U CN 206251533U
- Authority
- CN
- China
- Prior art keywords
- microcirculation
- radiator
- radiating
- fluid chamber
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of pipe type microcirculation radiator and microcirculation heat-exchange system, including heat source module installing plate, radiator installing plate and radiating subassembly, the heat source module installing plate and radiator installing plate interfix and are internally formed the main working fluid chamber for accommodating working medium, the radiating subassembly includes the multiple radiating fins for stacking at a certain distance and the microcirculation radiating module being arranged in radiating fin, the microcirculation radiating module is the tubular structure of one end open one end closing, it is a point working fluid chamber that it is internal, described point of working fluid chamber is connected with main working fluid chamber, the inwall of the main working fluid chamber and point working fluid chamber is provided with the imbibition microchannel of capillary structure, the capillary channel of the two is interconnected.Pipe type microcirculation radiator described in the utility model and microcirculation heat-exchange system compact conformation, heat transfer efficiency is high, noise is lower, and auxiliary power consumption is low, and reliability is high, and the Main Bottleneck of electronic component industry development, wide market are solved the problems, such as well.
Description
Technical field
The utility model is related to a kind of radiator, and in particular to a kind of pipe type microcirculation radiator and microcirculation heat exchange system
System.
Background technology
With the development of science and technology, the miniaturization of high-power and high-performance electronic component application system and highly integrated
Change, cause the caloric value of unit volume inner electronic equipment to be increased dramatically, local temperature is too high.When electronic component is chronically at height
During temperature state, often because overheat fails.In addition, when use environment heat exchanging system bulk, weight make strict limitation
And when cooling requirements are also very high, the traditional forced liquid circulation type of cooling, the forced ventilation type of cooling or gravity assisted heat pipe phase
Become the type of cooling to be difficult to meet the cooling requirements under high-power, high heat flux use condition, heat dissipation problem has turned into limitation
The Main Bottleneck of electronic component industry development.
Utility model content
The utility model radiates under the conditions of can not meeting high-power, high heat flux for traditional heat sinks set forth above
It is required that problem, and a kind of pipe type microcirculation radiator of research and design and microcirculation heat-exchange system.What the utility model was used
Technological means is as follows:
A kind of pipe type microcirculation radiator, including heat source module installing plate, radiator installing plate and radiating subassembly, it is described
Heat source module installing plate and radiator installing plate interfix and are internally formed the main working fluid chamber for accommodating working medium, the radiating
Component includes the multiple radiating fins for stacking at a certain distance and the microcirculation radiating module being arranged in radiating fin, described micro-
Circulation cooling module is the tubular structure of one end open one end closing, and the inside that microcirculation dissipates module is a point working fluid chamber, described micro-
The openend that circulation dissipates module is arranged on radiator installing plate, point working fluid chamber is connected with main working fluid chamber, the main working fluid chamber
Inwall be provided with the main imbibition microchannel of capillary structure, the inwall of the microcirculation radiating module be provided with capillary structure point
Imbibition passage.
Further, the section of the microcirculation radiating module is oval, circular, oblate or rectangle, and multiple is micro- to be followed
Ring radiating module is arranged in the form of crossed array or aligned type array.
Further, the capillary channel is regular hole or irregular hole that equivalent diameter is 0.001~8 ㎜.
Further, the capillary structure is that inwall is provided with the structure of minute protrusions or pit, inwall and is provided with small
The structure or porous metal structure of groove.
Further, the main imbibition microchannel and a point imbibition microchannel have identical or different capillary structure.
Further, the porous metals are made up of sintering process, and the minute protrusions, groove and minute recesses are by carving
The structure that etching technique or machining mode are obtained.
Further, the working medium is water, methyl alcohol, ethanol, ethylene glycol or acetone, and the radiating fin is flat board without pit
Shape, flat board have dimple-shaped, ripple non-incision shape, the ripple to have otch shape.
A kind of pipe type microcirculation heat-exchange system, including pipe type microcirculation radiator described in the utility model, also wrap
Include the blower fan group for providing cooling air.
Further, the blower fan group is axial-flow type or centrifugal fan group.
Compared with the prior art, pipe type microcirculation radiator described in the utility model and microcirculation heat-exchange system have
Advantages below:
1st, the worker quality liquid being set to after cooling liquid of imbibition microchannel is quickly successfully back in main working fluid chamber and carries
Capillary force and passage are supplied, this imbibition microchannel can make the heat-conductive characteristic of microcirculation radiator than the heat transfer of conventional heat pipe
Performance improves more than 10 times, therefore heat-exchange system more compact efficient;
2nd, the capillary structure of imbibition microchannel causes that point working fluid chamber setting angle out of plumb is even 0 degree with horizontal line angle
When, microcirculation radiator can also normally run, and this feature is very easy to the installation of electronic component;
3rd, working medium realizes that steam is flowed from heat source side to low-temperature receiver end by the micro-pressure difference of different zones steam, by imbibition
The extremely strong capillary force in microchannel realizes quick backflow of the liquid by low-temperature receiver end heat source end, and working medium is inside microcirculation radiating module
Flowing outside need not provide power, without pump, relative to the heat-exchange system of traditional use forced liquid circulation type of cooling,
Noise is lower, more saves auxiliary power;
4th, using shared main working fluid chamber, heat source module installing plate can be made to obtain uniform heat flow density, reduces radiating
There is the possibility of high temperature and hot spot in general ability portion, improves the reliability of microcirculation heat-exchange system;
5th, using the secondary radiating fin of plate-sheet-type two, it is not necessary to the fixed support of central dividing plate, secondary heat exchange face can be increased
Product, improves thermal discharge;The weight of radiator can also be mitigated simultaneously, reliability is improved;Processing link can also be reduced in addition, dropped
Low production cost.;
6th, compact conformation, heat transfer efficiency is high, noise is lower, and auxiliary power consumption is low, and reliability is high, can solve well
The Main Bottleneck problem of electronic component industry development-heat dissipation problem, wide market.
Brief description of the drawings
Fig. 1 is the structural representation of the pipe type microcirculation radiator described in the utility model embodiment.
A, b, c and d of Fig. 2 is the structural representation of the microcirculation radiating module of different cross section shape.
Fig. 3 is the structural representation of the radiator installing plate described in the utility model embodiment.
Fig. 4 is the structural representation of flat shape radiating fin.
Fig. 5 is the straight structural representation for having a dimple-shaped radiating fin.
Fig. 6 is the A-A sectional views of Fig. 5.
Fig. 7 is the structural representation of ripple non-incision shape radiating fin.
Fig. 8 is the B-B sectional views of Fig. 7.
Fig. 9 is the structural representation that ripple has otch shape radiating fin.
Figure 10 is the C-C sectional views of Fig. 9.
Figure 11 is the structural representation of the imbibition microchannel (square protruding structure) described in the utility model embodiment.
Figure 12 is the left view of Figure 11.
Figure 13 is the structural representation of the imbibition microchannel (circular protrusions structure) described in the utility model embodiment.
Figure 14 is the left view of Figure 13.
Figure 15 is the structural representation of the imbibition microchannel (groove structure) described in the utility model embodiment.
Figure 16 is the upward view of Figure 15.
Figure 17 is the structural representation of the imbibition microchannel (bowl configurations) described in the utility model embodiment.
Figure 18 is the left view of Figure 17.
Figure 19 is the structural representation of the imbibition microchannel (porous metal structure) described in the utility model embodiment.
Figure 20 is the schematic diagram of the microcirculation heat-exchange system described in the utility model embodiment.
Specific embodiment
As shown in Figure 1 to Figure 3, a kind of pipe type microcirculation radiator, including for installing the heat source module of heat source module 3
Installing plate 4, radiator installing plate 5 and radiating subassembly, the heat source module installing plate 4 and radiator installing plate 5 interfix and
The main working fluid chamber 7 for accommodating working medium 8 is internally formed, the radiating subassembly includes the multiple radiating fins for stacking at a certain distance
12 is that one end open one end is closed with the microcirculation radiating module 9 being arranged in radiating fin 12, the microcirculation radiating module 9
Tubular structure, the inside that microcirculation dissipates module 9 is a point working fluid chamber 11, offers installing port on the radiator installing plate 5, institute
State microcirculation and dissipate the openend of module 9 at the installing port on radiator installing plate 5, make point working fluid chamber 11 with main working fluid chamber
7 connections, the inwall of the main working fluid chamber 7 is provided with the main imbibition microchannel 6 of capillary structure, the microcirculation radiating module 9
Inwall is provided with point imbibition passage 10 of capillary structure.The capillary channel is regular hole that equivalent diameter is 0.001~8 ㎜
Or irregular hole.This special structure design, is that the working medium 8 after cooling liquid is quickly successfully back to main working fluid chamber 7
It is interior there is provided capillary force and passage.Therefore, this imbibition microchannel can make the heat-conductive characteristic of microcirculation radiator than tradition heat
The heat-conductive characteristic of pipe improves more than 10 times, therefore heat-exchange system more compact efficient.
As shown in a, b, c and d of Fig. 2, the section of the microcirculation radiating module 9 is oval, circular, oblate or square
Shape, oblateness refers to the shape being made up of the semi arch of two sections of line segments being parallel to each other and line segment two ends, is similar to playground runway
Shape, multiple microcirculation radiating modules 9 are arranged in the form of crossed array or aligned type array.
As shown in Fig. 4 to Figure 10, the radiating fin be flat board without dimple-shaped, flat board have dimple-shaped, ripple non-incision shape,
Ripple has otch shape.The runner of corrugated fin is bending, forms waveform, by constantly changing the flow direction of fluid, is promoted
The turbulence of fluid, separate and destruction thermal resistance boundary layer, it refers to the wing that opening is set on corrugated fin that ripple has otch shape fin
It is then the fin that pit is set on plate fin that piece flat board has dimple-shaped fin.
As shown in Figure 11 to Figure 19, the capillary structure is that inwall is provided with the structure of minute protrusions or pit, inwall
It is provided with the structure or porous metal structure of minute recesses.The main imbibition microchannel 6 and point imbibition microchannel 10 have it is identical or
Different capillary structures.The main imbibition microchannel 6 is that inwall is provided with the structure of minute protrusions or pit, in particular cases for
Smooth inner wall face.Described point of imbibition microchannel 10 is provided with the structure of minute recesses for inwall.Different capillary structures has not
Same porosity, the imbibition microchannel of small porosity can provide larger capillary pressure, and the imbibition microchannel of macroporosity can increase
The back-flow velocity of strong working medium;In addition, the imbibition microchannel of different porosities has different heat exchange areas.Therefore, it can basis
It is actually needed, the capillary structure of different porosities is set in main working fluid chamber 7 and point working fluid chamber 11, final optimization pass heat exchanger is changed
Hot property.The porous metals are made up of sintering process, and the minute protrusions, groove and minute recesses are by etching technics or machine
The structure that tool processing mode is obtained.Figure 11 to Figure 19 is merely to be illustrated more clearly that showing cited by the structure of imbibition microchannel
Example, the structure of actual imbibition microchannel runs far deeper than several shown in figure.
The working medium 8 is water, methyl alcohol, ethanol, ethylene glycol or acetone.
As shown in figure 20, a kind of pipe type microcirculation heat-exchange system, including pipe type microcirculation described in the utility model
Radiator 1, also including the blower fan group 2 for providing cooling air.The blower fan group 2 is axial-flow type or centrifugal fan group.Follow
Ring cooling system structure also including other connection annexes etc..Arrow is the signal arrow of cooling air flow direction in figure.
Described microcirculation radiator and the operation principle of heat-exchange system are:When electronic component operational heat, heat
The working medium 8 for being transmitted to storage in the inwall of main working fluid chamber 7, main working fluid chamber 7 by heat source module installing plate 4 is heated and evaporation occurs and boils
Rise, working medium becomes steam by liquid, substantial amounts of heat is absorbed in the process;Steam enters a point working fluid chamber 11 from main working fluid chamber 7,
Due to the cooling of blower fan forced ventilation, the cooled air of steam heat in point working fluid chamber 11 is taken away, steam liquefied, after liquefaction
Working medium is flow back into main working fluid chamber 7 along point imbibition microchannel 10 and main imbibition microchannel 6, proceeds next radiating circulation.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to model of the invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, those of ordinary skill in the art are to technical side of the invention
Various modifications and improvement that case is made, all should fall into the protection domain of claims of the present invention determination.
Claims (9)
1. a kind of pipe type microcirculation radiator, including heat source module installing plate, radiator installing plate and radiating subassembly, the heat
Source module installing plate and radiator installing plate interfix and are internally formed the main working fluid chamber for accommodating working medium, the radiating group
Part includes multiple radiating fins for stacking at a certain distance and the microcirculation radiating module being arranged in radiating fin, described micro- to follow
Ring radiating module is the tubular structure of one end open one end closing, and the inside that microcirculation dissipates module is a point working fluid chamber, described micro- to follow
The openend that ring dissipates module is arranged on radiator installing plate, point working fluid chamber is connected with main working fluid chamber, the main working fluid chamber
Inwall is provided with the main imbibition microchannel of capillary structure, and the inwall of the microcirculation radiating module is provided with point suction of capillary structure
Liquid passage.
2. pipe type microcirculation radiator according to claim 1, it is characterised in that:The microcirculation radiating module cut
Face is oval, circular, oblate or rectangle, and multiple microcirculation radiating modules are arranged in the form of crossed array or aligned type array
Row.
3. pipe type microcirculation radiator according to claim 1, it is characterised in that:The capillary channel is equivalent diameter
It is the regular hole or irregular hole of 0.001~8 ㎜.
4. pipe type microcirculation radiator according to claim 3, it is characterised in that:The capillary structure is to be set on inwall
There are the structure of minute protrusions or pit, inwall to be provided with the structure or porous metal structure of minute recesses.
5. pipe type microcirculation radiator according to claim 4, it is characterised in that:The main imbibition microchannel and point suction
Liquid microchannel has identical or different capillary structure.
6. pipe type microcirculation radiator according to claim 4, it is characterised in that:The porous metals are by sintering process
It is made, the minute protrusions, pit and minute recesses are the structure obtained by etching technics or machining mode.
7. pipe type microcirculation radiator as claimed in any of claims 1 to 6, it is characterised in that:The working medium
It is water, methyl alcohol, ethanol, ethylene glycol or acetone, the radiating fin is flat board has dimple-shaped, ripple without cutting without dimple-shaped, flat board
The degree of lip-rounding, ripple have otch shape.
8. a kind of pipe type microcirculation heat-exchange system, it is characterised in that:Including the pipe described in any one in claim 1 to 7
Chip microcirculation radiator, also including the blower fan group for providing cooling air.
9. pipe type microcirculation heat-exchange system according to claim 8, it is characterised in that:The blower fan group be axial-flow type or
Centrifugal fan group.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621128469.4U CN206251533U (en) | 2016-10-18 | 2016-10-18 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621128469.4U CN206251533U (en) | 2016-10-18 | 2016-10-18 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206251533U true CN206251533U (en) | 2017-06-13 |
Family
ID=58996287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621128469.4U Expired - Fee Related CN206251533U (en) | 2016-10-18 | 2016-10-18 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206251533U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106255396A (en) * | 2016-10-18 | 2016-12-21 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
CN109842323A (en) * | 2017-11-27 | 2019-06-04 | 四川大学 | A kind of device of waste gas residual heat power generation |
CN110278696A (en) * | 2019-07-19 | 2019-09-24 | 深圳市英维克科技股份有限公司 | Gravity force heat pipe radiator and electronic equipment |
CN112888264A (en) * | 2021-02-02 | 2021-06-01 | 西安交通大学 | Double-deck microchannel heat abstractor based on gas-liquid separation |
-
2016
- 2016-10-18 CN CN201621128469.4U patent/CN206251533U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106255396A (en) * | 2016-10-18 | 2016-12-21 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
CN106255396B (en) * | 2016-10-18 | 2019-06-11 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
CN109842323A (en) * | 2017-11-27 | 2019-06-04 | 四川大学 | A kind of device of waste gas residual heat power generation |
CN110278696A (en) * | 2019-07-19 | 2019-09-24 | 深圳市英维克科技股份有限公司 | Gravity force heat pipe radiator and electronic equipment |
CN112888264A (en) * | 2021-02-02 | 2021-06-01 | 西安交通大学 | Double-deck microchannel heat abstractor based on gas-liquid separation |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106332529B (en) | A kind of corrugated tube type microcirculation radiator and microcirculation heat-exchange system | |
CN206251533U (en) | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system | |
CN106304805B (en) | A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system | |
US9097470B2 (en) | Internal liquid separating hood-type condensation heat exchange tube | |
CN106255396B (en) | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system | |
CN206389664U (en) | A kind of corrugated tube type microcirculation radiator and microcirculation heat-exchange system | |
US20120180994A1 (en) | Heat pipe structure | |
CN109671688B (en) | Refrigerant phase change cold plate | |
CN106885485B (en) | A kind of hot end variable cross-section is pulsed cool side heat pipes radiator more | |
CN110010569B (en) | Gradient-scale pore sintering core soaking plate heat exchanger and preparation method thereof | |
CN106033749A (en) | Parallel type parallel-microchannel multi-chip radiator | |
CN101268430A (en) | Venturi for heat transfer | |
CN105423789B (en) | Triangular inner-fin heat pipe | |
CN103928414A (en) | Liquid cooling radiating system of electronic component | |
CN209045535U (en) | Micropin rib cluster array microchannel micro heat exchanger | |
CN101022097A (en) | Circulating hot tube type radiator | |
CN105910480A (en) | Microchannel cooling plate of combined channel heat pipe structure for pump fluid loop | |
CN105845648A (en) | Microelectronic device tree-shaped radiator | |
CN102128552A (en) | Single-sided corrugated plate type pulsating heat pipe | |
CN107062963A (en) | A kind of alternating expression micro-channel condenser for hair cell regeneration | |
WO2024103670A1 (en) | Siphon cooler and fin thereof | |
CN208221247U (en) | A kind of cooling device for numerically-controlled machine tool hydraulic oil | |
CN103453792A (en) | Bottom enhanced heat transfer structure of gravity assisted heat pipe | |
TWM554979U (en) | Phase-change evaporator and phase-change heat dissipation device | |
CN206459534U (en) | A kind of peanut tubular type automobile radiators |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 Termination date: 20191018 |