CN109103156A - A kind of fractals microchannel heat sink - Google Patents
A kind of fractals microchannel heat sink Download PDFInfo
- Publication number
- CN109103156A CN109103156A CN201810910660.1A CN201810910660A CN109103156A CN 109103156 A CN109103156 A CN 109103156A CN 201810910660 A CN201810910660 A CN 201810910660A CN 109103156 A CN109103156 A CN 109103156A
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- microchannel
- fractals
- fluid
- heat sink
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of fractals microchannel heat sinks, including heat sink, water pump and the fluid injection conduit road and fluid return line that connect them, the heat sink is made of the circuit substrate on upper layer and the microchannel substrate of lower layer, and the microchannel substrate is equipped with fractals microchannel structure.Fractals microchannel radiator structure radiating efficiency is high, noise is low, and microchannel structure is also easy to process, and saves encapsulated space, is conducive to highly integrated feature；The drawbacks of curved channel of fractals microchannel structure is conducive to improve the heat exchanging process of fluid and wall surface, and fractals microchannel is uniformly covered in microchannel substrate layer, can uniformly and adequately radiate, effective solution non-uniform temperature.
Description
Technical field
The present invention relates to heat dissipation technology, specifically a kind of fractals microchannel heat sink can be used for high heat flux density
Cooling electronic component.
Background technique
With the electronic products such as smart phone, tablet computer, movable storage device and auto electronic equipments to it is more multi-functional,
The increasingly increase of smaller volume and more high integration demand.System on chip (SOC) integrates one completely on a single chip
System, including central processing unit, memory and peripheral circuit etc., and package system (SIP) work will have certain function
Chip be sealed in a case body adaptable with it, both technologies are also constantly progressive therewith, and microelectronic chip is real
Existing function and functional density is all in exponential increase.While function increases, power consumption and fever are consequently increased, and study table
It is bright, it is all excessively high caused by temperature more than the failure of 55% electronic equipment, therefore the encapsulation of chip or integrated system is proposed
Very high requirement.
In order to solve the problems, such as that electronic component reliability failures, domestic and international researcher due to fever take one to this
Fixed progress.And there are many kinds of heat dissipation technologys, different exothermic heat sources also has for different heat dissipation technologys, there is natural wind
Cooling heat source that is cold, can be used under low-heat current density；Forced air cooling heat dissipation technology, opposite natural cooling, enhances in air
Convective heat transfer process, so that accelerating heat dissipation performance, but relative noise is bigger, heat dissipation effect is not also high；Water-cooling method
Exchange capability of heat is strong, and noise is small, can be used for the higher cooling heat source of heat flow density；Also there is thermoelectric cooling heat dissipation technology, pass through both ends
After voltage difference forms electric current, heat will also transmit that form heat poor therewith, and then reach heat dissipation effect, this heat dissipation technology requirement
Reliability comparotive is high, it is also desirable to certain energy consumption.It compares and is directed to high heat flux density heating element, it can be by novel micro-
Channel heat dissipation technology, reaches required heat dissipation effect, and as the fluid channel heat dissipation technology of one of heat sinking technology due to
Have many advantages, such as low thermal resistance, high efficiency and can be processed with integrated chip.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide a kind of fractals microchannel heat sink,
For the device mainly using fractals microchannel structure as heat sinking technology, fractals structure has multiple flow passages and complications
Channel design feature, the layout of multiple flow passages are conducive to heat dissipation uniformly, and the type of flow of tortuous passageway can improve fluid flowing side
Formula promotes the turbulent model of fluid to improve the heat transfer process of fluid.And then meet the electronic component of high heat flux density
Radiating requirements.
Realizing the technical solution of the object of the invention is:
A kind of fractals microchannel heat sink, including heat sink, water pump and the fluid injection conduit road and stream that connect them
Body reflux line, the heat sink are made of the circuit substrate on upper layer and the microchannel substrate of lower layer, unlike the prior art
It is,
The microchannel substrate is equipped with fractals microchannel structure, and the fractals microchannel structure is along microchannel base
The periphery of plate is provided with the fluid slot of connection, and the part that the fluid slot surrounds is set there are two the groove body for being in " ten " font, described
Two " ten " font groove bodies be arranged by symmetry axis of microchannel substrate longitudinal central axis, it is between two " ten " font groove bodies and every
Two are respectively equipped between the side of a " ten " font groove body and the fluid slot on fractals microchannel structure periphery to be square
Groove body forms diversion channel between " ten " font groove body and rectangular groove body；
The fractals microchannel structure, is respectively arranged on the left side and the right side the protrusion into fluid slot, and upper and lower two sides are respectively equipped with
Fluid inlet and fluid outlet is respectively set in tongue to outside fluid slot, two tongues, and fluid inlet and fluid injection conduit road connect
It connects, fluid outlet is connect with fluid return line.
The rectangular groove body is arranged by symmetry axis of the horizontal and vertical axis of microchannel substrate.
The protrusion is located on the lateral axis of microchannel substrate, and tongue is located on the longitudinal central axis of microchannel substrate.
The depth of the fluid slot and diversion channel is 0.8mm
The fluid inlet and fluid outlet are located at the bottom of microchannel substrate.
The water pump is peristaltic pump.
The material of the circuit substrate is Fr4 material or ceramic material.
The material of the microchannel substrate is ceramics or brass.
A kind of fractals microchannel heat sink provided by the invention, fractals microchannel radiator structure radiating efficiency
Height, noise are low, and microchannel structure is also easy to process, and saves encapsulated space, is conducive to highly integrated feature；Fractals are micro-
The curved channel of channel design is conducive to improve the heat exchanging process of fluid and wall surface, and the uniform cloth in fractals microchannel
It is full uniformly and adequately to radiate in microchannel substrate layer, the drawbacks of effective solution non-uniform temperature.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of fractals microchannel heat sink；
Fig. 2 is a kind of layered structure schematic diagram of fractals microchannel heat sink；
Fig. 3 is the schematic diagram of fractals microchannel structure；
Fig. 4 is the experimental program structural block diagram of the embodiment of the present invention；
In figure, 1. circuit substrate, 2. microchannel substrate, 3. electronic device pyrotoxin, 4. fractals microchannel structure
5. the 6. rectangular groove body 4-3. diversion channel 4-4. tongue 4-5. of fluid outlet 4-1. fluid slot 4-2. of fluid inlet
" ten " font groove body 4-6. protrusion.
Specific embodiment
The present invention is further elaborated with reference to the accompanying drawings and examples, but is not limitation of the invention.
A kind of fractals microchannel heat sink, including heat sink, water pump and the fluid injection conduit road for connecting them
And fluid return line, as depicted in figs. 1 and 2, the heat sink is by the circuit substrate 1 on upper layer and the microchannel substrate 2 of lower layer
Composition, electronic component are placed on circuit substrate as pyrotoxin 3, and circuit substrate is equipped with printed circuit board, according to circuit
Demand is routed accordingly, under special circumstances, insulating layer is arranged between circuit substrate 1 and microchannel substrate 2, is avoided cold
Influence of the fluid to circuit when but, unlike the prior art,
The microchannel substrate 2 is equipped with fractals microchannel structure 4, as shown in figure 3, the fractals microchannel is tied
Structure 3 is provided with the fluid slot 4-1 of connection along the periphery of microchannel substrate 2, and the part that the fluid slot 4-1 is surrounded sets that there are two be in
The groove body 4-5, two described " ten " the font groove body 4-5 of " ten " font are arranged by symmetry axis of 2 longitudinal central axis of microchannel substrate,
Between two " ten " the font groove body 4-5 and side and 4 periphery of fractals microchannel structure of each " ten " font groove body 4-5
Fluid slot 4-1 between be respectively equipped with two groove body 4-2 being square, shape between " ten " font groove body 4-5 and rectangular groove body 4-2
At diversion channel 4-3；
The fractals microchannel structure 4 is respectively arranged on the left side and the right side the raised 4-6 into fluid slot, upper and lower two sides difference
Fluid inlet 5 and fluid outlet 6, fluid inlet 5 and stream are respectively equipped with equipped with the tongue 4-4, two tongue 4-4 to outside fluid slot
The connection of body flow in pipes, fluid outlet 6 are connect with fluid return line.
The rectangular groove body 4-2 is arranged by symmetry axis of the horizontal and vertical axis of microchannel substrate.
The raised 4-6 is located on the lateral axis of microchannel substrate, and tongue 4-4 is located in the longitudinal direction of microchannel substrate
On axis.
The depth of the fluid slot 4-1 and diversion channel 4-3 are 0.8mm.
The fluid inlet 5 and fluid outlet 6, are located at the bottom of microchannel substrate 2.
The water pump is peristaltic pump.
The material of the circuit substrate is Fr4 material or ceramic material.
The material of the microchannel substrate is ceramics or brass.
Embodiment:
When being tested, according to the structure of fractals microchannel heat sink described above, electronic component is placed
On circuit substrate, test sample is made, connects into according to experimental program as shown in Figure 4, fluid is by extraneous wriggling pumping action
Under, from 5 fractals microchannel structure 4 of fluid inlet, flows in fluid slot 4-1 and diversion channel 4-3, there are complications in runner
Channel, fluid-flow mode can be improved by tortuous detour, break original layer flow mode, and fluid under turbulent flow condition
Convective heat transfer process is more advantageous to microchannel wall surface, wide feature has according to the extension effect of fractal structure and heat dissipation area
The heat dissipation for being easy to substrate is uniform；It is described that ceramic substrate or brass material can be used with microchannel substrate material；Described point of shape
Laser processing technology or numerical control processing can be used in geometry microchannel structure, and required stream is made on the substrate of certain size
Body slot 4-1 and diversion channel 4-3, the microchannel substrate layer is having a size of 40mm × 60mm × 2mm, the fractals microchannel knot
Structure depth is 0.8mm.
The fluid is the light water in the case of room temperature.
Claims (8)
1. a kind of fractals microchannel heat sink, including heat sink, water pump and connect they fluid injection conduit road and
Fluid return line, the heat sink are made of the circuit substrate on upper layer and the microchannel substrate of lower layer, which is characterized in that
The microchannel substrate is equipped with fractals microchannel structure, and the fractals microchannel structure is along microchannel base
The periphery of plate is provided with the fluid slot of connection, and the part that the fluid slot surrounds is set there are two the groove body for being in " ten " font, described
Two " ten " font groove bodies be arranged by symmetry axis of microchannel substrate longitudinal central axis, it is between two " ten " font groove bodies and every
Two are respectively equipped between the side of a " ten " font groove body and the fluid slot on fractals microchannel structure periphery to be square
Groove body forms diversion channel between " ten " font groove body and rectangular groove body；
The fractals microchannel structure, is respectively arranged on the left side and the right side the protrusion into fluid slot, and upper and lower two sides are respectively equipped with
Fluid inlet and fluid outlet is respectively set in tongue to outside fluid slot, two tongues, and fluid inlet and fluid injection conduit road connect
It connects, fluid outlet is connect with fluid return line.
2. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the square groove
Body is arranged by symmetry axis of the horizontal and vertical axis of microchannel substrate.
3. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the protrusion is set
On the lateral axis of microchannel substrate, tongue is located on the longitudinal central axis of microchannel substrate.
4. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the fluid slot
Depth with diversion channel is 0.8mm.
5. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the fluid inlet
And fluid outlet, it is located at the bottom of microchannel substrate.
6. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the water pump is
Peristaltic pump.
7. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the circuit base
The material of plate is Fr4 material or ceramic material.
8. a kind of fractals microchannel heat sink according to claim 1, it is characterised in that, the microchannel
The material of substrate is ceramics or brass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810910660.1A CN109103156A (en) | 2018-08-10 | 2018-08-10 | A kind of fractals microchannel heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810910660.1A CN109103156A (en) | 2018-08-10 | 2018-08-10 | A kind of fractals microchannel heat sink |
Publications (1)
| Publication Number | Publication Date |
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| CN109103156A true CN109103156A (en) | 2018-12-28 |
Family
ID=64849396
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810910660.1A Pending CN109103156A (en) | 2018-08-10 | 2018-08-10 | A kind of fractals microchannel heat sink |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
| CN108172557A (en) * | 2018-02-07 | 2018-06-15 | 桂林电子科技大学 | A kind of spider net type fluid channel radiator |
-
2018
- 2018-08-10 CN CN201810910660.1A patent/CN109103156A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040188064A1 (en) * | 2002-11-01 | 2004-09-30 | Cooligy Inc. | Channeled flat plate fin heat exchange system, device and method |
| CN101026948A (en) * | 2007-03-26 | 2007-08-29 | 山东省科学院能源研究所 | Single-phase ultrahigh heat flow micro-column heat exchanger |
| CN106601703A (en) * | 2016-10-27 | 2017-04-26 | 湖北工程学院 | Microchannel heat sink adopting secondary backflow cooling mode |
| CN108172557A (en) * | 2018-02-07 | 2018-06-15 | 桂林电子科技大学 | A kind of spider net type fluid channel radiator |
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Application publication date: 20181228 |