200911101 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種水冷頭結構，特別是指一種運用 於水冷式散熱系統之水冷頭結構。 【先前技術】 為解決電腦主機中的發熱源之散熱問題，例如中央處 理器、顯示卡等，-般皆是以氣冷式散熱風扇來協助該發 熱源進行散熱，不過，散熱風扇在運轉時的噪音太高，其 耗電量也會造成電源供應器的負擔，而且，該散熱風扇容 易沉積過多的灰塵而導致運轉過熱進而發生故障，大幅降 低電腦主機的穩定度。 因此，為解決前述氣冷式散熱風扇的問題，即有業者 研^出以水冷式的冷卻裝置來協助該發熱源進行散熱參 閱圖1，為一水冷式散熱系統，該水冷式散熱系統包含一用 以貼附固接於-發熱源10外表面並對該發熱源10進行降 溫的水冷頭11、一泵浦12、一儲存有冷卻液的水箱13、一 可使該冷卻液降溫的散熱器14,及多數用以串接於上述各 組件間的管路15，藉由所述管路15以形成-可供冷卻液流 通的循環迴路。 配口參閲圖2 ’該水冷式散熱系統之水冷頭〗丨包括一 上妓體早元111、—可與該上殼體單元111相結合的隔熱底 板1 1 2、多數個設置在該隔熱底板丨12上的鰭片U3、一與 °亥上喊體單元111連接的進入管114,及一與該上殼體單元 111連接的排出管115，該冷卻液可由該進入管114流入並 5 200911101 與所述鰭片〗13進行執交 «完成協助該發熱源;。::散;^^ 散熱===㈣助㈣熱…行 ⑴的管徑均為相等I,1之進入管114與排出管 _ 4再加上该冷卻液從進入管114 =在:水冷頭11内部依循設定路徑迁迴地流= 月匕使6亥冷部液完全流經每一 並帶走，並且彻其低溫吸收 料2 所傳導至該等鰭片113上的熱量以進行200911101 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a water-cooled head structure, and more particularly to a water-cooled head structure for use in a water-cooled heat dissipation system. [Prior Art] In order to solve the heat dissipation problem of the heat source in the host computer, such as a central processing unit, a display card, etc., an air-cooled cooling fan is generally used to assist the heat source to dissipate heat, but the cooling fan is in operation. The noise is too high, and the power consumption also causes a burden on the power supply. Moreover, the cooling fan is likely to deposit excessive dust, causing overheating to cause malfunction, and greatly reducing the stability of the host computer. Therefore, in order to solve the problem of the air-cooling type cooling fan, a manufacturer has developed a water-cooling type cooling device to assist the heat source to perform heat dissipation. Referring to FIG. 1, a water-cooled heat dissipation system includes a water-cooling heat dissipation system. a water-cooling head 11 fixed to the outer surface of the heat source 10 and cooling the heat source 10, a pump 12, a water tank 13 storing the coolant, and a radiator capable of cooling the coolant 14, and a plurality of conduits 15 for being connected in series between the components, by means of the conduit 15 to form a circulation loop through which the coolant can flow. Referring to FIG. 2, the water-cooling head of the water-cooling heat dissipation system includes an upper body 111, and an insulated bottom plate 1 1 which can be combined with the upper casing unit 111. a fin U3 on the heat insulating bottom plate 12, an inlet pipe 114 connected to the upper body unit 111, and a discharge pipe 115 connected to the upper casing unit 111, the coolant can flow from the inlet pipe 114 And 5 200911101 is engaged with the fins 13 to complete the assistance of the heat source; ::scatter; ^^ heat dissipation === (four) help (four) heat... row (1) pipe diameters are equal I, 1 inlet pipe 114 and discharge pipe _ 4 plus the coolant from the inlet pipe 114 = in: water-cooled head 11 Internally follow the set path to move back to the ground flow = Month makes the 6H cold liquid completely flow through each and take away, and the heat conducted by the low temperature absorbent material 2 to the fins 113 is carried out.
Li二⑴排出’因此將會導致該冷卻液 二二=水冷頭U之壓力值下降，因而減低該冷卻液 +又、動的流速及流量，使整體的冷卻循環變慢，間 接影響到該發熱源10的散熱效能。 間 另外’若要提昇整體冷卻循環的效果，勢必要提高該 ^浦12之揚程以增加該冷卻㈣流速及流量，不過，該果 浦12之功率消耗也因此而相對增加。 【發明内容】 因此本發明之目的，即在提供一種能夠增加冷卻液 進出冷頭之壓力冑，且降低泵浦揚程並提昇散熱效能的 水冷式散熱系統之水冷頭結構。 於疋，本發明水冷式散熱系統之水冷頭結構，包含一 殼體單元、一進出單元’及一散熱單元。 該殼體單元概呈中空狀且包括一殼蓋，及一與該殼蓋 相結合的底板’該殼蓋與該底板相互界定出一腔室。 5 亥進出單元包括一與該殼體單元連接且連通該腔室的 200911101 進液管’及一與該殼體單元連接且連通該腔室的出液管， 其中’該進液管之管徑小於該出液管之管徑。 該散熱單元位於該腔室且包括多數個間隔設置於該殼 體單元内的散熱鰭片。 本發明之功效在於藉由該進液管之管徑小於該出液管 之管徑，使冷卻液流入與流出該腔室的壓力值增加，相對 提昇冷卻液的流速及流量，不僅能夠有效改善整體的冷卻 循環效果、提昇其散熱效能，更能降低泵浦之揚程，避免 消耗過多的功率而導致能源浪費。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明中’類似的元件是以相同的編號來表示。 多閱圖3、4、5，本發明水冷式散熱系統之水冷頭結構 的第一較佳實施例，是可裝設在一發熱源16上包含一殼 體單元2 進出單元3，及一散熱單元4。 罢5亥殼體單元2概呈中空狀且包括一殼蓋21、一與該殼 ^ 相、° σ的底板22、一由該殼蓋21與該底板22相互界 疋出的腔室23 ’及四個用於將該殻蓋21與該底板22予以 。固定接σ的螺絲24 ’其中，該殼蓋21與該底板22亦 可利用焊接或溶接等方式接合，只要能達到該腔室23内之 冷部液不外漏即可，並不侷限於本第—較佳實施之說明。 7 200911101 室3包括—與該殼體單元2連接且連通該腔 2 、進液官’及一與該殼體單元2連接且連通該腔室 32之I" 32 ’其中，該進液管31之管徑小於該出液管 -2 且該進液管31與該出液管32分別自該殼體單 凡 2 之殼 i 2 1 的同 _ ,g, r=i ζΐ /, ㈣向延伸。該散熱單元4位於該腔 至^且包括多數個間隔設置於該殼體單元2的散熱鰭片 41。 參閱圖5’當冷卻液由該進液管31流入該腔室23後， 2該腔室23㈣散而減«流速，並Μ勻地流入所述 月^片41所相互間隔的通道心（如圖5箭頭所示），在 =時，該冷卻液與每_散減片41的接觸面由於溫度的 二’由高溫往低溫的方向開始進行熱量的傳遞，使貼附 =设體單U之底板22下方的發熱源16進行散熱最 < 。亥冷部液再由該出液管32流出而離開該腔室 由於本發明水冷式散熱系統之水冷頭結構，是將該進 广3之進液s 31的f徑設計成小於該出液管32的管 使冷卻液流人與流出該腔室23的壓力值增加，由於管 U冷部液之水流速度成反比’即管徑越小，其增加之壓 力值會加快該冷卻液之水流速度，導致該冷卻液在整體的 5循環中提高其流速及流量，進—步地協助該發熱源」6 π走更多的熱量，使散熱效能大幅提昇。 參閱圖6、7’本發明水冷式散熱系統之水冷頭結構的 第二較佳實施例’大致上是與該第一較佳實施例相同，皆 包括—殼體單元2 一進出單元3,及-散熱單元4,其中 200911101 不相同之處在於，該進出單S3之進液管31與該出液管32 刀別自β &體單元2之殼蓋21的不同側向外延伸。 相較於Α第一較佳實施例之冷卻液是分別由該腔室Μ 同一側流入與流出，本第二較佳實施例是分別由該腔室23 之左右兩側流人與流出’不過，該第—與第二較佳實施例 之冷卻液流人與流出該腔室23的壓力值相仿，皆高於習知 之水冷頭的壓力值，可相對提昇冷卻液的流速及流量，所 以，該進液管31與該出液管32連接該殼體單元2之設計 可依照實際上的需求作變換，並不侷限在該 佳實施例之說明。 歸納上述，本發明水冷式散熱系統之水冷頭結構，藉 由該進液管31之管徑小於該出液管32之管#，使該冷卻 液流入與流出該腔室23㈣力值增加，相對提昇冷卻液的 流速及流量’不僅㈣有效改善整體的冷卻循環效果、提 昇其散熱效率，更能降低泵浦之揚程，避免消耗過多的功 率而導致能源的浪費，故確實能達到本發明之目的。 惟以上所述者，僅為本發明之二個較佳實施例而已， 當不能以此限定本發明實施之範圍，即大凡依本發明申請 專利範圍及發明說明内容所作之簡單的等”化與修飾， 皆仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖，說明習知水冷式散熱系統之態樣； 圖2是一立體分解圖，說明習知水冷式散熱系統 冷頭的細部結構； & 200911101 圖3是-用態樣； 圖4是-結構； 圖5是-例流動之態樣 圖6是-樣；及 圖7是-例流動之態樣 立體圖’說明本發明之笛 ^ 較佳實施例的使 立體分解圖，說明該第-較佳實施例之細部 部份剖視圖’說明冷卻液在該第一較佳實施 立體圖，說明本發明之第二較佳實施例的態 組合剖視圖，說明冷卻液在該第二較佳實施 10 200911101 【主要元件符號說明】 16 · · …"發熱源 31 • · · ·進液官 2 * •…殼體單元 32 · • · · 出液管 21 · · *…殼盖 33 - • · · ·腔室 22… 6…底板 4 - · •…散熱單元 23… -…腔室 41 · ……散熱鰭片 24… …5螺絲 42 · • •…通道 3 · · …。進出單元 11Li 2 (1) discharge 'Therefore, the pressure of the coolant 2 = water cooling head U will decrease, thus reducing the flow rate and flow rate of the coolant + again and moving, making the overall cooling cycle slow, indirectly affecting the heat The heat dissipation performance of the source 10. In addition, if the effect of the overall cooling cycle is to be improved, it is necessary to increase the head of the pump 12 to increase the cooling (four) flow rate and flow rate, but the power consumption of the pump 12 is relatively increased. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a water-cooled head structure for a water-cooled heat dissipating system capable of increasing the pressure enthalpy of coolant entering and leaving the cold head and reducing the pump head and improving heat dissipation performance. The water-cooling head structure of the water-cooled heat dissipating system of the present invention comprises a casing unit, an inlet and outlet unit, and a heat dissipating unit. The housing unit is generally hollow and includes a cover and a base plate associated with the cover. The cover and the base define a chamber therebetween. The 5th inlet and outlet unit includes a 200911101 inlet pipe connected to the casing unit and communicating with the chamber, and a liquid outlet pipe connected to the casing unit and communicating with the chamber, wherein the pipe diameter of the inlet pipe Less than the diameter of the outlet tube. The heat dissipating unit is located in the chamber and includes a plurality of heat dissipating fins spaced apart from the housing unit. The effect of the invention is that the diameter of the inlet pipe is smaller than the diameter of the outlet pipe, so that the pressure value of the coolant flowing into and out of the chamber is increased, and the flow rate and flow rate of the coolant are relatively increased, which can not only effectively improve. The overall cooling cycle effect, improve its heat dissipation performance, and reduce the pump lift, avoiding excessive power consumption and energy waste. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments of the invention. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to Figures 3, 4 and 5, a first preferred embodiment of the water-cooled head structure of the water-cooled heat dissipating system of the present invention is mounted on a heat source 16 and includes a housing unit 2 in and out of the unit 3, and a heat sink. Unit 4. The housing unit 2 is generally hollow and includes a cover 21, a bottom plate 22 opposite to the housing, a σ, and a chamber 23' defined by the cover 21 and the bottom plate 22. And four are used to apply the cover 21 to the bottom plate 22. The screw 24' is fixed to the sigma. The cover 21 and the bottom plate 22 can also be joined by welding or welding, as long as the cold liquid in the chamber 23 can be prevented from leaking, and is not limited to this. Description of the preferred embodiment. 7 200911101 The chamber 3 includes an I" 32' connected to the housing unit 2 and communicating with the chamber 2, a liquid inlet officer, and an inlet unit 32 connected to the chamber unit 32, wherein the inlet pipe 31 The pipe diameter is smaller than the liquid discharge pipe-2, and the liquid inlet pipe 31 and the liquid discharge pipe 32 respectively extend from the same _, g, r=i ζΐ /, (4) of the shell i 2 1 of the casing . The heat dissipating unit 4 is located at the cavity and includes a plurality of heat dissipating fins 41 disposed at intervals of the housing unit 2. Referring to FIG. 5', after the coolant flows into the chamber 23 from the inlet pipe 31, the chamber 23 (4) is dispersed to reduce the flow rate, and smoothly flows into the channel cores of the moon 41 which are spaced apart from each other (e.g. As indicated by the arrow in Fig. 5, at the time of =, the contact surface of the coolant and the _ diffuser 41 is subjected to heat transfer from the high temperature to the low temperature due to the temperature of the two's, so that the attachment = the single body U The heat source 16 below the bottom plate 22 performs the heat dissipation most. The cold liquid of the cold water flows out of the chamber and exits the chamber. Since the water-cooling head structure of the water-cooling heat dissipating system of the present invention, the f-path of the inlet s 31 of the inlet 3 is designed to be smaller than the outlet pipe. The tube of 32 increases the pressure of the coolant flowing out of the chamber 23, and the water flow velocity of the cold portion of the tube U is inversely proportional to 'the smaller the diameter of the tube, the increased pressure value will accelerate the water flow rate of the coolant. As a result, the coolant increases its flow rate and flow rate in the overall 5 cycles, and further assists the heat source to “6 π to take more heat, so that the heat dissipation performance is greatly improved. Referring to Figures 6 and 7', a second preferred embodiment of the water-cooling head structure of the water-cooled heat dissipating system of the present invention is substantially the same as the first preferred embodiment, and includes a housing unit 2, an inlet unit 3, and The heat dissipating unit 4, wherein the 200911101 is different in that the inlet pipe 31 of the inlet and outlet S3 and the outlet pipe 32 extend outward from different sides of the casing cover 21 of the β & body unit 2. Compared with the first preferred embodiment of the coolant, the coolant flows in and out from the same side of the chamber, respectively. The second preferred embodiment is flowed from the left and right sides of the chamber 23 respectively. The first and second preferred embodiments of the coolant flow are similar to the pressure values flowing out of the chamber 23, which are higher than the pressure values of the conventional water-cooling head, and can relatively increase the flow rate and flow rate of the coolant. The design of the inlet unit 31 and the outlet unit 32 for connecting the housing unit 2 can be changed according to actual needs, and is not limited to the description of the preferred embodiment. In summary, in the water-cooling head structure of the water-cooling heat dissipating system of the present invention, the diameter of the inlet pipe 31 is smaller than the pipe # of the outlet pipe 32, so that the coolant flows into and out of the chamber 23 (4), and the force value increases. Increasing the flow rate and flow rate of the coolant not only (4) effectively improving the overall cooling cycle effect, improving the heat dissipation efficiency, reducing the lift of the pump, avoiding the waste of excessive power and causing waste of energy, so it can achieve the purpose of the present invention. . However, the above is only the two preferred embodiments of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent of the scope of the invention and the description of the invention. Modifications are still within the scope of the present invention. [Simplified Schematic] FIG. 1 is a perspective view showing a state of a conventional water-cooled heat dissipation system; FIG. 2 is an exploded perspective view showing a conventional water-cooled heat dissipation Detailed structure of the system cold head; & 200911101 Fig. 3 is a state in which it is used; Fig. 4 is a structure; Fig. 5 is a state in which the flow is shown in Fig. 6; and Fig. 7 is a perspective view of a flow state DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT OF THE PREFERRED EMBODIMENT A cross-sectional view of a preferred embodiment, illustrating a cooling fluid in the second preferred embodiment 10 200911101 [Main component symbol description] 16 · · ... "heat source 31 • · · · liquid inlet 2 * • ... housing unit 32 · • · · Outlet tube 21 · · *... Case cover 33 - • · · · Chamber 22... 6... Base plate 4 - · •... Heat sink unit 23... -... Chamber 41 · Heat sink fin 24... 5 Screw 42 · • •...Channel 3 · · .... In and out unit 11