TWI413751B - A heat exchange chamber for liquid state cooling fluid - Google Patents

Abstract

A heat exchange chamber for liquid state cooling fluid is provided, which comprises a flow resistance, the flow resistance is sited inside a cavity at a position proximate to an inlet. In other words, the flow resistance is sited between the inlet and a thermal dissipation device. The flow resistance narrows down a flow channel from the inlet to the cavity, and it raises the resistance of the cooling fluid before the cooling fluid flows through a thermal dissipation device. Because of the heat exchange chamber for liquid state cooling fluid, the cooling fluid could be distributed uniformly through the dissipating heat device.

Description

Liquid cooling fluid heat exchange chamber

The invention relates to a heat dissipation module using a cooling fluid, in particular to a flow passage which is made smaller when the inlet pipe enters the cavity by using the first-class resistance portion, and is used for improving the flow resistance before the heat dissipation device, so that the cooling fluid is evenly distributed. The ground flows through the heat sink.

When a large computer device such as a server is in operation, the problem of poor heat dissipation and equipment failure is an issue that is currently being solved by various people. In addition, the power used in the calculation of the server of the typical data center is taken as an example. The cooling system needs to consume twice as much power, so when the server is densely concentrated in the cloud data center, the room can even require up to twice the extra cooling system. It can be seen that if the cloud high-density server does not properly handle the heat dissipation problem, it will cause the server to work unstable or even unable to operate, consume energy, the machine room can not maintain the quality of maintenance, and increase the management cost of the equipment room.

In the way of dissipating heat, the use of a liquid cooling fluid heat exchange chamber is a conventional method. The conventional liquid cooling fluid heat exchange chamber is a heat transfer device through which a cooling fluid is injected and flows through the heat exchange device for heat exchange. Take heat away to reduce system heat. However, when the cooling fluid is injected into the conventional liquid cooling fluid heat exchange chamber, the cooling fluid tends to concentrate in the central portion of the flow path of the liquid cooling fluid heat exchange chamber due to the faster flow rate of the cooling fluid, rather than uniformly flowing through the entire liquid cooling fluid. The heat exchange chamber, which makes the heat sink in the liquid cooling fluid heat exchange chamber not fully usable, resulting in a low heat dissipation efficiency.

Therefore, there is a need for a liquid cooling fluid heat exchange chamber that allows the cooling fluid to be evenly distributed within the heat exchange chamber to solve the problems associated with conventional techniques.

The invention relates to a liquid cooling fluid heat exchange chamber, which utilizes a first-class resistance portion to increase flow resistance, so that the cooling fluid can be evenly distributed in the accommodating space.

The present invention provides a liquid cooling fluid heat exchange chamber comprising: a housing having a cavity, the housing including an inlet conduit and an outlet conduit for providing a cooling fluid into the chamber a cavity for providing the cooling fluid to flow out of the cavity, the cooling fluid flowing through the cavity in a flow direction; a heat dissipating device disposed in the cavity; and a first-class resistance portion, the flow a blocking portion is disposed in the cavity near the inlet conduit, that is, the flow resistance portion is disposed between the heat dissipation device and the inlet conduit, and the flow resistance portion causes the inlet conduit to change into a flow passage when entering the cavity Small, used to increase the flow resistance before the heat sink, so that the cooling fluid can flow uniformly through the heat sink.

In order to enable the reviewing committee to have a further understanding and understanding of the features, objects and functions of the present invention, the related detailed structure of the system of the present invention and the concept of the design are explained below so that the reviewing committee can understand the present invention. The detailed description is as follows: The present invention provides a liquid cooling fluid heat exchange chamber. Referring to FIG. 1 , FIG. 1 is a side view of the liquid cooling fluid heat exchange chamber of the present invention, and FIG. 2A is the first embodiment of the present invention. A schematic diagram of a flow resistance portion of an embodiment. The liquid cooling fluid heat exchange chamber comprises: a casing 1, a heat sink 2 and a first-class resistor 3, the casing 1 having a cavity 10, the casing 1 comprising an inlet pipe 11 and an outlet a conduit 12 for providing a cooling fluid 0 into the cavity 10, the outlet conduit 12 for providing the cooling fluid 0 to flow out of the cavity 10. In the embodiment, the outlet conduit 12 The caliber is larger than the diameter of the inlet pipe 11 to prevent excessive gas volume from being pressed into the cavity 10, thereby increasing the pressure in the cavity 10 and the boiling point of the cooling fluid 0, thereby weakening the heat dissipation effect, the cooling fluid 0 flows through the cavity 10 in a flow direction 00; the heat sink 2 is disposed in the cavity 10; the flow resistance portion 3 is disposed in the cavity 10 near the inlet pipe 11, that is, the flow resistance portion 3 is disposed between the heat dissipating device and the inlet pipe. The flow resistance portion 3 is a convex structure, and the flow resistance portion 3 makes the flow path of the inlet pipe 11 smaller when entering the cavity 10, thereby improving heat dissipation. The flow resistance before the device 2 allows the cooling fluid 0 to flow uniformly through the heat sink 2.

2B is a schematic view showing a flow resistance portion of a second embodiment of the present invention, and FIG. 2C is a top plan view showing a flow resistance portion of the second embodiment of the present invention, the flow resistance portion 3 including a plurality of convex portions 30, The flow resistance portion 3 makes the flow path of the inlet pipe 11 smaller when it enters the cavity 10, and serves to increase the flow resistance so that the cooling fluid 0 can uniformly flow through the heat dissipation device 2. Each of the convex portions 30 has a first inclined surface 300 and a second inclined surface 301 respectively, so that a tapered flow path 302 is formed between the adjacent convex portions 30 by the corresponding first inclined surface 300 and by the phase The corresponding second inclined surface 301 forms an involute flow path 303. In this embodiment, the shape of the two sides of the convex portion 30 is used to further increase the flow resistance before the heat dissipation device 2 is increased, but the shape of the convex portion 30 is not the above. Limited.

The difference between the first embodiment and the second embodiment is that in the first embodiment, only the convex structure of the choke portion 3 causes the reduction of the flow path to achieve the purpose and effect of increasing the flow resistance, and the second embodiment The tapered flow passage 302 can further increase the flow resistance, and the involute flow passage can guide the flow direction to accelerate the flow rate after the cooling fluid has uniformly flowed through each of the flow passages.

In addition, in the first and second embodiments, the housing 1 further includes a bottom member 13 that is in thermal contact with a heat source 4, and the heat of the heat source 4 is heated by the bottom member 13. Contacting and transferring to the liquid cooling fluid heat exchange chamber, the heat source may be a central processing unit or a wafer module, but not limited to the above, and the heat sink 2 is also in thermal contact with the bottom member 13 to transfer heat To the heat sink 2. In the present invention, the flow resistance portion 3 may be disposed in the accommodating space and above the bottom member 13 or in the accommodating space and disposed under the top surface of the housing. The flow resistance portion 3 The shape and direction and position of the setting are not limited to the above.

The liquid cooling fluid heat exchange chamber of the present invention is provided with a flow resistance portion 3 in the cavity 10 near the inlet line 11 to form a flow passage area smaller than the cross-sectional area of the inlet line 11, so that the cooling fluid 0 flows through the heat dissipation. Before the device 2, the speed of the cooling fluid 0 can be slowed down, the cooling fluid 0 can be evenly distributed in the cavity 10, or the obstacle shape can be further adjusted to increase the flow resistance to enhance the effect of the flow resistance portion. By using the liquid cooling fluid heat exchange chamber of the present invention, the cooling fluid can be uniformly flowed through the heat dissipating device to improve heat dissipation efficiency.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto. That is, the equivalent changes and modifications made by the present invention in the scope of the present invention will remain as the further embodiment of the present invention.

0. . . Cooling fluid

00. . . Flow direction

1. . . case

10. . . Cavity

11. . . Inlet pipe

12. . . Outlet pipeline

13. . . Bottom piece

2. . . Heat sink

20. . . Plate body

twenty one. . . Heat sink fin

3. . . Flow resistance

30. . . Convex

300. . . First slope

301. . . Second slope

302. . . Tapered flow path

303‧‧‧Opening the runner

4‧‧‧heat source

Figure 1 is a side elevational view of the liquid cooling fluid heat exchange chamber of the present invention.

Figure 2A is a schematic view of a first embodiment of the flow resistance of the present invention.

Figure 2B is a schematic view of a second embodiment of the flow resistance of the present invention.

Figure 2C is a top plan view showing a second embodiment of the flow resistance of the present invention.

0‧‧‧Cooling fluid

00‧‧‧Flow direction

1‧‧‧shell

10‧‧‧ cavity

11‧‧‧Inlet pipe

12‧‧‧Export line

2‧‧‧heating device

20‧‧‧ board

21‧‧‧ Heat sink fins

3‧‧‧ flow resistance

4‧‧‧heat source

Claims (4)

A liquid cooling fluid heat exchange chamber comprising: a housing having a cavity, the housing comprising an inlet conduit and an outlet conduit for providing a cooling fluid into the cavity The outlet line is configured to provide the cooling fluid to flow out of the cavity, the cooling fluid flows through the cavity in a flow direction; a heat dissipating device is disposed in the cavity; and a first-class resistance portion is disposed in the cavity And a flow path between the heat dissipating device and the inlet pipe, the flow path of the inlet pipe is reduced when entering the cavity, the flow resistance portion comprising a plurality of convex portions, each adjacent two The convex portions form a first-class track, and the flow paths include a tapered flow path and an involute flow path. The liquid cooling fluid heat exchange chamber of claim 1, wherein the outlet conduit has a larger diameter than the inlet conduit. The liquid cooling fluid heat exchange chamber of claim 1, wherein the heat dissipating device comprises a plate body and a plurality of heat dissipating fins formed on the plate body. The liquid cooling fluid heat exchange chamber of claim 1, wherein the housing further comprises a bottom member, the bottom member being in thermal contact with a heat source, the heat sink being in thermal contact with the bottom member.