CN104823279B - Power scr unit cooling system - Google Patents
Power scr unit cooling system Download PDFInfo
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- CN104823279B CN104823279B CN201380063026.4A CN201380063026A CN104823279B CN 104823279 B CN104823279 B CN 104823279B CN 201380063026 A CN201380063026 A CN 201380063026A CN 104823279 B CN104823279 B CN 104823279B
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- housing
- igct
- section
- liquid chiller
- liquid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to being heated for the electric control and regulation of thermal technology, equipment and semiconductor device, power engineering and by using electricity, for heating, liquid (such as water), steam are produced, electrical power is translates directly into heat.Certainly, the present invention is used for the liquid cooling for the power semiconductor device for controlling and adjusting, particularly for cooling down semiconductor thyristor.Another task is to simplify the assembly precision demand of whole unit and cooling system by following the housing design and IGCT of type of recommendation relative to each other and relative to the type of arrangement of device case.The present invention can be used in recommending the convection current situation of the circulating liquid of IGCT arrangement.Figure 17 is the view of embodiment 2, wherein, power scr or bidirectional thyristor (1) are asymmetric and be anisotropically arranged on body (2) or on intermediate plate (3).The body cavity (6) of device can have such shape in general case, and random smooth closed curve can be made in the profile of longitudinal section (4) and cross section (7).It can be the shape of random closed contour at the exterior contour of longitudinal section (5) and cross section (8).
Description
Technical field
The present invention relates to thermal technology, equipment and semiconductor device, for electric control and regulation, power engineering and by using
Electricity is heated, and for heating, liquid (such as water), steam are produced, electric energy is translates directly into heat.Specifically, the present invention is used to control
The liquid cooling of system and the power semiconductor device of regulation, particularly for cooling down semiconductor thyristor.This can apply to
In heating and hot-water supply system in the control and regulating system of hot water heating, in the self-rugulating heater of liquid, independent, move
In dynamic heating and hot-water supply system.In addition, it may be used as the dress of the liquid cooling for a variety of power semiconductor devices
Put, so as to efficiently ensure for controlling the default operating mode with regulating member.
Background technology
Have been known electric power control section (such as semiconductor thyristor and double in available for control and regulating system
To IGCT (symistors)) the substantial amounts of heat of place's dissipation.Used due to the operating principle of these devices and these devices
Larger electric current and voltage and cause loss, such as in electric heating heated condition, particularly in water heating electrode boiler.Simultaneously
It is also known that semiconductor device (including IGCT and bidirectional thyristor) is very sensitive for overheating, and need efficient cooling system
System.This aggravates due to the special characteristics that they are used in control and regulating system, and the control and regulating system use them
It is used as AC controlling transistors.In addition, they are by larger current, (this is precisely that they are subjected to larger heat energy and released in the case of
The reason for putting, it is necessary to eliminate) influence redistributed is dropped by adjustable voltage.
Proposed invention is used for control and the regulating system of electric water heating boiler, but, and it can also be typically used as appointing
The part of the liquid-cooling system of what power semiconductor arrangement.
Most it is efficiently the liquid cooling of power semiconductor arrangement as the solution for key issue, particularly
In the system of electric water heating boiler, the electric water heating boiler has had the feature of the circulatory function of liquid flow.Use this liquid
Body stream comes for controlling the pressure cooling with regulating element quite to facilitate and promising.
The common shortcoming of known cooling system can include being used to supply the geometry designs of the main cooling-part of cooling liquid
Symmetry, the geometrical symmetry of IGCT and the bidirectional thyristor distribution at heat-delivery surface.Due to ensure it is this symmetrical and
The whole preparation and the degree of precision processing of part needed, this largely reduces the manufacturability of product, and causes
Device overall complicated.Must all be caused by being practically used for all known device of cooling power semiconductor device by horizontal and vertical section
The internal cooling circuit in face and external cooling circuit Accurate align.Disadvantages mentioned above is removed, is also easy to cause following poor feature：Resistance
Only the mount point for cooling device, which is customized to consideration, can select most efficient heat release.In these areas, known device is not
Radiating efficiency can be improved with selection using all by adjusting all interior shapes of flow type cooling element by having.When by
During the permanent effect of machinery, chemical attack and the hot factor symmetrically destroyed, these reasons cause known device due to assembling not
Accurate and poor maintenance reliability and it is unreliable.Meanwhile, this symmetry is useless, has no effect on device and operates, and
It is any with keeping symmetrically associated production cost aspect and improper.This also causes the repairability of known device to be deteriorated, because
Symmetry may be all influenceed for any repairing.In addition, installation symmetry and coolant for the semiconductor element to be cooled down
The type of the design symmetry of the inner section of body conduit and pipeline causes concurrent condition to be deteriorated, hence in so that heat release is deteriorated.This
Can explain in view of radiating efficiency optimize and power semiconductor can not be attached to reinforcement heat release point neutralizes can not be flexible
Ground adjusts the cross-sectional internal shape of thermal component.
Known device can be categorized into the following group：
First group.Absorb heat both sides.
A) have for semiconductor device cool down known systems, including both sides heat absorption IGCT and it in heating system
In recycling.The low energy that low energy semiconductor device is distributed is served only for without using the system of liquid.For example, as it is known that following system
System：
In the extra heat release of semiconductor device opposite side, heat is reclaimed at main radiator, thus provides both sides heat release.
EP2178117 (A1) -2010-04-21 is also identical-the power semiconductor modular that there are both sides to cool down.Further, US2003122242
(A1) -2003-07-03, the semiconductor package part with the integrated heat spreader being attached on heat conduction substrate core, US2007108594
(A1) -2007-05-17 semiconductor devices, KR20120057330 (A) -2012-06-05- semiconductor chip packages.
The both sides of WO2012143784 (A2) -2012-10-26- semiconductor devices and its manufacture method-IGCT crystal
Cooling.
EP0046825 (A1) -1982-03-10- manufactures be clamped in electric device component between cooling-part method and
Component-the IGCT manufactured by this method is pressed against on cooling element by close elasticity, to reduce thermal resistance.
The parallel and symmetric array of the both sides heat release of the crystal of semiconductor device, its unitary elasticity compression.
B) liquid cooling is best mode, directly to manage high voltage and electric current in circuit.In addition, at this
In the case of planting the purpose that control is used for liquid heating and cooling, such as in water heats electric boiler, cooled down using liquid flow
It is desirably also simplest mode that Large Copacity IGCT, which is,.RU2184998 (C2) -2002-07-10 chips thyristor cell-master
Cooling channels are designed as the both sides current cooling of flat tube.The shortcoming of the example is the inferior mechanical reliability of design.Master is flat
The section of pipeline is symmetrical, and this will accurately be followed, therefore it reduce the manufacturability of device so that it is complicated, and increases
Its production cost.
C) allowed for by air cooling come the combination of enhanced liquid cooling by the energy for running liquid flow
It drives.EP0582217 (A1) -1994-02-09- liquid cooling current rectifier modules, with by cooling medium pump-by running
Liquid flow driving extra ventilating duct fan-generation coolant flow.
Or vice versa, and WO2004031588 (A1) -2004-04-15- is used to remove heat from the part to be cooled down
Structures and methods-pump cooling cause for IGCT cool down liquid flow movement.
Second group.The IGCT cooled down by the combination of controlled cooled liquid stream.
A) DE4112677 (A1) -1992-10-22- fluid refrigeration resistors, it is especially useful in GTO- thyristor switch-include
The coaxitron of (parallel water cooling) is cooled down by the inverse liquid flow in the whole surface of resistor element.The accurate of cooling duct is put down
Row and arranged at right angles cause its shortcoming.
EP0099092B1-1984-01-25- strings-and flow cooling device-simultaneously-and IGCT cool down, pass through their company
Continuous group arrangement associates each group simultaneously with by coolant flow.
US4023616 (A) 1977-05-17- IGCTs cooling structure-IGCT direct liquid flow cooling it is continuous simultaneously
Row module, IGCT is by pressing to sink side portion.
US5043797 (A) -1990-04-03- is used for the IGCT liquid of cooling manifold connection-packet of IGCT heap in column
Body cooling-part replaces.
US2009284922 (A1) -2009-11-19- has cooling effect high power thyristor module-changed by being filled in
The system that the middle oil in space between hot device and IGCT carrys out direct liquid flow cooling.
US4475152 (A) -1984-10-02- water coolings high voltage device-when cooling liquid supply pipe section selection for provide
Continuous parallel IGCT cooling during optimal liquid flow velocity.
FR2715773 (A1) -1995-08-04 is fixed on the liquid for electronic power component on the base portion of electric car
The continuous parallel system of cooling device-liquid cooling pipe.
CN1688086A-2005-10-26- is used for mechanical erection structure-liquid cooling of controllable series compensation thyristor valve
The parallel and arranged at right angles of IGCT pipeline.
CN201156539 (Y) -2008-11-26- is used for the radiator that DC electric power conveys thyristor converter valve member；
CN201450002 (U) -2010-05-05- is used for HVDC and conveys the radiator of thyristor converter valve member-be used for brilliant lock
The unit of the liquid cooling of pipe, conduit be right angle with it is parallel.
B) the liquid flow cooler pan conduit of KR20050034526 (A) -2005-04-14- liquid coolings set-directly abreast cloth
Put.
CN201655786 (U) -2010-11-24- is used for the water-filled radiator of high power IGCT；CN101984507
(A) -2011-03-09- is used for the water cooling radiator of IGCT, and CN201229939 (Y) -2009-04-29- is integral water-cooled
Ceramic shell-Archimedian screw types of liquid radiator of radiating IGCT, their inner section repeats outer cross section.
New integrated water cooling IGCT ceramic shells of CN101308826 (A)-2008-11-19-be arranged to are full symmetric
The round ceramic housing of circular body cavity.
C) KR200462248 (Y1) -2012-09-04- water aligner-liquid cooling cylindricality module, its cooling target peace
In cylindrical shell.
Braking resistor device-cylindricality that KR20080053550 (A) -2008-06-16 is used for fuel-cell vehicle is circular straight
Connect liquid flow cooler, its cavity in its housing equidistantly, and its export and import pipe and housing outer surface into
Right angle.
3rd group.Plate flat liquid cools down radiator.
US4142231 (A) -1979-02-27- high current low-voltage liquid cooling switching regulaors D/C power-IGCT peace
On liquid cooling plane hollow plate.
The fluid cooling power that there are US2009057882 (A1) (US7834448) -2009-03-05 both sides to cool down partly is led
Module-cooled down out of plane hollow plate, its IGCT is disposed therein.
The liquid of KR20060051066 (A) -2006-05-19- high power resistors-be designed as surface plate directly flows cooling
Device.
KR20110046302 (A) -2011-05-04- has the cored slab of ridge, and cooling liquid flows through it, but, its outside
Housing strictly replicates its inner shell, and the selection of the strict liquid flow variation being limited at the point for needing to cool down.These become
Change and minimize, and be only limitted to the fillet of ditch ridge.
The device that RU74010 (U1) -2008-06-10- will cool down semiconductor transistor is used as the plane hollow of electric lead
Plate.
4th group.Cooler casing design is geometrically changing.Major defect include complexity and higher manufacturing cost, it
Relatively low reliability and repairability, poor feature (hot-fluid can not be distributed to form plan into for special duty and special
In each IGCT), limited product scope.
EP0930480 (A2) -1999-07-21- heat exchangers-cryptomere heat exchanger needs to be arranged in Trunk Line with symmetric array
On.
The submissive fluid cooling caps of EP0453763B1-1991-10-30--be used for the inclination import (plastics) of cooling liquid.
The cooling device of KR20100085999 (A) -2010-07-29 liquid coolings-enter parallel pipe for cooling liquid
Inclination import in line.
DE19921663 (A1) -1999-12-16- cooling water supply units, part-mixed plastic for electric welding equipment
Unit, its cylindrical conduit is asymmetrically arranged relative to the axis of symmetry of longitudinal cross-section, but is applied to square outer housing
The shape of (plastic casing).
US3361195 (A) 1968-01-02- is used for the thermal component of semiconductor device, CH461648 (A) -1968-08-
31-DurchK ü hlmittel k ü hlbare Kuhlanordnung, GB1135526 (A) -1968-12-
04- is used for the thermal component of semiconductor device, DE1639047 (A1) -1971-01-21-Durch stromendes
Kuehlmittel rueckgekuehlter Kuehlkoerper fuer Halbleiterbauelemente- are in IGCT
A large amount of liquid cooling conduits in the housing of cooler, their cross sectional shape is different from hull shape；But, they are whole
It is equally spaced in housing, and their sidepiece is parallel to housing sidepiece.
The plate type heat exchanger of RU2093923 (A1) -20.10.1997 liquid coolings group radiator-liquid cooling, it is included
The housing of parallelepiped is designed as, the housing is manufactured by the material of high heat conductor, internal cross one another circular pipe peace
On the housing, the IGCT to be cooled down is installed on top to dress.The axis of symmetry that circular pipe is respectively relative to their own is tight
Lattice are symmetrical, while whole conduits all align with respect to the common axis of symmetry of housing.Because adding the accuracy of manufacture to produce skill
Art is deteriorated, and needs IGCT for the accurate installation of conduit.
RU38999 (U1) -2004-07-10, RU39220 (U1) -2004-07-20, RU43997 (U1) are used to operate grill pan
Thyristor module-the 2005-02-10- of the power control unit of stove is used for the IGCT for the power cell for controlling electric boiler to operate
The difference of module is that IGCT is completely symmetrically arranged on and directly flows cooling for the liquid of IGCT or bidirectional thyristor
At the regular shape asymmetric housings of system.
The content of the invention
The purpose of the present invention is to improve manufacturability so that the crystalline substance of easy to manufacture and developing electrode heating boiler control unit
The cooling system of brake tube module.Another task be by follow the housing design and IGCT of type of recommendation toward each other and phase
For the type of arrangement of device case, to improve the reliability of device design, prevent machinery dislocation, simplified whole unit and cooling
The assembly precision demand of system.Also it is improved the repairability and durability of device and the task of its service life extension.
In addition, meaning of the present invention is feature, availability and the controllability of expanding unit, its possibility product scope and predetermined
The available selection used.In addition, the present invention can be advantageously used for the radiator of the power scr unit of homogeneous solution-type reactor control
Cooling performance, so as to improve for circulating liquid and recommend the convection current situation of thyristor structure.The present invention also aims to increase
The efficient IGCT is protected by force to prevent from heating in static and dynamic operation mode.
A further object is, in the case where not resetting design and size parameter, to expand the tune except thermal conditioning Functional Design
Adjusting range.
In order to realize the task, there is a kind of power scr unit cooling system, it has at least one brilliant lock
Manage and including：Liquid chiller housing；So that the element that liquid chiller is connected with pipeline；The housing of liquid chiller is hollow
, to cause the in-profile shape of the axial longitudinal section of housing to be the outer contoured shape of the axial longitudinal section of housing.Liquid
The in-profile of the axial longitudinal section of cooler casing relative to the exterior contour of the axial longitudinal section of housing the axis of symmetry not
It is arranged symmetrically.The housing of liquid chiller is planar-formed, with the in-profile shape and housing of the cross section that causes housing
Cross section outer contoured shape it is different.The sidepiece of the in-profile of the longitudinal section of the body cavity of liquid chiller housing is not parallel
In the sidepiece of the exterior contour of the cross section of body cavity.The sidepiece of the in-profile of the cross section of the body cavity of liquid chiller housing is not
Parallel to the sidepiece of the exterior contour of the cross section of body cavity.Flowed through so that each element that housing is connected with pipeline has for liquid
Hole, while liquid chiller housing is connected with pipeline jumper pipe, so that the Kong Lian of the hollow parts of housing and housing jumper pipe
Logical, the pipeline jumper pipe is used to housing being integrated into pipeline.In addition, the brilliant lock installed in the outside of liquid chiller housing
Pipe is asymmetric and is unevenly arranged on the outer surface of liquid chiller housing.
The inside of housing body cavity is formed into the shape of asymmetric truncated cone.
The in-profile of the longitudinal section of liquid chiller housing is formed into the polygonal shape of closure.
The in-profile of the longitudinal section of liquid chiller housing is formed into asymmetric elliptical shape.
The inside of liquid chiller housing is formed into the shape of asymmetric Lavalle (Laval) nozzle.
The inside of liquid chiller housing is formed into asymmetric screw thread form.
The in-profile of the longitudinal section of liquid chiller housing is formed into the shape of smooth closed curve.
The pipeline jumper pipe of liquid chiller housing and housing is formed into the global facility of pipeline.
The outside for being provided with the liquid chiller housing of IGCT is formed into the outer flat face of liquid chiller housing
Shape；IGCT is arranged on the outer flat face of liquid chiller housing, so that each heat absorbing surface is pacified with minimum clearance
On tabular surface.
Flat surface portion at liquid chiller housing outer surface, being exchanged heat with the heat absorbent surface of IGCT is formed into
It is as smooth as possible.
Flat surface portion and IGCT at liquid chiller housing outer surface, with the heat absorbent surface heat exchange of IGCT
Between heat absorption packing ring is installed.
Flat surface portion and IGCT at liquid chiller housing outer surface, with the heat absorbent surface heat exchange of IGCT
Between have heat conduction paste.
The housing side of most thin-walled is arranged in the tabular surface of liquid chiller housing outer surface；Outside liquid chiller housing
The density of IGCT at the tabular surface on surface is maximum in the most thin-walled portion of liquid chiller housing.
Brief description of the drawings
Fig. 1 illustrates cooling channels longitudinal section and the installation diagram for power semiconductor.It provides inner wheel
The wide asymmetric example of vertical and horizontal axis relative to housing longitudinal cross-section, i.e. conical by its shape.IGCT is relative to housing
The lateral symmetry axis of longitudinal cross-section is asymmetrically installed.The section of inside and outside profile in shape and is mismatched, relatively
In the axis of symmetry of exterior contour section housing and asymmetric.Longitudinal cross-section in-profile sidepiece is not parallel to its outer wheels
Wide sidepiece.
Fig. 2 illustrates the sectional view of the housing section for circular apparatus, and its longitudinal section corresponds to Fig. 1, and its is ellipse
Circular body cavity is asymmetrically disposed in housing section.
Fig. 3 and 4 is the longitudinal section and cross-sectional view of the housing of the device for outer circular shape in sectional view respectively.
Body cavity expands towards cooling liquid flowing direction.Body cavity is asymmetrically arranged relative to hull outside profile, such as Fig. 4 section institute
Show.Inside and outside section of outline shape is substantially different (ellipse and circle, see Fig. 4).The in-profile of longitudinal cross-section
Any side is all not parallel to the sidepiece of exterior contour.
Fig. 5 is the longitudinal section of device case.Body cavity is tapered into towards cooling liquid flowing direction.Body cavity also relative to
Hull outside profile is asymmetrically arranged, and is not parallel to hull outside profile, such as in longitudinal section (Fig. 5), is also such as existed
In cross-sectional view (Fig. 6).Housing section is rectangle, and body cavity section is quadrangle, its shape and the exterior contour of housing section
It is not consistent.
Fig. 7,8 are the longitudinal section and cross-sectional view of the housing of the device for outer circular shape in sectional view respectively.
Body cavity has two conical sections, and the two conical sections are connected with intermediate cylinder.Body cavity cylinder is tilted on housing.Section of body cavity
Face is elliptical shape, and the shape is circular different from exterior contour.
Fig. 9,10 are the longitudinal section and cross-sectional view of the housing of the device of tetragonal shape and rectangular shape, brilliant lock respectively
Pipe is attached in two different faces of housing.Body cavity section is similar to ellipse, and its shape is arranged suitable for IGCT.Body cavity
Longitudinal cross-section correspond to Fig. 7, but related ratio has some changes.
Figure 11,12 are longitudinal section and the cross section of the housing of the device of outer rectangular longitudinal section and circular cross section respectively
Figure.Body cavity is elliptical shape in its cross-sectional view and longitudinal section, and in its cross-sectional view and longitudinal section not
It is symmetrically arranged at enclosure interior.
Figure 13,14 are the longitudinal section and cross-sectional view of the housing of the device of outside tetragonal longitudinal section respectively, with circle
Angle side and Polyhedral shells section.Body cavity is made in its longitudinal section into the shape similar with asymmetric Laval nozzles
Shape, is asymmetrically arranged relative to hull outside profile longitudinal section and cross section.
Figure 15,16 are the longitudinal section and cross-sectional view of the housing of the device of outside polygonal longitudinal section respectively, and housing is cut
Face is elliptical shape.The shape of body cavity is similar to two continuous installations and longitudinally connected Laval nozzles, vertical relative to housing
The exterior contour in section is asymmetrically arranged, and their profile longitudinal section shape is different from each other.
Figure 17,18 are the longitudinal section of the most common types of devices housing of outside polygonal longitudinal section and rectangular cross section respectively
Figure and cross-sectional view, and its in-profile cavity shape is designed as random smooth closure song in cross-sectional view and longitudinal section
Line.
Figure 19,20 be most common style cross-sections device sectional view, be characterized as outer circular housing section and it
In-profile cavity shape cross section is designed as random smooth closed curve (Figure 19)；Unaccounted hull outside section of outline shape
Shape also identical-Figure 20.
Figure 21,22 are device case rectangle longitudinal section and rectangle (particularly square) cross-sectional view respectively.In body cavity
There is the larger triangular hill of the longitudinal section of housing body cavity at surface, the body cavity is to be cut with hull outside profile in its section
Face different quadrangles (rhombus) shape.Housing section it is raised asymmetric, as shown in Figure 22 sectional view.Body cavity they
The sidepiece of in-profile in longitudinal section and cross section is not parallel to the sidepiece of hull outside profile.
Figure 23,24 are the longitudinal section of the device case of outside polygon longitudinal section and quadrangle (rhombus) cross section respectively
And cross-sectional view.There is the larger triangular hill of the longitudinal section of housing at the inner surface of cavity.Section case protrusion is not right
Claim, as shown in Figure 22 sectional view.IGCT is expressed as uneven in longitudinal section and cross-sectional view and asymmetrically arranged.
Figure 25,26 are the longitudinal section of the device case of outside polygon longitudinal section and quadrangular cross section respectively and transversal
Face figure, the in-profile cavity shape in its sectional view is the shape of zigzag line.There is housing at the inner surface of cavity
Longitudinal section larger projection.IGCT is expressed as uneven in longitudinal section and cross-sectional view and asymmetrically arranged.
Figure 27,28 are the polygon longitudinal section exterior contour, elliptical outer profiles and circular body cavity of housing section respectively
The longitudinal section and cross-sectional view of the housing of the device in section.The longitudinal section of housing has polygonal shape, have two it is larger
Zigzag line longitudinal direction sidepiece and less triangular hill.There is screw thread in the cavities；Cavity is vertical relative to hull outside profile
Asymmetrically arranged to axis.
Figure 29,30 are longitudinal section and the cross section of the device case of outside polygon longitudinal section and square-section respectively
Figure, in-profile cavity shape has random zigzag line in its section and cross section.
Figure 31,32 are the longitudinal section and cross-sectional view of the device of most common type respectively, are characterized in that its housing is being indulged
It is the circular cross-section pipeline of irregular bus in section, its cross section is also so.
Figure 33 is the sectional view of device case, is designed as the rectangular tube of the outwardly and inwardly cross section profile of irregular shape
Road；There is one layer of heat conduction paste between pipeline face and IGCT.
Figure 34 is the sectional view of the subtype according to Figure 31, the device case for being designed as polyhedron pipe section, it
The in-profile of housing section is elliptical shape.
Embodiment
Alternative 1
Fig. 1-6 provides the thyristor power unit cooling system housing of alternative 1 according to embodiments of the present invention
Longitudinal section and cross-sectional view.Following whole accompanying drawings have marked cross section and the longitudinal section exterior contour of housing with axial dotted line
The axis of symmetry.
According to alternative 1, the control power scr and bidirectional thyristor (1) (they at least one) of device are in peace
Fill plate (3) place to be arranged on the housing (2) of device, the installing plate (3) is made for a part for housing, or separates with housing
(in the case where housing (2) design is approximately round-shaped).Housing shape in Fig. 1,2 in internal longitudinal direction axial cross section (4)
Shape is different from the outer contoured shape of outside longitudinal axial cross section (5), is also so in cross-section.In simplest situation
In, in-profile can be formed as trapezoidal (frustum in body cavity (6) section), can be relative to its longitudinal direction in longitudinal section
Axis is asymmetrically arranged (Fig. 1), and is asymmetrically arranged (Fig. 2) relative to the axis of symmetry of circular shell cross section.At this
In the case of kind, due to body cavity (6) relative to the conical by its shape (i.e. trapezoidal shape) of its longitudinal section and its inside the housing (2)
Position, body cavity is asymmetric relative to the horizontal and vertical axis of symmetry in housing (2) section.IGCT (1) is (when their number is super
When 1) anisotropically it is arranged on plate (3), it is grouped at the wall of reduce thickness.Fig. 1-6 illustrates the non-equal of IGCT
Many seeds selection of even installation.In addition, housing (2) wall thickness reduces in privileged site and the uneven installation of IGCT (1) is carried out
Predetermined combinations.Inside (7) and outside (8) part for housing (2) section, internal (4) and outside (5) longitudinal axial cross section
(2) contour shape is not lined up simultaneously, enabling simplify the demand of manufacturing technology and the reduction accuracy of manufacture.Longitudinal section and cross section
Inside (4), (7) and outside (5), the sidepiece of (8) profile it is not parallel be also beneficial to it is described above.The design of the present invention can also
Enough so that the longitudinally and laterally axis of symmetry of the longitudinal section of housing and do not line up (Fig. 1,3,5) and cause the cross section axis of symmetry not
Align (Fig. 2,4,6).The convection properties of all these heat exchange for improving cooling liquid and installing plate (3) and IGCT (1), and
It is different from known application, enabling to change and program a quantitative index of heat exchange.IGCT anisotropically installs (1) to installing plate
(3) alternative on makes it possible to the most suitable mount point of their position of flexible modulation and selection on heat conduction.Relative
The available import (9) and outlet (10) pipe being connected at side end with housing (2) enable to device to be simply attached to for example
Electric homogeneous solution-type reactor is flowed through in pipeline.Device is arranged in pipeline to increase (Fig. 3) or reduce (Fig. 4) along cooled liquid stream (11)
The available feature of body cavity taper (6) device can be adjusted to current flow, its acceleration and deceleration is designed, so as to strengthen it
Air-circulation features.
Fig. 5-6 illustrates the sub- selection scheme of device in rectangle (particularly square) section of housing, because housing is by increasing
Heavy wall and reasonably strengthen, this can simplify in some cases manufacturing technology, assembling, the installation of device and repairability and
Extend its failsafe operation life-span.Body cavity (6) is relative to cross section and the position of the exterior contour (8) of longitudinal section (5)
Can be symmetrical and not parallel (Fig. 6).This simplifies manufacturing technology, reduce the requirement to the housing accuracy of manufacture and improve shell
Body durability and device overall reliability, if reduce housing machinery, chemically and thermally impact under deformability requirement.
Alternative 2
Fig. 7-20 illustrates the thyristor power unit cooling system housing of alternative 2 according to an embodiment of the invention
Longitudinal section and cross-sectional view.
Fig. 7-10 illustrates the view of the device of enlarging body cavity (6), the frustum (12) that the enlarging body cavity (6) passes through it
And be connected with import (9) and outlet (10) pipe.Cavity (6) is designed for opposing lines increasing section, so as to increase
The instantaneous volume of the cooling liquid of unit interval flowing, removes the situation of heat from IGCT (1) and increases them so as to improve
Operating efficiency, reliability and service life.As long as reducing the demand of assembly precision, cylindrical cavity (6) can also be along longitudinal direction not
It is symmetrically arranged at housing (2) internal, is also that so, cross section profile sidepiece is simultaneously not parallel, so as to substantially simplify in cross-section
Manufacturing technology.IGCT (1) also can be arranged on housing (2) outside by this at the wall least position of thickness, so as to improve except heat
State.Because IGCT (1) is arranged on plate (3), this forms other function reinforcing element, in this IGCT (1) construction
The durability of lower house (2) will not be reduced, so as to be more equally distributed in outer wheels compared with full symmetric body cavity (6) situation
On wide (8) section.This is conducive to extension operation lifetime, the overall reliability of device and its safe utilization.
Figure 11-12 illustrates the sub- selection scheme of body cavity shape (6), and the body cavity shape is in the longitudinal section of housing (2) and horizontal stroke
All close to ellipse in section.This shape can for example be served only for longitudinal section (4) or be served only for cross section (7), or simultaneously
For two sections.The shape of cavity (6) is similar to the instantaneous body that ellipse is also beneficial to the cooling liquid by increasing supply
Accumulate and improve the state of cooling, while not disturbing the laminar flow of the liquid flow in pipeline.Which reduce in pipeline and device case
The generation of dirt deposition at inwall.The elliptical shape in internal cavities section can be substantially asymmetric, until it is close to Laval
Nozzle (Figure 13,14) or other hydrodynamic shapes, including (such as two, such as scheme multiple continuously coupled Laval nozzles
15th, 16 provided).This can design the speed of cooled liquid stream, so as to make it close at IGCT (1) installation position most
Slow down or accelerate in big heat sink region.This scheme significantly improves the feature of device and its use adaptability, so that
It can be used in the refrigerating capacity of relative broad range and the product scope of expanding unit sample.
In the case where exterior contour housing (2) is rectangle in its section (8), in such as Figure 10,14,18, IGCT
(1) it can be directly installed in one or more (such as two, as in Figure 10,14) faces of housing (2), without intermediate plate
(3).This is conducive to housing to simplify, the thermal resistance of increase reliability and reduction from IGCT to cooling liquid.Identical solution
It can be used for housing (2) section exterior contour (8) (Figure 14) of rectangular shape.
The body cavity (6) of device can have the profile of such shape, longitudinal section (4) and cross section (7) in general case
Random smooth closed curve (Figure 17-20) can be made.Therefore, exterior contour can in its longitudinal section (5) and cross section (8)
To be quadrangle (rectangle) (Figure 18), polygon (Figure 14), circular (Fig. 8,12,19) or shape with random closed contour
Shape (Figure 20).It is described above to combine in any combination, therefore substantially extend feature and availability, operation bar
Part, optional scope, therefore, it is possible to carry out the regulation for being exclusively used in any individually situation.Different from known device, this actually can
It is enough to come to provide customization to any required use condition with minimum cost in the case where not updating manufacturing technology.
Alternative 3
Figure 21-30 illustrates the thyristor power unit cooling system housing of alternative 3 according to embodiments of the present invention
Longitudinal section and cross-sectional view.The difference of alternative 3 and alternative 1 and 2 is following characteristics.
According to alternative 3, the shape of the in-profile (4) of housing longitudinal section (2) and the outer wheels of housing longitudinal section (2)
Wide (5) are different, its sidepiece are not parallel to, with the interrupted bus of zigzag (Figure 21,23,25), with obtuse angle crown.Tooth can
With non-homogeneous and asymmetric (Figure 23).For example, tooth position put can with IGCT (1) aligned in position, to ensure in each IGCT
There is minimum wall thickness (MINI W.) part below, so that efficiently enhancing is except heat.Housing section (2) body cavity (6) in-profile shape (7) with it is outer
The difference of the shape of contouring (8) can be ratio, the angle (Figure 22) at tip, the surface location (Figure 24) in section,
Or the more complicated shape in profile dashed line (having obtuse angle tooth at its sophisticated place) deviates.This side for special duty
Case can cause turbulent flow at the housing parts immediately below IGCT in the laminar flow flowing of pipeline, so as to mix
Effect is preferably arranged in the liquid flow of operation, and improves heat exchange.
Figure 27,28 are illustrated when the son for having a large amount of smaller teeth at profile (4) bus in housing (2) body cavity (6) section can
Select scheme.In this case, the tooth of longitudinal cross-section profile (4) can form spiral shell in cross section (7) in the space of body cavity
Line surface.This also ensures the global swirl of bigger cooled liquid stream in addition to the turbulent flow at tooth, therefore ensures its in addition
More preferable immixture, so as to further improve cooling convection current feature.
In the case of most common (Figure 29,30), this selection scheme includes the inside of housing (2) body cavity (6) longitudinal section
Profile (4) and the in-profile (2) of housing (2) body cavity (6) cross section (7), they be designed as single dashed line or and its
Any combination that its alternative is combined.This can be calculated while the turbulent model for keeping the liquid in this housing (2)
With freely arrange their distribution map situations in the whole space of housing (2) body cavity (6).Such feature can be in the implementation
Increase heat exchange efficiency in any independent situation of example, corresponding to the quantitative characteristic of any specific of service condition.
Alternative 4
Figure 31-34 provides the thyristor power unit cooling system housing of alternative 4 according to embodiments of the present invention
Longitudinal section and cross-sectional view.
In these examples, such as the pipeline itself of electric water heating boiler may be used as device case (2).Therefore, in pipe
Circular cross-section (13) in the case of, IGCT (1) by adapter plate (3) be arranged on its outer surface (14) on, the joint
Plate (3) is to be used for the plate that IGCT (1) is installed；Generally, adapter plate (3) is in the region directly contacted with IGCT (1) radiator
In have smooth surface.Compared with all known corresponding intruments such scheme significantly simplify whole device and its installation and
Repairability.The exterior contour for managing (13) longitudinal cross-section (14) is different (Figure 31) from the in-profile (15) of its longitudinal cross-section,
So as to reduce the demand for the accuracy of manufacture, simplify and reduce the cost of device and its manufacturing technology.This is also by making
Must manage (13) section inside (16) and outside (17) profile and do not line up with they asymmetric be mutually arranged (Figure 32-34) and
It is helpful.
In pipe (13) section similar with quadrangle (Figure 33) or polygonal cross-sectional (Figure 34), IGCT (1) can be direct
It is attached in the outer surface of pipe (13) (14).Therefore, the installation region of the IGCT at one or more faces of pipe is embodied as
It is as smooth as possible.In addition, smooth section can be used for by heat conduction paste (18) processing or install heat outlet washer, for causing pipe (13)
Outer surface is preferably contacted with IGCT (1) radiator, to ensure thermal conduction resistance.Heat conduction paste application or below IGCT
Install in any embodiment that heat outlet washer can be used for the present invention.
The operation of power scr unit cooling system in all alternatives all includes following.
In the case of 1-3 alternatives are followed, the housing (2) of device collects together with import (9) and outlet (10) pipe
Into into the supervisor for flowing through pipeline.It is such be integrated in it is most efficient at the minimum branch pipe of the temperature of flowed through fluid, for example, branch pipe
Cold water is supplied to electric water heating boiler.In this case, due to IGCT maximum allowable operating temperature scope 120 to
In 130 Celsius temperatures, efficiently cooling is produced.
Such Integrated Solution is preferred when under any circumstance, particularly as used for the device of water heating, because when control
Only some heat energy will be recovered during device (IGCT (1)) cooling processed, not wasted and be used and be actually recovered and make
With, therefore it is adapted to its main intended purpose (water heating), therefore the coefficient of performance of increase device.In the supervisor as boiler
(13) in the embodiment of the housing (2) of a part, IGCT is arranged in intake pipeline according to the alternative 4 of the present invention
At any suitable location of pipeline.It is constant to flow through housing (2) and the internal water of pipe (13) section (IGCT (1) side of being mounted thereon)
Efficient absorption heat, because its temperature is significantly lower than IGCT (1), installing plate (3), (wall is with good heat exchange for housing wall
Rate is contacted with plate (3), or directly contact IGCT (1) radiator) temperature.Due to the housing body cavity (6) according to the present invention
Interior shape embodiment, the efficiency of this method greatly increases, and keeps identical in the example of laminar flow with cooled liquid stream, in crystalline substance
It is also so in the case of the plan turbulent flow of stream at brake tube (1) mount point.In the dynamic mode of boiler ON/OFF, liquid flow
Setting and no more than thyristor variable heat time, different from known device, this can be by changing housing section and its body cavity
Shape is adjusted, according to the present invention, and this is capable of the flowing of specially acceleration or deceleration cooling liquid.In addition, turbulent flow prevents dirt from sinking
Product is on the wall of housing and pipeline, so as to contribute to device, the proper function of electric water heating boiler, their service life extension
And processing safety.
Claims (13)
1. a kind of power scr unit cooling system, including：
A) liquid chiller housing；
B) element that liquid chiller is connected with pipeline is caused；
C) at least one IGCT；
Wherein, axial longitudinal section of the in-profile of the axial longitudinal section of liquid chiller housing relative to liquid chiller housing
The axis of symmetry of exterior contour asymmetrically arrange；
The in-profile in the section of the body of liquid chiller is not right relative to the axis of symmetry of the exterior contour in the section of body
Claim ground arrangement；
The sidepiece of the in-profile of the longitudinal section of the body cavity of liquid chiller housing is not parallel to the outer wheels of the cross section of body cavity
Wide sidepiece；
The sidepiece of the in-profile of the cross section of the body cavity of liquid chiller housing is not parallel to the outer wheels of the cross section of body cavity
Wide sidepiece；
So that each element for being connected with pipeline of housing, which has, is used for the hole that liquid flows through, at the same liquid chiller housing and pipeline across
Adapter connection, so that the hollow parts of housing are connected with the hole of housing jumper pipe, the pipeline jumper pipe is used for housing is integrated
Into pipeline；
In addition, the IGCT installed in the outside of liquid chiller housing is asymmetric and is unevenly arranged in liquid chiller shell
On the outer surface of body.
2. power scr unit cooling system according to claim 1, wherein：The inside of housing body cavity is formed into not
The shape of symmetrical truncated cone.
3. power scr unit cooling system according to claim 1, wherein：The longitudinal section of liquid chiller housing
In-profile is formed into the polygonal shape of closure.
4. power scr unit cooling system according to claim 1, wherein：The longitudinal section of liquid chiller housing
In-profile is formed into asymmetric elliptical shape.
5. power scr unit cooling system according to claim 1, wherein：Made the inside of liquid chiller housing
Shape as asymmetric Laval nozzle.
6. power scr unit cooling system according to claim 1, wherein：Made the inside of liquid chiller housing
As asymmetric screw thread form.
7. power scr unit cooling system according to claim 1, wherein：The longitudinal section of liquid chiller housing
In-profile is formed into the shape of smooth closed curve.
8. power scr unit cooling system according to claim 1, wherein：The pipe of liquid chiller housing and housing
Road jumper pipe is formed into the global facility of pipeline.
9. power scr unit cooling system according to claim 1, wherein：
A) outside for being provided with the liquid chiller housing of IGCT is formed into the outer flat face of liquid chiller housing
Shape；
B) IGCT is arranged on the outer flat face of liquid chiller housing, so that each heat absorbing surface is installed with minimum clearance
On tabular surface.
10. power scr unit cooling system according to claim 9, wherein：In liquid chiller housing outer surface
Place, be formed into the flat surface portion of the heat absorbent surface of IGCT heat exchange it is as smooth as possible.
11. power scr unit cooling system according to claim 9, wherein：In liquid chiller housing outer surface
Heat absorption packing ring is installed between the flat surface portion and IGCT of place and IGCT heat absorbent surface heat exchange.
12. power scr unit cooling system according to claim 9, wherein：In liquid chiller housing outer surface
There is heat conduction paste between the flat surface portion and IGCT of place and IGCT heat absorbent surface heat exchange.
13. power scr unit cooling system according to claim 9, wherein：
A) it is arranged in the housing side of most thin-walled in the tabular surface of liquid chiller housing outer surface；
B) most thin-walled of the density of the IGCT at the tabular surface of liquid chiller housing outer surface in liquid chiller housing
Part is maximum.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IB2013/001292 WO2014174336A1 (en) | 2013-04-24 | 2013-04-24 | Power thyristor unit cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104823279A CN104823279A (en) | 2015-08-05 |
| CN104823279B true CN104823279B (en) | 2017-09-08 |
Family
ID=51791121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380063026.4A Active CN104823279B (en) | 2013-04-24 | 2013-04-24 | Power scr unit cooling system |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR101551874B1 (en) |
| CN (1) | CN104823279B (en) |
| HK (1) | HK1213691A1 (en) |
| IN (1) | IN2015DN02629A (en) |
| WO (1) | WO2014174336A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6541812B1 (en) * | 2018-01-25 | 2019-07-10 | 三菱電機株式会社 | Heat sink and semiconductor module |
| KR102473908B1 (en) * | 2021-12-03 | 2022-12-06 | 네덱 주식회사 | Casting product for cooling heating element and manufacturing method for the same |
| DE102022211794A1 (en) | 2022-11-08 | 2024-05-08 | Robert Bosch Gesellschaft mit beschränkter Haftung | Heat sink for cooling an electrical and/or electronic assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5453911A (en) * | 1994-02-17 | 1995-09-26 | General Motors Corporation | Device for cooling power electronics |
| JPH09126589A (en) * | 1995-10-27 | 1997-05-16 | Hitachi Cable Ltd | Heat transfer pipe for heat absorber and its manufacturing method |
| WO1999014807A1 (en) * | 1997-09-17 | 1999-03-25 | Advanced Energy's Voorhees Operations | Cooling module for electronic components |
| CN1301606A (en) * | 1999-11-10 | 2001-07-04 | Sms迪马格股份公司 | Metal continuous casting crystallizer of funnel taped pouring area with cool wide wall plate and cool narrow wall plate |
| CN201917256U (en) * | 2010-12-15 | 2011-08-03 | 茂名重力石化机械制造有限公司 | Heat exchange tube for tube type heat exchanger and tube type heat exchanger adopting same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361195A (en) * | 1966-09-23 | 1968-01-02 | Westinghouse Electric Corp | Heat sink member for a semiconductor device |
| US5719444A (en) * | 1996-04-26 | 1998-02-17 | Tilton; Charles L. | Packaging and cooling system for power semi-conductor |
-
2013
- 2013-04-24 CN CN201380063026.4A patent/CN104823279B/en active Active
- 2013-04-24 KR KR1020157008281A patent/KR101551874B1/en active IP Right Grant
- 2013-04-24 WO PCT/IB2013/001292 patent/WO2014174336A1/en active Application Filing
-
2015
- 2015-03-31 IN IN2629DEN2015 patent/IN2015DN02629A/en unknown
-
2016
- 2016-02-05 HK HK16101422.8A patent/HK1213691A1/en active IP Right Revival
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5453911A (en) * | 1994-02-17 | 1995-09-26 | General Motors Corporation | Device for cooling power electronics |
| JPH09126589A (en) * | 1995-10-27 | 1997-05-16 | Hitachi Cable Ltd | Heat transfer pipe for heat absorber and its manufacturing method |
| WO1999014807A1 (en) * | 1997-09-17 | 1999-03-25 | Advanced Energy's Voorhees Operations | Cooling module for electronic components |
| CN1301606A (en) * | 1999-11-10 | 2001-07-04 | Sms迪马格股份公司 | Metal continuous casting crystallizer of funnel taped pouring area with cool wide wall plate and cool narrow wall plate |
| CN201917256U (en) * | 2010-12-15 | 2011-08-03 | 茂名重力石化机械制造有限公司 | Heat exchange tube for tube type heat exchanger and tube type heat exchanger adopting same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014174336A1 (en) | 2014-10-30 |
| KR101551874B1 (en) | 2015-09-18 |
| CN104823279A (en) | 2015-08-05 |
| KR20150041187A (en) | 2015-04-15 |
| HK1213691A1 (en) | 2016-07-08 |
| IN2015DN02629A (en) | 2015-06-05 |
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